CN202402416U - Glue-dispersion chip mounting machine - Google Patents
Glue-dispersion chip mounting machine Download PDFInfo
- Publication number
- CN202402416U CN202402416U CN2012200122700U CN201220012270U CN202402416U CN 202402416 U CN202402416 U CN 202402416U CN 2012200122700 U CN2012200122700 U CN 2012200122700U CN 201220012270 U CN201220012270 U CN 201220012270U CN 202402416 U CN202402416 U CN 202402416U
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- Prior art keywords
- chip
- glue
- straight
- chip mounter
- chip mounting
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- Expired - Fee Related
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Abstract
The utility model discloses a glue-dispersion chip mounting machine which comprises a rack, and a large board card base material transportation mechanism, a glue dispersion mechanism, a material absorption chip mounting mechanism, a chip distributing mechanism and a control panel which are installed on the rack, wherein the glue dispersion mechanism is positioned deadly above the large board card base material transportation mechanism; and the chip distributing mechanism is positioned below the material absorption chip mounting mechanism and above the large board card base material transportation mechanism. Material absorbing and chip mounting are fused on a same mechanism, the chip mounting efficiency and speed are high; and the chip distributing mechanism provided by the utility model adopts two linear railways, chips can be accurately transported to a head absorbing and mounting part, and materials can be fed rapidly and accurately. The glue-dispersion chip mounting machine provided by the utility model is reasonable in structure, the matching among mechanisms is compact, and the working efficiency is high.
Description
Technical field
The utility model relates to a kind of some glue chip mounter.
Background technique
In commercial production, often need two tablets be sticked on together, the for example making of IC-card need be carried out cutting and obtain the finished product IC-card with a plurality of chip attach on a big integrated circuit board base-material again.IC-card (Integrated Circuit Card) that is smart card (smart card), smart card (intelligent card), microcircuit card (microcircuit card) or the chip card etc. often said.It is a microelectronic chip to be embedded meet in the big integrated circuit board base-material of ISO7816 standard, and at last through cutting, a big material can divide the card that is cut into different size.The IC-card chip mounter is a nucleus equipment of realizing IC-card stickup flow process, and its paster speed, paster efficient, paster stability decision smart card manufacturing efficiency are the bottlenecks of IC-card production line.
Summary of the invention
The utility model technical problem to be solved provides that a kind of paster speed is fast, paster efficient high, the some glue chip mounter of paster good stability.
In order to solve the problems of the technologies described above; The utility model provides a kind of some glue chip mounter; This glue chip mounter comprises frame and rack-mounted big integrated circuit board base-material conveyer, glue applying mechanism, suction paster mechanism, chip distribution mechanism and control panel; Said glue applying mechanism is arranged in the top of big integrated circuit board base-material conveyer, and said chip distribution mechanism is positioned at the below of suction paster mechanism and the top of big integrated circuit board base-material conveyer.
Further, said some glue chip mounter also has a chip recovering mechanism.
Further; Described suction paster mechanism be by a stepper motor, two synchronizing wheels, one synchronously band, balance staff, two bearing supports, several inhale and paste head and amplitude of oscillation snubbers constitute; Several are installed on said balance staff inhale obedient head; Said stepper motor is through said two synchronizing wheels of band drive synchronously, and said balance staff is installed between two bearing supports, and said synchronizing wheel connects balance staff.
Further; Described chip distribution mechanism installs crossbeam by a second-rate rectilinear orbit, three stream rectilinear orbit, four straight-line oscillation devices, four vibration isolators and one to constitute; Said second-rate rectilinear orbit is fixed on two straight-line oscillation devices; Said three stream rectilinear orbits are fixed on two other straight-line oscillation device, and per two straight-line oscillation devices are with a driver drives, and the installation crossbeam that is fixed with four straight-line oscillation devices connects through vibration isolator and frame.
Further, the chip recovering mechanism is to drag a reclaimed materials belt by a drive motor to constitute, and this chip recovering mechanism connects the chip distribution mechanism.
The beneficial effect of the utility model is: it is higher that the suction of the utility model technological scheme and paster merge in a mechanism paster efficient and speed; The chip distribution mechanism of the utility model adopts two rectilinear orbits; Chip can be transported to accurately to inhale and paste a position, realizes feeding quick and precisely.The utility model is rational in infrastructure, cooperates compactness, high working efficiency between each mechanism.
Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail.
Description of drawings
Fig. 1 is the utility model point glue chip mounter structural representation.
Fig. 2 is the structural representation of the utility model point glue chip mounter suction paster mechanism.
Fig. 3 is the structural representation of the utility model point sticker sheet machine chip distribution mechanism.
Among the figure: 1, control panel; 2, big integrated circuit board base-material conveyer; 3, big integrated circuit board base-material to be transported; 4, glue applying mechanism; 5, suction paster mechanism; 6, chip recovering mechanism; 7, chip distribution mechanism; 8, frame; 9, stepper motor; 10, synchronizing wheel; 11, be with synchronously; 12, inhale obedient head; 13, balance staff; 14, amplitude of oscillation snubber; 15, bearing support; 16, three stream rectilinear orbits; 17, second-rate rectilinear orbit; 18, straight-line oscillation device; 19, vibration isolator; 20, crossbeam is installed.
Embodiment
As shown in Figure 1; The point glue chip mounter that the utility model provides comprises frame 8 and rack-mounted big integrated circuit board base-material conveyer 2, glue applying mechanism 4, suction paster mechanism 5, chip recovering mechanism 6, chip distribution mechanism 7 and control panel 1; Said glue applying mechanism 4 is arranged in the top of big integrated circuit board base-material conveyer 2, and said chip distribution mechanism 7 is positioned at the below of suction paster mechanism 5 and the top of big integrated circuit board base-material conveyer 2; Said chip recovering mechanism 6 is to drag a reclaimed materials belt by a drive motor to constitute, and this chip recovering mechanism 6 connects chip distribution mechanism 7.
As shown in Figure 2; The utility model point glue chip mounter suction paster mechanism 5 be by a stepper motor 9, two synchronizing wheels 10, one be with synchronously 11, balance staffs 13, two bearing supports 15, five inhale paste 12 and amplitude of oscillation snubber 14 constitute; Install five on the said balance staff 13 and inhale obedient 12; Said stepper motor 9 is with 11 to drive said two synchronizing wheels 10 through one synchronously, and said balance staff 13 is installed between two bearing supports 15, and said synchronizing wheel 10 connects balance staff 13; Stepper motor 9 provides pulse signal by PLC; Through synchronizing wheel 10, be with 11 to drive the balance staffs rotation synchronously; Owing to adopt the synchronous pulley structure, guaranteed kinematic accuracy, the suction subsides head that is fixed on the balance staff swings back and forth; Can swing to the suction station respectively and paste the material station, the scope of the amplitude of oscillation snubber 14 control amplitudes of oscillation.
As shown in Figure 3; The utility model point sticker sheet machine chip distribution mechanism 7 is by a second-rate rectilinear orbit 17, one piece three stream rectilinear orbit 16, four straight-line oscillation devices 18, four vibration isolators 19 and one crossbeam 20 to be installed to constitute; Said second-rate rectilinear orbit 17 is fixed on two straight-line oscillation devices; Said three stream rectilinear orbits 16 are fixed on two other straight-line oscillation device; Per two straight-line oscillation devices are with a driver drives, guarantee that two are directly shaken with frequently, with width of cloth synchronous vibration, with the chip of per pass stream on the track steadily, accurately send to.The installation crossbeam 20 that is fixed with four straight-line oscillation devices connects through vibration isolator 19 and frame 8; Said chip recovering mechanism 6 is to drag a reclaimed materials belt by a drive motor to constitute, and this chip recovering mechanism 6 connects chip distribution mechanism 7; Unnecessary chip is fallen on the reclaimed materials belt, under the driving of reclaiming motor, the chip that falls is reclaimed.
The working principle of the utility model is described below: during through control panel 1 operation, chip distribution mechanism 7 is transported to specified position, big integrated circuit board base-material conveyer 2 with chip; Drive big integrated circuit board base-material 3 to be transported moves ahead; When arriving first certain bits, glue applying mechanism 4 control starting point glue, some glue is accomplished continued and is moved ahead; When arriving second certain bits, suction paster mechanism 5 control beginning pasters.In above-mentioned work engineering, unnecessary chip is reclaimed by chip recovering mechanism 6.All mechanisms are combined into integral body by frame 8, thereby realize continuously the work of reliable some sticker sheet.
Disclosed some glue chip mounter of the utility model can be applied to have advantages such as paster speed is fast, paster efficient height, paster good stability in the industrial processes that (manufacturing process of similar IC-card point sticker sheet) bond together two tablets.
The protection domain of the utility model is not limited to the foregoing description, and every conspicuous technology distortion of being done according to the utility model know-why all falls within the protection domain of the utility model.
Claims (5)
1. some glue chip mounter; It is characterized in that; This glue chip mounter comprises frame and rack-mounted big integrated circuit board base-material conveyer, glue applying mechanism, suction paster mechanism, chip distribution mechanism and control panel; Said glue applying mechanism is arranged in the top of big integrated circuit board base-material conveyer, and said chip distribution mechanism is positioned at the below of suction paster mechanism and the top of big integrated circuit board base-material conveyer.
2. according to claim 1 some glue chip mounter is characterized in that, said some glue chip mounter also has a chip recovering mechanism.
3. according to claim 1 some glue chip mounter; It is characterized in that; Described suction paster mechanism be by a stepper motor, two synchronizing wheels, one synchronously band, balance staff, two bearing supports, several inhale and paste head and amplitude of oscillation snubbers constitute, several are installed on said balance staff inhale obedient head, said stepper motor through one synchronously band drive said two synchronizing wheels; Said balance staff is installed between two bearing supports, and said synchronizing wheel connects balance staff.
4. according to claim 1 some glue chip mounter; It is characterized in that; Described chip distribution mechanism installs crossbeam by a second-rate rectilinear orbit, three stream rectilinear orbit, four straight-line oscillation devices, four vibration isolators and one to constitute; Said second-rate rectilinear orbit is fixed on two straight-line oscillation devices; Said three stream rectilinear orbits are fixed on two other straight-line oscillation device, and per two straight-line oscillation devices are with a driver drives, and the installation crossbeam that is fixed with four straight-line oscillation devices connects through vibration isolator and frame.
5. according to claim 2 some glue chip mounter is characterized in that, said chip recovering mechanism is to drag a reclaimed materials belt by a drive motor to constitute, and this chip recovering mechanism connects the chip distribution mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200122700U CN202402416U (en) | 2012-01-12 | 2012-01-12 | Glue-dispersion chip mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200122700U CN202402416U (en) | 2012-01-12 | 2012-01-12 | Glue-dispersion chip mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202402416U true CN202402416U (en) | 2012-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200122700U Expired - Fee Related CN202402416U (en) | 2012-01-12 | 2012-01-12 | Glue-dispersion chip mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202402416U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103159167A (en) * | 2013-03-22 | 2013-06-19 | 常熟艾科瑞思封装自动化设备有限公司 | Sensor encapsulation equipment |
| CN104879358A (en) * | 2015-06-04 | 2015-09-02 | 上海交通大学 | Automatic metal piece connecting device and method under oxygen-free environment |
| CN105499067A (en) * | 2015-11-27 | 2016-04-20 | 新奥光伏能源有限公司 | Automatic dispensing chip mounter for manufacturing trays |
| CN108580183A (en) * | 2018-05-10 | 2018-09-28 | 深圳市益华兴包装制品有限公司 | A kind of point glue equipment and its dispensing method of Full-automatic folding-gluing machine |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
-
2012
- 2012-01-12 CN CN2012200122700U patent/CN202402416U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103159167A (en) * | 2013-03-22 | 2013-06-19 | 常熟艾科瑞思封装自动化设备有限公司 | Sensor encapsulation equipment |
| CN103159167B (en) * | 2013-03-22 | 2015-09-30 | 江苏艾科瑞思封装自动化设备有限公司 | Sensor encapsulation equipment |
| CN104879358A (en) * | 2015-06-04 | 2015-09-02 | 上海交通大学 | Automatic metal piece connecting device and method under oxygen-free environment |
| CN104879358B (en) * | 2015-06-04 | 2017-01-18 | 上海交通大学 | Automatic metal piece connecting device and method under oxygen-free environment |
| CN105499067A (en) * | 2015-11-27 | 2016-04-20 | 新奥光伏能源有限公司 | Automatic dispensing chip mounter for manufacturing trays |
| CN105499067B (en) * | 2015-11-27 | 2018-01-12 | 新奥光伏能源有限公司 | A kind of automatic glue-dispersion chip mounting machine for being used to prepare pallet |
| CN108580183A (en) * | 2018-05-10 | 2018-09-28 | 深圳市益华兴包装制品有限公司 | A kind of point glue equipment and its dispensing method of Full-automatic folding-gluing machine |
| CN108580183B (en) * | 2018-05-10 | 2019-07-12 | 深圳市益华兴包装制品有限公司 | A kind of point glue equipment and its dispensing method of Full-automatic folding-gluing machine |
| CN110413087A (en) * | 2019-08-13 | 2019-11-05 | 徐州工业职业技术学院 | A kind of computer motherboard chip cooling silica gel mounting device |
| CN110413087B (en) * | 2019-08-13 | 2022-06-07 | 徐州工业职业技术学院 | Computer motherboard chip heat dissipation silica gel pastes dress device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20140112 |