CN211546546U - Module structure and gene amplification device having the same - Google Patents
Module structure and gene amplification device having the same Download PDFInfo
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- CN211546546U CN211546546U CN201921771866.7U CN201921771866U CN211546546U CN 211546546 U CN211546546 U CN 211546546U CN 201921771866 U CN201921771866 U CN 201921771866U CN 211546546 U CN211546546 U CN 211546546U
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- modular structure
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Abstract
The application discloses modular structure and gene amplification equipment that has this modular structure, the modular structure of this application includes first radiator, the second radiator, at least one first refrigeration piece, at least one second refrigeration piece and at least one module main part, wherein, the module main part is fixed between first radiator and second radiator, the module main part has the first surface towards first radiator and the second surface towards the second radiator, first refrigeration piece is fixed between the first surface of module main part and first radiator, the second refrigeration piece is fixed between the second surface of module main part and second radiator, between first radiator and first refrigeration piece, between first refrigeration piece and the module main part, between module main part and the second refrigeration piece and between second refrigeration piece and the second radiator have the heat conduction membrane. The module structure of this application simple structure, the universalization is high, simple to operate, and the atress of installation back refrigeration piece is more even for the life-span of refrigeration piece is secure.
Description
Technical Field
The utility model relates to a gene amplification equipment technical field, concretely relates to modular structure and have this modular structure's gene amplification equipment.
Background
The gene amplification equipment is mainly used for scientific research and clinical gene amplification, qualitative PCR gene amplification, gene chip and other gene analysis applications, and the key point of the work is temperature control.
The gene amplification equipment comprises a host platform and a module structure with a refrigerating and heating chip, wherein the host platform controls the module structure to operate in temperature circulation through a program, so that the reagent in the module structure reaches the temperature required by gene amplification. The existing module structure mainly adopts a mode that a pressing frame is pressed on the edge of a module main body, so that the whole module structure is unevenly stressed, refrigerating sheets in the module structure are unevenly stressed, the refrigerating sheets are easily deformed, and the service life is shortened; meanwhile, the existing module structure has the defects of large size, inconvenient installation, poor temperature uniformity, low heat dissipation efficiency and the like, the performance of the product is seriously restricted, and the production cost and the body size of the gene amplification equipment are increased.
SUMMERY OF THE UTILITY MODEL
Based on the deficiencies of the prior art, the object of the present invention is to provide a modular structure and a gene amplification device having the same.
As a first aspect of the present application, the present application provides a modular structure.
Preferably, the module structure includes a first heat sink, a second heat sink, at least one first cooling fin, at least one second cooling fin, and at least one module main body, the module main body is fixed between the first heat sink and the second heat sink, the module main body has a first surface facing the first heat sink and a second surface facing the second heat sink, the first cooling fin is fixed between the first surface of the module main body and the first heat sink, the second cooling fin is fixed between the second surface of the module main body and the second heat sink, and a heat conductive film is provided between the first heat sink and the first cooling fin, between the first cooling fin and the module main body, between the module main body and the second cooling fin, and between the second cooling fin and the second heat sink.
Preferably, the module main body is provided with a plurality of through holes for placing reagents, the through holes are arranged in n rows along the width direction of the module main body, wherein n is more than or equal to 1 and less than or equal to 4.
Preferably, the module structure further includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are respectively fixed to the inner sides of the first heat sink and the second heat sink, and the module main body is located between the first circuit board and the second circuit board.
Preferably, the first refrigeration piece and the second refrigeration piece are respectively positioned on the first circuit board and the second circuit board, and the bottoms of the first refrigeration piece and the second refrigeration piece are respectively connected with the first circuit board and the second circuit board.
Preferably, insulating sheets are provided between the first heat sink and the first circuit board and between the second heat sink and the second circuit board.
Preferably, the fan further comprises a fan, the fan comprises a first fan and a second fan, and the first fan and the second fan are respectively located on the outer sides of the first radiator and the second radiator and located on the same straight line.
Preferably, the fan is installed on a fan installation plate, and the fan installation plate is connected with the first radiator and the second radiator respectively.
Preferably, the kit further comprises a mounting rack for connecting the modular structure to a gene amplification device, wherein the mounting rack is positioned at the upper end and the lower end of the modular structure and is positioned on the same straight line with the module main body.
Preferably, the module further comprises a temperature sensor located on the module body and the at least one heat sink.
As a second aspect of the present application, there is provided a gene amplification apparatus.
Preferably, the gene amplification device comprises a modular structure as described herein.
Has the advantages that: the module structure of this application simple structure, design benefit have improved temperature control's accuracy and homogeneity, have improved experimental efficiency and degree of accuracy. The module structure universalization of this application is high, simple to operate, and the atress of installation back refrigeration piece is more even for the life-span of refrigeration piece is secure, is equipped with n row in the module main part of this application simultaneously and is used for placing the through-hole of reagent, and 1 is not less than n and is not more than 4, makes the module structure of this application compare in the module structure of the same through-hole number obviously shortened the size, thereby has reduced the size and the manufacturing cost of gene amplification equipment.
Drawings
Fig. 1 is a main body schematic view of a module structure of one embodiment of the present application.
Fig. 2 is a front view of the modular structure of fig. 1.
Fig. 3 is an exploded view of the modular structure of fig. 1.
Fig. 4 is a schematic view of the connection of the first cooling plate to the first circuit board.
Fig. 5 is a top view of a module structure of another embodiment of the present application.
Fig. 6 is a top view of a module structure of yet another embodiment of the present application.
Reference numerals: the module comprises a first radiator 10, a second radiator 11, a first refrigeration sheet 20, a second refrigeration sheet 21, a module body 30, a first surface 301, a second surface 302, through holes 303, a heat conduction film 40, a first circuit board 50, a second circuit board 51, an insulation sheet 60, a first fan 70, a second fan 71, a fan mounting plate 80 and a mounting frame 90.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that, in the description of the present invention, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
It is to be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-6, the present invention provides a modular structure comprising a first radiator 10, a second radiator 11, at least one first cooling plate 20, at least one second cooling plate 21 and at least one module body 30, the module body 30 is fixed between the first heat sink 10 and the second heat sink 11, the module body 30 has a first surface 301 facing the first heat sink 10 and a second surface 302 facing the second heat sink 11, the first cooling plate 20 is fixed between the first surface 301 of the module body 30 and the first heat sink 10, the second cooling plate 21 is secured between the second surface 302 of the module body 30 and the second heat sink 21, and heat conducting films 40 are arranged between the first radiator 10 and the first refrigerating sheet 20, between the first refrigerating sheet 20 and the module main body 30, between the module main body 30 and the second refrigerating sheet 21 and between the second refrigerating sheet 21 and the second radiator 11.
The module main body 30 is sandwiched by at least one first refrigeration sheet 20 and at least one second refrigeration sheet 21, and is heated and cooled by the refrigeration sheets to provide a temperature environment for the module main body 30. The first refrigerating sheet 20 and the second refrigerating sheet 21 can be semiconductor refrigerating sheets, and are provided with a hot end and a cold end, the purpose of heating or cooling is achieved by changing the current direction when the current in the refrigerating sheets passes through an N-type element and a P-type element, when the current flows from the N-type element to the P-type element, heat is absorbed, the temperature is reduced, and the surface of the refrigerating sheet through which the current passes becomes a cold surface; when current flows from the P-type element to the N-type element, heat is released, the temperature rises, and the surface of the cooling plate through which the current passes becomes a hot surface. By heat conduction, the test tube on the module main body 30 is heated uniformly or cooled.
The module body 30 is made of a material with good thermal conductivity, such as a super-heat-conductive metal material.
The first radiator 10 and the second radiator 11 perform a heat dissipation function, so that temperature control is normal. The radiator can adopt a copper-aluminum combined finned radiator, and the part of the radiator combined with the refrigerating sheet can adopt a material with good heat conductivity, so that the radiating efficiency is improved.
When the refrigerating sheet works, the heat-conducting film 40 enables the temperature of each position of the module main body 30 to be uniformly distributed, and the heat on the refrigerating sheet is transferred to the radiator through the heat-conducting film 40. In some preferred modes, the heat conductive film 40 is a carbon film or a graphite heat conductive film.
In some preferred embodiments, a plurality of through holes 303 for placing reagents are formed in the module body 30, and the plurality of through holes 303 are arranged in n rows along the width direction of the module body, wherein n is greater than or equal to 1 and less than or equal to 4. In the present embodiment, n is an integer, and n may be 1, 2, 3 or 4, that is, 1 row, 2 rows, 3 rows or 4 rows of through holes 303 may be distributed in the width direction of the module main body 30, wherein each row may uniformly distribute a plurality of through holes 303 along the length direction of the module main body 30. In the embodiment, since the module main body 30 is located between the at least one first chilling plate 20 and the at least one second chilling plate 21, n is less than or equal to 4 in order to ensure that the reagents placed in the plurality of through holes 303 of the module main body 30 are heated uniformly and reduce the edge effect.
In some preferred manners, as shown in fig. 1 to 4, the module structure includes a module main body 30, two first cooling fins 20 distributed in parallel, and two second cooling fins 21 distributed in parallel, the module main body 30 is sandwiched by the two first cooling fins 20 and the two second cooling fins 21, and a heat-conducting film 40 is respectively disposed between the first heat sink 10 and the two first cooling fins 20, between the two first cooling fins 20 and the module main body 30, between the module main body 30 and the two second cooling fins 21, and between the two second cooling fins 21 and the second heat sink 11, so as to form a temperature control partition.
In other preferred forms, as shown in fig. 6, the modular structure comprises two modular bodies 30, four first fins 20 distributed in parallel, four second fins 21 distributed in parallel, wherein each module body 30 is respectively sandwiched by two first refrigerating sheets 20 and two second refrigerating sheet clips 21, and a heat-conducting film 40 is respectively arranged between the radiator and the refrigerating sheet and between the refrigerating sheet and the module main body, thereby forming two temperature control subareas, one module main body 30, two first refrigeration sheets 20 corresponding to the left side of the module main body 30, two second refrigeration sheets 21 corresponding to the right side of the module main body 30 and four heat-conducting films 40 form a first temperature control partition, and the other module main body 30, two first refrigeration sheets 20 corresponding to the left side of the module main body 30, two second refrigeration sheets 21 corresponding to the right side of the module main body 30 and four heat-conducting films 40 form a second temperature control partition. In some preferred embodiments, the first temperature-controlled section and the second temperature-controlled section can be independently operated by a program, so that multiple gene amplifications can be conveniently realized by different temperature programs.
It will be appreciated that multiple temperature control zones may be formed by providing multiple module bodies 30, such as a single row 8-well single zone configuration as shown in FIG. 1, a double row 16-well single zone configuration as shown in FIG. 5, and a triple row 48-well double zone configuration as shown in FIG. 6.
In some preferred embodiments, the module structure of the present application further includes a first circuit board 50 and a second circuit board 51, the first circuit board 50 and the second circuit board 51 being fixed to the inner sides of the first heat sink 10 and the second heat sink 11, respectively, wherein the module body 30 is located between the first circuit board 50 and the second circuit board 51. The inner sides of the first radiator 10 and the second radiator 11 herein refer to the side of the first radiator 10 for connecting the first cooling fin 20 and the second radiator 11 for connecting the second cooling fin 21. The circuit board is provided with a circuit, and the circuit board is connected with a power supply to supply power for normal work of the module structure.
In some preferred embodiments, the first and second cooling fins 20 and 21 are respectively located on the first and second circuit boards 50 and 51, and the bottoms of the first and second cooling fins 20 and 21 are respectively connected with the first and second circuit boards 50 and 51. In the present embodiment, the first cooling plate 20 and the second cooling plate 21 are located on the first circuit board 50 and the second circuit board 51, respectively, and the bottoms of the first cooling plate 20 and the second cooling plate 21 are welded on the first circuit board 50 and the second circuit board 51 through the wires, respectively. As can be seen from fig. 4, the inner side of the first heat sink 10 is a mounting plane of the at least one first cooling fin 20 and the first circuit board 50, wherein the mounting position of the at least one first cooling fin 20 is close to the upper end of the first heat sink 10, the mounting position of the first circuit board 50 is close to the lower end of the first heat sink 10, and the bottom of the first cooling fin 20, that is, the position where the first cooling fin 20 is close to the first circuit board 50, is connected to the first circuit board 50.
In some preferred embodiments, insulating sheets 60 are provided between the first heat sink 10 and the first circuit board 50 and between the second heat sink 11 and the second circuit board 51 for insulating the circuit boards from the heat sinks.
In some preferred embodiments, the module structure of the present application further includes a fan including a first fan 70 and a second fan 71, and the first fan 70 and the second fan 71 are respectively located outside the first radiator 10 and the second radiator 11 and are located on the same straight line. As shown in fig. 1 and 2, the first fan 70 and the second fan 71 are respectively opposed to the first radiator 10 and the second radiator 11 so that components located between the first radiator 10 and the second radiator 11 are located between the first fan 70 and the second fan 71, and a heat dissipation air passage is formed between the first fan 70 and the second fan 71. In some forms, the first fan 70 and the second fan 71 are axial fans.
When the temperature is too high, the first fan 70 and the second fan 71 work to blow air to the first radiator 10 and the second radiator 11, and the air flow blows to the first radiator 10 and the second radiator 11 to dissipate heat, so that the heat on the first refrigerating sheet 20, the second refrigerating sheet 21 and the module main body 30 can be quickly dissipated.
In some preferred embodiments, the fan is mounted on a fan mounting plate 80, and the fan mounting plate 80 is connected to the first and second radiators 10 and 11, respectively. As shown in fig. 1 and 2, the fan mounting plate 80 is fixedly connected to the outer sides of the first radiator 10 and the second radiator 11, and the fan mounting plate 80 has a mounting hole for mounting a fan.
In some preferred embodiments, the modular structure of the present application further comprises mounting brackets 90 for connecting the modular structure to a gene amplification apparatus, the mounting brackets 90 being located at upper and lower ends of the modular structure and being aligned with the module main body 30. As shown in the figure, the mounting frame 90 is provided with mounting holes through which the detachable connection of the modular structure and the gene amplification device can be realized, and the mounting and the dismounting are convenient.
In some preferred embodiments, the module structure of the present application further includes temperature sensors located on the module body 30 and at least one heat sink (not shown in the figures). In some forms, the temperature sensor disposed on the first heat sink 10 and/or the second heat sink 11 is disposed on a circuit board connected to the first heat sink 10 and/or the second heat sink 11. The temperature sensor can detect and control the temperature of the module main body 30 and the radiator, effectively prevents the problems of module structure failure and the like caused by low temperature or high temperature, and can be fixed on the module main body and/or the radiator in a threaded connection mode.
In some preferred modes, each part forming the module structure of the application is provided with a mounting hole, and the detachable or fixed connection is realized through a screw or a bolt.
A gene amplification device having the aforementioned modular structure.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The utility model provides a modular structure, its characterized in that, includes first radiator, second radiator, at least one first refrigeration piece, at least one second refrigeration piece and at least one module main part, the module main part is fixed between first radiator and the second radiator, the module main part has the first surface towards first radiator and the second surface towards the second radiator, first refrigeration piece is fixed between the first surface of module main part and the first radiator, the second refrigeration piece is fixed between the second surface of module main part and the second radiator have the heat conduction membrane between first radiator and the first refrigeration piece, between first refrigeration piece and the module main part, between module main part and the second refrigeration piece and between second refrigeration piece and the second radiator.
2. The modular structure of claim 1, wherein the module body is provided with a plurality of through holes for placing reagents, the plurality of through holes are arranged in n rows along the width direction of the module body, wherein n is greater than or equal to 1 and less than or equal to 4.
3. The modular structure of claim 1 further comprising a first circuit board and a second circuit board, the first circuit board and the second circuit board being secured to the inside of the first heat sink and the second heat sink, respectively, the module body being located between the first circuit board and the second circuit board.
4. The modular structure of claim 3, wherein the first and second chilling plates are positioned on a first circuit board and a second circuit board, respectively, and wherein bottoms of the first and second chilling plates are connected to the first and second circuit boards, respectively.
5. The modular structure of claim 3 wherein insulating sheets are provided between the first heat sink and the first circuit board and between the second heat sink and the second circuit board.
6. The modular structure of claim 1, further comprising a fan comprising a first fan and a second fan, the first fan and the second fan being located outside the first radiator and the second radiator, respectively, and being located on a same line.
7. The modular structure of claim 6, wherein the fan is mounted on a fan mounting plate, the fan mounting plate being connected to the first and second heat sinks, respectively.
8. The modular structure of claim 1, further comprising mounting brackets for connecting the modular structure to gene amplification equipment, the mounting brackets being located at upper and lower ends of the modular structure and in line with the modular body.
9. The modular structure of claim 1, further comprising a temperature sensor located on the module body and the at least one heat sink.
10. A gene amplification apparatus comprising the modular structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921771866.7U CN211546546U (en) | 2019-10-22 | 2019-10-22 | Module structure and gene amplification device having the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921771866.7U CN211546546U (en) | 2019-10-22 | 2019-10-22 | Module structure and gene amplification device having the same |
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| CN211546546U true CN211546546U (en) | 2020-09-22 |
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| CN201921771866.7U Active CN211546546U (en) | 2019-10-22 | 2019-10-22 | Module structure and gene amplification device having the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
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2019
- 2019-10-22 CN CN201921771866.7U patent/CN211546546U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112345123A (en) * | 2020-10-28 | 2021-02-09 | 杭州博日科技股份有限公司 | Calibrating device for temperature measuring probe of PCR instrument module |
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