CN210197652U

CN210197652U - Air conditioning unit

Info

Publication number: CN210197652U
Application number: CN201921038549.4U
Authority: CN
Inventors: Tiejun Zheng; 郑铁军; Chao Wu; 吴超; Guohua Jin; 金国华; Mingyao Xi; 奚明耀
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2020-03-27
Anticipated expiration: 2029-07-03

Abstract

The application provides an air conditioning unit, this air conditioning unit include casing and semiconductor heat conduction structure, and semiconductor heat conduction structure installs on the inner wall of casing, and semiconductor heat conduction structure includes hot junction and cold junction, and the hot junction is laminated mutually with the inner wall of casing, and the cold junction is towards the inside of casing. Use the technical scheme of the utility model, through semiconductor heat conduction structure with the heat transfer to the hot junction of its cold junction to heat the casing, improve the temperature of casing, thereby avoid the casing to produce the condensation water. In addition, on the one hand, the cold end of the semiconductor heat conduction structure also takes away the heat inside the shell, so that the refrigerating capacity inside the shell is improved, and the refrigerating effect is improved. Therefore, the condensation problem of the traditional air conditioning unit is solved from the source of the generated condensation, and a series of fault problems caused by the condensation problem of the air conditioning unit are reduced, such as electrical safety problems caused by dripping the condensed water into an electrical box.

Description

Air conditioning unit

Technical Field

The utility model relates to an air conditioning equipment technical field particularly, relates to an air conditioning unit.

Background

An air conditioning unit is an air treatment device assembled by various air treatment functional sections. With the improvement of the living standard of people, the air conditioning unit is widely applied to thousands of households, and people increasingly depend on the air conditioning unit and are indispensable household appliances in life.

The air conditioning unit also has many problems in the use process, and the problems are gradually exposed, for example, the high temperature which needs to be solved urgently is the condensation problem of the air conditioning unit. As shown in fig. 1, the mechanism of generating condensation is that air state B1 entering the air conditioning unit exchanges heat through an evaporator, low-temperature saturated air state B2 is sent out through air supply, the moisture content is the same as state B1, when the dry bulb temperature of B2 is lower than B3, the moisture in the air in the state of B3 appears on the cold surface, and condensation is generated. In the case of refrigeration, condensation is likely to form on the housing of the air conditioning unit.

The traditional air conditioning unit solves the problem that the condensation scheme is realized by sticking sponge and flannelette inside the shell of the air conditioning unit, but the effect is not good, the condition of air leakage and condensation also exists in the side seam area of the shell, and a rotten area can appear in a gap between the sponge and the flannelette.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides an air conditioning unit to solve among the prior art air conditioning unit to the not good problem of technological effect who prevents the casing and produce the condensation.

The embodiment of the application provides an air conditioning unit, includes: a housing; the semiconductor heat conduction structure is installed on the inner wall of the shell and comprises a hot end and a cold end, the hot end is attached to the inner wall of the shell, and the cold end faces the inside of the shell.

In one embodiment, a semiconductor heat conducting structure includes a hot side connection pad and a cold side connection pad, and a P-type semiconductor and an N-type semiconductor disposed between the hot side connection pad and the cold side connection pad.

In one embodiment, the hot side connection pad and the cold side connection pad are metal connection pads.

In one embodiment, the air conditioning unit includes a dc power supply electrically connected to the semiconductor heat conducting structure for supplying power to the semiconductor heat conducting structure.

In one embodiment, the semiconductor heat conducting structure is a plurality of semiconductor heat conducting structures, and the plurality of semiconductor heat conducting structures are distributed on the inner wall of the shell.

In one embodiment, the air conditioning assembly includes an evaporator mounted within the housing, and a semiconductor heat conducting structure mounted on the housing in an area corresponding to the evaporator.

In one embodiment, the air conditioning unit comprises a refrigerant pipeline, the refrigerant pipeline is located inside the shell, and the semiconductor heat conduction structure is installed on the shell in an area corresponding to the refrigerant pipeline.

In one embodiment, the air conditioning unit includes an air duct located inside the housing, and the semiconductor heat conducting structure is mounted on the housing in an area corresponding to the air duct.

In one embodiment, the housing comprises an air-out frame, and the semiconductor heat conducting structure is mounted on the inner wall of the air-out frame.

In one embodiment, the housing includes a top cover plate, and the semiconductor heat conducting structure is mounted on an inner wall of the top cover plate.

In the above embodiment, heat transfer to the hot junction of its cold junction is through semiconductor heat conduction structure to heat the casing, improve the temperature of casing, thereby avoid the casing to produce the condensation water. In addition, on the one hand, the cold end of the semiconductor heat conduction structure also takes away the heat inside the shell, so that the refrigerating capacity inside the shell is improved, and the refrigerating effect is improved. Therefore, the condensation problem of the traditional air conditioning unit is solved from the source of the generated condensation, and a series of fault problems caused by the condensation problem of the air conditioning unit are reduced, such as electrical safety problems caused by dripping the condensed water into an electrical box.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:

FIG. 1 is a schematic illustration of the mechanism for generating condensation;

fig. 2 is a schematic diagram of a semiconductor heat conducting structure of an air conditioning unit according to the present invention;

fig. 3 is a schematic structural view of a housing of an air conditioning unit according to the present invention;

fig. 4 is a schematic structural diagram of an air outlet frame of the air conditioning unit according to fig. 3.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

As shown in fig. 3, the embodiment of the utility model discloses an air conditioning unit includes casing 10 and semiconductor heat conduction structure 20, and semiconductor heat conduction structure 20 is installed on casing 10's inner wall, and semiconductor heat conduction structure 20 includes hot junction and cold junction, and the hot junction is laminated mutually with casing 10's inner wall, and the cold junction is towards casing 10's inside.

Use the technical scheme of the utility model, heat transfer to the hot junction with its cold junction through semiconductor heat conduction structure 20 to heat casing 10, improve casing 10's temperature, thereby avoid casing 10 to produce the condensation water. On the other hand, the cold end of the semiconductor heat conducting structure 20 also takes away the heat inside the casing 10, which is also beneficial to improving the cooling capacity inside the casing 10 and improving the cooling effect. Therefore, the condensation problem of the traditional air conditioning unit is solved from the source of the generated condensation, and a series of fault problems caused by the condensation problem of the air conditioning unit are reduced, such as electrical safety problems caused by dripping the condensed water into an electrical box.

It should be noted that, the technical solution of the present invention is mainly to apply the peltier effect generated by the semiconductor heat conducting structure 20, and to exchange heat between the region of the casing 10 with the condensation and the inside of the casing 10 by heating, so as to raise the temperature of the region without generating the condensation problem.

As shown in fig. 2, in the technical solution of the present invention, the semiconductor heat conducting structure 20 includes a hot end connecting sheet 21 and a cold end connecting sheet 22, and a P-type semiconductor and an N-type semiconductor disposed between the hot end connecting sheet 21 and the cold end connecting sheet 22. The N-type semiconductor element and the P-type semiconductor element are connected into a thermocouple pair, namely a P-N junction-Peltier element is formed. When direct current passes through the P-N junction, energy is generated to exchange with the external environment at the junction. Specifically, the direct current is introduced into a P-N junction and is contacted with the inner wall of the shell 10 through a hot end connecting sheet 21, the principle is known from the Peltier effect, after the direct current passes through the thermocouple, the P-type semiconductor and the N-type semiconductor transmit heat at the

joints

1 and 3 to the joints 2 and 4 to release heat to the inner wall of the shell 10, and therefore the inner wall of the shell 10 can have a certain temperature and does not have temperature difference with a condensation area, and the problem of condensation cannot be caused. Macroscopically, the thermocouple is made into the heating thin films of each small block by utilizing the Peltier effect principle to be connected in series, so that the heating end connecting sheet 21 is connected with the inner wall of the shell 10, the temperature of the shell 10 is adjusted under the condition of ensuring a certain temperature, the temperature difference problem of the shell 10 is further solved, and the shell of the unit can be kept from generating condensed water. Since the heat absorption of a single peltier element is limited, in practical applications, a plurality of peltier elements are usually cascaded together and encapsulated by a ceramic sheet which is insulating and well heat conductive, thus forming the semiconductor heat conducting structure 20.

In the technical solution of this embodiment, the hot end connection sheet 21 and the cold end connection sheet 22 are metal connection sheets. Optionally, the metal connecting sheet is a copper sheet.

More preferably, the air conditioning unit includes a dc power supply 30, and the dc power supply 30 is electrically connected to the semiconductor heat conducting structure 20 for supplying power to the semiconductor heat conducting structure 20. Use the technical scheme of the utility model, can set up direct current power supply ware 30 in air conditioning unit inside to supply power to semiconductor heat conduction structure 20. As another alternative, an external dc power supply may be provided to supply power to the semiconductor heat-conducting structure 20.

More preferably, in the technical solution of the present invention, the number of the semiconductor heat conducting structures 20 is multiple, and the multiple semiconductor heat conducting structures 20 are distributed on the inner wall of the casing 10. Since a plurality of regions in which dew condensation is likely to occur may exist inside the case 10, the plurality of semiconductor heat conductive structures 20 may be distributed at positions corresponding to the plurality of regions in which dew condensation is likely to occur on the inner wall of the case 10, so that dew condensation does not occur on the outside of the case 10. Alternatively, the semiconductor heat conductive structure 20 may be mounted on a sheet metal of the case 10.

Optionally, in the technical solution of the present invention, the air conditioning unit includes an evaporator, and the evaporator is installed inside the casing 10. Since the evaporator is located at a low temperature, condensed water is easily generated on the housing 10 adjacent thereto. In this way, the semiconductor heat conducting structure 20 is mounted on the region of the casing 10 corresponding to the evaporator, so that the region of the casing 10 corresponding to the evaporator can be well protected from generating condensed water. As shown in fig. 3, the casing 10 includes a top cover plate 12, and since the top cover plate 12 is adjacent to the evaporator, condensed water is easily generated on the top cover plate 12, and the semiconductor heat conducting structure 20 is mounted on the inner wall of the top cover plate 12.

In addition, the air conditioning unit includes a refrigerant pipe line located inside the casing 10. Since the temperature of the area where the refrigerant pipeline is located is low, condensed water is easily generated on the adjacent shell 10. In this way, the semiconductor heat conducting structure 20 is mounted on the region of the casing 10 corresponding to the refrigerant pipeline, so that the region of the casing 10 corresponding to the refrigerant pipeline can be well prevented from generating condensed water.

Optionally, the air conditioning unit includes an air duct located inside the housing 10. Since the temperature is also low in the area of the air duct, condensed water is easily generated on the housing 10 adjacent to the air duct. In this way, the semiconductor heat conducting structure 20 is mounted on the region of the casing 10 corresponding to the air duct, so that the region of the casing 10 corresponding to the air duct can be well protected from generating condensed water. As shown in fig. 4, the housing 10 includes an air outlet frame 11, and since the air outlet frame 11 corresponds to the air duct, condensed water is easily generated on the air outlet frame 11, and the semiconductor heat conducting structure 20 is mounted on the inner wall of the air outlet frame 11.

When using, reach the temperature sensing temperature with supply air temperature through logic control, do the contrast between this supply air temperature and the return air temperature, can separate out the condition that produces the condensation, judge whether semiconductor heat conduction structure 20 can open, if can open the in-process, thereby reach outside casing 10's temperature through heating casing 10 and outside temperature is unanimous just can reach temperature balance with the interior panel beating casing part below temperature value of air conditioning unit, can not produce the condensation water.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An air conditioning assembly, comprising:

a housing (10);

the semiconductor heat conduction structure (20) is installed on the inner wall of the shell (10), the semiconductor heat conduction structure (20) comprises a hot end and a cold end, the hot end is attached to the inner wall of the shell (10), and the cold end faces the inside of the shell (10).

2. Air conditioning unit according to claim 1, characterized in that said semiconductor heat conducting structure (20) comprises a hot side connection pad (21) and a cold side connection pad (22), and a P-type semiconductor and an N-type semiconductor arranged between said hot side connection pad (21) and said cold side connection pad (22).

3. Air conditioning unit according to claim 2, characterized in that the hot end connection piece (21) and the cold end connection piece (22) are metal connection pieces.

4. Air conditioning assembly according to claim 1, characterized in that it comprises a direct current power supply (30), said direct current power supply (30) being electrically connected to said semiconductor heat conducting structure (20) for supplying power to said semiconductor heat conducting structure (20).

5. Air conditioning assembly according to claim 1, wherein said semiconductor heat conducting structure (20) is a plurality of semiconductor heat conducting structures (20) distributed on the inner wall of said housing (10).

6. Air conditioning assembly according to claim 1, characterized in that it comprises an evaporator mounted inside said casing (10), said semiconductor heat-conducting structure (20) being mounted on the casing (10) in a region corresponding to said evaporator.

7. The air conditioning unit according to claim 1, characterized in that it comprises a coolant line inside the casing (10), the semiconductor heat conducting structure (20) being mounted on the casing (10) in a region corresponding to the coolant line.

8. Air conditioning assembly according to claim 1, characterized in that it comprises an air duct located inside said casing (10), said semiconductor heat-conducting structure (20) being mounted on said casing (10) in a region corresponding to said air duct.

9. Air conditioning assembly according to claim 1, wherein the housing (10) comprises an air-out frame (11), the semiconductor heat conducting structure (20) being mounted on an inner wall of the air-out frame (11).

10. Air conditioning assembly according to claim 1, characterized in that the housing (10) comprises a top cover plate (12), the semiconductor heat conducting structure (20) being mounted on an inner wall of the top cover plate (12).