CN211629082U - Water cooling head for semiconductor heat dissipation - Google Patents
Water cooling head for semiconductor heat dissipation Download PDFInfo
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- CN211629082U CN211629082U CN202020842481.1U CN202020842481U CN211629082U CN 211629082 U CN211629082 U CN 211629082U CN 202020842481 U CN202020842481 U CN 202020842481U CN 211629082 U CN211629082 U CN 211629082U
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- mixing chamber
- cooling head
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Abstract
The utility model provides a be used for radiating water-cooling head of semiconductor belongs to water-cooling head technical field. The water cooling head comprises a body, wherein a water inlet nozzle, a water outlet nozzle, an upper mounting bracket and a lower mounting bracket are arranged on the body; the water mixing chamber is arranged inside the body, the semiconductor refrigerating sheet is arranged at the bottom of the water mixing chamber, the body is further provided with a temperature sensor and a positioning screw hole, the screws are fixed on the positioning screw hole, the upper mounting support and the lower mounting support are coaxially mounted on the upper side and the lower side of the body through the screws, and the upper mounting support and the lower mounting support can coaxially rotate relative to the body. According to the water cooling head, the positioning screw hole is formed in the center of the water cooling head, and the upper mounting bracket and the lower mounting bracket are coaxially mounted on the positioning screw hole, so that the water cooling head, the upper mounting bracket and the lower mounting bracket are fixed in position and are not easy to fall off; meanwhile, the upper mounting bracket and the lower mounting bracket can coaxially rotate relative to the water-cooling head body, and the position of the mounting hole can be flexibly adjusted during mounting.
Description
Technical Field
The utility model belongs to the technical field of the water-cooling head, concretely relates to be used for radiating water-cooling head of semiconductor.
Background
The traditional semiconductor refrigeration piece is mostly cooled by air, the air cooling mode mainly has low heat dissipation efficiency, the semiconductor is refrigerated by temperature difference, if the temperature control of the heating surface is not good, the refrigeration effect of the semiconductor refrigeration piece is greatly reduced, and the problem can be well solved by water cooling.
The current common semiconductor water cooling head is expensive, or the cost is low but the simple heat absorption effect of the water channel is not good. During installation, no positioning piece is arranged between the installation fixture and the water cooling head for fixing, so that the water cooling head is easy to fall off or run away after working for a period of time.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a be used for radiating water-cooling head of semiconductor to solve the technical problem that current water-cooling head drops easily or runs the position.
In order to achieve the above object, the technical solution of the present invention is:
a water cooling head for semiconductor heat dissipation comprises a body, wherein a water inlet nozzle, a water outlet nozzle, an upper mounting bracket and a lower mounting bracket are arranged on the body; the water mixing chamber is arranged inside the body, the semiconductor refrigerating sheet is arranged at the bottom of the water mixing chamber, the body is further provided with a temperature sensor, a positioning screw hole and a screw, the screw is fixed on the positioning screw hole, the upper mounting bracket and the lower mounting bracket are coaxially mounted on the upper side and the lower side of the body through the screws, and the upper mounting bracket and the lower mounting bracket can coaxially rotate relative to the body.
Preferably, the positioning screw hole is formed in the center of the water cooling head.
Preferably, the water mixing chamber is composed of a plurality of grooves and comprises a first water mixing chamber, a second water mixing chamber and a third water mixing chamber, and the first water mixing chamber and the third water mixing chamber are respectively connected with the water inlet nozzle and the water outlet nozzle.
Preferably, front blocking pieces are arranged at the front ends of the first water mixing chamber and the third water mixing chamber, and a rear blocking piece is arranged at the rear end of the second water mixing chamber.
Preferably, the temperature sensor is arranged between the first water mixing chamber and the third water mixing chamber.
Preferably, the two ends of the upper mounting bracket and the lower mounting bracket are both provided with screw holes, and the two ends of the upper mounting bracket and the lower mounting bracket are both connected through screws.
The utility model has the advantages that:
according to the water cooling head, the positioning screw hole is formed in the center of the water cooling head, and the upper mounting bracket and the lower mounting bracket are coaxially mounted on the positioning screw hole, so that the water cooling head, the upper mounting bracket and the lower mounting bracket are fixed in position and are not easy to fall off; meanwhile, the upper mounting bracket and the lower mounting bracket can coaxially rotate relative to the body, and the position of the mounting hole can be flexibly adjusted during mounting.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a perspective view of the present invention.
Fig. 3 is a side sectional view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
Referring to fig. 1 to 3, a water cooling head for semiconductor heat dissipation comprises a body, wherein a water inlet nozzle 1, a water outlet nozzle 2, an upper mounting bracket 3 and a lower mounting bracket 4 are arranged on the body; the water mixing chamber is arranged inside the body, the semiconductor refrigerating sheet 5 is arranged at the bottom of the water mixing chamber, the body is further provided with a temperature sensor 6, a positioning screw hole 7 and screws, the screws are fixed on the positioning screw hole, the upper mounting bracket 3 and the lower mounting bracket 4 are coaxially mounted on the upper side and the lower side of the body through the screws, and the upper mounting bracket 3 and the lower mounting bracket 4 can coaxially rotate relative to the body.
The water cooling head adopts the extruded section to generate a water channel, the milling grooves at the two ends generate water mixing chambers, each water mixing chamber comprises a first water mixing chamber 8, a second water mixing chamber 9 and a third water mixing chamber 10, the first water mixing chamber 8 and the third water mixing chamber 10 are respectively connected with the water inlet nozzle 1 and the water outlet nozzle 2, and the water inlet nozzle 1 and the water outlet nozzle 2 can be replaced. Preferably, the front blocking piece 13 is embedded in the milled groove at the front end of the first mixing chamber 8 and the third mixing chamber 10, and the rear blocking piece 14 is embedded in the milled groove at the rear end of the second mixing chamber. The water cooling head is provided with an upper mounting bracket and a lower mounting bracket, and preferably, the positioning screw hole 7 is arranged at the center of the water cooling head. The upper mounting bracket 3 and the lower mounting bracket 4 are coaxially mounted on the upper side and the lower side of the body through screws, so that the upper mounting bracket and the lower mounting bracket can rotate and be fixed conveniently and flexibly adjusted. The two ends of the upper mounting bracket 3 and the lower mounting bracket 4 are both provided with screw holes, and the two ends of the upper mounting bracket 3 and the lower mounting bracket 4 are both connected through screws 11 and nuts 12. In addition, a temperature probe hole 61 is arranged in the middle of the water cooling head, and the temperature sensor 6 extends into the body through the temperature probe hole arranged on the body and is in contact with the semiconductor chilling plate 5. Preferably, the temperature sensor 6 is arranged between the first water mixing chamber 8 and the third water mixing chamber 10, and is used for monitoring the temperature of the semiconductor refrigeration sheet in real time.
The utility model has the advantages that:
according to the water cooling head, the positioning screw hole is formed in the center of the water cooling head, and the upper mounting bracket and the lower mounting bracket are coaxially mounted on the positioning screw hole, so that the water cooling head, the upper mounting bracket and the lower mounting bracket are fixed in position and are not easy to fall off; meanwhile, the upper mounting bracket and the lower mounting bracket can coaxially rotate relative to the water-cooling head body, and the position of the mounting hole can be flexibly adjusted during mounting.
The device greatly reduces the production cost of the water cooling head, improves the heat absorption efficiency, simplifies the installation mode and realizes the purpose of monitoring the central temperature of the semiconductor refrigeration sheet in real time.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (6)
1. A water cooling head for semiconductor heat dissipation comprises a body, wherein a water inlet nozzle, a water outlet nozzle, an upper mounting bracket and a lower mounting bracket are arranged on the body; the water mixing chamber is arranged inside the body, the semiconductor refrigerating sheet is arranged at the bottom of the water mixing chamber, and the water mixing chamber is characterized in that the body is further provided with a temperature sensor and a positioning screw hole, the screws are fixed on the positioning screw hole, the upper mounting bracket and the lower mounting bracket are coaxially mounted on the upper side and the lower side of the body through the screws, and the upper mounting bracket and the lower mounting bracket can coaxially rotate relative to the body.
2. The water cooling head for dissipating heat of a semiconductor as recited in claim 1, wherein the screw hole is formed at a center of the water cooling head.
3. The water cooling head for semiconductor heat dissipation according to claim 1, wherein the water mixing chamber is formed by a plurality of grooves, and comprises a first water mixing chamber, a second water mixing chamber and a third water mixing chamber, and the first water mixing chamber and the third water mixing chamber are respectively connected with a water inlet nozzle and a water outlet nozzle.
4. The water cooling head for semiconductor heat dissipation according to claim 3, wherein front blocking pieces are arranged at the front ends of the first water mixing chamber and the third water mixing chamber, and rear blocking pieces are arranged at the rear end of the second water mixing chamber.
5. The water cooling head for the semiconductor heat dissipation according to any one of claims 3 or 4, wherein the temperature sensor is arranged between the first water mixing chamber and the third water mixing chamber.
6. The water cooling head for semiconductor heat dissipation according to claim 1, wherein screw holes are formed in two ends of the upper mounting bracket and the lower mounting bracket, and the two ends of the upper mounting bracket and the two ends of the lower mounting bracket are connected through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020842481.1U CN211629082U (en) | 2020-05-19 | 2020-05-19 | Water cooling head for semiconductor heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020842481.1U CN211629082U (en) | 2020-05-19 | 2020-05-19 | Water cooling head for semiconductor heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211629082U true CN211629082U (en) | 2020-10-02 |
Family
ID=72623338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020842481.1U Active CN211629082U (en) | 2020-05-19 | 2020-05-19 | Water cooling head for semiconductor heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211629082U (en) |
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2020
- 2020-05-19 CN CN202020842481.1U patent/CN211629082U/en active Active
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