CN213399405U

CN213399405U - Temperature-controllable radiator

Info

Publication number: CN213399405U
Application number: CN202022136387.7U
Authority: CN
Inventors: 吴利民
Original assignee: Kunshan Yingfan Precision Metal Co ltd
Current assignee: Kunshan Yingfan Precision Metal Co ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-06-08
Anticipated expiration: 2030-09-25

Abstract

The utility model discloses a controllable temperature formula radiator, including the radiator body, the back of radiator body is provided with the temperature controller, the bottom fixedly connected with semiconductor refrigeration piece of radiator body, the bottom swing joint of semiconductor refrigeration piece has equipment bearing structure, equipment bearing structure's inner wall swing joint has the temperature sensing device, equipment bearing structure's bottom swing joint has the copper billet, the surperficial swing joint of copper billet has the lock to attach the screw, the upper end of radiator body is provided with the fin. The utility model discloses a set up the semiconductor refrigeration piece, can reach refrigerated effect, effectively promoted the heat dissipation cooling effect of device, through setting up copper billet, temperature sensing device and temperature controller, can detect and control semiconductor refrigeration piece and fan work to the temperature, can also reach energy saving and emission reduction's effect when possessing good heat dispersion, effectively promoted the life of device.

Description

Temperature-controllable radiator

Technical Field

The utility model relates to a radiator technical field specifically is a controllable temperature formula radiator.

Background

The heat generated by machinery or other appliances in the working process is transferred in time to avoid influencing the normal work of the equipment or the instrument, common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode, most radiators used in the existing market do not have the temperature control function, the energy consumption is greatly increased after long-time operation, and the operation cost is increased; in addition, after the refrigerator is used for a long time, the refrigerating sheet is easy to damage, so that the service life is greatly shortened, and the heat dissipation effect is very poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a controllable temperature formula radiator, it is good to possess the radiating effect, energy saving and emission reduction, and long service life's advantage has solved the function that the radiator that uses on the current market does not possess the control by temperature change mostly, and long-time operation greatly increased the consumption of the energy, improved running cost's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a controllable temperature formula radiator, includes the radiator body, the back of radiator body is provided with the temperature controller, the bottom fixedly connected with semiconductor refrigeration piece of radiator body, the bottom swing joint of semiconductor refrigeration piece has equipment bearing structure, equipment bearing structure's inner wall swing joint has temperature sensing device, equipment bearing structure's bottom swing joint has the copper billet, the surperficial swing joint of copper billet has the lock to attach the screw.

Preferably, the upper end of the radiator body is provided with a radiating fin, and the outer side of the radiating fin is provided with a dust cover.

Preferably, the surfaces of the assembly supporting structure and the copper block are provided with notches, and the assembly supporting structure and the copper block are in threaded connection through locking screws.

Preferably, the inner cavity of the radiator body is provided with a fan, and the surface of the fan is movably connected with a mounting seat.

Preferably, an auxiliary cooling fin is arranged above the semiconductor refrigeration fin and is positioned at the lower end of the radiator body.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the semiconductor refrigeration piece, can reach refrigerated effect, effectively promoted the heat dissipation cooling effect of device, through setting up copper billet, temperature sensing device and temperature controller, can detect and control semiconductor refrigeration piece and fan work to the temperature, can also reach energy saving and emission reduction's effect when possessing good heat dispersion, effectively promoted the life of device.

2. The utility model discloses a set up fin and dust cover, when can increase and air contact surface, the dust access device in the air has been avoided influencing the phenomenon of radiating effect, attach the screw through setting up the lock, can play fixed effect to equipment bearing structure and copper billet, the stability of device has effectively been promoted, through setting up fan and mount pad, the circulation of air can accelerate, the radiating effect of device has effectively been promoted, through setting up auxiliary cooling fin, can carry out the heat exchange with the environment with higher speed, thereby the effectual refrigeration effect who promotes the semiconductor refrigeration piece.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a bottom view of the present invention;

figure 4 is a right side sectional view of the utility model

Fig. 5 is an exploded view of the present invention.

In the figure: 1. a heat sink body; 2. a semiconductor refrigeration sheet; 3. assembling a support structure; 4. a copper block; 5. a temperature sensing device; 6. locking screws; 7. and (7) a temperature controller.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a radiator body 1, semiconductor refrigeration piece 2, equipment bearing structure 3, copper billet 4, temperature-sensing device 5,

lock attach screw

6 and 7 parts of temperature controller are the parts that universal standard spare or field technical personnel know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-5, a temperature-controllable heat sink comprises a heat sink body 1, a temperature controller 7 is disposed on the back of the heat sink body 1, a heat sink is disposed at the upper end of the heat sink body 1, and a dust cover is disposed outside the heat sink, the heat sink and the dust cover can increase the contact surface with air, and prevent dust in air from entering the device and affecting the heat dissipation effect, a fan is disposed in the inner cavity of the heat sink body 1, and the surface of the fan is movably connected with a mounting seat, the air circulation can be accelerated by the arrangement of the fan and the mounting seat, the heat dissipation effect of the device is effectively improved, a semiconductor cooling fin 2 is fixedly connected to the bottom of the heat sink body 1, an auxiliary heat sink is disposed above the semiconductor cooling fin 2, and the auxiliary heat sink is disposed at the lower end of the heat sink, can accelerate heat exchange with the environment, thereby effectively improving the refrigeration effect of the semiconductor refrigeration sheet 2, the bottom of the semiconductor refrigeration sheet 2 is movably connected with an assembly supporting structure 3, the inner wall of the assembly supporting structure 3 is movably connected with a temperature sensing device 5, the bottom of the assembly supporting structure 3 is movably connected with a copper block 4, the surface of the copper block 4 is movably connected with a locking screw 6, the surfaces of the assembly supporting structure 3 and the copper block 4 are both provided with notches, the assembly supporting structure 3 and the copper block 4 are in threaded connection through the locking screw 6, the assembly supporting structure 3 and the copper block 4 can be fixed by arranging the locking screw 6, the stability of the device is effectively improved, the refrigeration effect can be achieved by arranging the semiconductor refrigeration sheet 2, the heat dissipation and cooling effects of the device are effectively improved, by arranging the copper block 4, the temperature sensing device 5 and the temperature controller 7, the semiconductor refrigerating sheet 2 and the fan can be detected and controlled to work, the energy-saving and emission-reducing effects can be achieved while the semiconductor refrigerating sheet has good heat dissipation performance, and the service life of the device is effectively prolonged.

When the temperature control device is used, the temperature is reduced or increased mainly by the Peltier effect of the semiconductor refrigerating sheet 2, when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the thermocouple pair, heat transfer can be generated between two ends, the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold-hot end, the temperature on the surface of the copper block 4 can be detected in real time by arranging the temperature sensing device 5 on the copper block 4, the working temperature interval of the copper block 4 can be set in the temperature controller 7, when the temperature of the copper block 4 is lower than the set temperature, the semiconductor refrigerating sheet 2 does not work, when the temperature controller 7 senses that the temperature of the copper plate exceeds the set value, the temperature control device outputs current to the semiconductor refrigerating sheet 2, after the semiconductor refrigerating sheet 2 obtains the current, the cooling refrigeration is carried out on the surface contacting the copper block 4, and, the heating surface of the semiconductor refrigerating sheet 2 is cooled, so that the temperature controllable effect is achieved, and the device has the advantages of good cooling effect, energy conservation, emission reduction and long service life through the matching of the structure, and is suitable for popularization and application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a controllable temperature formula radiator, includes radiator body (1), its characterized in that: the back of radiator body (1) is provided with temperature controller (7), the bottom fixedly connected with semiconductor refrigeration piece (2) of radiator body (1), the bottom swing joint of semiconductor refrigeration piece (2) has equipment bearing structure (3), the inner wall swing joint of equipment bearing structure (3) has temperature sensing device (5), the bottom swing joint of equipment bearing structure (3) has copper billet (4), the surperficial swing joint of copper billet (4) attaches screw (6) with the lock.

2. A temperature controllable heat sink as claimed in claim 1, wherein: the radiator is characterized in that radiating fins are arranged at the upper end of the radiator body (1), and dust covers are arranged on the outer sides of the radiating fins.

3. A temperature controllable heat sink as claimed in claim 1, wherein: the surface of the assembly supporting structure (3) and the surface of the copper block (4) are both provided with notches, and the assembly supporting structure (3) is in threaded connection with the copper block (4) through locking screws (6).

4. A temperature controllable heat sink as claimed in claim 1, wherein: the inner cavity of the radiator body (1) is provided with a fan, and the surface of the fan is movably connected with a mounting seat.

5. A temperature controllable heat sink as claimed in claim 1, wherein: and auxiliary radiating fins are arranged above the semiconductor refrigerating fins (2) and are positioned at the lower end of the radiator body (1).