CN110307629A - Air conditioning unit - Google Patents
Air conditioning unit Download PDFInfo
- Publication number
- CN110307629A CN110307629A CN201910596418.6A CN201910596418A CN110307629A CN 110307629 A CN110307629 A CN 110307629A CN 201910596418 A CN201910596418 A CN 201910596418A CN 110307629 A CN110307629 A CN 110307629A
- Authority
- CN
- China
- Prior art keywords
- shell
- air
- conductive structure
- conditioner set
- semiconductor conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004378 air conditioning Methods 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 claims abstract description 61
- 239000003507 refrigerant Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 abstract description 36
- 238000009833 condensation Methods 0.000 abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F2013/221—Means for preventing condensation or evacuating condensate to avoid the formation of condensate, e.g. dew
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2221/00—Details or features not otherwise provided for
- F24F2221/34—Heater, e.g. gas burner, electric air heater
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides an air conditioning unit, this air conditioning unit include casing and semiconductor heat conduction structure, and semiconductor heat conduction structure installs on the inner wall of casing, and semiconductor heat conduction structure includes hot junction and cold junction, and the hot junction is laminated mutually with the inner wall of casing, and the cold junction is towards the inside of casing. By applying the technical scheme of the invention, the heat at the cold end of the semiconductor heat conducting structure is transferred to the hot end to heat the shell, so that the temperature of the shell is increased, and the shell is prevented from generating condensed water. In addition, on the one hand, the cold end of the semiconductor heat conduction structure also takes away the heat inside the shell, so that the refrigerating capacity inside the shell is improved, and the refrigerating effect is improved. Therefore, the condensation problem of the traditional air conditioning unit is solved from the source of the generated condensation, and a series of fault problems caused by the condensation problem of the air conditioning unit are reduced, such as electrical safety problems caused by dripping the condensed water into an electrical box.
Description
Technical field
The present invention relates to air conditioner technical fields, in particular to a kind of air-conditioner set.
Background technique
Air-conditioner set is a kind of airhandling equipment assembled by various air-treatment function sections.As people live
Horizontal raising, air-conditioner set have been commonly applied to huge numbers of families, and people are also increasingly dependent on air-conditioner set, are that life can not
The household electrical appliance lacked.
And there is also many problems in use for air-conditioner set, and these problems are gradually spilt cruelly, such as
A kind of high temperature for needing urgently to solve is exactly the condensation problem of air-conditioner set.As shown in Figure 1, the mechanism for generating condensation is exactly to enter
The air condition B1 of air-conditioner set pass through evaporator heat exchange, by air-supply send out low temperature saturation air condition B2, water capacity with
State B1 is identical, and when the dry-bulb temperature of B2 is lower than B3, the moisture content in air when B3 state at this time just occurs on cold surface, produces
Raw condensation.Generally produce do freeze in the case where, be easy that condensation will be being generated in air conditioner set shell body part.
Traditional air conditioner unit solves condensation scheme and pastes sponge and flannelette in the enclosure interior of air-conditioner set to realize, but this
Kind effect is bad, equally can also have the case where leaking out condensation in shell side seam region area, and sponge and flannelette have gap
It will appear rotten region.
Summary of the invention
The embodiment of the invention provides a kind of air-conditioner set, with solve in the prior art air-conditioner set for preventing shell from producing
The bad problem of the technical effect of raw condensation.
The application embodiment provides a kind of air-conditioner set, comprising: shell；Semiconductor conductive structure, is mounted on shell
Inner wall on, semiconductor conductive structure includes hot end and cold end, and the inner wall of hot end and shell fits, and cold end is towards in shell
Portion.
In one embodiment, semiconductor conductive structure includes hot end connection sheet and cold end connection sheet, and setting exists
P-type semiconductor and N-type semiconductor between hot end connection sheet and cold end connection sheet.
In one embodiment, hot end connection sheet and cold end connection sheet are metal connecting sheet.
In one embodiment, air-conditioner set includes DC power supply, DC power supply and semiconductor conductive structure electricity
Connection, for powering to semiconductor conductive structure.
In one embodiment, semiconductor conductive structure is multiple, and multiple semiconductor conductive structures are distributed in shell
Inner wall.
In one embodiment, air-conditioner set includes evaporator, and evaporator is mounted on the inside of shell, and semiconductor is thermally conductive
Structure is mounted on the region corresponding with evaporator on shell.
In one embodiment, air-conditioner set includes refrigerant pipeline, and refrigerant pipeline is located in the inside of shell, semiconductor
Conductive structure is mounted on the region corresponding with refrigerant pipeline on shell.
In one embodiment, air-conditioner set includes air duct, and air duct is located in the inside of shell, semiconductor conductive structure
It is mounted on the region corresponding with air duct on shell.
In one embodiment, shell includes outlet frame, and semiconductor conductive structure is mounted on the inner wall of outlet frame.
In one embodiment, shell includes lamina tecti, and semiconductor conductive structure is mounted on the inner wall of lamina tecti.
In the above-described embodiments, by semiconductor conductive structure by the heat transfer of its cold end to hot end, with to shell into
Row heating, improves the temperature of shell, so that shell be avoided to generate condensation water.Still further aspect, due to semiconductor conductive structure
Cold end has also taken away the heat for stating the inside of shell, also contributes to the refrigerating capacity of the inside of shell, improves refrigeration effect.This
As soon as sample solves the condensation problem of traditional air conditioner unit from the root for generating condensation, while reducing air-conditioner set because solidifying
A series of failure problems that dew problem generates, such as condensation water instill electrical appliance kit and electrical safety problems occur.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the mechanism schematic diagram for generating condensation；
Fig. 2 is the schematic illustration of the semiconductor conductive structure of air-conditioner set according to the present invention；
Fig. 3 is the structural schematic diagram of the shell of air-conditioner set according to the present invention；
Fig. 4 is the structural schematic diagram according to the outlet frame of the air-conditioner set of Fig. 3.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, right below with reference to embodiment and attached drawing
The present invention is described in further details.Here, exemplary embodiment and its explanation of the invention is used to explain the present invention, but simultaneously
It is not as a limitation of the invention.
As shown in figure 3, the embodiment of air-conditioner set of the invention includes shell 10 and semiconductor conductive structure 20, semiconductor
Conductive structure 20 is mounted on the inner wall of shell 10, and semiconductor conductive structure 20 includes hot end and cold end, hot end and shell 10
Inner wall fits, and cold end is towards the inside of shell 10.
It applies the technical scheme of the present invention, by semiconductor conductive structure 20 by the heat transfer of its cold end to hot end, with
Shell 10 is heated, the temperature of shell 10 is improved, so that shell 10 be avoided to generate condensation water.Still further aspect, due to half
The cold end of conductor conductive structure 20 has also taken away the heat for stating the inside of shell 10, also contributes to the system of the inside of shell 10
Cooling capacity improves refrigeration effect.So, the condensation problem of traditional air conditioner unit is just solved from the root for generating condensation,
A series of failure problems that air-conditioner set is generated by condensation problem are reduced simultaneously, electrical safety occur as condensation water instills electrical appliance kit
Problem etc..
It should be noted that technical solution of the present invention mainly applies the generation Peltier of semiconductor conductive structure 20 to imitate
It answers, the region of the shell 10 of condensation is subjected to heat exchange with the inside of shell 10 by way of heating, this regional temperature is mentioned
Condensation problem would not be generated by rising.
As shown in Fig. 2, in the inventive solutions, semiconductor conductive structure 20 includes hot end connection sheet 21 and cold end
Connection sheet 22, and the P-type semiconductor and N-type semiconductor that are arranged between hot end connection sheet 21 and cold end connection sheet 22.N-type
Semiconductor element and P-type semiconductor element are joined into a thermocouple pair, that is, form a P-N junction-peltier-element.When having
When direct current passes through this P-N junction, energy can be generated and carry out energy exchange with external environment at node.Specifically, will be passed through
Direct current enters in P-N junction, is contacted by hot end connection sheet 21 with the inner wall of shell 10, this principle can by paltie effect
Know, after thermocouple passes through direct current, P-type semiconductor and N-type semiconductor by the heat transfer at connector 1, connector 3 to connector 2, connect
Heat is discharged at first 4 to the inner wall of shell 10, thus the inner wall of shell 10 can be made to have certain temperature, not deposited with condenser zone
In the temperature difference, so that condensation problem will not be generated.It is small that thermocouple is macroscopically made into each using this paltie effect principle
The heating film of block is together in series, and connect fever end connection sheet 21 with the inner wall of shell 10, can guarantee certain temperature
In the case of the temperature of adjustment housings 10 be able to maintain unit shell to adapt it to temperature difference problem existing for external environment temperature
Condensation water will not be generated on body.It is limited since single Peltier element absorbs heat, in practical applications, usually
Many Peltier elements are concatenated together, and with insulation and thermally conductive good potsherd is encapsulated, have thus been made half
Conductor conductive structure 20.
In the technical scheme of this embodiment, hot end connection sheet 21 and cold end connection sheet 22 are metal connecting sheet.Optionally,
Metal connecting sheet is copper sheet.
More preferably, air-conditioner set includes DC power supply 30,20 electricity of DC power supply 30 and semiconductor conductive structure
Connection, for powering to semiconductor conductive structure 20.It applies the technical scheme of the present invention, can be arranged inside air-conditioner set straight
Charger 30 is flowed, in order to be powered to semiconductor conductive structure 20.As other optional embodiments, can also set
External DC power supply is set to be powered to semiconductor conductive structure 20.
More preferably, in the inventive solutions, semiconductor conductive structure 20 is multiple, and multiple semiconductors are thermally conductive
Structure 20 is distributed in the inner wall of shell 10.It, will be multiple since the inside of shell 10 can have multiple regions for being also easy to produce condensation water
Semiconductor conductive structure 20 is distributed in the inner wall position corresponding with multiple regions for being also easy to produce condensation water of shell 10, would not
It is upper outside shell 10 to generate condensation water.Optionally, semiconductor conductive structure 20 can be mounted on the metal plate of shell 10.
Optionally, in the inventive solutions, air-conditioner set includes evaporator, and evaporator is mounted on the interior of shell 10
Portion.Region as where evaporator, temperature is lower, is just easy to generate condensation water on shell 10 adjacent thereto.In this way, half
The region corresponding with evaporator of the installation of conductor conductive structure 20 on the housing 10, so that it may avoided on shell 10 well
Region corresponding with evaporator generates condensation water.As shown in figure 3, shell 10 includes lamina tecti 12, due to lamina tecti 12 and steam
It is adjacent to send out device, is easy to generate condensation water on lamina tecti 12, semiconductor conductive structure 20 is just mounted on to the inner wall of lamina tecti 12
On.
In addition, air-conditioner set includes refrigerant pipeline, refrigerant pipeline is located in the inside of shell 10.Due to where refrigerant pipeline
Region, temperature is lower, is just also easy to produce condensation water on shell 10 adjacent thereto.In this way, semiconductor conductive structure 20 is pacified
The region corresponding with refrigerant pipeline of dress on the housing 10, so that it may avoid well opposite with refrigerant pipeline on shell 10
The region answered generates condensation water.
Optionally, air-conditioner set includes air duct, and air duct is located in the inside of shell 10.Region as where air duct, temperature
It is also lower for spending, and is just also easy to produce condensation water on shell 10 adjacent thereto.In this way, semiconductor conductive structure 20 is mounted on shell
Region corresponding with air duct on body 10, so that it may avoid the region corresponding with air duct on shell 10 to generate well solidifying
Dew.As shown in figure 4, shell 10 includes that outlet frame 11 is easy to produce since outlet frame 11 is corresponding with air duct on outlet frame 11
Semiconductor conductive structure 20, is just mounted on the inner wall of outlet frame 11 by raw condensation water.
When in use, supply air temperature is reached by temperature-sensitive temperature by logic control, between this supply air temperature and return air temperature
It compares, the condition for generating condensation can be analyzed, judge whether semiconductor conductive structure 20 can be opened, if can open
Cheng Zhong reaches sheet metal shell portion in the temperature i.e. outdoor temperature and air-conditioner set of external shell 10 by heating to shell 10
Temperature value can unanimously reach equalized temperature below part, will not generate condensation water.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the embodiment of the present invention can have various modifications and variations.All within the spirits and principles of the present invention, made
Any modification, equivalent substitution, improvement and etc. should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of air-conditioner set characterized by comprising
Shell (10)；
Semiconductor conductive structure (20), is mounted on the inner wall of the shell (10), and the semiconductor conductive structure (20) includes
The inner wall of hot end and cold end, the hot end and the shell (10) fits, inside of the cold end towards the shell (10).
2. air-conditioner set according to claim 1, which is characterized in that the semiconductor conductive structure (20) includes that hot end connects
Contact pin (21) and cold end connection sheet (22), and be arranged between the hot end connection sheet (21) and the cold end connection sheet (22)
P-type semiconductor and N-type semiconductor.
3. air-conditioner set according to claim 2, which is characterized in that the hot end connection sheet (21) connects with the cold end
Piece (22) is metal connecting sheet.
4. air-conditioner set according to claim 1, which is characterized in that the air-conditioner set includes DC power supply (30),
The DC power supply (30) is electrically connected with the semiconductor conductive structure (20), for the semiconductor conductive structure (20)
Power supply.
5. air-conditioner set according to claim 1, which is characterized in that the semiconductor conductive structure (20) be it is multiple, it is more
A semiconductor conductive structure (20) is distributed in the inner wall of the shell (10).
6. air-conditioner set according to claim 1, which is characterized in that the air-conditioner set includes evaporator, the evaporation
Device is mounted on the inside of the shell (10), the semiconductor conductive structure (20) be mounted on the shell (10) with it is described
The corresponding region of evaporator.
7. air-conditioner set according to claim 1, which is characterized in that the air-conditioner set includes refrigerant pipeline, described cold
Matchmaker's pipeline be located in the inside of the shell (10), the semiconductor conductive structure (20) be mounted on the shell (10) with
The corresponding region of the refrigerant pipeline.
8. air-conditioner set according to claim 1, which is characterized in that the air-conditioner set includes air duct, the air duct position
In the inside in the shell (10), the semiconductor conductive structure (20) be mounted on the shell (10) with the air duct
Corresponding region.
9. air-conditioner set according to claim 1, which is characterized in that the shell (10) includes outlet frame (11), described
Semiconductor conductive structure (20) is mounted on the inner wall of the outlet frame (11).
10. air-conditioner set according to claim 1, which is characterized in that the shell (10) includes lamina tecti (12), described
Semiconductor conductive structure (20) is mounted on the inner wall of the lamina tecti (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910596418.6A CN110307629A (en) | 2019-07-03 | 2019-07-03 | Air conditioning unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910596418.6A CN110307629A (en) | 2019-07-03 | 2019-07-03 | Air conditioning unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110307629A true CN110307629A (en) | 2019-10-08 |
Family
ID=68079077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910596418.6A Pending CN110307629A (en) | 2019-07-03 | 2019-07-03 | Air conditioning unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110307629A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112303763A (en) * | 2020-10-30 | 2021-02-02 | 北京理工大学 | Self-adaptive anti-condensation semiconductor radiation air conditioner |
| CN114543300A (en) * | 2022-01-21 | 2022-05-27 | 青岛海尔空调器有限总公司 | Method and device for controlling air conditioner and air conditioner |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107143913A (en) * | 2016-11-29 | 2017-09-08 | 青岛海信日立空调系统有限公司 | A kind of embedded air-conditioner indoor set |
| CN208508320U (en) * | 2018-06-01 | 2019-02-15 | 北京百度网讯科技有限公司 | Cooling device for power distribution cabinet |
| CN210197652U (en) * | 2019-07-03 | 2020-03-27 | 珠海格力电器股份有限公司 | Air conditioning unit |
-
2019
- 2019-07-03 CN CN201910596418.6A patent/CN110307629A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107143913A (en) * | 2016-11-29 | 2017-09-08 | 青岛海信日立空调系统有限公司 | A kind of embedded air-conditioner indoor set |
| CN208508320U (en) * | 2018-06-01 | 2019-02-15 | 北京百度网讯科技有限公司 | Cooling device for power distribution cabinet |
| CN210197652U (en) * | 2019-07-03 | 2020-03-27 | 珠海格力电器股份有限公司 | Air conditioning unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112303763A (en) * | 2020-10-30 | 2021-02-02 | 北京理工大学 | Self-adaptive anti-condensation semiconductor radiation air conditioner |
| CN114543300A (en) * | 2022-01-21 | 2022-05-27 | 青岛海尔空调器有限总公司 | Method and device for controlling air conditioner and air conditioner |
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