CN108931087A - A kind of refrigerating appliance - Google Patents
A kind of refrigerating appliance Download PDFInfo
- Publication number
- CN108931087A CN108931087A CN201710387584.6A CN201710387584A CN108931087A CN 108931087 A CN108931087 A CN 108931087A CN 201710387584 A CN201710387584 A CN 201710387584A CN 108931087 A CN108931087 A CN 108931087A
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- CN
- China
- Prior art keywords
- temperature
- turnover panel
- refrigerating appliance
- chilling plate
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/04—Preventing the formation of frost or condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A kind of refrigerating appliance, including：Compartment；Oppose the first door body and the second door body being arranged, and is used to open or closes the compartment；Turnover panel is mounted in the first door body or the second door body, and the turnover panel has the inner surface towards the compartment, and towards the outer surface outside the refrigerating appliance；At least one semiconductor chilling plate group part is provided in the turnover panel, the hot end of the semiconductor chilling plate group part is coupled with the outer surface heat of the turnover panel, the cold end of the semiconductor chilling plate group part and the inner surface thermal coupling of the turnover panel, the conductor cooling piece component is under the driving of driving current, its hot end releases heat, and cold end absorbs heat.Electric energy loss can be saved while the outer surface for preventing refrigerating appliance turnover panel forms condensation using technical solution of the present invention.
Description
Technical field
The present invention relates to field of home appliance technology, in particular to a kind of refrigerating appliance.
Background technique
Nowadays, refrigerating appliance has entered into huge numbers of families, such as refrigerator, wine cabinet etc..As user is to storage space demand
Increase, by taking refrigerator as an example, the bigger side by side combination refrigerator of storage space is favored by more users.
It include the first door body and the second door body of compartment, opposition setting in a kind of biggish refrigerating appliance of storage space,
It is used to open or is closed the compartment, turnover panel is equipped with also in the first door body or the second door body, the turnover panel is generally vertically placed,
In order to the overlap joint and sealing of first door body and the second door body and the compartment door seal.Between the turnover panel has described in
The inner surface of room, and towards the outer surface outside the refrigerating appliance.
In refrigerating appliance work, the hull-skin temperature of turnover panel is lower, when the dew point temperature of the outer surface lower than the turnover panel
When spending, condensation is also easy to produce on the outer surface of the turnover panel.For the technical problem, in the prior art using in the turnover panel
The mode of reload temperature compensating heater improves the hull-skin temperature of the turnover panel, to prevent condensation from generating.Specifically, in institute
It states and heating wire is set in turnover panel, be evenly distributed in it in turnover panel, electric drive is applied to the heating wire, to control
Electrothermal wire heating is stated, the hull-skin temperature of the turnover panel is improved.
However, while improving the hull-skin temperature of the turnover panel by the way of above-mentioned electrothermal wire heating, heating wire
Heat will be transmitted to the compartment and leak heat to it, and the compartment is needed to carry out thermal compensation, and electric energy loss is big.
Summary of the invention
Present invention solves the technical problem that being the section how while the outer surface for preventing refrigerating appliance turnover panel forms condensation
About electric energy loss.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of refrigerating appliance, including：Compartment；Opposition setting
First door body and the second door body, are used to open or close the compartment；Turnover panel is mounted in the first door body or the second door body, institute
Stating turnover panel has inner surface towards the compartment, and towards the outer surface outside the refrigerating appliance；It is set in the turnover panel
It is equipped at least one semiconductor chilling plate group part, the hot end of the semiconductor chilling plate group part and the outer surface thermal coupling of the turnover panel
It closes, the cold end of the semiconductor chilling plate group part and the inner surface thermal coupling of the turnover panel, the conductor cooling piece component are driving
Under the driving of streaming current, hot end releases heat, and cold end absorbs heat.
Optionally, the first heat-conduction component is covered on the hot end of the semiconductor chilling plate group part, the hot end release
Heat is transferred to the outer surface of the turnover panel by first heat-conduction component.
Optionally, the second heat-conduction component, the interior table of the turnover panel are covered in the cold end of the semiconductor chilling plate group part
The heat in face is transferred to the cold end by second heat-conduction component and is absorbed by the cold end.
Optionally, first heat-conduction component and/or second heat-conduction component are made of insulating ceramic materials.
Optionally, the appearance face contact in the hot end of the semiconductor chilling plate group part and the turnover panel, the semiconductor system
The cold end of cold component is contacted with the inner surface of the turnover panel.
Optionally, the inner surface of the turnover panel and outer surface are made of heat conducting material, and the heat conducting material is exhausted
Edge body.
Optionally, the refrigerating appliance further includes：Electric drive module, at least one described semiconductor chilling plate group part electricity
Connection, the driving current are provided by the Electric drive module.
Optionally, the refrigerating appliance further includes：First temperature sensor is adapted to detect for the outer surface temperature of the turnover panel
Degree；The hull-skin temperature of the turnover panel that the Electric drive module is suitable for being obtained according to detection is at least one described semiconductor system
Cold component provides the driving current or stops providing the driving current.
Optionally, at least one described semiconductor chilling plate group part includes the multiple semiconductors for being respectively arranged at multiple regions
Cooling piece component；The Electric drive module includes multiple driven submodules, the multiple driven submodule and multiple groups semiconductor system
Cold component is electrically connected correspondingly, and the driven submodule is suitable for providing the drive to corresponding semiconductor chilling plate group part
Streaming current stops providing the driving current；The quantity of first temperature sensor be it is multiple, be respectively arranged at difference
Test point, each test point are distributed in the multiple region, the multiple first temperature sensor and the multiple driving submodule
Block corresponds；The appearance for the turnover panel that the driven submodule is suitable for being detected according to corresponding first temperature sensor
Face temperature provides the driving current to the corresponding semiconductor chilling plate group part or stops providing the driving current.
Optionally, the hull-skin temperature and preset temperature for the turnover panel that the Electric drive module is suitable for being obtained according to detection
The comparison result of threshold values provides the driving current at least one described semiconductor chilling plate group part or stops described in offer
Driving current.
Optionally, the preset temperature threshold be equal to the turnover panel outer surface dew-point temperature or with the dew point temperature
Degree is associated.
Optionally, the dew-point temperature is determined according to the temperature and/or humidity outside the refrigerating appliance.
Optionally, the refrigerating appliance further includes：Second temperature sensor and/or humidity sensor, wherein described second
Temperature sensor is adapted to detect for the temperature outside the refrigerating appliance, and the humidity sensor is adapted to detect for outside the refrigerating appliance
The humidity in portion.
Optionally, the preset temperature threshold is the temperature range that low temperature threshold value and high-temperature threshold define, described low
Temperature threshold is less than the outer surface of the high-temperature threshold, the low temperature threshold value and/or high-temperature threshold and the turnover panel
Dew-point temperature is associated；It is less than or equal to the low temperature threshold value, the electric drive mould in response to the extexine temperature of the turnover panel
Block provides the driving current at least one described semiconductor chilling plate group part；It is big in response to the extexine temperature of the turnover panel
In being equal to the high-temperature threshold, the Electric drive module stops providing the driving current.
Optionally, the low temperature threshold value is equal to the sum of the dew-point temperature and the first temperature allowance, the high-temperature threshold
Value is equal to the sum of the dew-point temperature and second temperature allowance, and the first temperature allowance is less than the second temperature allowance.
Compared with prior art, the technical solution of the embodiment of the present invention has the advantages that：
The refrigerating appliance of the embodiment of the present invention is made by the way that at least one semiconductor chilling plate group part is arranged in turnover panel
The hot end of the semiconductor chilling plate group part is coupled with the outer surface heat of the turnover panel, the cold end of the semiconductor chilling plate group part
With the inner surface thermal coupling of the turnover panel, for the conductor cooling piece component under the driving of driving current, hot end releases heat,
The hull-skin temperature that the turnover panel can be improved, prevents the generation of condensation, and cold end absorbs heat, can reduce the refrigerator
Has the temperature of medial compartment.It can be radiated to the compartment by the way of controlling electrothermal wire heating in compared with the prior art, this hair
Bright technical solution not only reduces the heat of the leakage to the compartment, may be used also while the outer surface for preventing the turnover panel forms condensation
To provide cooling capacity to it, without carrying out thermal compensation to the compartment, electric energy loss is reduced.
Further, the refrigerating appliance can also include the first temperature sensor, be adapted to detect for the appearance of the turnover panel
Face temperature is used to provide the described the hull-skin temperature of the turnover panel that the Electric drive module of driving current can be obtained according to detection,
For example, can according to its with preset temperature threshold values (such as can be equal to the outer surface of the turnover panel dew-point temperature or with institute
It is associated to state dew-point temperature) comparison result, at least one described semiconductor chilling plate group part provide the driving current or
Person stops providing the driving current, to control the semiconductor chilling plate group part intermittent work, with energy saving.
Further, at least one described semiconductor chilling plate group part may include be respectively arranged at multiple regions multiple
Semiconductor chilling plate group part；The Electric drive module includes multiple driven submodules；The quantity of first temperature sensor is
It is multiple；The hull-skin temperature for the turnover panel that the driven submodule is detected according to corresponding first temperature sensor, to
The corresponding semiconductor chilling plate group part provides the driving current or stops providing the driving current.Due to described half
The quantity of conductor cooling piece component be different zones that are multiple, and being distributed in the turnover panel, may be implemented for different zones,
The control of the hull-skin temperature of more accurate temperature detection and the turnover panel, so that the better effect for preventing condensation from generating.
Further, the dew-point temperature is determined according to the temperature and/or humidity outside the refrigerating appliance.At this
In embodiment, since the hull-skin temperature of the turnover panel can be monitored in real time, refrigerator described in real-time monitoring can also be passed through
Temperature and/or humidity outside tool, carrys out the current dew-point temperature of real-time update, therefore, no matter environment (namely the refrigerating appliance
It is external) epidemic disaster how to change, can according to the hull-skin temperature of presently described turnover panel and dew-point temperature to it is described at least
One semiconductor chilling plate group part is controlled, response quickly.
Further, since the detection to the temperature and humidity outside the refrigerating appliance can be multiplexed the refrigerating appliance
In preset second temperature sensor and humidity sensor, therefore, the scheme of the embodiment of the present invention is more easily implemented.
Further, the preset temperature threshold is low temperature threshold value and the temperature range that high-temperature threshold defines, response
In the turnover panel extexine temperature be less than or equal to the low temperature threshold value, the Electric drive module to it is described at least one partly lead
Body cooling piece component provides the driving current；It is more than or equal to the high-temperature threshold in response to the extexine temperature of the turnover panel
Value, the Electric drive module stop providing the driving current, and the extexine temperature of the turnover panel can be made to be controlled always
Between the low temperature threshold value and high-temperature threshold, each semiconductor chilling plate group part without being in work shape always
State realizes the maximization of energy consumption saving while preventing condensation from generating.
Further, the low temperature threshold value is equal to the sum of the dew-point temperature and the first temperature allowance, the high-temperature
Threshold value is equal to the sum of the dew-point temperature and second temperature allowance, and the first temperature allowance is less than the second temperature allowance,
The extexine temperature for once detecting the turnover panel can be made to be less than the sum of the dew-point temperature and the first temperature allowance, that is, controlled
The hot end heat release for making corresponding semiconductor chilling plate group part, since the semiconductor chilling plate group part improves the appearance of the turnover panel
The process of layer temperature needs the regular hour, and therefore, anti-condensation reliability can be improved in the setting of the first temperature allowance,
And the setting of the second temperature allowance can save energy consumption, so that the extexine temperature of the turnover panel is controlled in conjunction
In the range of reason.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of refrigerating appliance of the embodiment of the present invention.
Fig. 2 is the schematic diagram of another refrigerating appliance of the embodiment of the present invention.
Fig. 3 is a kind of schematic diagram of semiconductor chilling plate group part of the embodiment of the present invention.
Fig. 4 is the schematic diagram of another semiconductor chilling plate group part of the embodiment of the present invention.
Fig. 5 is the schematic diagram of another refrigerating appliance of the embodiment of the present invention.
Fig. 6 is the schematic diagram of another refrigerating appliance of the embodiment of the present invention.
Fig. 7 is control process schematic diagram of the embodiment of the present invention to the hull-skin temperature of turnover panel.
Specific embodiment
As described in the background section, the hull-skin temperature of turnover panel is improved by the way of electrothermal wire heating in the prior art
While to prevent condensation from generating, the compartment that the heat of heating wire will be transmitted to refrigerating appliance leaks heat to it, needs the compartment
Thermal compensation is carried out, electric energy loss is big.
For techniques discussed above problem, the embodiment of the present invention proposes that a kind of refrigerating appliance, the refrigerating appliance turn over
Be provided at least one semiconductor chilling plate group part in plate, hot end and cold end respectively with the outer surface of the turnover panel and inner surface
Thermal coupling, under the driving of driving current, hot end releases heat, and cold end absorbs heat, in the outer surface shape for preventing turnover panel
While at condensation, electric energy loss is effectively reduced.
It is understandable to enable above-mentioned purpose of the invention, feature and beneficial effect to become apparent, with reference to the accompanying drawing to this
The specific embodiment of invention is described in detail.
Together referring to Fig. 1 and Fig. 2, a kind of refrigerating appliance 100 of the embodiment of the present invention may include compartment 10, the first door body
201, the second door body 202 and turnover panel 30.Wherein, first door body 201 and the opposition setting of the second door body 202, are used to open
Or close the compartment 10；The turnover panel 30 is mounted in first door body 201 or the second door body 202 that (Fig. 1 is to be mounted on
It is illustrated for stating in the first door body 201), in order to first door body 201 and the second door body 202 and the compartment 10
The overlap joint of envelope and sealing.The turnover panel 30 has the inner surface 301 towards the compartment 10, and towards the refrigerating appliance
Outer surface 302 outside 100.Preferably, the compartment 10 can be refrigerator room.Optionally, the refrigerating appliance 100 may be used also
To include compartment 203 and compartment 204, for example, the compartment 203 and compartment 204 can be freezing compartment.
In the present embodiment, it can be set at least one semiconductor chilling plate group part 40 in the turnover panel 30, described half
302 thermal coupling of outer surface in the hot end 401 of conductor cooling piece component 40 and the turnover panel 30, the semiconductor chilling plate group part 40
Cold end 402 and the turnover panel 30 301 thermal coupling of inner surface.
For example, in specific implementation, the first heat being covered on the hot end 401 of the semiconductor chilling plate group part 40 and is passed
Component 501 is led, the heat that the hot end 401 discharges can be transferred to the turnover panel 30 by first heat-conduction component 501
Outer surface 302.Further, the second heat-conduction component 502 is covered in the cold end 402 of the semiconductor chilling plate group part 40,
The heat of the inner surface 301 of the turnover panel 30 can be transferred to the cold end 402 and quilt by second heat-conduction component 502
The cold end 402 absorbs.
In specific implementation, first heat-conduction component 501 and/or second heat-conduction component 502 can be by exhausted
Edge ceramic material is made, but not limited to this, first heat-conduction component 501 and/or second heat-conduction component 502 may be used also
To use other materials appropriate, as long as the material has good thermal conduction characteristic and insulate.
In one change case of the embodiment of the present invention, the hot end 401 of the semiconductor chilling plate group part 40 can also with it is described
The outer surface 302 of turnover panel 30 contacts, and the cold end 402 of the semiconductor chilling plate group part 40 can also be with the interior table of the turnover panel 30
Face 301 contacts.
In specific implementation, the inner surface 301 of the turnover panel 30 and outer surface 302 can be made of heat conducting material,
The heat conducting material is insulator.
In another change case of the embodiment of the present invention, the hot end 401 of the semiconductor chilling plate group part 40 can be direct
It is contacted with the outer surface 302 of the turnover panel 30, described second can be covered in the cold end 402 of the semiconductor chilling plate group part 40
Heat-conduction component 502；Alternatively, the cold end 402 of the semiconductor chilling plate group part 40 can directly with the turnover panel 30 interior table
Face 301 contacts, and can cover first heat-conduction component 501 on the hot end 401 of the semiconductor chilling plate group part 40.
For the conductor cooling piece component 40 under the driving of driving current Id, hot end 401 releases heat, and institute can be improved
The hull-skin temperature for stating turnover panel 30, prevents the generation of condensation, and cold end 402 absorbs heat, can reduce the refrigerating appliance 100
The temperature of medial compartment 10.It can be between in refrigerating appliance 100 by the way of controlling electrothermal wire heating in compared with the prior art
Room 10 is radiated, and technical solution of the present invention is not only reduced while the outer surface 302 for preventing the turnover panel 30 forms condensation to institute
The leakage heat for stating compartment 10, can also provide cooling capacity to it, without carrying out thermal compensation to the compartment 10, reduce electric energy loss.
To put it more simply, a semiconductor chilling plate group part 40 is only shown in Fig. 2, however, in the specific implementation, it can basis
Specific requirements configure multiple semiconductor chilling plate group parts 40 in the turnover panel 30, no longer illustrate one by one herein.
In specific implementation, each semiconductor chilling plate group part 40 may include a semiconductor chilling plate or multiple
The semiconductor chilling plate being arranged in series.It can be by adjusting P-type semiconductor P in the semiconductor chilling plate group part 40 and N-type half
The quantity of conductor N controls the maximum calorific value (namely maximum temperature) in the hot end 401 of the semiconductor chilling plate group part 40, with
And its maximum caloric receptivity of cold end 402.
Those skilled in the art understand that knowing, semiconductor chilling plate (being also thermoelectric module) is a kind of heat pump,
It is worked using the peltier effect (Peltier Effect) of semiconductor material, when direct current passes through two kinds of different semiconductors
Material in series at galvanic couple when, the both ends of galvanic couple can absorb respectively heat and release heat, realize the purpose of refrigeration.
In specific implementation, multiple semiconductor chilling plates in each group of semiconductor chilling plate group part 40 can connect,
The N-type semiconductor N of i.e. previous semiconductor chilling plate connects the P-type semiconductor P of the latter semiconductor chilling plate, and so on.
Wherein, the N-type semiconductor N and P-type semiconductor P of the same semiconductor chilling plate can be connected with sheet metal (not indicating in figure),
The N-type semiconductor N and P-type semiconductor P of different semiconductor chilling plates can also be connected using the sheet metal, but not limited to this,
Connection between above-mentioned N-type semiconductor N and P-type semiconductor P can also be using other conductive and thermally conductive materials appropriate, herein
No longer illustrate one by one.
In specific implementation, the hot end of the semiconductor chilling plate group part 40 and cold end according to the driving current Id not
It is same and different.For example, with reference to Fig. 3, when the driving current (not indicating in figure) is by the N-type half of each semiconductor chilling plate
When conductor flows to its P-type semiconductor, the abutting end of same semiconductor chilling plate is its cold end, and in same semiconductor chilling plate not
The both ends of engagement are its hot end.For another example referring to fig. 4, when the driving current (not indicating in figure) is by each semiconductor
When the P-type semiconductor P of cooling piece flows to its N-type semiconductor N, the abutting end of same semiconductor chilling plate is its hot end, and same
Unassembled both ends are its cold end in semiconductor chilling plate.
With continued reference to Fig. 2, in specific implementation, can using a conducting-heat elements by the hot end of each semiconductor chilling plate into
Row connection, the hot end 401 as the semiconductor chilling plate group part 40；Furthermore, it is possible to using another conducting-heat elements by each half
The cold end of conductor cooling piece is attached, the cold end 402 as the semiconductor chilling plate group part 40.
It should be noted that the semiconductor chilling plate group part 40 in Fig. 2 (is not indicated) by five semiconductor chilling plates in figure
Composition, but it is unlimited in this way, in actual implementation, it can be according to the hot end of each semiconductor chilling plate component and the target temperature of cold end
The weight and volume of poor, the described turnover panel 30 carries out comprehensive consideration.
Preferably, the refrigerating appliance 100 can also include Electric drive module 60, at least one described semiconductor refrigerating
Piece component 40 is electrically connected, and the driving current Id is provided by the Electric drive module 60.In specific implementation, the electric drive mould
Block 60 can be by whether provide the driving current Id at least one described semiconductor chilling plate group part 40, described in controlling
Whether at least one semiconductor chilling plate group part 40 works.For example, the Electric drive module 60 can be DC power supply.
It should be noted that the Electric drive module 60 can be internally integrated or outside is coupled to the refrigerating appliance 100,
The present embodiment is without specifically limited.
It is further preferred that the refrigerating appliance 100 can also include the first temperature sensor 70, first temperature is passed
Sensor 70 is adapted to detect for the hull-skin temperature of the turnover panel 30.The Electric drive module 60 is suitable for turning over according to detecting and obtain
The hull-skin temperature of plate 30, for example, the hull-skin temperature of the turnover panel 30 is compared with a preset temperature threshold values, to described
At least one semiconductor chilling plate group part 40 provides the driving current Id or stops providing the driving current Id.For example,
When the hull-skin temperature of the turnover panel 30 is lower than the preset temperature threshold, then at least one described semiconductor chilling plate group part
40 provide the driving current Id, otherwise provide stopping to the driving current Id.That is, the Electric drive module 60 can
40 intermittent work of semiconductor chilling plate group part is controlled with the hull-skin temperature of the turnover panel 30 obtained according to detection, with
Energy saving.
With continued reference to Fig. 2, in specific implementation, the Electric drive module 60 is suitable for the turnover panel 30 obtained according to detection
Hull-skin temperature and preset temperature threshold values comparison result, provided at least one described semiconductor chilling plate group part 40 described
Driving current Id stops providing the driving current Id.
Furthermore, the dew-point temperature for the outer surface that the preset temperature threshold can be equal to the turnover panel 30 (is set as
Td), or can be associated with the dew-point temperature Td, for example, the preset temperature threshold has with the dew-point temperature Td
Preset linear relationship.
In specific implementation, the dew-point temperature Td is true according to the temperature and/or humidity outside the refrigerating appliance 100
Fixed.The temperature and humidity outside the refrigerating appliance 100 can be monitored by the temperature and moisture sensors of response.
It should be noted that the refrigerating appliance 100 can also include to generate to first temperature sensor 70
First conditioning module (not shown) of electric signal progress signal condition；It can be with data acquisition module in the Electric drive module 60
(not shown) and control module (not shown).Wherein, the data acquisition module is to first temperature sensor 70 or institute
The electric signal for stating the output of the first conditioning module is converted into digital signal, and is transmitted to the control module, the control module
The hull-skin temperature of the turnover panel 30 that can be obtained according to detection, control the Electric drive module 60 to it is described at least one half
Conductor cooling piece component 40 provides the driving current Id or stops providing the driving current Id.In specific implementation, institute
The refrigerating appliance 100 can be internally integrated by stating control module, such as can be the central control unit of the refrigerating appliance 100
(Central Controlling Unit), or can also be the external control module for being coupled to the refrigerating appliance 100.
In the present embodiment, since the hull-skin temperature of the turnover panel 30 can be monitored in real time, further, it is also possible to pass through
Temperature and/or humidity outside refrigerating appliance 100 described in real-time monitoring comes the current dew-point temperature Td of real-time update, therefore, nothing
How epidemic disaster by environment (namely outside described refrigerating appliance 100) changes, for example, adjustment temperature gear is made in compartment 10
At the variation of 10 internal temperature of compartment and the variation of environment (namely outside described refrigerating appliance 100) epidemic disaster, such as in refrigerator
Tool 100 is nearby cooked, can according to the hull-skin temperature of presently described turnover panel 30 and dew-point temperature Td to it is described at least one
The working condition of semiconductor chilling plate group part 40 is controlled, response quickly.
Referring to Fig. 5, the structure and working principle of refrigerating appliance 200 and refrigerating appliance 100 shown in Fig. 2 shown in fig. 5
Essentially identical, the main distinction is：At least one described semiconductor chilling plate group part 40 may include be respectively arranged at it is multiple
Multiple semiconductor chilling plate group parts 403 in region (not indicating in figure), Fig. 5 is to be set to the semiconductor refrigeratings of three different zones
It is illustrated for piece component 403, but not limited to this, the refrigerating appliance 200 can also include that other an appropriate number of are partly led
Body cooling piece component 403.To put it more simply, the first heat-conduction component 501 and second for being used for heat transfer in Fig. 2 is not shown in Fig. 5
Heat-conduction component 502.
Further, the Electric drive module 60 includes multiple driven submodules 601, the multiple driven submodule 601
It is electrically connected correspondingly with multiple semiconductor chilling plate group parts 403, the driven submodule 601 is suitable for corresponding semiconductor
Cooling piece component 403 provides the driving current Id or stops providing the driving current Id.
Further, the quantity of first temperature sensor 70 is multiple, is respectively arranged at different test points (in figure not
Mark), each test point is distributed in the multiple region, the multiple first temperature sensor 70 and the multiple driving submodule
Block 601 corresponds.The driven submodule 601 be suitable for according to corresponding first temperature sensor 70 detection obtain described in turn over
The hull-skin temperature of plate 30 provides the driving current Id to the corresponding semiconductor chilling plate group part 403 or stops mentioning
For the driving current Id.
Preferably, the multiple semiconductor chilling plate group parts 403 of multiple regions are set to mutually to be in parallel, can each freedom it is different
Driven submodule 601 drives, and can also be driven jointly using an Electric drive module 60, and in each semiconductor chilling plate
Switch block is arranged in parallel branch where component 403, and the switch state by controlling corresponding switch block controls corresponding
Whether semiconductor chilling plate group part 403 works.
It, can since the quantity of semiconductor chilling plate group part 403 is different zones that are multiple, and being distributed in the turnover panel 30
With the different zones directly or indirectly thermal coupling of the outer surface 302 with the turnover panel 30.Preferably, multiple first temperature
Degree sensor 70 is set to the corresponding semiconductor chilling plate group part 403 and carries out pair in the turnover panel 30 of thermal coupling with it
The region answered, to realize the control of the hull-skin temperature for different zones, more accurate temperature detection and the turnover panel 30
System, so that the better effect for preventing condensation from generating.
In specific implementation, the multiple driven submodule 601 is suitable for being detected according to corresponding first temperature sensor 70
The hull-skin temperature of the obtained turnover panel 30 and the comparison result of preset temperature threshold values, to corresponding semiconductor chilling plate group part
403 provide the driving current Id or stop providing the driving current Id.
Furthermore, the dew-point temperature for the outer surface that the preset temperature threshold can be equal to the turnover panel 30 (is set as
Td) or associated with the dew-point temperature Td.
In specific implementation, the dew-point temperature Td is true according to the temperature and/or humidity outside the refrigerating appliance 100
Fixed.
More information about the refrigerating appliance 200 refers to above to the associated description of the refrigerating appliance 100, this
Place no longer repeats one by one.
Together referring to figs. 5 and 6, the structure and work of the refrigerating appliance 300 shown in Fig. 6 and the refrigerating appliance 200 shown in Fig. 5
It is essentially identical to make principle, the main distinction is：The refrigerating appliance 300 can also include second temperature sensor 801 and/or
Humidity sensor 802, wherein the second temperature sensor 801 is adapted to detect for the temperature outside the refrigerating appliance 300, institute
State the humidity that humidity sensor 802 is adapted to detect for outside the refrigerating appliance 300.Due to the temperature outside the refrigerating appliance
Detection with humidity has been multiplexed preset temperature and moisture sensors in the refrigerating appliance 300, therefore the embodiment of the present invention
Scheme is more easily implemented.
It should be noted that the second temperature sensor 801 and/or humidity sensor 802 can be internally integrated or outside
Portion is coupled to the refrigerating appliance 100, and the present embodiment is without specifically limited.
It should also be noted that, the scheme of the refrigerating appliance 300 shown in Fig. 6 can be applicable to refrigerator shown in Fig. 2
Tool 100, no longer repeats one by one herein.
Together referring to Fig. 5 and Fig. 7, the preset temperature threshold can be low temperature threshold value (not indicating in figure) and high-temperature
The temperature range that threshold value (not indicating in figure) defines, the low temperature threshold value are less than the high-temperature threshold, the low temperature threshold
Value and/or high-temperature threshold are associated with the dew-point temperature Td of outer surface of the turnover panel 30.
In specific implementation, it is less than or equal to the low temperature threshold value in response to the extexine temperature of the turnover panel 30, it is described
Driven submodule 601 provides the driving current Id to corresponding semiconductor chilling plate group part 403；In response to the turnover panel 30
Extexine temperature is more than or equal to the high-temperature threshold, and the driven submodule 601 stops providing the driving current Id, can be with
So that the extexine temperature of the turnover panel 30 is controlled in always between the low temperature threshold value and high-temperature threshold, it is each described
Semiconductor chilling plate group part 403 is without in running order always, while preventing condensation from generating, realizes energy consumption saving most
Bigization.
Optionally, the low temperature threshold value is equal to the sum of the dew-point temperature Td and the first temperature margin Δ t1, the height
Temperature threshold is equal to the sum of the dew-point temperature Td and second temperature margin Δ t2, and the first temperature margin Δ t1 is less than described
Second temperature margin Δ t2.Namely once detect that the extexine temperature of the turnover panel 30 is less than the dew-point temperature Td and first
The sum of temperature margin Δ t1 controls corresponding semiconductor chilling plate group part 403 into working condition, hot end heat release, to mention
The extexine temperature of the high turnover panel 30, since the semiconductor chilling plate group part 403 improves the extexine temperature of the turnover panel 30
The process of degree needs the regular hour, and therefore, anti-condensation reliability can be improved in the setting of the first temperature margin Δ t1,
And the setting of the second temperature margin Δ t2 can save energy consumption, so that the extexine temperature of the turnover panel 30 is controlled
System is in reasonable range.
It should be noted that the scheme shown in Fig. 7 can be applicable to refrigerating appliance 100 shown in Fig. 2.
Together referring to fig. 2 and Fig. 7, in the refrigerating appliance 100, the preset temperature threshold can be low temperature threshold value
The temperature range that (not indicating in figure) and high-temperature threshold (not indicating in figure) define, the low temperature threshold value are less than the high temperature
Threshold value is spent, the low temperature threshold value and/or high-temperature threshold are associated with the dew-point temperature Td.
In specific implementation, it is less than or equal to the low temperature threshold value in response to the extexine temperature of the turnover panel 30, it is described
Electric drive module 60 provides the driving current Id at least one described semiconductor chilling plate group part 40；In response to the turnover panel
30 extexine temperature is more than or equal to the high-temperature threshold, and the Electric drive module 60 stops providing the driving current Id.
Optionally, the low temperature threshold value is equal to the sum of the dew-point temperature Td and the first temperature margin Δ t1, the high-temperature threshold
Equal to the sum of the dew-point temperature Td and second temperature margin Δ t2, the first temperature margin Δ t1 is less than the second temperature
Margin Δ t2.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (15)
1. a kind of refrigerating appliance, including：
Compartment (10)；
Oppose the first door body (201) and the second door body (202) being arranged, and is used to open or closes the compartment (10)；
Turnover panel (30) is mounted in the first door body (201) or the second door body (202), between the turnover panel (30) has described in
The inner surface (301) of room (10), and towards the refrigerating appliance (100；200；300) external outer surface (302)；
It is characterized in that, being provided at least one semiconductor chilling plate group part (40), the semiconductor system in the turnover panel (30)
Outer surface (302) thermal coupling in the hot end (401) and the turnover panel (30) of cold component (40), the semiconductor chilling plate group part
(40) inner surface (301) thermal coupling of cold end (402) and the turnover panel (30), the conductor cooling piece component (40) are driving
Under the driving of electric current (Id), hot end (401) release heat, and cold end (402) absorbs heat.
2. refrigerating appliance according to claim 1, which is characterized in that the hot end of the semiconductor chilling plate group part (40)
(401) it is covered on the first heat-conduction component (501), the heat of hot end (401) release passes through first heat-conduction component
(501) it is transferred to the outer surface (302) of the turnover panel (30).
3. refrigerating appliance according to claim 2, which is characterized in that the cold end of the semiconductor chilling plate group part (40)
(402) it is covered on the second heat-conduction component (502), the heat of the inner surface (301) of the turnover panel (30) passes through second heat
Conducting parts (502) are transferred to the cold end (402) and are absorbed by the cold end (402).
4. refrigerating appliance according to claim 3, which is characterized in that first heat-conduction component (501) and/or described
Second heat-conduction component (502) is made of insulating ceramic materials.
5. refrigerating appliance according to claim 1, which is characterized in that the hot end of the semiconductor chilling plate group part (40)
(401) it is contacted with the outer surface (302) of the turnover panel (30), the cold end (402) of the semiconductor chilling plate group part (40) and institute
State inner surface (301) contact of turnover panel (30).
6. refrigerating appliance according to claim 1 or 5, which is characterized in that the inner surface (301) of the turnover panel (30) and outer
Surface (302) is made of heat conducting material, and the heat conducting material is insulator.
7. refrigerating appliance according to any one of claims 1 to 5, which is characterized in that further include：Electric drive module (60),
It is electrically connected at least one described semiconductor chilling plate group part (40), the driving current (Id) is by the Electric drive module (60)
It provides.
8. refrigerating appliance according to claim 7, which is characterized in that further include：
First temperature sensor (70), is adapted to detect for the hull-skin temperature of the turnover panel (30)；
The hull-skin temperature of the turnover panel (30) that the Electric drive module (60) is suitable for being obtained according to detection is to described at least one
A semiconductor chilling plate group part (40) provides the driving current (Id) or stops providing the driving current (Id).
9. refrigerating appliance according to claim 8, which is characterized in that at least one described semiconductor chilling plate group part (40)
Multiple semiconductor chilling plate group parts (403) including being respectively arranged at multiple regions；
The Electric drive module (60) includes multiple driven submodules (601), the multiple driven submodule (601) and multiple groups half
Conductor cooling piece component (403) is electrically connected correspondingly, and the driven submodule (601) is suitable for corresponding semiconductor refrigerating
Piece component (403) provides the driving current (Id) or stops providing the driving current (Id)；
The quantity of first temperature sensor (70) be it is multiple, be respectively arranged at different test points, each test point is distributed in
The multiple region, the multiple first temperature sensor (70) and the multiple driven submodule (601) correspond；
The driven submodule (601) is suitable for detecting the obtained turnover panel (30) according to corresponding first temperature sensor (70)
Hull-skin temperature, provide the driving current (Id) to the corresponding semiconductor chilling plate group part (403) or stop mentioning
For the driving current (Id).
10. refrigerating appliance according to claim 8, which is characterized in that the Electric drive module (60) is suitable for according to detection
The hull-skin temperature of the obtained turnover panel (30) and the comparison result of preset temperature threshold values, at least one described semiconductor system
Cold component (40) provides the driving current (Id) or stops providing the driving current (Id).
11. refrigerating appliance according to claim 10, which is characterized in that the preset temperature threshold is equal to the turnover panel
The dew-point temperature (Td) or associated with the dew-point temperature (Td) of outer surface.
12. refrigerating appliance according to claim 11, which is characterized in that the dew-point temperature (Td) is according to the refrigeration
Utensil (100；200；300) external temperature and/or humidity determines.
13. refrigerating appliance according to claim 12, which is characterized in that further include：Second temperature sensor (801) and/
Or humidity sensor (802), wherein the second temperature sensor (801) is adapted to detect for the refrigerating appliance (100；200；
300) external temperature, the humidity sensor (802) are adapted to detect for the refrigerating appliance (100；200；300) outside is wet
Degree.
14. refrigerating appliance according to claim 10, which is characterized in that the preset temperature threshold be low temperature threshold value and
The temperature range that high-temperature threshold defines, the low temperature threshold value be less than the high-temperature threshold, the low temperature threshold value and/or
High-temperature threshold is associated with dew-point temperature (Td) of the outer surface of the turnover panel；
In response to the turnover panel (30) extexine temperature be less than or equal to the low temperature threshold value, the Electric drive module (60) to
At least one described semiconductor chilling plate group part (40) provides the driving current (Id)；
It is more than or equal to the high-temperature threshold in response to the extexine temperature of the turnover panel (30), the Electric drive module (60) is stopped
The driving current (Id) is only provided.
15. refrigerating appliance according to claim 14, which is characterized in that the low temperature threshold value is equal to the dew-point temperature
(Td) the sum of with the first temperature allowance (Δ t1), the high-temperature threshold is equal to the dew-point temperature (Td) and second temperature allowance
The sum of (Δ t2), the first temperature allowance (Δ t1) are less than the second temperature allowance (Δ t2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710387584.6A CN108931087A (en) | 2017-05-26 | 2017-05-26 | A kind of refrigerating appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710387584.6A CN108931087A (en) | 2017-05-26 | 2017-05-26 | A kind of refrigerating appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108931087A true CN108931087A (en) | 2018-12-04 |
Family
ID=64451260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710387584.6A Pending CN108931087A (en) | 2017-05-26 | 2017-05-26 | A kind of refrigerating appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108931087A (en) |
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| CN110836559A (en) * | 2019-12-27 | 2020-02-25 | 王博良 | Method for controlling semiconductor refrigerating sheet |
| CN115751823A (en) * | 2022-12-22 | 2023-03-07 | 珠海格力电器股份有限公司 | Anti-condensation system of air return pipe and refrigerator |
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