CN207199609U - A kind of active heat removal mechanism and Intelligent worn device - Google Patents
A kind of active heat removal mechanism and Intelligent worn device Download PDFInfo
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- CN207199609U CN207199609U CN201721034909.4U CN201721034909U CN207199609U CN 207199609 U CN207199609 U CN 207199609U CN 201721034909 U CN201721034909 U CN 201721034909U CN 207199609 U CN207199609 U CN 207199609U
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- heat
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- removal mechanism
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Abstract
The utility model discloses a kind of active heat removal mechanism and Intelligent worn device.The active heat removal mechanism includes：One TEC；It is connected to the radiator in the hot junction of the TEC；And heat-conducting piece, the heat-conducting piece are configurable for conducting heat caused by multiple heating elements to the cold end of a TEC.One of the present utility model has the technical effect that heat dissipation design can save the inside of electronic equipment and use space, meets the miniature requirement of electronic equipment.
Description
Technical field
Cooling electronic component technical field is the utility model is related to, more specifically, the utility model is related to a kind of active
Cooling mechanism and Intelligent worn device.
Background technology
With becoming stronger day by day for consumer electronicses product function, the work(of the electronic component such as required CPU, GPU, HPU
Rate improves constantly, and causes the temperature of component to improve, and then causes the local temperature of whole electronic equipment to raise, so as to influence visitor
The usage experience at family.
Temperature rise can cause the reliability of electronic component to reduce or even fail.Data shows, the failure of electronic equipment
It is too high caused by temperature to have 55%, and famous " 10 DEG C of rules " supports：Semiconductor device temperature often raises 10 DEG C, its
Reliability will reduce by 50%.
Heat caused by electronic component is directed at product surface by traditional electronic equipment dissipating heat generally use Heat Conduction Material,
And rejected heat to using the heat loss through radiation mode of cross-ventilation or material in itself in surrounding air nearby.This radiating
The efficiency of mode is low, far can not meet the radiating requirements of existing electronic equipment.
Patent CN201520219900 describes a kind of chip radiator based on thermoelectric cooling principle, thermoelectric material and dissipates
Warmware is directly mounted on heating element, is connected to be radiated, had using the hot junction of ceramic radiating fin and thermoelectric material
Certain advance.But for increasingly minimizing, light-weighted electronic equipment, multiple heating elements are provided with it, every
A thermoelectric material is mounted on individual heating element and radiating piece, space-consuming are big, it is impossible to meets that the miniaturization of product is set
Meter requires.
It is small provided with high-density integration chip group, installing space especially in Intelligent worn device；The power of chip is big,
Caloric value is big.It is low according to traditional heat-dissipating mode efficiency, it is impossible to meet radiating requirements.According to thermoelectric cooling chip radiator,
A thermoelectric material and radiating piece are respectively mounted on each chip, because High Density Integration, installing space are small, leads to not install
Realize.
Therefore, it is necessary to the radiator structure of electronic component in existing electronic equipment especially Intelligent worn device is carried out
Improve.
Utility model content
A purpose of the present utility model is to provide a kind of new solution of active heat removal mechanism and Intelligent worn device.
According to first aspect of the present utility model, there is provided a kind of active heat removal mechanism.The active heat removal mechanism includes：One
Individual TEC；It is connected to the radiator in the hot junction of the TEC；And heat-conducting piece, the heat-conducting piece are configured as
For heat caused by multiple heating elements to be conducted to the cold end of a TEC.
Alternatively, the highly heat-conductive material includes one in graphite material, grapheme material or high-thermal conductive metal material
Kind is a variety of.
Alternatively, the flexible body is banded structure or linear structure.
Alternatively, the thermal conductivity factor of the high heat conduction grapheme material is more than 800W/ (mK).
Alternatively, the heat-conducting piece only includes the flexible body；Or the heat-conducting piece is also wrapped in the flexibility
Heat-insulating material on body.
Alternatively, the thermal conductivity factor of the heat-insulating material is less than 0.1W/ (mK), and the heat-insulating material includes heat-intercepting glass
One or more in fiber, adiabatic asbestos, adiabatic plastics.
Alternatively, the quantity of the heat-conducting piece is multiple that one end of each heat-conducting piece is connected to the thermoelectric cooling
The cold end of device, the other end are connected to the surface of heating element.
Alternatively, the cold end of the both ends of the heat-conducting piece and the TEC, heating element are all provided between surface
There is heat conductive silica gel；The end face of the radiator is smooth, and is connected by heat conductive silica gel with the hot junction of the TEC.
According to second aspect of the present utility model, there is provided a kind of Intelligent worn device.The Intelligent worn device includes shell
Body, mainboard and above-mentioned active heat removal mechanism, the mainboard are installed in the housing, and the mainboard has multiple chips, institute
Heat-conducting piece is stated to be configurable for conducting heat caused by multiple chips to the cold end of a TEC, institute
The heat for stating hot junction is released into outside the housing.
Alternatively, the TEC is installed on the mainboard, and the cold end of the TEC is located at the shell
In vivo, the hot junction of the TEC is located at outside the housing.
Inventor of the present utility model has found that traditional product radiating generally use Heat Conduction Material produces heating element
Heat conduct to product surface, recycle the heat loss through radiation mode of cross-ventilation or material in itself to reject heat to nearby
In surrounding air, radiating efficiency is low.Based on the chip radiator of thermoelectric cooling principle, ceramic radiating fin and thermoelectric material are used
Hot junction is connected to be radiated, and thermoelectric material is directly mounted on electronic component.In the electronics with multiple heating elements
In equipment, a thermoelectric material is respectively mounted on each heating element and radiating piece, space-consuming are big, it is impossible to meets product
Miniaturization Design requirement.
Therefore, the technical assignment or technical problem to be solved that the utility model to be realized are people in the art
It is that member never expects or it is not expected that, therefore the utility model is a kind of new technical scheme.
In active heat removal mechanism provided by the utility model and Intelligent worn device, coordinated by a TEC
Radiator is by heat derives caused by multiple heating elements.Each heating element will by one or more heat-conducting piece
Caused heat is conducted to the cold end of TEC.
TEC and radiator need not be respectively mounted on each heating element, occupy little space, disclosure satisfy that electricity
The Miniaturization Design demand of sub- equipment.
Chipset is provided with especially in Intelligent worn device, in it, each chip passes through one or more heat conduction
Part conducts caused heat to the cold end of TEC.It can save inside Intelligent worn device and use space, for intelligence
The design of wearable device provides flexibility.
After TEC is powered, temperature difference is produced between cold end and hot junction so as to realize heat conduction, based on
Dynamic radiating mode, radiating efficiency are high.Improve the stability and reliability of electronic component.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
It is combined in the description and the accompanying drawing of a part for constitution instruction shows embodiment of the present utility model, and
And it is used to explain principle of the present utility model together with its explanation.
Fig. 1 is the schematic diagram of the active heat removal mechanism provided in a kind of embodiment of the utility model；
Fig. 2 is the sectional view in A-A directions in Fig. 1；
Fig. 3 is the scheme of installation of the active heat removal mechanism provided in a kind of embodiment of the utility model.
Wherein, 1：Heating element；2：Flexible piece；3：Heat-insulating material；4：TEC；40：Cold end；41：Hot junction；5：
Radiator；6：Mainboard；7：Battery.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：It is unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The utility model provides a kind of active heat removal mechanism, and the active heat removal mechanism can realize dissipating for electronic component
Heat, it can particularly be applied to the Intelligent worn device with high-density integration chip group, VR, AR, MR intelligent glasses, intelligent hand
The radiating of machine or game machine or other electronic equipments.With reference to figure 1, the active heat removal mechanism includes a TEC 4, dissipated
Hot device 5 and heat-conducting piece.The TEC 4 is a kind of electronic component based on semiconductor.By in the thermoelectricity
The both ends loading DC voltage of refrigerator 4, one end of the TEC 4 turns cold, other end heating.By the heat of refrigeration one end
Amount is passed to hot junction 41.The concrete structure of the TEC 4 can use prior art, and therefore not to repeat here.
The hot junction 41 of the TEC 4 is connected with the radiator 5, so as to discharge from the TEC 4
Cold end 40 heat and device running that pass in caused Joule heat.
The heat-conducting piece is used to conduct heat caused by multiple heating elements 1 to TEC 4
Cold end 40.The heat-conducting piece realizes heat from the higher heating element 1 of temperature to the relatively low cold end 40 of TEC 4 of temperature
Transmit.
Specifically, the quantity of the heat-conducting piece can be one or more.Each heating element 1 and the thermoelectric cooling
At least one heat-conducting piece is provided between the cold end 40 of device 4.One end of the heat-conducting piece is connected to the thermoelectric cooling
The cold end 40 of device 4, the other end are connected to the surface of heating element 1.So, heat energy quilt caused by multiple heating elements 1
The heat-conducting piece is conducted to the cold end 40 of the TEC 4.
Further, the cold end 40 of the both ends of the heat-conducting piece and the TEC 4, the surface of heating element 1
Between can be provided with heat conductive silica gel.The heat conductive silica gel is located at the heat-conducting piece and the TEC 4, heating element
1 linkage interface, more effectively heat caused by multiple heating elements 1 can be conducted to the cold end of the TEC 4
40。
The TEC 4 is powered and actively by the heat transfer of cold end 40 to hot junction 41.Due to the thermoelectric cooling
The hot junction 41 of device 4 is connected with the radiator 5, and the heat in the hot junction 41 can be released out.Based on the active heat removal mechanism
Dynamic radiating mode, radiating efficiency are high.Improve the stability and reliability of electronic component.
The heat-conducting piece conducts heat caused by multiple heating elements 1 to the cold end of a TEC 4
40.TEC 4 and radiator 5 need not be respectively mounted on each heating element 1, occupied little space.Thus this actively dissipates
Heat engine structure disclosure satisfy that the Miniaturization Design demand of electronic equipment.
The heat-conducting piece has conduction of heat, can conduct heat caused by multiple heating elements 1 to described in one
The cold end 40 of TEC 4.The concrete structure of the heat-conducting piece can have a variety of.
The highly heat-conductive material includes graphite material, grapheme material or one kind or more in high-thermal conductive metal material
Kind.
In one embodiment, the heat-conducting piece can be made up of graphite.For example, the heat-conducting piece can be graphite sheet or
Graphite wire rod etc..
In one preferred embodiment, with reference to figure 1, the heat-conducting piece can include made of high heat conduction grapheme material
Flexible body 2.The flexible body 2 is made up of high heat conduction grapheme material, can be fast and effeciently by caused by multiple heating elements 1
Heat is conducted to the cold end 40 of a TEC 4.
The flexible body 2 can any flexural deformation, in order to which the TEC 4 is connected with heating element 1.
, will in the needs heat-conducting piece because the position relationship between the TEC 4 and heating element 1 does not uniquely determine
When the TEC 4 links together with heating element 1, the flexible body 2 could connect both after flexural deformation
Connect.The flexible body 2 have it is certain flexible, after the active force for making the flexural deformation of flexible body 2 loses, the flexible body
2 itself can not recover original form, it is therefore prevented that the both ends of the heat carrier depart from the cold end 40 and hair in the TEC 4
The surface of hot component 1.
In the embodiment, the flexible body 2 can be banded structure.For example, the flexible body 2 can be sheet.It is described soft
Property body 2 can also be linear structure.
In the embodiment, the thermal conductivity factor of the high heat conduction grapheme material is more than 800W/ (mK).Heat-conductive characteristic
Excellent, efficiency high.
In the embodiment, with reference to figure 1, Fig. 2, the heat-conducting piece can also be wrapped in the thermal insulation on the flexible body 2
Material 3.The heat-insulating material 3 wraps up the outer wall of the flexible body 2, can prevent flexible body 2 of the heat from comparative high temperature
Conducted to other structures part, ensure the accurate of heat conduction orientation.
The thermal conductivity factor of the heat-insulating material 3 is compared with low setting, to play heat insulating function.Preferably, the heat-insulating material 3
Thermal conductivity factor is less than 0.1W/ (mK).
The material of the heat-insulating material 3 can have a variety of.Alternatively, the heat-insulating material 3 include insulated fibre glass, absolutely
One or more in hot asbestos, adiabatic plastics.
In addition, can not also be enclosed with heat-insulating material 3 on the flexible body 2, the heat-conducting piece only includes the flexibility
Body 2.
The concrete structure of the radiator 5 can have it is a variety of, as long as it, which can be realized, to discharge the TEC 4
The heat in hot junction 41.Preferably, the radiator 5 include fin, liquid thermal conductivity device, one kind in radiator fan or
It is a variety of., can be with the side of the fin for example, fin can be connected with the hot junction 41 of the TEC 4
Provided with radiator fan.
To realize more excellent conductive force, it is preferable that with reference to figure 1, the end face of the radiator 5 is smooth, and described scattered
The flat end face of hot device 5 is connected by heat conductive silica gel with the hot junction 41 of the TEC 4.The heat conductive silica gel is positioned at described
Radiator 5 and the linkage interface in the hot junction 41, play conductive force.
The utility model additionally provides a kind of Intelligent worn device, the Intelligent worn device can be virtual reality device,
Augmented reality equipment, mixed reality equipment, intelligent watch or other Intelligent worn devices.Referring to figs. 1 to Fig. 3, the intelligence
Wearable device includes housing, mainboard 6 and active heat removal mechanism provided by the utility model.The housing is with accommodating chamber.Institute
Mainboard 6 is stated to be installed in the housing.Multiple heating elements 1 are the chipset of the mainboard 6.The chipset includes multiple
Chip.For example, the chipset can include CPU (Central Processing Unit, central processing unit), GPU
(Graphics Processing Unit, graphics processor) etc..The heat-conducting piece is used for will be hot caused by multiple chips
Amount is conducted to the cold end 40 of a TEC 4.The heat in the hot junction 41 of the TEC 4 is released into described
The outside of housing.
Preferably, the quantity of the active heat removal mechanism is for one group or multigroup.In active heat removal mechanism described in every group
Including a TEC 4, multiple chips and the heat-conducting piece.
The heat in the hot junction 41 of the TEC 4 need to be released into the outside of the housing, and its delivery mode can be with
Have a variety of.
Alternatively, the TEC 4 is installed on the mainboard 6.The cold end 40 of the TEC 4 is located at institute
State in housing, the hot junction 41 of the TEC 4 is located at outside the housing.It so, it is possible the heat energy in the hot junction 41
It is released into the outside of the shell.
Alternatively, the hot junction 41 of the TEC 4 can also be located in the housing.The radiator 5 is by described in
The heat in hot junction 41 is discharged to the outside of the housing.For example, the radiator 5 can include fin, the fin
One end is connected with the hot junction 41 of the TEC 4, the other end passes the housing, can discharge the heat in the hot junction 41
To the outside of the housing.
In addition, the salable setting of housing, is avoided that the impurity such as moisture, dust enter in the housing.The mainboard 6
It can also electrically connect with battery 7, be powered for the chipset and the TEC 4.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
Modify.The scope of the utility model is defined by the following claims.
Claims (10)
- A kind of 1. active heat removal mechanism, it is characterised in that including：One TEC (4)；It is connected to the radiator (5) in the hot junction (41) of the TEC (4)；AndHeat-conducting piece, the heat-conducting piece are configurable for conducting heat caused by multiple heating elements to the thermoelectricity The cold end (40) of refrigerator (4).
- 2. active heat removal mechanism according to claim 1, it is characterised in that the heat-conducting piece is included by highly heat-conductive material system Into flexible body (2), the highly heat-conductive material include graphite material, grapheme material or high-thermal conductive metal material in one kind It is or a variety of.
- 3. active heat removal mechanism according to claim 2, it is characterised in that the flexible body (2) be banded structure or Linear structure.
- 4. active heat removal mechanism according to claim 2, it is characterised in that the heat conduction system of the high heat conduction grapheme material Number is more than 800W/ (mK).
- 5. active heat removal mechanism according to claim 2, it is characterised in that the heat-conducting piece only includes the flexible body (2)；OrThe heat-conducting piece is also wrapped in the heat-insulating material (3) on the flexible body (2).
- 6. active heat removal mechanism according to claim 5, it is characterised in that the thermal conductivity factor of the heat-insulating material (3) is low In 0.1W/ (mK), the heat-insulating material (3) includes a kind of or more in insulated fibre glass, adiabatic asbestos, adiabatic plastics Kind.
- 7. the active heat removal mechanism according to any one of claim 1-6, it is characterised in that the quantity of the heat-conducting piece is Multiple, each one end of the heat-conducting piece is connected to the cold end (40) of the TEC (4), the other end is connected to heating member The surface of device.
- 8. active heat removal mechanism according to claim 7, it is characterised in that the both ends of the heat-conducting piece and the thermoelectricity system The cold end (40) of cooler (4), heating element are equipped with heat conductive silica gel between surface；The end face of the radiator (5) is smooth, and by the hot junction (41) of heat conductive silica gel and the TEC (4) even Connect.
- 9. a kind of Intelligent worn device, it is characterised in that including housing, mainboard (6) and according to any one of claim 1-8 Described active heat removal mechanism, the mainboard (6) are installed in the housing, and the mainboard (6) has multiple chips, described to lead Warmware is configurable for conducting heat caused by multiple chips to the cold end of a TEC (4) (40), the heat of the hot junction (41) is released into outside the housing.
- 10. Intelligent worn device according to claim 9, it is characterised in that the TEC (4) is installed on described On mainboard (6), the cold end (40) of the TEC (4) is located in the housing, the hot junction of the TEC (4) (41) outside the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721034909.4U CN207199609U (en) | 2017-08-17 | 2017-08-17 | A kind of active heat removal mechanism and Intelligent worn device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721034909.4U CN207199609U (en) | 2017-08-17 | 2017-08-17 | A kind of active heat removal mechanism and Intelligent worn device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207199609U true CN207199609U (en) | 2018-04-06 |
Family
ID=61794144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721034909.4U Withdrawn - After Issue CN207199609U (en) | 2017-08-17 | 2017-08-17 | A kind of active heat removal mechanism and Intelligent worn device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207199609U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393891A (en) * | 2017-08-17 | 2017-11-24 | 歌尔股份有限公司 | A kind of active heat removal mechanism and Intelligent worn device |
-
2017
- 2017-08-17 CN CN201721034909.4U patent/CN207199609U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393891A (en) * | 2017-08-17 | 2017-11-24 | 歌尔股份有限公司 | A kind of active heat removal mechanism and Intelligent worn device |
| CN107393891B (en) * | 2017-08-17 | 2023-07-25 | 歌尔科技有限公司 | Initiative cooling mechanism and intelligent wearing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201013 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221213 Address after: 266104 No. 500, Songling Road, Laoshan District, Qingdao, Shandong Patentee after: GOERTEK TECHNOLOGY Co.,Ltd. Address before: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronics office building) Patentee before: GoerTek Optical Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180406 Effective date of abandoning: 20230725 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20180406 Effective date of abandoning: 20230725 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |