CN201967291U - Electronic heat-conducting silicon sheet - Google Patents
Electronic heat-conducting silicon sheet Download PDFInfo
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- CN201967291U CN201967291U CN2010206754989U CN201020675498U CN201967291U CN 201967291 U CN201967291 U CN 201967291U CN 2010206754989 U CN2010206754989 U CN 2010206754989U CN 201020675498 U CN201020675498 U CN 201020675498U CN 201967291 U CN201967291 U CN 201967291U
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- heat
- silicon sheet
- conducting silicon
- electronic
- thermal conductive
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Abstract
The utility model relates to the field of silica gel, and relates to an electronic heat-conducting silicon sheet used for quickening the heat transmission speed of electrons and electric appliances to a radiator, which comprises a heat-conducting silicon sheet body; and a sticking layer fixed with the radiating positions of the electrons and electric appliances is arranged at the bottom side of the heat-conducting silicon sheet body. The electronic heat-conducting silicon sheet has the beneficial effects of reducing the temperatures of electronic elements and devices, and improving the reliability and service lives of the electronic elements and devices. Moreover, the electronic heat-conducting silicon sheet can also be used for heat conduction between a CPU (central processing unit) fan and a radiating fin of a computer. Compared with a copper plate and an aluminum plate of a traditional radiating fin, the electronic heat-conducting silicon sheet has the advantages of simple manufacture, lower cost, and better radiating performance. Compared with heat conduction silicone grease, the electronic heat-conducting silicon sheet is convenient to operate, and is uniform and even.
Description
Technical field
The utility model relates to the silica gel field, especially relates to a kind of electronics thermal conductive silicon film that is used to accelerate electronics, electrical equipment to the heat abstractor heat conduction velocity.
Background technology
Silica gel (Silicone rubber) another name: silicon rubber can be divided into two big classes by its character and component: organic silica gel and inorganic silica gel; Can be divided into three major types by sulfuration type and sulfuration mechanism: two component condensed room temperature vulcanized silicone rubbers, dual composition addition type room temperature vulcanized silicone rubber, high-temperature silicon disulfide rubber.Water insoluble and any solvent of silica gel, nonpoisonous and tasteless, chemical property is stable, does not react with any material except that highly basic, hydrofluoric acid.The silica gel of various models forms different microcellular structures because of its manufacture method is different.The chemical composition of silica gel and physical structure have determined it to have the advantages that many other same type of material are difficult to replace: have excellent electrical insulating property, ageing resistance, thermal stability, chemical stability and higher mechanical strength etc.
Present silica gel use is a lot, but in studying for a long period of time of the applicant used, but also there are improvements in discovery in following industry: heat radiations such as traditional electronics, electrical equipment generally all realize by copper sheet, aluminium flake or heat-conducting silicone grease, but the making of copper sheet, aluminium flake is more loaded down with trivial details relatively, cost is higher, and thermal diffusivity is general.Heat-conducting silicone grease is inconvenient operation then, need spread upon above the electronic devices and components with instrument, and will be coated with evenly, if uneven heat dissipation is also bad.
In the weak point aspect the heat radiation, the inventor has designed the utility model a kind of " electronics thermal conductive silicon film " based on existing electronics, electrical equipment etc.
The utility model content
The utility model at above-mentioned the deficiencies in the prior art technical problem to be solved is: a kind of electronics thermal conductive silicon film that is used to accelerate electronics, electrical equipment to the heat abstractor heat conduction velocity is provided.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of electronics thermal conductive silicon film comprises a thermal conductive silicon film body, is provided with the adhesive layer that fixes with electronics, heat radiation of electrical apparatus position in the bottom side of thermal conductive silicon film body.The utility model is mainly used in accelerates electronics, the electrical equipment heat conduction velocity to heat abstractor, so that reduce the temperature of electronic devices and components, improves its reliability and useful life.Also can be used for the heat conduction between computer CPU fan and the fin.
Described thermal conductive silicon film body shape is circular, ellipse or quadrangle, and the shape that they are can be according to different electronics applications different is used the quadrangle similar to the CPU shape between computer CPU fan and the fin.
The beneficial effect of a kind of electronics thermal conductive silicon of the utility model film is:
The temperature of electronic devices and components be can reduce, its reliability and useful life improved.Also can be used for the heat conduction between computer CPU fan and the fin.Advantage with respect to traditional heat-dissipating sheet copper sheet, aluminium flake: make simply, cost is lower, and thermal diffusivity is better.Advantage with respect to heat-conducting silicone grease: easy to operate, evenly smooth.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is an overall structure front view of the present utility model;
Fig. 2 is an overall structure vertical view of the present utility model.
Description of reference numerals:
10, thermal conductive silicon film body 11, adhesive layer
Embodiment
Referring to figs. 1 through Fig. 2, the utility model is to implement like this:
In Fig. 1 and Fig. 2, a kind of electronics thermal conductive silicon film comprises a thermal conductive silicon film body 10, is provided with the adhesive layer 11 that fixes with electronic apparatus heat radiation position in the bottom side of thermal conductive silicon film body 10.
In the present embodiment, thermal conductive silicon film body 10 is the quadrangle similar to the CPU shape, and thermal conductive silicon film body shape can also be circular, oval or other shapes in addition.
The above, it only is a kind of preferred embodiment of the utility model electronics thermal conductive silicon film, be not that technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model all still belongs in the scope of the utility model technology any trickle modification, equivalent variations and modification that top embodiment did.
Claims (2)
1. an electronics thermal conductive silicon film is characterized in that: comprise a thermal conductive silicon film body (10), be provided with the adhesive layer (11) that fixes with electronics, heat radiation of electrical apparatus position in the bottom side of thermal conductive silicon film body (10).
2. electronics thermal conductive silicon film according to claim 1 is characterized in that described thermal conductive silicon film body (10) is shaped as circle, ellipse or quadrangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206754989U CN201967291U (en) | 2010-12-22 | 2010-12-22 | Electronic heat-conducting silicon sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206754989U CN201967291U (en) | 2010-12-22 | 2010-12-22 | Electronic heat-conducting silicon sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201967291U true CN201967291U (en) | 2011-09-07 |
Family
ID=44529845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206754989U Expired - Fee Related CN201967291U (en) | 2010-12-22 | 2010-12-22 | Electronic heat-conducting silicon sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201967291U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102533152A (en) * | 2012-01-18 | 2012-07-04 | 苏州领胜电子科技有限公司 | Heat-conducting siliconfilm and manufacturing method thereof |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
| CN111561835A (en) * | 2020-05-18 | 2020-08-21 | 中国科学院光电技术研究所 | Tool for quickly forming radial temperature gradient distribution |
-
2010
- 2010-12-22 CN CN2010206754989U patent/CN201967291U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102533152A (en) * | 2012-01-18 | 2012-07-04 | 苏州领胜电子科技有限公司 | Heat-conducting siliconfilm and manufacturing method thereof |
| CN102533152B (en) * | 2012-01-18 | 2013-10-23 | 苏州领胜电子科技有限公司 | Heat-conducting siliconfilm and manufacturing method thereof |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
| CN110413087B (en) * | 2019-08-13 | 2022-06-07 | 徐州工业职业技术学院 | Computer motherboard chip heat dissipation silica gel pastes dress device |
| CN111561835A (en) * | 2020-05-18 | 2020-08-21 | 中国科学院光电技术研究所 | Tool for quickly forming radial temperature gradient distribution |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20141222 |
|
| EXPY | Termination of patent right or utility model |