CN110413087B - Computer motherboard chip heat dissipation silica gel pastes dress device - Google Patents
Computer motherboard chip heat dissipation silica gel pastes dress device Download PDFInfo
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- CN110413087B CN110413087B CN201910743103.XA CN201910743103A CN110413087B CN 110413087 B CN110413087 B CN 110413087B CN 201910743103 A CN201910743103 A CN 201910743103A CN 110413087 B CN110413087 B CN 110413087B
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- bin
- glue
- piston rod
- silica gel
- seat
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 239000000741 silica gel Substances 0.000 title claims abstract description 32
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000005507 spraying Methods 0.000 claims abstract description 29
- 230000002093 peripheral effect Effects 0.000 claims abstract description 21
- 230000000750 progressive effect Effects 0.000 claims abstract description 21
- 210000001503 joint Anatomy 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000003032 molecular docking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Warehouses Or Storage Devices (AREA)
- Silicon Compounds (AREA)
Abstract
The invention provides a computer motherboard chip heat dissipation silica gel mounting device which comprises a mounting rack, wherein a carrying mechanism is arranged at the inner bottom of the mounting rack, a material guide bin is arranged above the carrying mechanism, the top end and the bottom end of the material guide bin are both of an open structure, a limiting block is arranged on the inner peripheral surface of the bottom end of the material guide bin, and a limiting sheet is arranged on the outer peripheral surface of the top end of the material guide bin; a feeding bin is sleeved in the material guiding bin, the top end and the bottom end of the feeding bin are both of an open structure, and the bottom end of the feeding bin is clamped on the limiting block; the outer peripheral surface of the lower end of the guide bin is provided with a glue spraying bin, the lower part of the glue spraying bin is provided with a plurality of glue spraying nozzles, the top of the mounting rack is provided with a glue applicator, the glue applicator is connected with the glue spraying bin through a glue conveying pipeline, and a glue conveying pump is arranged between the upper end of the glue conveying pipeline and the glue applicator. The invention conveys the heat dissipation silica gel in the feeding bin downwards in a progressive manner by the progressive push plug, so that the heat dissipation silica gel is attached to the back surface of the computer motherboard chip, and the efficiency of attaching the heat dissipation silica gel to the computer motherboard chip is greatly improved.
Description
Technical Field
The invention relates to a mounting device, in particular to a computer motherboard chip heat dissipation silica gel mounting device.
Background
The heat dissipation silica gel is a heat conduction material with low thermal resistance, high heat conduction performance and high flexibility. The high flexibility that this material has can reduce the required pressure between components and parts, thereby cover the surface of microcosmic unevenness simultaneously and make components and parts fully contact and improve heat conduction efficiency, is particularly suitable for the heat conduction demand that the space is restricted. The ultra-soft gap filling material is widely applied to various fields of war industry, computers, communication equipment, electronic consumer goods, power supplies, automotive electronics, industrial electronic equipment and the like so as to improve the reliability of electronic components and prolong the service life of the electronic components and the ultra-soft gap filling material with high thermal conductivity; the high-power heat dissipation system is applied to various fields such as military industry, computers, communication equipment, electronic consumer goods, power supplies, automotive electronics, industrial electronic equipment and the like. The existing heat dissipation silica gel is inconvenient to carry in a progressive mode, is inconvenient to mount on the back face of a chip of a computer mainboard, and is low in mounting efficiency.
Disclosure of Invention
The invention mainly aims to provide a computer motherboard chip radiating silica gel mounting device which carries out downward progressive conveying on radiating silica gel in a feeding bin through a progressive push plug, so that the radiating silica gel is mounted on the back of a computer motherboard chip, the efficiency of mounting the radiating silica gel on the computer motherboard chip is greatly improved, and automatic mounting is realized.
In order to achieve the purpose, the invention adopts the technical scheme that:
a computer motherboard chip heat dissipation silica gel mounting device comprises a mounting rack, wherein a carrying mechanism is arranged at the inner bottom position of the mounting rack, a material guide bin is arranged above the carrying mechanism, the top end and the bottom end of the material guide bin are both of an open structure, a limiting block is arranged on the inner circumferential surface of the bottom end of the material guide bin, and a limiting sheet is arranged on the outer circumferential surface of the top end of the material guide bin; a feeding bin is sleeved in the material guide bin, the top end and the bottom end of the feeding bin are both of an open structure, and the bottom end of the feeding bin is clamped on the limiting block; the glue spraying bin is arranged on the outer peripheral surface of the lower end of the guide bin, the lower part of the glue spraying bin is provided with a plurality of glue spraying nozzles, the top of the mounting rack is provided with a glue applicator, the glue applicator is connected with the glue spraying bin through a glue conveying pipeline, and a glue conveying pump is arranged between the upper end of the glue conveying pipeline and the glue applicator; the top of the mounting rack is provided with a first hydraulic cylinder, the lower part of the first hydraulic cylinder is provided with a first piston rod, the lower end of the first piston rod is provided with a progressive push plug, the progressive push plug is arranged above the feeding bin, and the diameter of the progressive push plug is smaller than that of the feeding bin; the carrying mechanism comprises a carrying seat, mounting shafts are arranged on two sides of the bottom of the carrying seat, universal wheels are arranged at two ends of each mounting shaft, positioning seats are arranged on two sides of the top surface of the carrying seat, a buffer spring is arranged between the bottom of each positioning seat and the carrying seat, side seats are arranged on the positioning seats, top seats are arranged on the tops of the side seats, locking grooves are formed among the positioning seats, the side seats and the top seats, and locking cavities are formed among the locking grooves; the outer side of the mounting frame is provided with a third hydraulic cylinder, the front part of the third hydraulic cylinder is provided with a third piston rod, and the front end of the third piston rod is connected with the carrying seat.
Furthermore, a push-pull seat is arranged on the side portion of the carrying seat, the front end of the third piston rod is connected with the push-pull seat, a push-pull frame is arranged between the front end of the third piston rod and the push-pull seat, and a fixing block is arranged between the push-pull frame and the front end of the third piston rod.
Further, the outside position of leading the feed bin is equipped with first crane and second crane, pastes the top of subsides dress frame and is equipped with the second pneumatic cylinder, and the lower part of second pneumatic cylinder is equipped with the second piston rod, and the lower extreme of second piston rod is installed between first crane and second crane.
Furthermore, the inner top of the mounting rack is provided with a butt joint frame, the butt joint frame is fixed to the inner top of the mounting rack through a buckling frame, the butt joint frame is provided with a first guide pipe and a second guide pipe, the first guide pipe is sleeved on the outer peripheral surface of the first piston rod, and the second guide pipe is sleeved on the outer peripheral surface of the second piston rod.
Furthermore, the inner top of the mounting rack is provided with a ceiling frame, two sides of the lower part of the ceiling frame are provided with fixed cylinders, a traction wheel is arranged between the fixed cylinders, and the rubber conveying pipeline bypasses the peripheral surface of the traction wheel.
Furthermore, the top peripheral face in feeding storehouse is equipped with the knot portion, and knot portion lock joint is on the spacing piece.
Further, the feeding bin comprises a bin body, a progressive feeding cavity is formed in the bin body, the top end and the bottom end of the bin body are both of an open structure, limiting convex rings are arranged on the inner circumferential surface of the bin body in sequence from top to bottom, and a limiting groove is formed between every two adjacent limiting convex rings.
Furthermore, the cross section of the limiting convex ring is in a semicircular shape.
Furthermore, the inward facing surface of the locking groove is provided with an elastic locking plate which is in a U shape.
The invention has the beneficial effects that: the operator places the computer main board to be processed on the carrying mechanism, places the computer main board between the locking grooves of the locking cavity, the computer mainboard is supported by the positioning seat, the two ends of the computer mainboard are firmly locked by the side seat and the top seat, the buffer spring greatly improves the buffer effect of the positioning seat, the carrying seat can conveniently and flexibly move through the universal wheel, the third hydraulic cylinder controls the carrying seat to realize horizontal reciprocating motion through the third piston rod, thereby being convenient for flexibly moving and adjusting the carrying seat, flexibly moving and adjusting the computer mainboard through the carrying seat, adjusting the chip on the computer mainboard to be right below the material guide bin, conveying the glue solution into the glue spraying bin through the glue conveying pipeline by the glue applicator, conveying the glue solution into a glue spraying bin through a glue conveying pump, and spraying the glue solution onto the back surface of a chip on a computer mainboard through a glue spraying nozzle by the glue spraying bin; an operator loads the heat-dissipation silica gel into the feeding bin, then loads the feeding bin into the guide bin, and limits the feeding bin through the limiting block so that the feeding bin is limited in the guide bin; the first hydraulic cylinder controls the progressive push plug to realize lifting control through the first piston rod, and the heat dissipation silica gel in the feeding bin is conveyed downwards in a progressive mode through the progressive push plug, so that the heat dissipation silica gel is attached to the back face of the computer motherboard chip, the efficiency of attaching the heat dissipation silica gel to the computer motherboard chip is greatly improved, and automatic attaching is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic structural view of a computer motherboard chip heat dissipation silica gel mounting device.
Fig. 2 is a schematic structural diagram of the carrying mechanism of the present invention.
Fig. 3 is a schematic structural view of the glue nozzle of the present invention.
Fig. 4 is a schematic structural diagram of the feeding bin of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 4, a computer motherboard chip heat dissipation silica gel mounting device includes a mounting frame 1, a carrying mechanism 2 is disposed at an inner bottom position of the mounting frame 1, a material guiding bin 3 is disposed above the carrying mechanism 2, top and bottom ends of the material guiding bin 3 are both open structures, a limiting block 4 is disposed on an inner peripheral surface of the bottom end of the material guiding bin 3, and a limiting piece 5 is disposed on an outer peripheral surface of the top end of the material guiding bin 3; a feeding bin 6 is sleeved in the material guiding bin 3, the top end and the bottom end of the feeding bin 6 are both of an open structure, and the bottom end of the feeding bin 6 is clamped on the limiting block 4; a glue spraying bin 7 is arranged on the outer peripheral surface of the lower end of the material guiding bin 3, a plurality of glue spraying nozzles 8 are arranged on the lower portion of the glue spraying bin 7, a glue applicator 9 is arranged on the top of the mounting rack 1, the glue applicator 9 is connected with the glue spraying bin 7 through a glue conveying pipeline 10, and a glue conveying pump 11 is arranged between the upper end of the glue conveying pipeline 10 and the glue applicator 9; the top of the mounting rack 1 is provided with a first hydraulic cylinder 15, the lower part of the first hydraulic cylinder 15 is provided with a first piston rod 16, the lower end of the first piston rod 16 is provided with a progressive push plug 17, the progressive push plug 17 is arranged above the feeding bin 6, and the diameter of the progressive push plug 17 is smaller than that of the feeding bin 6; the carrying mechanism 2 comprises a carrying seat 26, mounting shafts 27 are arranged on two sides of the bottom of the carrying seat 26, universal wheels 28 are arranged at two ends of each mounting shaft 27, positioning seats 29 are arranged on two sides of the top surface of the carrying seat 26, a buffer spring 30 is arranged between the bottom of each positioning seat 29 and the carrying seat 26, a side seat 31 is arranged on each positioning seat 29, a top seat 32 is arranged on the top of each side seat 31, locking grooves 33 are arranged among the positioning seats 29, the side seats 31 and the top seats 32, and a locking cavity 35 is formed among the locking grooves 33; a third hydraulic cylinder 36 is arranged at the outer side of the mounting frame 1, a third piston rod 37 is arranged at the front part of the third hydraulic cylinder 36, and the front end of the third piston rod 37 is connected with the carrier seat 26.
The invention relates to a computer mainboard chip heat dissipation silica gel mounting device.A computer mainboard to be processed is placed on a carrying mechanism 2 by an operator, the computer mainboard is placed between lock grooves 33 of a lock cavity 35, the computer mainboard is supported by a positioning seat 29, two ends of the computer mainboard are firmly locked and connected by a side seat 31 and a top seat 32, a buffer spring 30 greatly improves the buffer effect of the positioning seat 29, a carrying seat 26 can conveniently and flexibly move by a universal wheel 28, a third hydraulic cylinder 36 controls the carrying seat 26 to horizontally reciprocate by a third piston rod 37, thereby being capable of conveniently and flexibly moving and adjusting the carrying seat 26, the computer mainboard is flexibly moved and adjusted by the carrying seat 26, a chip on the computer mainboard is adjusted under a material guide bin 3, a glue applying machine 9 delivers glue solution into a glue spraying bin 7 by a glue delivery pipeline 10, conveying the glue solution into a glue spraying bin 7 through a glue conveying pump 11, and spraying the glue solution onto the back surface of a chip on a computer mainboard through a glue spraying nozzle 8 by the glue spraying bin 7; an operator loads the heat-dissipating silica gel into the feeding bin 6, then loads the feeding bin 6 into the guide bin 3, and limits the feeding bin 6 through the limiting block 4 to limit the feeding bin 6 in the guide bin 3; first pneumatic cylinder 15 upgrades the plug 17 through the control of first piston rod 16 and realizes lift control, upgrades the transport downwards to the heat dissipation silica gel in the feeding storehouse 6 through upgrading the plug 17, makes heat dissipation silica gel subside dress on the back of computer motherboard chip, has improved the efficiency of carrying out subsides dress heat dissipation silica gel to computer motherboard chip greatly, realizes automatic dress of pasting.
Preferably, a push-pull seat 38 is arranged at a side position of the carrier seat 26, the front end of the third piston rod 37 is connected with the push-pull seat 38, a push-pull frame 39 is arranged between the front end of the third piston rod 37 and the push-pull seat 38, and a fixed block 40 is arranged between the push-pull frame 39 and the front end of the third piston rod 37; the third piston rod 37 pushes and pulls the carrier seat 26 through the push-pull seat 38, the push-pull frame 39 and the fixing block 40, which greatly improves the efficiency of pushing and pulling the carrier seat 26.
Preferably, a first lifting frame 18 and a second lifting frame 19 are arranged at the outer side of the material guide bin 3, a second hydraulic cylinder 20 is arranged at the top of the placement rack 1, a second piston rod 21 is arranged at the lower part of the second hydraulic cylinder 20, and the lower end of the second piston rod 21 is arranged between the first lifting frame 18 and the second lifting frame 19; the second hydraulic cylinder 20 lifts and clears the first lifting frame 18 and the second lifting frame 19 through a second piston rod 21, and the lifting of the material guiding cabin 3 is controlled through the first lifting frame 18 and the second lifting frame 19.
Preferably, a docking frame 22 is arranged at the inner top of the mounting rack 1, the docking frame 22 is fixed at the inner top of the mounting rack 1 through a buckle frame 25, a first guide tube 23 and a second guide tube 24 are arranged on the docking frame 22, the first guide tube 23 is sleeved on the outer peripheral surface of the first piston rod 16, and the second guide tube 24 is sleeved on the outer peripheral surface of the second piston rod 21; the first piston rod 16 is guided by the first guide tube 23, and the second piston rod 21 is guided by the second guide tube 24.
Preferably, a ceiling frame 12 is arranged at the inner top of the mounting rack 1, two sides of the lower part of the ceiling frame 12 are respectively provided with a fixed cylinder 13, a traction wheel 14 is arranged between the fixed cylinders 13, and the rubber conveying pipeline 10 bypasses the peripheral surface of the traction wheel 14; the fixed cylinder 13 is used for positioning and controlling the traction wheel 14, and the traction wheel 14 is used for guiding and controlling the glue conveying pipeline 10.
Preferably, the peripheral surface of the top end of the feeding bin 6 is provided with a buckling part 50, and the buckling part 50 is buckled on the limiting sheet 5; the top end of the feeding bin 6 is fastened through a fastening part 50.
Preferably, the feeding bin 6 comprises a bin body 46, a progressive feeding cavity 47 is arranged inside the bin body 46, the top end and the bottom end of the bin body 46 are both of an open structure, limiting convex rings 48 are arranged on the inner circumferential surface of the bin body 46 in sequence from top to bottom, and a limiting groove 49 is formed between every two adjacent limiting convex rings 48; the cross section of the limiting convex ring 48 is semicircular; the bin body 46 stores the heat-dissipating silica gel through the progressive feeding cavity 47, and the limiting convex ring 48 performs limiting control on the heat-dissipating silica gel through the limiting groove 49.
Preferably, an elastic locking piece 34 is arranged at the position facing inwards of the locking groove 33, and the elastic locking piece 34 is in a U-shaped shape; the two ends of the computer main board between the lock grooves 33 are firmly clamped by the elastic locking sheets 34.
Preferably, the glue spraying nozzle 8 comprises a nozzle 44, the lower end of the nozzle 44 is a free end, the upper end of the nozzle 44 is provided with an adjusting ball 43, the adjusting ball 43 is installed in a positioning ball 41, an adjusting cavity 42 is arranged inside the positioning ball 41, the adjusting ball 43 is installed at the inner bottom of the adjusting cavity 42, a rubber layer 45 is arranged between the adjusting ball 43 and the adjusting cavity 42, the surface of the positioning ball 41 is of a net structure, and the positioning ball 41 is installed in the glue spraying bin 7; the glue spraying bin 7 conveys the glue solution into the adjusting ball 43 through the positioning ball 41, the adjusting ball 43 conveys the glue solution into the nozzle 44, the glue solution is sprayed out through the nozzle 44, the adjusting ball 43 rotates around the rubber layer 45 in the adjusting cavity 42, and therefore the nozzle 44 can be flexibly adjusted in a rotating mode.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A computer motherboard chip heat dissipation silica gel mounting device comprises a mounting rack, wherein a carrying mechanism is arranged at the inner bottom position of the mounting rack, a material guide bin is arranged above the carrying mechanism, the top end and the bottom end of the material guide bin are both of an open structure, a limiting block is arranged on the inner circumferential surface of the bottom end of the material guide bin, and a limiting sheet is arranged on the outer circumferential surface of the top end of the material guide bin; a feeding bin is sleeved in the material guiding bin, the top end and the bottom end of the feeding bin are both of an open structure, and the bottom end of the feeding bin is clamped on the limiting block; the glue spraying bin is arranged on the outer peripheral surface of the lower end of the guide bin, the lower part of the glue spraying bin is provided with a plurality of glue spraying nozzles, the top of the mounting rack is provided with a glue applicator, the glue applicator is connected with the glue spraying bin through a glue conveying pipeline, and a glue conveying pump is arranged between the upper end of the glue conveying pipeline and the glue applicator; the top of the mounting rack is provided with a first hydraulic cylinder, the lower part of the first hydraulic cylinder is provided with a first piston rod, the lower end of the first piston rod is provided with a progressive push plug, the progressive push plug is arranged above the feeding bin, and the diameter of the progressive push plug is smaller than that of the feeding bin; the carrying mechanism comprises a carrying seat, mounting shafts are arranged on two sides of the bottom of the carrying seat, universal wheels are arranged at two ends of each mounting shaft, positioning seats are arranged on two sides of the top surface of the carrying seat, a buffer spring is arranged between the bottom of each positioning seat and the carrying seat, side seats are arranged on the positioning seats, top seats are arranged on the tops of the side seats, locking grooves are formed among the positioning seats, the side seats and the top seats, and locking cavities are formed among the locking grooves; a third hydraulic cylinder is arranged at the outer side part of the mounting rack, a third piston rod is arranged at the front part of the third hydraulic cylinder, and the front end of the third piston rod is connected with the carrying seat;
a push-pull seat is arranged at the side part of the carrying seat, the front end of the third piston rod is connected with the push-pull seat, a push-pull frame is arranged between the front end of the third piston rod and the push-pull seat, and a fixed block is arranged between the push-pull frame and the front end of the third piston rod;
the method is characterized in that: a first lifting frame and a second lifting frame are arranged at the outer side part of the material guide bin, a second hydraulic cylinder is arranged at the top of the pasting rack, a second piston rod is arranged at the lower part of the second hydraulic cylinder, and the lower end of the second piston rod is arranged between the first lifting frame and the second lifting frame; the inner top of the mounting rack is provided with a butt joint frame, the butt joint frame is fixed on the inner top of the mounting rack through a buckling frame, the butt joint frame is provided with a first guide pipe and a second guide pipe, the first guide pipe is sleeved on the outer peripheral surface of the first piston rod, and the second guide pipe is sleeved on the outer peripheral surface of the second piston rod.
2. The computer motherboard chip heat-dissipating silica gel mounting apparatus of claim 1, wherein: the inner top of the pasting rack is provided with a suspended ceiling frame, both sides of the lower part of the suspended ceiling frame are provided with fixed cylinders, a traction wheel is arranged between the fixed cylinders, and the rubber conveying pipeline bypasses the peripheral surface of the traction wheel.
3. The computer motherboard chip heat-dissipating silica gel mounting apparatus of claim 1, wherein: the top peripheral face in feeding storehouse is equipped with the knot portion, and knot portion lock joint is on spacing piece.
4. The computer motherboard chip heat-dissipating silica gel mounting apparatus of claim 1, wherein: the feeding bin comprises a bin body, the inside of the bin body is a progressive discharging cavity, the top end and the bottom end of the bin body are both of an open structure, the inner peripheral surface of the bin body is provided with limiting convex rings which are sequentially arranged from top to bottom, and a limiting groove is formed between every two adjacent limiting convex rings.
5. The computer motherboard chip heat-dissipating silica gel mounting apparatus of claim 4, wherein: the cross section of the limit convex ring is in a semicircular shape.
6. The computer motherboard chip heat-dissipating silicone mounting device of claim 1, wherein: the inner facing surface of the locking groove is provided with an elastic locking plate which is in a U shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743103.XA CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743103.XA CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110413087A CN110413087A (en) | 2019-11-05 |
| CN110413087B true CN110413087B (en) | 2022-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910743103.XA Active CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
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| CN203575015U (en) * | 2013-10-18 | 2014-04-30 | 江苏宝浦莱半导体有限公司 | Surface mount system |
| CN103831208A (en) * | 2013-12-27 | 2014-06-04 | 广州奥迪通用照明有限公司 | Gluing mechanism |
| CN105499067A (en) * | 2015-11-27 | 2016-04-20 | 新奥光伏能源有限公司 | Automatic dispensing chip mounter for manufacturing trays |
| CN205194687U (en) * | 2015-12-07 | 2016-04-27 | 东莞市零度导热材料有限公司 | A heat conduction silica gel sheet for cell -phone |
| CN105742214A (en) * | 2016-03-23 | 2016-07-06 | 广东恒鑫智能装备股份有限公司 | Chip gluing apparatus |
| CN105857712A (en) * | 2016-04-22 | 2016-08-17 | 合肥宝亿自动化科技有限公司 | Automatic silicone stripe adhering device |
| CN205828401U (en) * | 2016-06-23 | 2016-12-21 | 浙江拓峰科技有限公司 | Solar base plate point glue chip mounter and slide pay-off thereof |
| CN106654342A (en) * | 2017-01-10 | 2017-05-10 | 深圳市欧盛自动化有限公司 | Full-automatic silicone pad pasting machine |
| CN206966012U (en) * | 2017-05-12 | 2018-02-06 | 南京理工大学紫金学院 | One kind can remote monitoring and temperature automatically controlled point gum machine |
| CN107396604A (en) * | 2017-08-04 | 2017-11-24 | 歌尔科技有限公司 | A kind of method, smart machine and system for improving smart machine receiving sensitivity |
| CN208800322U (en) * | 2018-08-14 | 2019-04-30 | 苏州万合电子有限公司 | A kind of process units for single side adhesion heat conductive silica gel gasket |
| CN208786807U (en) * | 2018-09-21 | 2019-04-26 | 蚌埠崧欣电子科技有限公司 | A kind of dispersing and curing device for LED power |
| CN109107835A (en) * | 2018-10-12 | 2019-01-01 | 东莞市耀野自动化有限公司 | A kind of Full-automatic spot gluing patch device |
| CN109340233A (en) * | 2018-11-28 | 2019-02-15 | 深圳市诺峰光电设备有限公司 | A kind of electronic product auxiliary material automation make-up machine |
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Effective date of registration: 20231107 Address after: No. 5 Yanli Road, Yantou Town, Pujiang County, Jinhua City, Zhejiang Province, 322203 Patentee after: Dudi (Zhejiang) New Materials Co.,Ltd. Address before: No. 819, 8th Floor, Unit 1, Building 2, No. 978, Section 1, Riyue Avenue, Qingyang District, Chengdu City, Sichuan Province, 610031 Patentee before: Sicguo (Chengdu) Intellectual Property Operation Co.,Ltd. Effective date of registration: 20231107 Address after: No. 819, 8th Floor, Unit 1, Building 2, No. 978, Section 1, Riyue Avenue, Qingyang District, Chengdu City, Sichuan Province, 610031 Patentee after: Sicguo (Chengdu) Intellectual Property Operation Co.,Ltd. Address before: 221140 No.1 Xiangwang South Road, Gulou District, Xuzhou City, Jiangsu Province Patentee before: XUZHOU College OF INDUSTRIAL TECHNOLOGY |