CN206331356U - The radiating subassembly of notebook computer - Google Patents
The radiating subassembly of notebook computer Download PDFInfo
- Publication number
- CN206331356U CN206331356U CN201621318860.0U CN201621318860U CN206331356U CN 206331356 U CN206331356 U CN 206331356U CN 201621318860 U CN201621318860 U CN 201621318860U CN 206331356 U CN206331356 U CN 206331356U
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- radiating
- radiating bottom
- heat conducting
- conducting pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of radiating subassembly of notebook computer, including radiating bottom plate, heat conducting pipe and cooling rib arrangement, the upper face of radiating bottom plate is provided with the mounting groove for installing heat conducting pipe, the both sides of mounting groove are provided with the baffle plate higher than radiating bottom plate upper face, thermal conductivity region is provided with radiating bottom plate lower face, the edge of the radiating bottom plate sets and offers mounting hole, the periphery of the mounting hole is provided with the positioning convex higher than radiating bottom plate lower face, linear array is provided with several column structures on the upper face of the radiating bottom plate, one end of the heat conducting pipe is fixedly mounted in the mounting groove of radiating bottom plate, the other end of heat conducting pipe is fixedly mounted with cooling rib arrangement.By setting positioning convex on mounting hole periphery, the accurate purpose of the overall location and installation of radiating subassembly is realized, column structure is set on the upper face of radiating bottom plate, in order to increase the overall thermal conductivity energy of radiating bottom plate, the purpose of fast endothermic and radiating is realized.
Description
Technical field：
The utility model is related to a kind of radiating subassembly of notebook computer.
Background technology：
Radiating subassembly is parts essential on notebook computer, by radiating copper sheet, heat-transfer pipe, radiating fin group,
Fan and a few part compositions of copper sheet mounting bracket.Radiating copper sheet and radiating fin group are the core components in radiating subassembly, radiating
Copper sheet is arranged on CPU and video card, by heat-transfer pipe by CPU and video card heat derives, then is radiated by radiating fin group,
Fan is additionally provided with radiating subassembly, fan exchanges heat cool ambient air and radiating fin group, so as to realize the drop of CPU and video card
Temperature.
It is main and current this radiating subassembly has that bulk strength is inadequate, it is low to install inconvenient, radiating efficiency
Show that radiating bottom plate and computer main board installation setting accuracy be not high, influence heat dissipation region and CPU and the contact surface of video card
Product, in addition, when computer temperature is too high, the area of radiating bottom plate and radiating fin is smaller, influences the heat dispersion of computer.
The content of the invention：
Technical problem to be solved in the utility model is：A kind of high structural strength, installation registration and radiating are provided
The good computer heat radiation component of performance.
In order to solve the above-mentioned technical problem, the utility model is achieved through the following technical solutions：A kind of desk-top electromechanics
The radiating subassembly of brain and notebook notebook computer, including radiating bottom plate, heat conducting pipe and cooling rib arrangement, the radiating bottom plate
Upper face is provided with the mounting groove for installing heat conducting pipe, and the both sides of the mounting groove are provided with higher than radiating bottom plate upper face
Thermal conductivity region is provided with baffle plate, the radiating bottom plate lower face, the edge of the radiating bottom plate, which is set, offers mounting hole,
It is in line that the periphery of the mounting hole, which is provided with the positioning convex higher than radiating bottom plate lower face, the upper face of the radiating bottom plate,
Property array is provided with several column structures, and one end of the heat conducting pipe is fixedly mounted in the mounting groove of radiating bottom plate, heat conducting pipe
The other end and cooling rib arrangement be fixedly mounted.
Preferably, the fin of the cooling rib arrangement is set to U-shape structure.
Preferably, the column structure is covered with the upper face of radiating bottom plate.
Preferably, the center between a diameter of 0.5mm~0.8mm of the column structure, two adjacent columns structures
Away from for 10mm~13mm.
Preferably, the heat conducting pipe is internally provided with heat-conducting medium.
Preferably, being additionally provided with nameplate marking plate on the upper face of the radiating bottom plate, the nameplate marks the top of plate
Face is higher than the upper face of radiating bottom plate.
Compared with prior art, usefulness of the present utility model is：It is real by setting positioning convex on mounting hole periphery
The accurate purpose of the overall location and installation of radiating subassembly is showed, heat conducting pipe is arranged in mounting groove, realizes heat conducting pipe and accurately install
The purpose of positioning, meanwhile, mounting groove both sides set baffle plate, can make up the problem of mounting groove structural strength is not enough, in addition, in radiating
Column structure is set on the upper face of base plate, in order to increase the overall thermal conductivity energy of radiating bottom plate, fast endothermic and radiating is realized
Purpose.
Brief description of the drawings：
The utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is positive structure schematic of the present utility model.
Fig. 2 is structure schematic diagram of the present utility model.
In figure：1st, radiating bottom plate；2nd, heat conducting pipe；3rd, cooling rib arrangement；4th, mounting groove；5th, baffle plate；6th, thermal conductivity region；7th, pacify
Fill hole；8th, positioning convex；9th, column structure；10th, nameplate marking plate.
Embodiment：
Below in conjunction with the accompanying drawings and the utility model is described in detail embodiment：
A kind of desktop computer and the radiating subassembly of notebook notebook computer as depicted in figs. 1 and 2, including radiating bottom
Plate 1, heat conducting pipe 2 and cooling rib arrangement 3, the upper face of the radiating bottom plate 1 are provided with the mounting groove 4 for installing heat conducting pipe 2,
The both sides of the mounting groove 4 are provided with the baffle plate 5 higher than the upper face of radiating bottom plate 1, the lower face of radiating bottom plate 1 and are provided with
Thermal conductivity region 6, the edge of the radiating bottom plate 1, which is set, offers mounting hole 7, and the periphery of the mounting hole 7, which is provided with, to be higher than
Linear array is provided with several cylinder knots on the positioning convex 8 of the lower face of radiating bottom plate 1, the upper face of the radiating bottom plate 1
Structure 9, one end of the heat conducting pipe 2 is fixedly mounted in the mounting groove 4 of radiating bottom plate 1, the other end and radiating fin machine of heat conducting pipe 2
Structure 3 is fixedly mounted.
In actual use in order to increase the heat dispersion of cooling rib arrangement 3, cooling rib arrangement fin can be increased
Area, therefore, the fin of the cooling rib arrangement 3 are set to U-shape structure.
It is to increase the overall heat absorption capacity of radiating bottom plate 1, can increase to greatest extent using the purpose of column structure 9
Plus the quantity of column structure 9, therefore, the column structure 9 are covered with the upper face of radiating bottom plate 1.
As the preferred size and preferred arrangement mode of column structure 9, a diameter of 0.5mm of the column structure 9~
Centre-to-centre spacing between 0.8mm, two adjacent columns structures 9 is 10mm~13mm.
Further for the heat dispersion of this radiating subassembly is increased, the heat conducting pipe 2 is internally provided with heat-conducting medium.
Nameplate marking plate 10 is additionally provided with the upper face of the radiating bottom plate 1, the top surface of the nameplate marking plate 10 is high
It is to be easy to manufacturer to enter rower to the model of radiating bottom plate 1 using the purpose of this structure in the upper face of radiating bottom plate 1
Note.
It is emphasized that：It the above is only preferred embodiment of the present utility model, not the utility model appointed
What formal limitation, every any simple modification made according to technical spirit of the present utility model to above example, etc.
With change and modification, in the range of still falling within technical solutions of the utility model.
Claims (6)
1. a kind of radiating subassembly of notebook computer, it is characterised in that：Including radiating bottom plate (1), heat conducting pipe (2) and radiating fin machine
Structure (3), the upper face of the radiating bottom plate (1) is provided with the mounting groove (4) for installing heat conducting pipe (2), the mounting groove (4)
Both sides be provided with baffle plate (5) higher than radiating bottom plate (1) upper face, radiating bottom plate (1) lower face and be provided with heat conduction
Region (6), the edge of the radiating bottom plate (1), which is set, offers mounting hole (7), and the periphery of the mounting hole (7) is provided with
Higher than the positioning convex (8) of radiating bottom plate (1) lower face, linear array is provided with the upper face of the radiating bottom plate (1)
Several column structures (9), one end of the heat conducting pipe (2) is fixedly mounted in the mounting groove (4) of radiating bottom plate (1), heat conducting pipe
(2) the other end is fixedly mounted with cooling rib arrangement (3).
2. the radiating subassembly of notebook computer according to claim 1, it is characterised in that：The cooling rib arrangement (3)
Fin is set to U-shape structure.
3. the radiating subassembly of notebook computer according to claim 1, it is characterised in that：The column structure (9) is covered with
The upper face of radiating bottom plate (1).
4. the radiating subassembly of notebook computer according to claim 1, it is characterised in that：The column structure (9) it is straight
Footpath is that the centre-to-centre spacing between 0.5mm~0.8mm, two adjacent columns structures (9) is 10mm~13mm.
5. the radiating subassembly of notebook computer according to claim 1, it is characterised in that：Set inside the heat conducting pipe (2)
It is equipped with heat-conducting medium.
6. the radiating subassembly of notebook computer according to claim 1, it is characterised in that：The radiating bottom plate (1) it is upper
Nameplate marking plate (10) is additionally provided with plate face, the top surface of the nameplate marking plate (10) is higher than the upper face of radiating bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621318860.0U CN206331356U (en) | 2016-12-02 | 2016-12-02 | The radiating subassembly of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621318860.0U CN206331356U (en) | 2016-12-02 | 2016-12-02 | The radiating subassembly of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206331356U true CN206331356U (en) | 2017-07-14 |
Family
ID=59288286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621318860.0U Expired - Fee Related CN206331356U (en) | 2016-12-02 | 2016-12-02 | The radiating subassembly of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206331356U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108572713A (en) * | 2018-04-09 | 2018-09-25 | 中尚能源科技有限公司 | A kind of metal cpu heat |
-
2016
- 2016-12-02 CN CN201621318860.0U patent/CN206331356U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108572713A (en) * | 2018-04-09 | 2018-09-25 | 中尚能源科技有限公司 | A kind of metal cpu heat |
| CN108572713B (en) * | 2018-04-09 | 2021-05-25 | 中尚能源科技有限公司 | A metal CPU cooler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170714 Termination date: 20191202 |