CN218055900U - Packaging device for semiconductor parts - Google Patents
Packaging device for semiconductor parts Download PDFInfo
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- CN218055900U CN218055900U CN202220816850.9U CN202220816850U CN218055900U CN 218055900 U CN218055900 U CN 218055900U CN 202220816850 U CN202220816850 U CN 202220816850U CN 218055900 U CN218055900 U CN 218055900U
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- machine body
- supporting leg
- packaging machine
- electric telescopic
- packaging
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Abstract
The utility model discloses an packaging hardware for semiconductor spare part, including electric telescopic handle, connecting piece and anti-skidding pad foot, the electric telescopic handle top is fixed in on the connecting plate bottom surface, the electric telescopic handle bottom is connected with the rubber slab, the rubber slab bottom surface is connected with the movable rod, movable rod externally mounted has buffer spring, the tubaeform stabilizer blade is installed to the buffer spring tip, large-scale supporting leg is installed at the connecting piece top, the connecting piece bottom is provided with the gyro wheel, the quantity of gyro wheel is four. The utility model discloses an electric telescopic handle, rubber slab, movable rod, buffer spring and the tubaeform stabilizer blade of design can be fixed it subaerial and have the absorbing effect to the packaging machine body when the packaging machine body carries out the operation, through the connecting piece and four gyro wheels of design, is convenient for remove the packaging machine body, is convenient for maintain the packaging machine body and to the change of packaging machine body internals.
Description
Technical Field
The utility model relates to the field of semiconductor technology, concretely relates to packaging hardware for semiconductor spare part.
Background
The semiconductor, which refers to a material with electric conductivity between a conductor and an insulator at normal temperature, is widely applied to radio, television and temperature measurement, and semiconductor parts need to be packaged in the production process of the semiconductor, but the current packaging device is inconvenient to move, so that subsequent maintenance and replacement of the packaging machine bring much trouble.
In the prior art, for example, in publication No. CN108717935a, in 2018, 10 and 30, a semiconductor packaging apparatus is disclosed, which is used for realizing a loading function of a semiconductor to be packaged only through a semiconductor feeding device, a semiconductor positioning device is used for positioning the semiconductor to be packaged, a carrying manipulator device is used for carrying a semiconductor workpiece among the semiconductor feeding device, the semiconductor positioning device and an automatic packaging device, and the automatic packaging device is used for loading a material cup, loading a heat-sealing film and heat-sealing the heat-sealing film and the material cup.
Therefore, it is necessary to invent a packaging device for semiconductor components to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a packaging hardware for semiconductor spare part to the problem that the packaging machine body can not remove and lead to the packaging machine body not be convenient for maintain and not be convenient for change the inside part of packaging machine body in solving the technique.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides an packaging hardware for semiconductor spare part, includes small-size supporting leg, conveyer belt driving motor, electric telescopic handle, connecting piece and anti-skidding pad foot, the electric telescopic handle top is fixed in on the connecting plate bottom surface, the electric telescopic handle bottom is connected with the rubber slab, the rubber slab bottom surface is connected with the movable rod, movable rod externally mounted has buffer spring, buffer spring's quantity sets up to four, the tubaeform stabilizer blade is installed to the buffer spring tip, large-scale supporting leg is installed at the connecting piece top, the connecting piece bottom is provided with the gyro wheel, the quantity of gyro wheel is four.
Preferably: the conveying belt is installed on the top end of the small supporting leg, and the packaging machine body is arranged right above the conveying belt and is convenient for conveying semiconductor parts.
Preferably: the side surface of the conveyor belt driving motor is connected with a conveyor belt, so that the conveyor belt driving motor drives the conveyor belt to transmit.
Preferably: the packaging machine comprises a packaging machine body and is characterized in that a plurality of heat dissipation holes are formed in the top of the packaging machine body, and large support legs are fixed on the side faces of the packaging machine body and can dissipate heat generated inside the packaging machine body.
Preferably: the conveyer belt is installed to large-scale supporting leg inboard, large-scale supporting leg side-mounting has the connecting plate for electric telescopic handle can install on the connecting plate.
Preferably: the connecting plate inboard is provided with the conveyer belt, the connecting plate below is equipped with tubaeform stabilizer blade for the packaging machine body can be more steady fixed subaerial.
Preferably: the top of the horn-shaped support leg is connected with a buffer spring, and the roller is installed on the outer side of the horn-shaped support leg, so that the packaging machine body can be conveniently moved.
Preferably: four the anti-skidding foot pads are installed in small-size supporting leg bottom for the conveyer belt can be steady fixed subaerial.
In the technical scheme, the utility model provides a technological effect and advantage:
the packaging machine body can be fixed on the ground and has a damping effect on the packaging machine body when in operation through the designed electric telescopic rod, the rubber plate, the movable rod, the buffer spring and the horn-shaped support leg, the packaging machine body can be conveniently moved through the designed connecting piece and the four rollers, and the packaging machine body can be conveniently maintained and internal parts of the packaging machine body can be conveniently replaced;
through the conveyer belt and the conveyer belt driving motor of design, can carry out automatic material loading and unloading operation to semiconductor parts, this process is full automatic, does not need personnel to participate in, very big improvement the efficiency of work, not only save time but also laborsaving.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of the conveyor belt of the present invention;
FIG. 3 is a schematic perspective view of the roller of the present invention;
fig. 4 is an enlarged schematic structural view of a point a in fig. 2 according to the present invention;
fig. 5 is a front view of the electric telescopic rod of the present invention.
Description of reference numerals:
1. a small support leg; 2. a conveyor belt; 3. a conveyor belt drive motor; 4. a packaging machine body; 5. heat dissipation holes; 6. a large support leg; 7. a connecting plate; 8. an electric telescopic rod; 9. a rubber plate; 10. a movable rod; 11. a buffer spring; 12. a horn-shaped leg; 13. a connecting member; 14. a roller; 15. anti-skid foot pads.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
The utility model provides a packaging hardware for semiconductor spare part as shown in fig. 1-5, including small-size supporting leg 1, conveyer belt driving motor 3, electric telescopic handle 8, connecting piece 13 and anti-skidding pad foot 15, 8 tops of electric telescopic handle are fixed in on the 7 bottom surfaces of connecting plate, 8 bottoms of electric telescopic handle are connected with rubber slab 9, rubber slab 9 bottom surface is connected with movable rod 10, 10 externally mounted of movable rod have buffer spring 11, buffer spring 11's quantity sets up to four, tubaeform stabilizer blade 12 is installed to buffer spring 11 tip, large-scale supporting leg 6 is installed at connecting piece 13 top, 13 bottoms of connecting piece are provided with gyro wheel 14, gyro wheel 14's quantity is four, conveyer belt 2 is installed on 1 top of small-size supporting leg, be provided with packaging machine body 4 directly over conveyer belt 2.
3 sides of conveyor belt driving motor are connected with conveyer belt 2, a plurality of louvre 5 has been seted up at 4 tops of packaging machine body, 4 sides of packaging machine body are fixed with large- scale supporting leg 6, 6 inboard installations of large-scale supporting leg have conveyer belt 2, 6 side installations of large-scale supporting leg have connecting plate 7, 7 inboard sides of connecting plate are provided with conveyer belt 2, 7 below of connecting plate are equipped with tubaeform stabilizer blade 12, tubaeform stabilizer blade 12 top is connected with buffer spring 11, gyro wheel 14 is installed in tubaeform stabilizer blade 12 outside, four non-slip pad feet 15 are installed in 1 bottom of small-size supporting leg.
This practical theory of operation:
referring to the attached drawings 1-5 of the specification, when the device is used, firstly, the device is moved to a use position, then a circuit is connected with an external power supply, then, a semiconductor part is placed on the conveyor belt 2, the conveyor belt 2 conveys the semiconductor part to the interior of the packaging machine body 4 under the driving of the conveyor belt driving motor 3, the packaging machine body 4 packages the semiconductor part entering the interior of the packaging machine body, and after the packaging is finished, the semiconductor part is conveyed out along with the conveyor belt 2;
referring to the attached drawings 1-5 of the specification, when the device is used, after the packaging machine body 4 is used for a long time, elements inside the packaging machine body 4 are abraded and even destroyed, at the moment, the electric telescopic rod 8 contracts, the electric telescopic rod 8 drives the rubber plate 9, the movable rod 10, the buffer spring 11 and the horn-shaped support leg 12 to move upwards, when the horn-shaped support leg 12 leaves the ground, when the four rollers 14 contact with the ground, the electric telescopic rod 8 stops contracting, at the moment, a worker only needs to push the packaging machine body 4, and the packaging machine body 4 can move along with the four rollers 14 in the direction away from the conveyor belt driving motor 3.
Claims (8)
1. The utility model provides a packaging hardware for semiconductor spare part, includes small-size supporting leg (1), conveyer belt driving motor (3), electric telescopic handle (8), connecting piece (13) and anti-skidding foot pad (15), its characterized in that: electric telescopic handle (8) top is fixed in on connecting plate (7) bottom surface, electric telescopic handle (8) bottom is connected with rubber slab (9), rubber slab (9) bottom surface is connected with movable rod (10), movable rod (10) externally mounted has buffer spring (11), the quantity of buffer spring (11) sets up to four, tubaeform stabilizer blade (12) are installed to buffer spring (11) tip, large-scale supporting leg (6) are installed at connecting piece (13) top, connecting piece (13) bottom is provided with gyro wheel (14), the quantity of gyro wheel (14) is four.
2. A packaging apparatus for a semiconductor component as claimed in claim 1, wherein: conveyer belt (2) are installed on small-size supporting leg (1) top, be provided with packaging machine body (4) directly over conveyer belt (2).
3. A packaging apparatus for a semiconductor component as claimed in claim 1, wherein: and the side surface of the conveyor belt driving motor (3) is connected with a conveyor belt (2).
4. A packaging apparatus for a semiconductor component as claimed in claim 2, wherein: a plurality of heat dissipation holes (5) are formed in the top of the packaging machine body (4), and large support legs (6) are fixed to the side faces of the packaging machine body (4).
5. A packaging apparatus for semiconductor components as claimed in claim 4, wherein: the conveying belt (2) is installed on the inner side of the large supporting leg (6), and the connecting plate (7) is installed on the side face of the large supporting leg (6).
6. A packaging apparatus for semiconductor components as claimed in claim 5, wherein: the conveying belt (2) is arranged on the inner side of the connecting plate (7), and horn-shaped supporting legs (12) are arranged below the connecting plate (7).
7. A packaging apparatus for a semiconductor component as claimed in claim 6, wherein: the top of the horn-shaped supporting leg (12) is connected with a buffer spring (11), and a roller (14) is installed on the outer side of the horn-shaped supporting leg (12).
8. A packaging apparatus for a semiconductor component as claimed in claim 1, wherein: four anti-skid foot pads (15) are arranged at the bottom of the small-sized supporting leg (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220816850.9U CN218055900U (en) | 2022-04-01 | 2022-04-01 | Packaging device for semiconductor parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220816850.9U CN218055900U (en) | 2022-04-01 | 2022-04-01 | Packaging device for semiconductor parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218055900U true CN218055900U (en) | 2022-12-16 |
Family
ID=84415965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220816850.9U Active CN218055900U (en) | 2022-04-01 | 2022-04-01 | Packaging device for semiconductor parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218055900U (en) |
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2022
- 2022-04-01 CN CN202220816850.9U patent/CN218055900U/en active Active
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