CN103159167A - Sensor encapsulation equipment - Google Patents
Sensor encapsulation equipment Download PDFInfo
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- CN103159167A CN103159167A CN2013100940370A CN201310094037A CN103159167A CN 103159167 A CN103159167 A CN 103159167A CN 2013100940370 A CN2013100940370 A CN 2013100940370A CN 201310094037 A CN201310094037 A CN 201310094037A CN 103159167 A CN103159167 A CN 103159167A
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Abstract
The invention discloses sensor encapsulation equipment. The equipment comprises a base, at least one conveying mechanism, a driving mechanism, a plurality of dispensing mechanisms, a plurality of crystal solidifying mechanisms and a plurality of crystal supply mechanisms, wherein the conveying mechanism is slidably connected with the base; the driving mechanism is arranged on the base and is used for driving the conveying mechanism to reach multiple stations; the dispensing mechanisms are arranged on the base at intervals along the movement direction of the conveying mechanism; the crystal solidifying mechanisms are also arranged on the base at intervals along the movement direction of the conveying mechanism and are distributed behind the dispensing mechanisms respectively; the crystal supply mechanisms are arranged on the base at intervals and are distributed on one sides of the crystal solidifying mechanisms respectively; each crystal supply mechanism comprises an ejector pin mechanism and a crystal taking movement mechanism; the crystal taking movement mechanisms are slidably and/or rotatably connected with the base; the ejector pin mechanisms are arranged on the base and below the movement direction of the crystal taking movement mechanisms; and the multiple stations are formed in positions at which the dispensing mechanisms and the crystal solidifying mechanisms are located. The sensor encapsulation equipment can be used for improving the encapsulation efficiency, reducing the intervention of workers, and improving the consistency of finished products.
Description
Technical field
The present invention relates to the semiconductor packaging field, particularly a kind of sensor package equipment.
Background technology
The multi-chip sensor is widely used in every field and product now, as being used for MEMS(Micro-Electro-Mechanical Systems, MEMS) etc. the sensor in product.Mainly comprised MCM(Multichip Module for this class multi-chip packaging of the fiber grating sensors mode now, multi-chip module) mode and SIP(System In a Package, system in package) mode etc., and these encapsulation are mainly to realize by means of artificial or the half artificial mode of production.
Realize by manual type, generally to complete by the operation of respective numbers according to number of chips, if the sensor with two chip blocks is encapsulated, complete by first, second two procedures, namely a workman first carries out a glue and die bond on a position of substrate, and then by own or hand to the next bit workman and carry out again a glue and die bond on another position of substrate, complete the chip of whole sensor and the packaging operation of substrate.Due to, all production scale in large quantity now, encapsulate with this manual type, in the handshaking of two procedures, need to material be transported to next process from a procedure by artificial or equipment toward contact, sometimes also can need first material to be collected operation, then also need material is proceeded apportioned effort after complete transporting, give the operation that the workman carries out next process.
Realize it being generally to complete packaging operation by many similar equipment by half manual type, these equipment are respectively completed the operation to the substrate with a slice chip package, are therefore that the quantity of these equipment need to be set according to the quantity of chip.Similarly that this mode is also to need by artificial or equipment, material to be transported to next process from a procedure in the handshaking of two procedures with manual type.
Top several modes of saying mainly exist following shortcoming:
At first, artificial mode has all dropped into a large amount of manpowers from the packaging operation to the transport operation etc., high to the manpower degree of dependence, and half artificial mode, although realized the machine operation of packaging operation, but it is not for transport operation etc. or need to drop into a certain amount of manpower, still low to the degree of dependence of manpower; What can see is: on the one hand, artificial or half artificial operating type, its production efficiency is also obviously not high, and workman's mood just certainly will all can have influence on its work, makes working (machining) efficiency unstable; On the other hand, in today that human cost day by day is expected to rise and the recruitment famine occurred, many enterprises are all doing one's utmost to compress number of workers, control the cost payout of enterprise or guarantee the normal production of enterprise, and this operating type obviously is difficult to satisfy the demand of enterprise;
Secondly, in above-mentioned mode, all to disconnect carrying out operation between each procedure, process lacks continuity, and the operation that separates between each procedure also can have influence on the uniformity of operation effectiveness, and each species diversity that occurs between finished product also can cause the control that is difficult to product yield further, has affected potentially the quality of finished product.
Therefore, in order to complete better the operation of multi-chip packaging of the fiber grating sensors, need a kind of equipment that can overcome above-mentioned shortcoming badly.
Summary of the invention
Purpose of the present invention is exactly for the problems referred to above, provides a kind of and can improve packaging operation efficient, reduces manual intervention and improve the conforming sensor package equipment of finished product.
To achieve these goals, the invention provides following technical scheme: sensor package equipment, for a plurality of chips of sensor being fitted in the substrate of sensor, this sensor package equipment comprises:
Support;
At least one conveying mechanism, it is slidably connected on above-mentioned support;
Driving mechanism, it is arranged on above-mentioned support, is used for driving above-mentioned conveying mechanism and arrives a plurality of stations;
A plurality of glue applying mechanism, its direction of motion along above-mentioned conveying mechanism is arranged at intervals on above-mentioned support, and these a plurality of glue applying mechanism include at least one Glue dripping head;
A plurality of die bond mechanism, its direction of motion along above-mentioned conveying mechanism is arranged at intervals on above-mentioned support, be divided into each above-mentioned glue applying mechanism after, this die bond mechanism comprises die bond swing arm and the swing arm drive device that drives this die bond swing arm, and an end and the above-mentioned support of this die bond swing arm are rotationally connected;
The brilliant mechanism of a plurality of confessions, its interval is arranged on above-mentioned support, be divided into a side position of each above-mentioned die bond mechanism, the brilliant mechanism of this confession comprises ejector pin mechanism and gets brilliant motion, this gets brilliant motion and above-mentioned support is slidably connected and/or is rotationally connected, and this ejector pin mechanism is arranged on above-mentioned support, this gets the below of the direction of motion of brilliant motion;
The position at above-mentioned a plurality of glue applying mechanism and a plurality of die bond mechanisms place forms above-mentioned a plurality of stations.
further, above-mentioned sensor package equipment also comprises an electrical control mechanism, itself and above-mentioned a plurality of glue applying mechanism, a plurality of die bond mechanisms and a plurality of confession brilliant mechanism are electrically connected to respectively, be used for controlling and driving above-mentioned a plurality of glue applying mechanism, a plurality of die bond mechanisms and the operation of a plurality of confession brilliant mechanism, this electrical control mechanism comprises CPU, drive circuit board and motor, this CPU is electrically connected to this drive circuit board, this drive circuit board is electrically connected to this motor, be used for transmitting control signal to described motor by described drive circuit board, this motor and described a plurality of glue applying mechanism, a plurality of die bond mechanism with are connected confession brilliant mechanism and connect respectively.
Further, above-mentioned sensor package equipment also comprises shell, and it covers on above-mentioned support, is provided with visual window on this shell.
Further, above-mentioned sensor package equipment also comprises cutting agency, and it is arranged on above-mentioned support, after last in above-mentioned a plurality of die bond mechanism, and this cutting agency comprises the material grasping manipulator.
Further, above-mentioned sensor package equipment also comprises at least one pallet, and it is arranged on above-mentioned conveying mechanism.
Further, above-mentioned conveying mechanism comprises guide rail and is slidably connected to slide on this guide rail.
Further, above-mentioned driving mechanism comprises a plurality of cylinders, and its interval is arranged on a plurality of positions of above-mentioned support.
Further, above-mentioned glue applying mechanism also comprises the camera model corresponding with above-mentioned Glue dripping head.
Further, the above-mentioned brilliant motion of getting comprises base and gets brilliant fixture, this base and above-mentioned support are slidably connected and/or are rotationally connected, this is got brilliant fixture and comprises clip arm and wafer jig, one end of this clip arm is fixedly connected with above-mentioned base, the other end is fixedly connected with above-mentioned wafer jig, and above-mentioned ejector pin mechanism is arranged at the below of the direction of motion of this wafer jig.
Further, the other end of above-mentioned die bond swing arm is provided with suction nozzle.
Adopt the beneficial effect of above technical scheme to be:
1) sensor package equipment of the present invention is provided with a plurality of glue applying mechanism on a support, a plurality of die bond mechanism, the brilliant mechanism of a plurality of confessions, at least one conveying mechanism and driving mechanism, wherein, conveying mechanism and driving mechanism are used for convey materials and arrive on each processing stations, a plurality of glue applying mechanism and a plurality of die bond mechanism arrange along the direction of motion interval of conveying mechanism and form these stations, and a plurality of die bond branch constructions are after each glue applying mechanism, the brilliant mechanism of a plurality of confessions is divided into again on a side position of each die bond mechanism, that is to say, glue applying mechanism, die bond mechanism and be what intert to arrange on support for brilliant mechanism, so also just formed the packaging mechanism that many covers are used for some glue and die bond on support, every cover packaging mechanism can be responsible for the packaging operation of a slice chip, can see from above-mentioned, this equipment makes the inductor of multi-chip can complete the encapsulation of multi-plate chip on an equipment, it compared with prior art, the artificial operations such as carrying have been removed from, can improve further the operating efficiency of encapsulation, and reduce artificial intervention,
2)Introduction to technical scheme from first o'clock can be seen, continual operating type on an equipment compared with prior art, can improve the uniformity of packaging effect, is convenient to control the yield of product, to guarantee the quality of finished product;
3) in the further embodiment of the present invention, the many covers packaging mechanism in this equipment has used same electrical control mechanism, can control these packaging mechanisms easily and the operation such as driving, so that hold the uniformity of packaging operation;
4) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises shell, and it covers on support, is provided with visual window on this shell, can also facilitate the staff to observe inner operation situation when interior arrangement is protected;
5) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for the diode finished product that encapsulation is completed in crawl, convenient arrangement shipment;
6) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on conveying mechanism, is used for the drop target thing.
Description of drawings
Fig. 1 is the structural representation of sensor package equipment of the present invention front angle in embodiment 1.
Fig. 2 is the structural representation of sensor package equipment of the present invention depression angle in embodiment 1.
Fig. 3 is that sensor package equipment of the present invention adds the structural representation of casing in embodiment 1.
Fig. 4 is the structural representation of sensor package equipment of the present invention front angle in embodiment 2.
Among them, 1 base, 11. Shell, 111. Available window 2. Conveying mechanism 21. Rail 22. Slide 31 first dispensing mechanism 311. Dispensing head 312. Camera module 313. sensors, 314. stand 32 first solid crystal bodies 321. crystalline solid arm, 322. swing arm drive, the first four states first for crystal institutions 41. thimble mechanism 411. thimble, 412. thimble holder, 42 take grain movement mechanism 421. base 422. gripper arms, 423. wafer fixture 51 second dispensing mechanism, 52 second solid crystal body, 6 second for crystal institutions, 71. manipulator, 711 . manipulator, 712. mechanical claw, 72. bearing, 8. driving mechanism 81. cylinder, 9. electronic control mechanism 10. tray 12. third dispensing mechanism 13. third solid crystal agencies, 14 The third mechanism for grain.
The specific embodiment
Describe the preferred embodiment of the present invention in detail below in conjunction with accompanying drawing.
Embodiment 1
as shown in Figure 1 and Figure 2, the sensor package equipment in the present embodiment comprises: support 1, one conveying mechanism 2, it is slidably connected on support 1, driving mechanism 6, it is arranged on support 1, is used for driving conveying mechanism 2 and arrives four stations, the first glue applying mechanism 31, its direction of motion along conveying mechanism 2 is arranged on support 1, and this first glue applying mechanism 31 comprises two Glue dripping heads 311, the first die bond mechanism 32, its direction of motion along conveying mechanism 2 is arranged on support 1, after the first glue applying mechanism 31, the swing arm drive device 322 that this first die bond mechanism 32 comprises die bond swing arm 321 and drives this die bond swing arm 321, one end and the support 1 of this die bond swing arm 321 are rotationally connected, and swing arm drive device 322 adopts nation 322 to implement in the present embodiment, first for brilliant mechanism 4, it is arranged on support 1, one side position of the first die bond mechanism 32, the brilliant mechanism 4 of this first confession comprises ejector pin mechanism 41 and gets brilliant motion 42, getting brilliant motion 42 is slidably connected and is rotationally connected with support 1, realize getting the motion of brilliant motion 42 all directions, be slidably connected and realize by slide rail and slide etc. are installed, be rotationally connected and realize by articulated elements etc. is installed, ejector pin mechanism 41 is arranged on support 1, get the below of the direction of motion of brilliant motion 42, the above-mentioned connected mode of getting brilliant motion 42 and support 1 also can be set to be slidably connected or be rotationally connected, to satisfy the use needs in practical operation, second point gluing mechanism 51, it is arranged on support 1, the first die bond mechanism 32 and first is for after brilliant mechanism 4, and its structure is identical with the first glue applying mechanism 31, the second die bond mechanism 52, it is arranged on support 1, after the first glue applying mechanism 31, and its structure is identical with the first die bond mechanism 32, second for brilliant mechanism 6, and it is arranged on support 1, a side position of the second die bond mechanism 52.The first above-mentioned glue applying mechanism 31 and second point gluing mechanism 51, the first die bond mechanism 32 and the second die bond mechanism 52, first are arranged at intervals on support 1 for brilliant mechanism 6 for brilliant mechanism 4 and second, wherein, the position at the first glue applying mechanism 31, the first die bond mechanism 32, second point gluing mechanism 51 and the second die bond mechanism 52 places forms four above-mentioned stations.
Above-mentioned conveying mechanism 2 can also be set to more than one, adapts to more massive operation needs.The quantity of above-mentioned Glue dripping head 311 also can be set to one or more than two, satisfies different operation needs, as less in cultivation scale can only arrange one, more can arrange more than two as cultivation scale, should arrange at least one.
As shown in Figure 1, above-mentioned ejector pin mechanism 41 comprises thimble 411 and thimble seat 412, thimble 411 is fixedly connected on thimble seat 412, thimble seat 412 is slidably connected and is rotationally connected with support 1, realize the motion of ejector pin mechanism 41 all directions, be slidably connected and realize by slide rail and slide etc. are installed, be rotationally connected and realize by articulated elements etc. is installed.
as shown in Figure 1, above-mentioned sensor package equipment also comprises an electrical control mechanism 9, itself and above-mentioned the first glue applying mechanism 31, second point gluing mechanism 51, the first die bond mechanism 32, the second die bond mechanism 52, first is electrically connected to respectively for brilliant mechanism 6 for brilliant mechanism 4 and second, be used for controlling and driving these mechanism's operations, electrical control mechanism 9 comprises CPU, drive circuit board and motor (not shown), CPU is electrically connected to drive circuit board, drive circuit board is electrically connected to motor, be used for transmitting control signal to motor by drive circuit board, motor is connected respectively with above-mentioned mechanism.
As shown in Figure 3, above-mentioned sensor package equipment also comprises shell 11, and it covers on support 1, is provided with visual window 111 on this shell 11, and visual window 111 can be offered a fan or many fans.
As shown in Figure 1 and Figure 2, above-mentioned sensor package equipment also comprises cutting agency, and it is arranged on support 1, after the second die bond mechanism 52, be used for the sensor that encapsulation is completed is carried out blanking and readjusting operations, this cutting agency comprises manipulator 71, has also comprised bearing 72.This manipulator 71 comprises mechanical arm 711 and gripper 712.Bearing 72 is slidably connected with support 1, and mechanical arm 711 is rotationally connected with bearing 72, can realize like this motion of manipulator 71 multiple directions.
As shown in Figure 1, above-mentioned sealed in unit also comprises a pallet 10, and it is arranged on conveying mechanism 2, is used for taking up workpiece.
As shown in Figure 1 and Figure 2, above-mentioned conveying mechanism 2 comprises guide rail 21 and is slidably connected to slide 22 on this guide rail, makes conveying mechanism 2 to slide.Guide rail 21 and slide 22 also can replace implementing with modes of being slidably connected well known in the prior art such as chute and slide blocks.
As shown in Figure 1, above-mentioned driving mechanism 8 comprises four cylinders 81, and its interval is arranged on four positions of support 1.How much quantity of cylinder 81 should according to the adjusting of station, but at least all more than one.
As shown in Figure 1 and Figure 2, the first glue applying mechanism 31 also comprises the camera model corresponding with Glue dripping head 311 312, second point gluing mechanism 32 has also comprised this camera model, and camera model can guarantee respectively the accuracy of the some glue position of the first glue applying mechanism 31 and second point gluing mechanism 32.The first glue applying mechanism 31 can also comprise support 314, and second point gluing mechanism 32 also can comprise this support.
As shown in Figure 1, the first above-mentioned glue applying mechanism 31 also comprises the sensor 313 for detection of object, and it is electrically connected to this first glue applying mechanism 31, and second point gluing mechanism 51 also comprises this sensor.Sensor can workpiece enters rear drive the first glue applying mechanism 31 and second point gluing mechanism 51 carries out a glue to workpiece detecting.This sensor can adopt the sensors more well known in the prior art such as infrared ray sensor to implement.
As shown in Figure 2, the above-mentioned brilliant motion 42 of getting comprises base 421 and gets brilliant fixture, this base 421 is slidably connected and is rotationally connected with support 1, this is got brilliant fixture and comprises clip arm 422 and wafer jig 423, one end of this clip arm 422 is fixedly connected with base 1, the other end is fixedly connected with above-mentioned wafer jig 423, and above-mentioned ejector pin mechanism 41 is arranged at the below of the direction of motion of this wafer jig 423.Base 421 also can be set to be slidably connected or be rotationally connected with the connected mode of support 1, to satisfy the use needs in practical operation.
The other end of above-mentioned die bond swing arm 321 is provided with the suction nozzle (not shown), conveniently fetches crystal grain.
For the chip die bond on different position, can be adopted position or glue applying mechanism, the die bond mechanism that adjusts conveying mechanism 2 and realizes for the position of brilliant mechanism to the substrate.The realization of this mode can be controlled by electrical control mechanism 9 or other modes.
Embodiment 2
Other are identical with the described content of embodiment 1, difference is: as shown in Figure 4, also be provided with and comprise gluing mechanism 12 thirdly, the 3rd die bond mechanism 13 and the 3rd the 3rd packaging mechanism for brilliant mechanism 14, it is arranged at and comprises that second point gluing mechanism 51, the second die bond mechanism 52 and second are for after the second packaging mechanism of brilliant mechanism 6, before cutting agency, can implement the die bond operation of three chips.
The below introduces operation principle of the present invention:
the substrate of sensor is placed on conveying mechanism 2, under the driving of driving mechanism 8, conveying mechanism 2 is delivered to this substrate on the station of the first glue applying mechanism 31 it is carried out a glue operation, the substrate completed of some glue continues to be transported on the station of the first die bond mechanism 32, wafer is being transported to first on the station of brilliant mechanism 4 under the effect of getting brilliant motion 42 simultaneously, namely corresponding on the position of ejector pin mechanism 41, ejector pin mechanism 41 ejects crystal grain, driving die bond swing arms 32 by the swing arm drive device 322 of the first die bond mechanism 32 is positioned on the some glue position of substrate obtaining crystal grain on ejector pin mechanism 41 again, complete die bond, then the complete substrate of die bond continues to be transported to the encapsulation of carrying out next chip on the station of second point gluing mechanism 51 and the second die bond mechanism 52 again.
The beneficial effect of above-described embodiment is:
1) sensor package equipment of the present invention is provided with a plurality of glue applying mechanism on a support, a plurality of die bond mechanism, the brilliant mechanism of a plurality of confessions, at least one conveying mechanism and driving mechanism, wherein, conveying mechanism and driving mechanism are used for convey materials and arrive on each processing stations, a plurality of glue applying mechanism and a plurality of die bond mechanism arrange along the direction of motion interval of conveying mechanism and form these stations, and a plurality of die bond branch constructions are after each glue applying mechanism, the brilliant mechanism of a plurality of confessions is divided into again on a side position of each die bond mechanism, that is to say, glue applying mechanism, die bond mechanism and be what intert to arrange on support for brilliant mechanism, so also just formed the packaging mechanism that many covers are used for some glue and die bond on support, every cover packaging mechanism can be responsible for the packaging operation of a slice chip, can see from above-mentioned, this equipment makes the inductor of multi-chip can complete the encapsulation of multi-plate chip on an equipment, it compared with prior art, the artificial operations such as carrying have been removed from, can improve further the operating efficiency of encapsulation, and reduce artificial intervention,
2)Introduction to technical scheme from first o'clock can be seen, continual operating type on an equipment compared with prior art, can improve the uniformity of packaging effect, is convenient to control the yield of product, to guarantee the quality of finished product;
3) in the further embodiment of the present invention, the many covers packaging mechanism in this equipment has used same electrical control mechanism, can control these packaging mechanisms easily and the operation such as driving, so that hold the uniformity of packaging operation;
4) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises shell, and it covers on support, is provided with visual window on this shell, can also facilitate the staff to observe inner operation situation when interior arrangement is protected;
5) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for the diode finished product that encapsulation is completed in crawl, convenient arrangement shipment;
6) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on conveying mechanism, is used for the drop target thing.
The present invention other NM contents are all can be learnt in prior art, does not therefore repeat them here.
Above-described is only the preferred embodiment of the present invention, should be pointed out that for the person of ordinary skill of the art, is not breaking away under the prerequisite of the invention design, can also make some distortion and this advances, and these all belong to protection scope of the present invention.
Claims (10)
1. sensor package equipment is used for a plurality of chips of sensor are fitted in the substrate of sensor, and it is characterized in that: described sensor package equipment comprises:
Support;
At least one conveying mechanism, it is slidably connected on described support;
Driving mechanism, it is arranged on described support, is used for driving described conveying mechanism and arrives a plurality of stations;
A plurality of glue applying mechanism, its direction of motion along described conveying mechanism is arranged at intervals on described support, and described a plurality of glue applying mechanism include at least one Glue dripping head;
A plurality of die bond mechanism, its direction of motion along described conveying mechanism is arranged at intervals on described support, be divided into each described glue applying mechanism after, described die bond mechanism comprises die bond swing arm and the swing arm drive device that drives described die bond swing arm, and an end and the described support of described die bond swing arm are rotationally connected;
The brilliant mechanism of a plurality of confessions, its interval is arranged on described support, be divided into a side position of each described die bond mechanism, the brilliant mechanism of described confession comprises ejector pin mechanism and gets brilliant motion, describedly get brilliant motion and described support is slidably connected and/or is rotationally connected, described ejector pin mechanism is arranged on described support, described below of getting the direction of motion of brilliant motion;
The position at described a plurality of glue applying mechanism and a plurality of die bond mechanisms place forms described a plurality of station.
2. sensor package equipment according to claim 1, it is characterized in that: also comprise an electrical control mechanism, itself and described a plurality of glue applying mechanism, a plurality of die bond mechanisms and a plurality of confession brilliant mechanism are electrically connected to respectively, be used for controlling and driving described a plurality of glue applying mechanism, a plurality of die bond mechanisms and the operation of a plurality of confession brilliant mechanism, described electrical control mechanism comprises CPU, drive circuit board and motor, described CPU is electrically connected to described drive circuit board, described drive circuit board is electrically connected to described motor, be used for transmitting control signal to described motor by described drive circuit board, described motor and described a plurality of glue applying mechanism, a plurality of die bond mechanism with are connected confession brilliant mechanism and connect respectively.
3. sensor package equipment according to claim 1, it is characterized in that: also comprise shell, it covers on described support, is provided with visual window on described shell.
4. sensor package equipment according to claim 1 is characterized in that: also comprise cutting agency, it is arranged on described support, after last in described a plurality of die bond mechanism, and described cutting agency comprises the material grasping manipulator.
5. sensor package equipment according to claim 1, it is characterized in that: also comprise at least one pallet, it is arranged on described conveying mechanism.
6. sensor package equipment according to claim 1 or 5 is characterized in that: described conveying mechanism comprises guide rail and is slidably connected to slide on described guide rail.
7. sensor package equipment according to claim 1, it is characterized in that: described driving mechanism comprises a plurality of cylinders, its interval is arranged on a plurality of positions of described support.
8. sensor package equipment according to claim 1, it is characterized in that: described glue applying mechanism also comprises the camera model corresponding with described Glue dripping head.
9. sensor package equipment according to claim 1, it is characterized in that: describedly get brilliant motion and comprise base and get brilliant fixture, described base and described support are slidably connected and/or are rotationally connected, describedly get brilliant fixture and comprise clip arm and wafer jig, one end of described clip arm is fixedly connected with described base, the other end is fixedly connected with described wafer jig, and described ejector pin mechanism is arranged at the below of the direction of motion of described wafer jig.
10. according to claim 1 or 9 described sensor package equipment, it is characterized in that: the other end of described die bond swing arm is provided with suction nozzle.
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| CN201310094037.0A CN103159167B (en) | 2013-03-22 | 2013-03-22 | Sensor encapsulation equipment |
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| CN201310094037.0A CN103159167B (en) | 2013-03-22 | 2013-03-22 | Sensor encapsulation equipment |
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| WO2017096640A1 (en) * | 2015-12-09 | 2017-06-15 | 华南师范大学 | Wire-bonding system and method for cob die-bonding |
| CN107369639A (en) * | 2017-07-27 | 2017-11-21 | 深圳市新益昌自动化设备有限公司 | A kind of line LED bonders |
| CN110379732A (en) * | 2019-05-28 | 2019-10-25 | 广东工业大学 | A kind of detection die bond integration bull chip mounter |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN111490147A (en) * | 2020-04-21 | 2020-08-04 | 深圳新益昌科技股份有限公司 | Full-automatic planar IC die bonder and die bonding method |
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| CN110379732A (en) * | 2019-05-28 | 2019-10-25 | 广东工业大学 | A kind of detection die bond integration bull chip mounter |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN111370350B (en) * | 2020-03-19 | 2021-04-16 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN111490147A (en) * | 2020-04-21 | 2020-08-04 | 深圳新益昌科技股份有限公司 | Full-automatic planar IC die bonder and die bonding method |
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| CN103159167B (en) | 2015-09-30 |
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