CN212658935U - Industrial camera shell based on semiconductor refrigeration piece - Google Patents
Industrial camera shell based on semiconductor refrigeration piece Download PDFInfo
- Publication number
- CN212658935U CN212658935U CN202021363168.6U CN202021363168U CN212658935U CN 212658935 U CN212658935 U CN 212658935U CN 202021363168 U CN202021363168 U CN 202021363168U CN 212658935 U CN212658935 U CN 212658935U
- Authority
- CN
- China
- Prior art keywords
- refrigeration piece
- cavity
- semiconductor refrigeration
- camera housing
- industrial camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000005057 refrigeration Methods 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 230000007774 longterm Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Studio Devices (AREA)
Abstract
The utility model discloses a mode of installing the semiconductor fin additional has improved the radiating efficiency, has avoided the radiating unable long-term work of mechanical structure, passive radiating efficiency not enough, and fan cooling damages easily, can additionally increase temperature output after damaging, causes extra temperature burden scheduling problem. The industrial camera shell based on the semiconductor refrigeration piece is characterized in that a cavity is formed in the camera shell, the semiconductor refrigeration piece is arranged in the cavity and closely attached to the cavity, and the cold surface of the semiconductor refrigeration piece faces towards the inner side of the cavity.
Description
Technical Field
The utility model relates to an industry camera shell specifically is an utilize semiconductor refrigeration piece to carry out the camera shell of initiative cooling to industry camera.
Background
When the industrial camera works, a large amount of heat is inevitably generated synchronously, and the internal precision components are sensitive to temperature, so that after the critical value is reached, the efficiency is reduced even if the temperature is increased for one degree, and therefore, the heat dissipation component of the industrial camera is more important.
There are two main types of heat dissipation methods for the existing industrial cameras, and the first type is a method of improving heat exchange efficiency with air by using a structure of increasing the surface area of a housing. The method has the disadvantages of complex structure and large volume; the second type is to use an electric fan to actively dissipate heat, and has the disadvantages that the fan belongs to a mechanical motion structure, is easy to damage after long-term work in a dust environment, and can emit more heat after being damaged.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a mode of installing the semiconductor fin additional has improved the radiating efficiency, has avoided the radiating unable long-term work of mechanical structure, passive radiating efficiency not enough, and fan cooling damages easily, can additionally increase temperature output after damaging, causes extra temperature burden scheduling problem.
The utility model discloses a solve above-mentioned technical problem and adopt following technical scheme:
the utility model provides an industry camera shell based on semiconductor refrigeration piece, its characterized in that, be equipped with the cavity on the camera shell, be equipped with the semiconductor refrigeration piece in the cavity, the semiconductor refrigeration piece with the cavity closely laminates, the cold side orientation of semiconductor refrigeration piece the cavity is inboard.
Further, the camera shell is a cuboid.
Furthermore, the semiconductor refrigerating sheet is coated with heat-conducting silicone grease.
Furthermore, the semiconductor refrigeration piece is fixed on the camera shell through screws.
Further, the semiconductor refrigeration piece can be installed outside the camera shell.
Further, the camera housing is made of metal.
Furthermore, the outer side of the semiconductor refrigeration sheet is provided with a heat conduction fin which is fixedly connected with the camera shell through a heat insulation component.
Advantageous effects
The technology aims at the problem that the temperature rises in the operation of the industrial camera, reduces the working temperature of the industrial camera by arranging the semiconductor refrigerating sheet and the radiating sheet, and improves the stability, the reliability and the service life of industrial equipment.
Drawings
FIG. 1 is a schematic structural diagram of the present invention
1. Semiconductor refrigeration piece, 2, fin, 3, heat conduction silicone grease, 4, camera shell.
FIG. 2 is a perspective view of the present invention
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Referring to fig. 1, in order to protect the industrial camera device, the industrial camera is provided with a rectangular camera housing 4, and a circular opening is formed in a side surface of the housing corresponding to a lens of the industrial camera. When the industrial camera lens works, the temperature rises, and the performance of the equipment is unstable. Set up a cavity on the shell, place semiconductor refrigeration piece 1, semiconductor refrigeration piece 1 is even after being full of heat conduction silica gel 3, puts into the cavity, closely laminates with the cavity, and the cold side of semiconductor refrigeration piece is inboard, camera shell one side promptly. The cavity is provided with a heat sink 2, and the heat sink 2 and the camera housing are fixed by a heat insulating means, such as a rubber pad. The heat sink can be fixed by screws or bayonet.
The utility model provides a refrigeration piece can choose for use: TEC1-12703, TEC1-12704, TEC1-12705, TEC1-12706, TEC1-12707, TEC1-12708, TEC1-12709, and the like. And matching corresponding working power according to the heating power of the camera by using the same power supply voltage as the camera. The cold surface of the semiconductor refrigeration piece exchanges heat with the camera shell, so that the working temperature of the industrial camera is reduced. The heat sink can further enhance the heat dissipation effect.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modifications made on the basis of the technical scheme according to the technical idea of the present invention fall within the protection scope of the present invention.
Claims (7)
1. The utility model provides an industry camera shell based on semiconductor refrigeration piece, its characterized in that, be equipped with the cavity on the camera shell, be equipped with the semiconductor refrigeration piece in the cavity, the semiconductor refrigeration piece with the cavity closely laminates, the cold side orientation of semiconductor refrigeration piece the cavity is inboard.
2. The industrial camera housing of claim 1, wherein the camera housing is a cuboid.
3. The industrial camera housing of claim 1, wherein the semiconductor cold plate is coated with a thermally conductive silicone grease.
4. The industrial camera housing of claim 1, wherein the semiconductor chilling plate is secured by screws.
5. The industrial camera housing of claim 1, wherein the semiconductor chilling plate is mounted outside the camera housing.
6. The industrial camera housing of claim 1, wherein the camera housing is metal.
7. The industrial camera housing of claim 1, wherein heat conducting fins are disposed on the outer side of the semiconductor cooling plate, and the heat conducting fins are fixedly connected to the camera housing through a heat insulating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021363168.6U CN212658935U (en) | 2020-07-13 | 2020-07-13 | Industrial camera shell based on semiconductor refrigeration piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021363168.6U CN212658935U (en) | 2020-07-13 | 2020-07-13 | Industrial camera shell based on semiconductor refrigeration piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212658935U true CN212658935U (en) | 2021-03-05 |
Family
ID=74761462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021363168.6U Expired - Fee Related CN212658935U (en) | 2020-07-13 | 2020-07-13 | Industrial camera shell based on semiconductor refrigeration piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212658935U (en) |
-
2020
- 2020-07-13 CN CN202021363168.6U patent/CN212658935U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210305 |