CN110413087A - A kind of computer motherboard chip cooling silica gel mounting device - Google Patents
A kind of computer motherboard chip cooling silica gel mounting device Download PDFInfo
- Publication number
- CN110413087A CN110413087A CN201910743103.XA CN201910743103A CN110413087A CN 110413087 A CN110413087 A CN 110413087A CN 201910743103 A CN201910743103 A CN 201910743103A CN 110413087 A CN110413087 A CN 110413087A
- Authority
- CN
- China
- Prior art keywords
- storehouse
- seat
- glue
- computer motherboard
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 239000000741 silica gel Substances 0.000 title claims abstract description 19
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 48
- 238000005507 spraying Methods 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 238000004513 sizing Methods 0.000 claims abstract description 13
- 238000003032 molecular docking Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Silicon Compounds (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910743103.XA CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910743103.XA CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110413087A true CN110413087A (en) | 2019-11-05 |
CN110413087B CN110413087B (en) | 2022-06-07 |
Family
ID=68367176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910743103.XA Active CN110413087B (en) | 2019-08-13 | 2019-08-13 | Computer motherboard chip heat dissipation silica gel pastes dress device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110413087B (en) |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201967291U (en) * | 2010-12-22 | 2011-09-07 | 深圳市固加实业发展有限公司 | Electronic heat-conducting silicon sheet |
CN202156098U (en) * | 2011-08-04 | 2012-03-07 | 厦门市弘瀚电子科技有限公司 | LED (light-emitting diode) glue film sticking machine |
CN202402416U (en) * | 2012-01-12 | 2012-08-29 | 焦作市神盾科技有限公司 | Glue-dispersion chip mounting machine |
CN203575015U (en) * | 2013-10-18 | 2014-04-30 | 江苏宝浦莱半导体有限公司 | Surface mount system |
CN103831208A (en) * | 2013-12-27 | 2014-06-04 | 广州奥迪通用照明有限公司 | Gluing mechanism |
CN104517861A (en) * | 2013-10-04 | 2015-04-15 | 株式会社日立高新技术仪器 | Chip mounting device and adhesive coating method |
CN105499067A (en) * | 2015-11-27 | 2016-04-20 | 新奥光伏能源有限公司 | Automatic dispensing chip mounter for manufacturing trays |
CN205194687U (en) * | 2015-12-07 | 2016-04-27 | 东莞市零度导热材料有限公司 | A heat conduction silica gel sheet for cell -phone |
CN105742214A (en) * | 2016-03-23 | 2016-07-06 | 广东恒鑫智能装备股份有限公司 | Chip gluing apparatus |
CN105857712A (en) * | 2016-04-22 | 2016-08-17 | 合肥宝亿自动化科技有限公司 | Automatic silicone stripe adhering device |
CN205828401U (en) * | 2016-06-23 | 2016-12-21 | 浙江拓峰科技有限公司 | Solar base plate point glue chip mounter and slide pay-off thereof |
CN106654342A (en) * | 2017-01-10 | 2017-05-10 | 深圳市欧盛自动化有限公司 | Full-automatic silicone pad pasting machine |
CN107396604A (en) * | 2017-08-04 | 2017-11-24 | 歌尔科技有限公司 | A kind of method, smart machine and system for improving smart machine receiving sensitivity |
CN206966012U (en) * | 2017-05-12 | 2018-02-06 | 南京理工大学紫金学院 | One kind can remote monitoring and temperature automatically controlled point gum machine |
CN109107835A (en) * | 2018-10-12 | 2019-01-01 | 东莞市耀野自动化有限公司 | A kind of Full-automatic spot gluing patch device |
CN109340233A (en) * | 2018-11-28 | 2019-02-15 | 深圳市诺峰光电设备有限公司 | A kind of electronic product auxiliary material automation make-up machine |
CN208786807U (en) * | 2018-09-21 | 2019-04-26 | 蚌埠崧欣电子科技有限公司 | A kind of dispersing and curing device for LED power |
CN208800322U (en) * | 2018-08-14 | 2019-04-30 | 苏州万合电子有限公司 | A kind of process units for single side adhesion heat conductive silica gel gasket |
-
2019
- 2019-08-13 CN CN201910743103.XA patent/CN110413087B/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201967291U (en) * | 2010-12-22 | 2011-09-07 | 深圳市固加实业发展有限公司 | Electronic heat-conducting silicon sheet |
CN202156098U (en) * | 2011-08-04 | 2012-03-07 | 厦门市弘瀚电子科技有限公司 | LED (light-emitting diode) glue film sticking machine |
CN202402416U (en) * | 2012-01-12 | 2012-08-29 | 焦作市神盾科技有限公司 | Glue-dispersion chip mounting machine |
CN104517861A (en) * | 2013-10-04 | 2015-04-15 | 株式会社日立高新技术仪器 | Chip mounting device and adhesive coating method |
CN203575015U (en) * | 2013-10-18 | 2014-04-30 | 江苏宝浦莱半导体有限公司 | Surface mount system |
CN103831208A (en) * | 2013-12-27 | 2014-06-04 | 广州奥迪通用照明有限公司 | Gluing mechanism |
CN105499067A (en) * | 2015-11-27 | 2016-04-20 | 新奥光伏能源有限公司 | Automatic dispensing chip mounter for manufacturing trays |
CN205194687U (en) * | 2015-12-07 | 2016-04-27 | 东莞市零度导热材料有限公司 | A heat conduction silica gel sheet for cell -phone |
CN105742214A (en) * | 2016-03-23 | 2016-07-06 | 广东恒鑫智能装备股份有限公司 | Chip gluing apparatus |
CN105857712A (en) * | 2016-04-22 | 2016-08-17 | 合肥宝亿自动化科技有限公司 | Automatic silicone stripe adhering device |
CN205828401U (en) * | 2016-06-23 | 2016-12-21 | 浙江拓峰科技有限公司 | Solar base plate point glue chip mounter and slide pay-off thereof |
CN106654342A (en) * | 2017-01-10 | 2017-05-10 | 深圳市欧盛自动化有限公司 | Full-automatic silicone pad pasting machine |
CN206966012U (en) * | 2017-05-12 | 2018-02-06 | 南京理工大学紫金学院 | One kind can remote monitoring and temperature automatically controlled point gum machine |
CN107396604A (en) * | 2017-08-04 | 2017-11-24 | 歌尔科技有限公司 | A kind of method, smart machine and system for improving smart machine receiving sensitivity |
CN208800322U (en) * | 2018-08-14 | 2019-04-30 | 苏州万合电子有限公司 | A kind of process units for single side adhesion heat conductive silica gel gasket |
CN208786807U (en) * | 2018-09-21 | 2019-04-26 | 蚌埠崧欣电子科技有限公司 | A kind of dispersing and curing device for LED power |
CN109107835A (en) * | 2018-10-12 | 2019-01-01 | 东莞市耀野自动化有限公司 | A kind of Full-automatic spot gluing patch device |
CN109340233A (en) * | 2018-11-28 | 2019-02-15 | 深圳市诺峰光电设备有限公司 | A kind of electronic product auxiliary material automation make-up machine |
Also Published As
Publication number | Publication date |
---|---|
CN110413087B (en) | 2022-06-07 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231107 Address after: No. 5 Yanli Road, Yantou Town, Pujiang County, Jinhua City, Zhejiang Province, 322203 Patentee after: Dudi (Zhejiang) New Materials Co.,Ltd. Address before: No. 819, 8th Floor, Unit 1, Building 2, No. 978, Section 1, Riyue Avenue, Qingyang District, Chengdu City, Sichuan Province, 610031 Patentee before: Sicguo (Chengdu) Intellectual Property Operation Co.,Ltd. Effective date of registration: 20231107 Address after: No. 819, 8th Floor, Unit 1, Building 2, No. 978, Section 1, Riyue Avenue, Qingyang District, Chengdu City, Sichuan Province, 610031 Patentee after: Sicguo (Chengdu) Intellectual Property Operation Co.,Ltd. Address before: 221140 No.1 Xiangwang South Road, Gulou District, Xuzhou City, Jiangsu Province Patentee before: XUZHOU College OF INDUSTRIAL TECHNOLOGY |
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TR01 | Transfer of patent right |