CN106793716A - The heat abstractor and robot of robot control mainboard - Google Patents
The heat abstractor and robot of robot control mainboard Download PDFInfo
- Publication number
- CN106793716A CN106793716A CN201710112850.4A CN201710112850A CN106793716A CN 106793716 A CN106793716 A CN 106793716A CN 201710112850 A CN201710112850 A CN 201710112850A CN 106793716 A CN106793716 A CN 106793716A
- Authority
- CN
- China
- Prior art keywords
- fin
- control mainboard
- robot control
- heater
- deformations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Manipulator (AREA)
Abstract
The embodiment of the invention discloses a kind of heat abstractor and robot of robot control mainboard, including:Fin and thermal grease.Wherein, fin is offered for receiving the raised accommodation space in the robot control mainboard surface heater;Thermal grease is filled in the connection heater and the fin in the accommodation space, and by the heat transfer in the fin to the fin.Fin is attached by robot control mainboard, increase the area of dissipation of robot control mainboard, and open up on a heat sink for receiving the raised accommodation space in robot control mainboard surface heater, connected by thermal grease between accommodation space and heater, the connection between fin and robot control mainboard can be made more tight, and the thermal conduction rate between heater and fin can be made higher, increased the radiating efficiency of heat abstractor.
Description
Technical field
The present embodiments relate to heat transfer field, the especially a kind of heat abstractor and machine of robot control mainboard
People.
Background technology
With the development of mobile communication, computer and Internet technology, intelligent robot is due to its small volume, treatment
Ability is strong, is widely used in the fields such as education, scientific research or safety, and approved by user.Along with intelligent robot
Development, degree of intelligence robot higher requires that the disposal ability of its CPU is more powerful, and the processing speed of CPU has with it
The rate of heat dispation of heat abstractor is closely bound up.
In the prior art, there is provided the radiating principle of heat abstractor mainly have two kinds:One kind is water cooled heat radiating, in addition one
It is air-cooled radiating to plant.Wherein, water cooled heat radiating is will to fill the pipe laying of heat absorption liquid in being provided with the mainboard of CPU,
Radiated by making heat absorption liquid carry out flowing, water cooled heat radiating has stronger heat-sinking capability, however it is necessary that larger dissipates
Heat space can make it play a role;Air-cooled radiating is to be attached to be provided with by the fin for being made heat sink material
On the mainboard of CPU, and drive the inner space air-flow to carry out flowing and radiated by fan, air-cooled radiating can be applied to compared with
Radiating in small space, but because air-cooled radiating is radiated by the way of fan rotation, easily produce noise unfavorable
In the intelligent robot being controlled using phonetic order.
The inventor of the invention has found that water-cooled power converter of the prior art is due to taking up room under study for action
It is larger, it is impossible to be radiated inside the limited intelligent robot in space;And air-cooled heat abstractor due to work when produce
Raw noise is larger, it is impossible to suitable for the intelligent robot controlled by phonetic order.Therefore, inventor needs to develop a kind of
Can be used in small space, noise and the heat abstractor with good heat radiating function are not produced.
The content of the invention
The embodiment of the present invention is mainly solving the technical problems that provide a kind of heat abstractor and machine of robot control mainboard
Device people, can be used in the heat abstractor of intelligent robot.
In order to solve the above technical problems, the technical scheme that the embodiment of the invention is used is:A kind of machine is provided
The heat abstractor of device people's control mainboard, the heat abstractor of the robot control mainboard includes:
Fin, offers for receiving the raised accommodation space in the robot control mainboard surface heater;
Thermal grease, is filled in the connection heater and the fin in the accommodation space, and by the radiating
In heat transfer to the fin in piece.
Alternatively, to be the fin cave in the accommodating groove to be formed, institute the accommodation space towards the heater side
When stating fin and being attached at the robot control mainboard, the heater is accommodated in the accommodating groove.
Alternatively, the thermal grease is filled in the space between the accommodating groove and the heater.
Alternatively, the accommodation space is that the receiving space is the glove hole being opened on the fin, described to dissipate
When backing is attached at the robot control mainboard, the heater is located at or passes the glove hole.
Alternatively, the thermal grease is filled in the space between the article putting groove and the heater, and is raised in
The fin surface.
Alternatively, a side surface of the fin dorsad robot control mainboard is provided with several deformations, institute
State deformations one end to be connected on the fin, the deformations other end is hanging;
The deformations are made up of memory metal material, when the deformations temperature reaches default deformation temperature, the shape
The hanging one end in change portion carries out deformation to the direction away from the fin.
Alternatively, described several deformations are regularly arranged forms deformation radiating matrix in the fin surface.
Alternatively, the deformations are obliquely installed, so that adjacent two row deformations width side in deformation radiating matrix
To extended line formed angle be acute angle;
The flow channel of air-flow displacement is formed between the adjacent two row deformations.
Alternatively, the air current flow between the two neighboring flow channel is in opposite direction, to accelerate the deformation to dissipate
The air flow of hot internal matrix.
Alternatively, the thermal grease includes following weight:Silane coupler 2-5 parts, Graphene 2-3 parts, two
Silica 2-6 parts, cumyl peroxide 2-6 parts, vinyl silicone oil 70-100 parts, reinforcing agent 3-5 parts and plasticizer 3-6 parts.
Alternatively, thermal dispersant coatings are coated with the fin.
Alternatively, the thermal dispersant coatings include following weight:5-10 parts, Graphene 1-3 parts of heat sink material of nanometer
With carrier material 20-100 parts.
Alternatively, the nanometer heat sink material is silica, antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide
The mixture of central one or more.
Alternatively, the carrier material is polyurethane series, epoxy resin, polyurethane resin system, polyester or fluoroolefins-second
Alkene ether (ester) copolymer coating.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of robot, it is provided with the robot
State the heat abstractor of the robot control mainboard in technical scheme.
The beneficial effect of the embodiment of the present invention is:Fin is attached by robot control mainboard, machine is increased
The area of dissipation of people's control mainboard, and open up on a heat sink for receiving projection in robot control mainboard surface heater
Accommodation space, is connected between accommodation space and heater by thermal grease, can make fin and robot control mainboard it
Between connection it is more tight, and the thermal conduction rate between heater and fin can be made higher, increased heat abstractor
Radiating efficiency.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, on the premise of not paying creative work, can also obtain other attached according to these accompanying drawings
Figure.
Fig. 1 is the construction for heat radiating device schematic diagram of embodiment of the present invention robot control mainboard;
Fig. 2 is the first implementation method schematic diagram of fin in the embodiment of the present invention;
Fig. 3 is second implementation method schematic diagram of fin in the embodiment of the present invention;
Fig. 4 is the third implementation method schematic diagram of fin in the embodiment of the present invention;
Fig. 5 is that the heat radiating fin structure schematic diagram that example is formed with deformation radiating matrix is applied in the invention of this reality;
Fig. 6 is a kind of implementation method of air current flow passage in embodiment of the present invention deformation radiating matrix;
Fig. 7 is the overall schematic of air current flow passage in embodiment of the present invention deformation radiating matrix.
Description of reference numerals:100th, robot control mainboard;200th, fin;210th, receiving space;211st, glove hole;
212nd, accommodating groove;220th, deformations;230th, deformation radiating matrix.
Specific embodiment
For the ease of understanding the present invention, below in conjunction with the accompanying drawings and specific embodiment, the present invention will be described in more detail.
It should be noted that when element is expressed " being fixed on " another element, it can directly on another element or therebetween
There may be one or more elements placed in the middle.When an element is expressed " connection " another element, it can directly be connected
It is connected to another element or there may be one or more elements placed in the middle therebetween.The term that this specification is used is " vertical
", " level ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all of technology and scientific terminology that this specification is used are led with technology of the invention is belonged to
The implication that the technical staff in domain is generally understood that is identical.The term used in the description of the invention in this specification is to be
The purpose of description specific embodiment, is not intended to the limitation present invention.The term "and/or" that this specification is used includes one
The arbitrary and all of combination of individual or multiple related Listed Items.
Embodiment 1
Fig. 1 is referred to, Fig. 1 is the construction for heat radiating device schematic diagram of embodiment of the present invention robot control mainboard 100.
As shown in figure 1, a kind of heat abstractor of robot control mainboard 100, the heat abstractor of robot control mainboard 100
Including:Fin 200 and thermal grease.Wherein, fin 200 is offered for receiving projection in robot control mainboard 100
The accommodation space of surface heater;Thermal grease is filled in connection heater and fin 200 in accommodation space, and by fin
In heat transfer to fin 200 in 200.
Fin 200 is particularly configured to the panel consistent with robot 100 appearance profiles of control mainboard, fin 200 with
The appearance profile of robot control mainboard 100 is consistent, on the premise of fin 200 can be made to be not take up extra physical space, to the greatest extent
The possible area of dissipation for increasing fin 200, to accelerate the area of dissipation of fin 200, is conducive to quick reduction to control
The temperature of mainboard.In some preferred embodiments, fin 200 is particularly configured to rectangular faceplate, but fin 200 is outer
Shape shape is not limited to and this, can select fin 200 of different shapes, its main selection according to different application scenarios
Standard is consistent with robot 100 appearance profiles of control mainboard for the concrete shape of fin 200.
Its main body of robot control mainboard 100 is printed circuit board (PCB), and sets cpu chip on a printed circuit,
Wherein CPU is the control centre of whole robot control mainboard 100, also the main hair in robot control mainboard 100
Hot body.Main heater (not shown) in present embodiment in robot control mainboard 100 is not limited to this, in some selections
In property implementation method, the heater in robot control mainboard 100 is included but is not limited to:North bridge chips, South Bridge chip, network interface card core
The electronic component heaters such as piece, sound card chip, resistance, electric capacity or transistor.Heater distribution in robot control mainboard 100
In the different zones of printed circuit board (PCB), its particular location is different according to the wire laying mode of various boards.
The receiving space 210 for receiving heater in robot control mainboard 100 is provided with fin 200, is accommodated
The concrete form in space 210 includes that cave in the side of 200 object manipulator control mainboard of fin 100 groove profile to be formed storage sky
Between, or it is opened in the pass accommodation space on fin 200.Accommodation space is specifically located at fin 200 corresponding to machine
The position of the heater of people's control mainboard 100, i.e. fin 200 are attached at when in robot control mainboard 100, accommodation space position
In the top of heater, and heater can be accommodated in accommodation space.The specific profile of accommodation space is, it is necessary to be applied to not
Adjusted with the profile of heater, such as when heater is foursquare chip, the cross section of corresponding accommodation space
Also it is square;When heater is rectangular chip, the cross section of corresponding accommodation space is rectangle;Same
The cross section of the corresponding accommodation space of heater of cylinder is circle.The cross-sectional area of receiving space 210 is more than heater
Cross-sectional area, therefore, after receiving space 210 houses heater, certain sky is left between heater and receiving space 210
Gap, in order to fill thermal grease in the space.
Connected by thermal grease between heater and fin 200, specifically, thermal grease is filled in heater and holds
In the space received between space 210, to solve heater and the contact surface limited area of fin 200, thermal conduction rate is slower
Problem.Thermal grease is a kind of low thermal resistance and high thermal conductivity, the Heat Conduction Material of high flexibility.The high flexibility having can subtract
Required pressure between few component, while covering the surface of microcosmic out-of-flatness so that component is fully contacted and improves hot biography
Efficiency is led, is particularly suitable for the heat transfer demand of limited space.Therefore, using thermal grease fill fin 200 and radiator it
Between space, the area of the effective heat transfer between heater and fin 200 can either be increased, additionally it is possible to make fin 200
Connection with robot control mainboard 100 is more firm, will not because of robot ride when shake cause fin 200 to come off
Problem, while buffering can also be played a part of.
Above-mentioned implementation method increases robot control master by attaching fin 200 in robot control mainboard 100
The area of dissipation of plate 100, and opened up on fin 200 for receiving projection in the surface heater of robot control mainboard 100
Accommodation space, connected by thermal grease between accommodation space and heater, fin 200 and robot can be made to control master
Connection between plate 100 is more tight, and the thermal conduction rate between heater and fin 200 can be made higher, increases
The radiating efficiency of heat abstractor.
Fig. 2 is referred to, Fig. 2 is the first implementation method schematic diagram of fin 200 in the embodiment of the present invention.
As shown in Fig. 2 in some selective implementation methods, accommodation space is fin 200 towards in heater side
The accommodating groove 212 for being formed is fallen into, when fin 200 is attached at robot control mainboard 100, heater is accommodated in accommodating groove 212,
Thermal grease is filled in the space between accommodating groove 212 and heater.
Specifically, accommodation space caves in the accommodating groove 212 to be formed, accommodating groove 212 for fin 200 towards heater side
Caving in be formed makes protuberance on fin 200 form hat projection, and accommodating groove 212 is specifically located at fin 200 corresponding to machine
The position of the heater of people's control mainboard 100, i.e. fin 200 are attached at when in robot control mainboard 100, accommodating groove 212
Positioned at the top of heater, and heater can be accommodated in accommodating groove 212.The specific profile of accommodating groove 212 is, it is necessary to be applicable
Adjusted in the profile of different heat body, such as when heater is foursquare chip, the horizontal stroke of corresponding accommodating groove 212
Section is also square;When heater is rectangular chip, the cross section of corresponding accommodating groove 212 is rectangle;
The cross section of the same cylindrical corresponding accommodating groove 212 of heater is circle.The cross-sectional area of receiving space 210 is more than hair
The cross-sectional area of hot body, therefore, after receiving space 210 houses heater, left between heater and receiving space 210 certain
Space, in order to fill thermal grease in the space.
Connected by thermal grease between heater and accommodating groove 212, specifically, thermal grease is filled in heater and receives
In the space received between groove 212, to solve heater and the contact surface limited area of fin 200, thermal conduction rate is slower to ask
Topic.Thermal grease is injected into the space between heater and accommodating groove 212 by way of heat injection, can not only be increased
Heat transfer area between heater and accommodating groove 212, can strengthen the stabilization connected between heater and accommodating groove 212 again
Property.
Fig. 3 is referred to, Fig. 3 is second implementation method schematic diagram of fin 200 in the embodiment of the present invention.
As shown in figure 3, in some selective implementation methods, accommodation space is receiving space 210 to be opened in fin
Glove hole 211 on 200, when fin 200 is attached at robot control mainboard 100, heater is located at or passes glove hole
211, thermal grease is filled in the space between article putting groove and heater, and is raised in the surface of fin 200.
Specifically, accommodation space is the glove hole 211 opened up on fin 200, and heater is placed in the glove hole 211
When, inside glove hole 211, i.e., heater is not raised in the surface of fin 200, or heater passes glove hole 211, i.e.,
Heater is raised in the surface of fin 200.Glove hole 211 is specifically located at fin 200 corresponding to robot control mainboard
The position of 100 heater, i.e. fin 200 are attached at when in robot control mainboard 100, and glove hole 211 is located at heater
Top, and heater can be accommodated in glove hole 211.The specific profile of glove hole 211 is, it is necessary to be applied to different heat
The profile of body is adjusted, and such as when heater is foursquare chip, the cross section of corresponding glove hole 211 is also for just
It is square;When heater is rectangular chip, the cross section of corresponding glove hole 211 is rectangle;Same cylinder
The cross section of the corresponding glove hole 211 of heater of shape is circle.The cross-sectional area of receiving space 210 is transversal more than heater
Area, therefore, after receiving space 210 houses heater, certain space is left between heater and receiving space 210, with
It is easy to fill thermal grease in the space.
Connected by thermal grease between heater and glove hole 211, specifically, thermal grease is filled in heater and puts
In space between thing hole 211, and to make preferably to connect heater and glove hole 211, thermal grease deviates from fin 200
The side of heater forms silica gel projection, and the raised cross-sectional area of silica gel is more than the cross-sectional area of glove hole 211, to solve heating
Body and the contact surface limited area of fin 200, the slower problem of thermal conduction rate.Thermal grease is noted by way of heat injection
Enter in the space between heater and glove hole 211, the heat transfer face between heater and glove hole 211 can not only be increased
Product, can strengthen the stability connected between heater and glove hole 211 again.
The area of dissipation of fin 200 is limited to the image of the surface area of fin 200, and the surface of fin 200
Product is limited by the place space size of fin 200 again, and the space that intelligent robot is used to set fin 200 is limited, therefore
The area of dissipation of the fin 200 inside intelligent robot is limited, it is impossible to effectively lifted.
In some selective implementation methods, there is provided a kind of technical side that can effectively expand the area of dissipation of fin 200
Case.
Fig. 4 is referred to, Fig. 4 is the third implementation method schematic diagram of the present embodiment fin 200.
As shown in figure 4, a side surface of the dorsad robot of fin 200 is provided with several deformations 220, deformations 220
One end is connected on fin 200, and the other end of deformations 220 is hanging;Deformations 220 are made up of memory metal material, deformations
When 220 temperature reach default deformation temperature, the hanging one end of deformations 220 carries out deformation to the direction away from fin 200.
Specifically, a side surface of the dorsad robot control mainboard 100 of fin 200 is provided with deformations 220, deformations
220 is specifically to be made up of memory metal material, and the characteristic of memory metal material is the material internal when temperature reaches a certain numerical value
Crystal structure can change, so as to result in the change of profile.The high-temperature-phase of marmem has structure higher
Symmetry, usually orderly cubic structure.Below Ms (initial temperature of martensite transfor mation) temperature, single-orientated high-temperature-phase
It is transformed into the martensite variants with different orientation.When making this material deformation to be made element below Ms temperature, material
It is interior constantly to cut down with the disadvantaged martensite variants of stress direction;The then constantly growth being on a good wicket.Finally turn
Become the element with single-orientated orderly martensite.As being heated to once again more than critical deformation temperature spot, this symmetry
Low, single-orientated martensite is taken a turn for the worse when becoming, and previous single-orientated high-temperature-phase is formed again.Corresponding to this microcosmic
The reversible sex reversal of structure, has just recovered macroshape of the material in high temperature, here it is so-called one-way shape memory.
Deformations 220 are particularly configured to four prisms cylinder, and one end of deformations 220 is connected to the surface of fin 200, another
End is hanging.Deformations 220 at normal temperatures when be with the relative position of fin 200:The one end of deformations 220 and fin 200
Surface connects, and the angle formed between deformations 220 and the surface of fin 200 is less than 30 degree of acute angle.Deformations 220 exist
Reach deformation temperature and be with the relative position of fin 200 when issuing after deformation:The one end of deformations 220 and fin 200
Surface connects, and the angle formed between deformations 220 and the surface of fin 200 is 90 degree.The concrete shape of deformations 220 is not
Four prisms cylinder is confined to, according to the difference of concrete application scene, the shape of deformations 220 can be:Cylinder, Elliptic Cylinder,
Triangular prism or other polygon prisms.
In some selective embodiments, the concrete shape of resettlement groove (not shown) resettlement groove is offered on fin 200
Concrete shape with deformations 220 is consistent, and when the temperature of deformations 220 is not up to deformation critical-temperature, deformations 220 are placed
In in resettlement groove, when the temperature in deformations 220 reaches deformation temperature, deformations 220 are placed perpendicular to resettlement groove.This implementation
Mode receives deformations 220 in normal temperature, in order to be installed to fin 200 under normal temperature by setting resettlement groove.
Fig. 5 is referred to, Fig. 5 is formed with the structural representation of fin 200 of deformation radiating matrix 230 for the present embodiment.
As shown in figure 5, in some selective embodiments, several deformations 220 are regularly arranged on the surface of fin 200
Form deformation radiating matrix 230.
Specifically, the deformation radiating matrix 230 of 6x5 specifications, the composition of deformation radiating matrix 230 are formed on fin 200
Deformations 220 can be made after deforming upon, in the air communication channel of the surface formation rule of fin 200, it is to avoid deformations
220 disordered arrangements cause to hinder the phenomenon of air circulation, are effectively improved the radiating efficiency of fin 200.By deformations 220
The specification for being formed at the deformation radiating matrix 230 on the surface of fin 200 is not limited to above-mentioned cited specification, according to concrete application
The difference of scene, the specification of deformation radiating matrix 230 also can be other different types of specifications.
Fig. 6 is referred to, Fig. 6 is a kind of implementation method of air current flow passage in the present embodiment deformation radiating matrix 230.
As shown in fig. 6, in some selective implementation methods, deformations 220 are obliquely installed, so that deformation radiating matrix 230
In the adjacent width of two row deformations 220 extended line formed angle be acute angle;Formed between adjacent two row deformations 220
The flow channel of air-flow displacement.
Specifically, the slant setting of deformations 220 in deformation radiating matrix 230, deformations 220 are connected to fin 200
On one end and the length direction of fin 200 on horizontal angle be more than 45 degree angles, deformation is radiated and be located in matrix 230
The inclined angle of deformations 220 in same row is consistent, and two adjacent in same horizontal line in adjacent two row
Deformations 220 are acute angle in the angle that the extended line of its width is formed.
Two the two of deformations 220 radiating surfaces adjacent in same horizontal line are respectively positioned on same direction in adjacent two row,
One of phenomenon in air flow to expand with heat and contract with cold, radiating surface towards the direction that extends of direction be where the radiating surface
The air current flow direction in space, the not only radiating surface of adjacent two deformations 220 in adjacent two row in same horizontal line but also be phase
To, therefore air flow direction power in a longitudinal direction is cancelled, then the air current flow between adjacent two row for direction be along
Gas channel between two row is oriented movement.
Tilted-putted deformations 220 make to form air-flow displacement between adjacent two row deformations 220, can make radiating
The air current flow on the surface of piece 200 has more order, and air flow rate within the identical radiating time with taking away with many heat soon
Amount, improves the rate of heat dispation of fin 200.
Fig. 7 is referred to, Fig. 7 is the overall schematic of air current flow passage in the present embodiment deformation radiating matrix 230.
As shown in fig. 7, in some selective implementation methods, the direction phase of the air current flow between two neighboring flow channel
Instead, with accelerate deformation radiate matrix 230 inside air flow.
Specifically, because adjacent two deformations 220 in same horizontal line in adjacent two row are in its width
The angle that is formed of extended line be acute angle, the in opposite direction of air current flow between two neighboring flow channel is caused, in radiating
The surface of piece 200 forms cross-ventilation.
Air current flow between two neighboring flow channel it is in opposite direction, form cross-ventilation on the surface of fin 200,
The air velocity on the surface of fin 200 can be made faster, the rate of heat dispation of fin 200 is improved.
In some selective embodiments, the thermal grease used in the present embodiment includes following weight:Silicon
2-5 parts of alkane coupling agent, Graphene 2-3 parts, silica 2-6 parts, cumyl peroxide 2-6 parts, vinyl silicone oil 70-100
Part, reinforcing agent 3-5 parts and plasticizer 3-6 parts.
Specifically, it is illustrated with 1 part of ratio for corresponding to 1 kilogram.
In some selective implementation methods, thermal grease by 2kg silane couplers, 2kg Graphenes, 2kg silica,
2kg cumyl peroxides, 70kg vinyl silicone oils, 3kg reinforcing agents and 3kg plasticizer are mixed, by above-mentioned material during preparation
Material is mixed, and to make it with good mixing, is placed on after stirring quiet under the ultrasonic wave that power is more than 1000W
Put, mix raw material more uniform.
In some selective implementation methods, thermal grease by 5kg silane couplers, 3kg Graphenes, 6kg silica,
6kg cumyl peroxides, 100kg vinyl silicone oils, 5kg reinforcing agents and 6kg plasticizer are mixed, by above-mentioned material during preparation
Material is mixed, and to make it with good mixing, is placed on after stirring quiet under the ultrasonic wave that power is more than 1000W
Put, mix raw material more uniform.
In some selective implementation methods, thermal grease is by 2.5kg silane couplers, 1.5kg Graphenes, 4kg dioxies
SiClx, 4kg cumyl peroxides, 85kg vinyl silicone oils, 4kg reinforcing agents and 4.5kg plasticizer are mixed, will during preparation
Above-mentioned material is mixed, and to make it with good mixing, the ultrasonic wave that power is more than 1000W is placed on after stirring
Lower standing, mixes raw material more uniform.
Thermal grease used in the present embodiment, is modified by using grapheme material to thermal grease, makes to dissipate
The rate of heat dispation of hot silica gel is highly improved, and can be more than 3 times of common thermal grease.
In some selective embodiments, thermal dispersant coatings are coated with fin 200.Thermal dispersant coatings are a kind of radiations heat energies
Coating, can with 1-13.5 mum wavelengths form transmitting walk fin 200 on heat, reduce the surface of fin 200 and inside
Temperature, radiating and cooling is obvious.Thermal dispersant coatings are not influenceed by surrounding medium, can be used in vacuum environment, and thermal dispersant coatings are rising
While to radiation cooling, also there are good self-cleaning, anti-corrosive properties, water proofing property, fire line, insulating properties, antiacid alkali, easy construction
The characteristics of.
In some selective implementation methods, thermal dispersant coatings include following weight:5-10 parts of heat sink material of nanometer,
Graphene 1-3 parts and carrier material 20-100 parts.
Specifically, it is illustrated with 1 part of ratio for corresponding to 1 kilogram.
In some selective implementation methods, thermal dispersant coatings are by 5kg nanometers of heat sink material, 1kg Graphenes and 20kg carriers
Material is mixed, and is mixed above-mentioned material during preparation, to make it with good mixing, work(is placed on after stirring
Rate mixes raw material more uniform to be stood under the ultrasonic wave of more than 1000W.Wherein, nanometer heat sink material be silica,
One or more in the middle of antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide of mixture.Carrier material is polyurethane
Any one in the middle of system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating.
In some selective implementation methods, thermal dispersant coatings are carried by 10kg nanometers of heat sink material, 3kg Graphenes and 100kg
Body material is mixed, and is mixed above-mentioned material during preparation, to make it with good mixing, is placed on after stirring
Power mixes raw material more uniform to be stood under the ultrasonic wave of more than 1000W.Wherein, nanometer heat sink material is titanium dioxide
One or more in the middle of silicon, antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide of mixture.Carrier material is poly- ammonia
It is any one in the middle of ester system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating
Kind.
In some selective implementation methods, thermal dispersant coatings are carried by 7.5kg nanometers of heat sink material, 2kg Graphenes and 60kg
Body material is mixed, and is mixed above-mentioned material during preparation, to make it with good mixing, is placed on after stirring
Power mixes raw material more uniform to be stood under the ultrasonic wave of more than 1000W.Wherein, nanometer heat sink material is titanium dioxide
One or more in the middle of silicon, antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide of mixture.Carrier material is poly- ammonia
It is any one in the middle of ester system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating
Kind.
Thermal dispersant coatings are modified by the thermal dispersant coatings used in the present embodiment by using grapheme material, make to dissipate
The rate of heat dispation of hot coating is highly improved, and can be more than 2 times of common thermal grease.
In the present embodiment, the combination of main embodiment and any selective embodiment, or main embodiment with
The combination of multiple selectivity embodiments, is the feasible technical scheme of the present embodiment.
Embodiment 2
A kind of robot, robot includes the robot control mainboard for being equipped with robot C PU, robot control master
Heat abstractor is pasted with plate, the heat abstractor is the heat abstractor of robot control mainboard described in embodiment 1.
Using the robot of the heat abstractor, fin is attached by robot control mainboard, increase robot
The area of dissipation of control mainboard, and open up on a heat sink for receiving the raised receipts in robot control mainboard surface heater
Receive space, connected by thermal grease between accommodation space and heater, can make between fin and robot control mainboard
Connection it is more tight, and the thermal conduction rate between heater and fin can be made higher, increased heat abstractor
Radiating efficiency.
It should be noted that preferred embodiment of the invention is given in specification of the invention and its accompanying drawing, but,
The present invention can be realized by many different forms, however it is not limited to the embodiment described by this specification, these embodiments
Not as the extra limitation to present invention, there is provided the purpose of these embodiments is to make the understanding to the disclosure
It is more thorough comprehensive.Also, above-mentioned each technical characteristic continues to be mutually combined, the various embodiments that formation is not enumerated above,
It is considered as the scope of description of the invention record;Further, for those of ordinary skills, can be according to the above description
Improved or converted, and all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of heat abstractor of robot control mainboard, it is characterised in that the heat abstractor bag of the robot control mainboard
Include:
Fin, offers for receiving the raised accommodation space in the robot control mainboard surface heater;
Thermal grease, is filled in the connection heater and the fin in the accommodation space, and by the fin
Heat transfer to the fin in.
2. the heat abstractor of robot control mainboard according to claim 1, it is characterised in that the accommodation space is institute
State fin to be caved in the accommodating groove to be formed towards the heater side, the fin is attached at the robot control mainboard
When, the heater is accommodated in the accommodating groove.
3. the heat abstractor of robot control mainboard according to claim 2, it is characterised in that the thermal grease filling
In space between the accommodating groove and the heater.
4. the heat abstractor of robot control mainboard according to claim 1, it is characterised in that the accommodation space is institute
It is the glove hole being opened on the fin to state receiving space, when the fin is attached at the robot control mainboard,
The heater is located at or passes the glove hole.
5. the heat abstractor of robot control mainboard according to claim 4, it is characterised in that the thermal grease filling
In space between the article putting groove and the heater, and it is raised in the fin surface.
6. the heat abstractor of robot control mainboard according to claim 1, it is characterised in that the fin dorsad institute
The side surface for stating robot control mainboard is provided with several deformations, and described deformations one end is connected on the fin,
The deformations other end is hanging;
The deformations are made up of memory metal material, when the deformations temperature reaches default deformation temperature, the deformations
Hanging one end carries out deformation to the direction away from the fin.
7. the heat abstractor of robot control mainboard according to claim 6, it is characterised in that described several deformations
It is regularly arranged to form deformation radiating matrix in the fin surface.
8. the heat abstractor of robot control mainboard according to claim 7, it is characterised in that the deformations are inclined and set
Put, so that the angle that the extended line of adjacent two row deformations width is formed in deformation radiating matrix is acute angle;
The flow channel of air-flow displacement is formed between the adjacent two row deformations.
9. the heat abstractor of robot control mainboard according to claim 8, it is characterised in that the two neighboring flowing
Air current flow between passage it is in opposite direction, to accelerate the deformation to radiate the air flow of internal matrix.
10. a kind of robot, it is characterised in that the robot includes the robot control described in claim 1~9 any one
The heat abstractor of mainboard processed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710112850.4A CN106793716B (en) | 2017-02-28 | 2017-02-28 | The radiator and robot of robot control mainboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710112850.4A CN106793716B (en) | 2017-02-28 | 2017-02-28 | The radiator and robot of robot control mainboard |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106793716A true CN106793716A (en) | 2017-05-31 |
CN106793716B CN106793716B (en) | 2019-05-31 |
Family
ID=58960084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710112850.4A Active CN106793716B (en) | 2017-02-28 | 2017-02-28 | The radiator and robot of robot control mainboard |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106793716B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108673554A (en) * | 2018-08-30 | 2018-10-19 | 遨博(北京)智能科技有限公司 | A kind of joint of robot arm and robot |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2826513Y (en) * | 2005-10-14 | 2006-10-11 | 英业达股份有限公司 | Radiator |
CN201163857Y (en) * | 2008-03-11 | 2008-12-10 | 英业达科技有限公司 | Heat radiator |
US20140239477A1 (en) * | 2011-08-23 | 2014-08-28 | Samsung Electronics Co., Ltd. | Semiconductor packages and methods of forming the same |
CN204362489U (en) * | 2014-12-31 | 2015-05-27 | 昆山立茂国际贸易有限公司 | Heat radiator of electronic element |
CN204408831U (en) * | 2015-02-04 | 2015-06-17 | 东莞市华鸿橡塑材料有限公司 | Solid conductive heat silica gel piece |
CN105038374A (en) * | 2015-09-02 | 2015-11-11 | 普罗旺斯科技(深圳)有限公司 | Cooling coating, cooling fin and manufacturing method |
US20160029517A1 (en) * | 2013-04-02 | 2016-01-28 | Gerald Ho Kim | Silicon-Based Heat Dissipation Device For Heat-Generating Devices |
CN205194687U (en) * | 2015-12-07 | 2016-04-27 | 东莞市零度导热材料有限公司 | A heat conduction silica gel sheet for cell -phone |
CN106047308A (en) * | 2016-06-28 | 2016-10-26 | 太仓陶氏电气有限公司 | Graphene heat conducting agent of computer CPU (Central Processing Unit) chip heat radiator |
CN106304755A (en) * | 2015-05-25 | 2017-01-04 | 奇鋐科技股份有限公司 | Hand-hold electronic device radiator structure |
-
2017
- 2017-02-28 CN CN201710112850.4A patent/CN106793716B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2826513Y (en) * | 2005-10-14 | 2006-10-11 | 英业达股份有限公司 | Radiator |
CN201163857Y (en) * | 2008-03-11 | 2008-12-10 | 英业达科技有限公司 | Heat radiator |
US20140239477A1 (en) * | 2011-08-23 | 2014-08-28 | Samsung Electronics Co., Ltd. | Semiconductor packages and methods of forming the same |
US20160029517A1 (en) * | 2013-04-02 | 2016-01-28 | Gerald Ho Kim | Silicon-Based Heat Dissipation Device For Heat-Generating Devices |
CN204362489U (en) * | 2014-12-31 | 2015-05-27 | 昆山立茂国际贸易有限公司 | Heat radiator of electronic element |
CN204408831U (en) * | 2015-02-04 | 2015-06-17 | 东莞市华鸿橡塑材料有限公司 | Solid conductive heat silica gel piece |
CN106304755A (en) * | 2015-05-25 | 2017-01-04 | 奇鋐科技股份有限公司 | Hand-hold electronic device radiator structure |
CN105038374A (en) * | 2015-09-02 | 2015-11-11 | 普罗旺斯科技(深圳)有限公司 | Cooling coating, cooling fin and manufacturing method |
CN205194687U (en) * | 2015-12-07 | 2016-04-27 | 东莞市零度导热材料有限公司 | A heat conduction silica gel sheet for cell -phone |
CN106047308A (en) * | 2016-06-28 | 2016-10-26 | 太仓陶氏电气有限公司 | Graphene heat conducting agent of computer CPU (Central Processing Unit) chip heat radiator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108673554A (en) * | 2018-08-30 | 2018-10-19 | 遨博(北京)智能科技有限公司 | A kind of joint of robot arm and robot |
Also Published As
Publication number | Publication date |
---|---|
CN106793716B (en) | 2019-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106817883B (en) | A kind of radiator and cam device of camera control mainboard | |
TWI257543B (en) | Equalizing temperature device | |
CN205610422U (en) | Heat dissipation mechanism of motor and motor | |
CN106765743A (en) | A kind of energy-saving type air-conditioning plant | |
CN211012103U (en) | Miniature cold and hot water generator | |
CN104216492B (en) | A kind of computer chip liquid cooled immersion structure cooling system | |
CN101659829B (en) | Infrared radiation composite radiating coating and preparation method and spraying method thereof | |
CN203934244U (en) | Electronic equipment | |
CN105792620A (en) | Chip, circuit board and mobile terminal | |
CN105744811A (en) | Housing and mobile terminal | |
CN107787167A (en) | A kind of mobile terminal | |
CN106793716A (en) | The heat abstractor and robot of robot control mainboard | |
CN105792619A (en) | Heat radiation device and mobile terminal | |
CN105744425A (en) | Telephone receiver assembly and mobile terminal | |
Saravanan et al. | Combined radiation-convection in an air filled enclosure with in-line heaters | |
CN203522288U (en) | Charger | |
CN204834603U (en) | High heat conduction graphite sheet | |
CN204810781U (en) | Heat dissipation graphite flake | |
CN106455441B (en) | A kind of high efficiency temperature controlled device of hand-held terminal device | |
CN105792618A (en) | Metal support and mobile terminal | |
CN206339926U (en) | The built-in radiator of notebook | |
CN108513519A (en) | Terminal device and its radiator structure | |
CN209708732U (en) | A kind of high performance radar heat conductive isolation sheet | |
CN207199609U (en) | A kind of active heat removal mechanism and Intelligent worn device | |
CN105763689A (en) | Display screen support and terminal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |