CN211782083U - Semiconductor refrigeration heat dissipation module - Google Patents
Semiconductor refrigeration heat dissipation module Download PDFInfo
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- CN211782083U CN211782083U CN201922203700.1U CN201922203700U CN211782083U CN 211782083 U CN211782083 U CN 211782083U CN 201922203700 U CN201922203700 U CN 201922203700U CN 211782083 U CN211782083 U CN 211782083U
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- heat dissipation
- semiconductor refrigeration
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Abstract
The utility model relates to a semiconductor refrigeration heat dissipation module. The problem of among the prior art product radiating effect not good in effective space is solved. The heat dissipation module comprises a radiator, semiconductor refrigeration pieces and a gold-plated plate, the semiconductor refrigeration pieces are arranged on the radiator, the gold-plated plate is arranged on the semiconductor refrigeration pieces, the gold-plated plate is connected with a cooling object, the radiator comprises a base plate, a plurality of heat dissipation fin groups are arranged on the base plate, the heat dissipation fin groups comprise a plurality of fins which are uniformly arranged at intervals, a first heat dissipation channel is formed among the fins, notches are correspondingly formed in the fins, a second heat dissipation channel is formed by the notches together, and heat dissipation fan assemblies are installed on the heat dissipation fin groups. The utility model discloses fin structure to the radiator improves, has satisfied even radiating requirement, still through installation radiator fan subassembly for the radiating rate has improved the refrigeration efficiency of semiconductor refrigeration piece. The improvement does not need to increase extra space, and the heat dissipation function is improved in the effective space.
Description
Technical Field
The utility model relates to a refrigeration technology field especially relates to a semiconductor refrigeration heat dissipation module.
Background
The refrigerating capacity and efficiency of the semiconductor refrigerator mainly depend on the temperature and temperature difference of the cold and hot surfaces, and because of the Peltier effect, the semiconductor can refrigerate at one end and heat at the other end, so if the semiconductor refrigerator is used for refrigerating, the heat at the other end must be rapidly dissipated, and once the semiconductor refrigerator is used for refrigerating, the thermal resistance of the hot surface is too high, so the refrigerating efficiency is reduced. At present, many products have high power, high heat density and limited heat dissipation space, so that how to refrigerate and dissipate high-density heat in the limited space is a very critical problem.
Disclosure of Invention
The utility model discloses mainly solved among the prior art not good problem of product radiating effect in effective space, provided a semiconductor refrigeration heat radiation module.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a semiconductor refrigeration heat dissipation module, includes radiator, semiconductor refrigeration piece and gilt board, and the semiconductor refrigeration piece sets up on the radiator, and the gilt board sets up on the semiconductor refrigeration piece, and the gilt board is connected with the cooling object, the radiator includes the base plate, is provided with a plurality of radiating fin groups on the base plate, and radiating fin group includes a plurality of even interval arrangement's fin, forms first heat dissipation channel between the fin, and it has the incision to correspond to open on the fin, and the incision forms the second heat dissipation channel who intersects with first heat dissipation channel jointly, installs radiator fan assembly on radiating fin group. The utility model discloses a radiator dispels the heat of semiconductor refrigeration piece hot side, and improves the fin structure of radiator, sets up interval between the suitable fin, forms crisscross horizontal heat dissipation channel and vertical heat dissipation channel between the fin, has satisfied even radiating requirement to still through installing radiator fan subassembly, take away the heat on the fin group by the radiator fan subassembly, accelerated the radiating rate, improved the refrigeration efficiency of semiconductor refrigeration piece. The utility model discloses can directly paste and carry out the refrigeration in high density heat source side, the radiating effect is good, and refrigeration efficiency is high, and space utilization is high.
As a preferable scheme of the above scheme, the number of the cooling fin groups is two, the number of the semiconductor cooling fins is two, the two semiconductor cooling fins are installed on the bottom surface of the substrate at positions corresponding to the cooling fin groups, the number of the gold-plated plates is two, and the gold-plated plates are respectively arranged on the semiconductor cooling fins. According to the scheme, two cooling fin groups are preferably arranged on the substrate, two semiconductor refrigerating pieces and two gold-plated plates are arranged corresponding to the two cooling fin groups, each semiconductor refrigerating piece is installed at the bottom of the substrate corresponding to the corresponding cooling fin group, and each gold-plated plate is installed corresponding to one semiconductor refrigerating piece.
As a preferred scheme of the above scheme, the LED lamp further comprises a plurality of temperature sensors and a PCB, wherein the temperature sensors are connected to the radiator and the gold-plated plate, the PCB is fixed on the base, and the temperature sensors are respectively connected with the PCB. The temperature sensors are respectively used for monitoring the temperatures of the radiator and the gold-plated plate, signals collected by the temperature sensors are sent to the PCB, the PCB judges whether to continue working or not according to the signals, namely, the PCB reaches a set value, stops working, does not reach the set value, continues working and achieves the aim of controlling the temperature.
As a preferable scheme of the above scheme, the temperature sensors include four, two sensors are respectively connected to the two fin groups, and the sensors are installed in the second heat dissipation channel, and the other two sensors are respectively connected to the two gold-plated plates. According to the scheme, the temperature sensors are arranged at key points respectively, one temperature sensor is arranged on each radiator, and one temperature sensor is arranged on each gold-plated plate.
As a preferable scheme of the above scheme, the semiconductor refrigeration sheet, the gold-plated plate and the radiator are fixed by silver glue. Adopt the silica gel of novel material in this scheme, when having guaranteed intensity, satisfied the requirement of performance.
As a preferable scheme of the scheme, the semiconductor refrigeration sheet is made of a silver cold plate, and the surface of the semiconductor refrigeration sheet is made of a gold plating process. The scheme selects the cold plate made of silver and the gold plating process, and plays a role in high-efficiency energy conduction.
As a preferable scheme of the above scheme, the cooling fan assembly includes a fixing bracket and a fan module, the fixing bracket covers the cooling fin assembly and is fixed to the substrate, an air outlet is provided on one surface of the fixing bracket, the fan module is mounted on the air outlet, and an air inlet is provided on the other surface of the fixing bracket. The fixing support is used for fixing the fan module, so that the fan module can blow out hot air in the radiating fin group. The fixed support is provided with an air outlet and an air inlet, the fan module blows hot air in the radiating fin group out of the air outlet, and meanwhile, external cold air enters the radiating fin group from the air inlet.
As a preferred scheme of the above scheme, the fixing bracket includes a top plate and side plates vertically connected to both sides of the top plate, a connecting wing is provided on an edge of the side plate, a through hole is provided on the connecting wing, a plurality of fixing columns are provided on the base plate corresponding to the connecting wing, the connecting wing is sleeved on the fixing columns through the through hole, threads are provided on outer walls of the fixing columns, nuts are screwed on the fixing columns, and the connecting wing is fixed on the base plate. The fixing support is arranged in a door shape, can be tightly attached to the surface of the radiating fin group for installation, and reduces the size. The fixation is realized by adopting the nut, the structure does not need to be changed, and the installation is convenient and simple.
As a preferable scheme of the above scheme, the air outlet is provided on one side plate, the air outlet is opposite to the first heat dissipation channel, the air inlet is provided on the top plate and the other side plate, and the air inlet is opposite to the first heat dissipation channel and the second heat dissipation channel. The fan module is arranged on one side, the interference with the temperature sensor is avoided, the fan is arranged on the side face, the original redundant space is fully utilized, the extra space does not need to be added, and the requirement of improving the heat dissipation function in the effective space is met. The fan module blows air out of the radiating fin group through the first radiating channel. Air enters the first heat dissipation channel and the second heat dissipation channel from the air inlet.
The utility model has the advantages that: the fin structure of the radiator is improved, the proper spacing between the fins is set, the crossed transverse radiating channels and the vertical radiating channels are formed between the fins, the requirement of uniform radiating is met, and heat on the fin group is taken away by the radiating fan assembly through installing the radiating fan assembly, so that the radiating speed is accelerated, and the refrigerating efficiency of the semiconductor refrigerating fin is improved. The improvement does not need to increase extra space, and meets the requirement of improving the heat dissipation function in the effective space.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is an exploded view of a structure of the present invention;
fig. 3 is a schematic top view of the cooling fan assembly of the present invention;
fig. 4 is a schematic structural view of the fixing bracket of the present invention;
fig. 5 is a schematic top view of the fixing bracket of the present invention.
The heat radiator comprises a heat radiator body 1, a heat radiator body 2, a semiconductor refrigerating sheet 3, a gold-plated sheet 4, a base plate 5, a heat radiating fin group 6, fins 7, a first upper heat-resisting channel 8, a second heat radiating channel 9, a temperature sensor 10, a PCB 11, a fixing support 12, a fan module 13, a top plate 14, a side plate 15, connecting wings 16, through holes 17, an air outlet 18, an air inlet 19 and a connecting edge.
Detailed Description
The technical solution of the present invention is further described below by way of examples and with reference to the accompanying drawings.
Example (b):
a semiconductor refrigeration heat dissipation module of this embodiment, as shown in fig. 1 and fig. 2, includes a heat sink 1, a semiconductor refrigeration sheet 2, and a gold-plated plate 3. The semiconductor refrigeration piece is arranged on the radiator, the gold-plated plate is arranged on the semiconductor refrigeration piece and connected with a cooling object, the radiator comprises a base plate 4 and two groups of radiating fin groups 5 arranged on the base plate, each radiating fin group comprises a plurality of fins 6 which are uniformly arranged at intervals, and the fins can be integrally manufactured with the base plate. The fins are transversely arranged, the fins are vertically arranged, a first heat dissipation channel 7 is formed between the fins, in addition, the corresponding positions on the fins are provided with notches, and the notches form a second heat dissipation channel 8 crossed with the first heat dissipation channel together.
In this embodiment, two semiconductor cooling fins are provided corresponding to the two cooling fin groups, the two semiconductor cooling fins are installed on the bottom surface of the substrate at positions corresponding to the cooling fin groups, two gold-plated plates are also provided, and the gold-plated plates are respectively arranged on the semiconductor cooling fins. The semiconductor refrigerating sheet, the gold-plated plate and the radiator are fixed by silver glue. The semiconductor refrigerating plate is made of silver cold plate.
In order to monitor the temperature of the heat dissipation module, the heat dissipation module further comprises a plurality of temperature sensors 9 and a PCB 10, in order to collect the temperature information of the key positions of the heat dissipation module, the number of the temperature sensors is four, the two sensors are respectively connected to the two heat dissipation fin groups, the sensors are installed in the second heat dissipation channel, and the other two sensors are respectively connected to the two gold-plated plates. The PCB is fixed on the base, and the temperature sensor is connected with the PCB respectively. The signal that temperature sensor gathered is sent to the PCB board, is judged by the PCB board according to the signal whether continue work, reaches the setting value promptly, and the work is suspended, does not reach the setting value and continues work, controls the temperature.
In order to increase the heat dissipation effect, a heat dissipation fan assembly is mounted on the heat dissipation fin set. As shown in fig. 3, 4 and 5, the cooling fan assembly includes a fixing bracket 11 and a fan module 12, the fixing bracket covers the cooling fin assembly and is fixed to the substrate, and the fan module is fixed to the fixing bracket. The fixing support comprises a top plate 13 and side plates 14 vertically connected to two sides of the top plate, a connecting wing 15 is arranged on the edge of the side plate on one side, a through hole 16 is formed in the connecting wing, as shown in fig. 1, a plurality of fixing columns 17 are arranged on the base plate corresponding to the connecting wing, as shown in fig. 5, a connecting edge is arranged on the edge of the side plate on the other side, and a fixing hole is formed in the connecting edge. When the fixing device is installed, the fixing support is buckled on the radiating fin group, the connecting wing is sleeved on the fixing column through the through hole, threads are arranged on the outer wall of the fixing column, a nut is screwed on the fixing column, the connecting wing is fixed on the base plate, the connecting edge is pressed on the base plate, and a screw is arranged on the fixing hole to fix the connecting edge and the base plate. An air outlet 17 is arranged on a side plate on the left side of one surface of the fixed support as shown in fig. 4, the air outlet is opposite to the first heat dissipation channel, the fan module is arranged on the air outlet, air inlets 18 are arranged on other surfaces of the fixed support as a top plate and a right side plate, and the air inlets are opposite to the first heat dissipation channel and the second heat dissipation channel. When the fan assembly works, air enters the radiator from the air inlet, exchanges heat in the first heat dissipation channel and the second heat dissipation channel and then is blown out from the fan module of the air outlet, and good heat dissipation is carried out. In this embodiment, the fan module is installed on the side surface, and the original space is utilized, so that the heat dissipation effect can be increased in the effective space, and the refrigeration efficiency is increased.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the terms heat spreader, semiconductor cooling plate, gold plate, substrate, fin assembly, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (9)
1. The utility model provides a semiconductor refrigeration heat dissipation module, includes radiator, semiconductor refrigeration piece and gilding plate, and the semiconductor refrigeration piece sets up on the radiator, and the gilding plate sets up on the semiconductor refrigeration piece, and the gilding plate is connected its characterized in that with the cooling object: the radiator comprises a base plate, wherein a plurality of radiating fin groups are arranged on the base plate, each radiating fin group comprises a plurality of fins which are uniformly arranged at intervals, a first radiating channel is formed among the fins, notches are correspondingly formed in the fins, the notches jointly form a second radiating channel which is intersected with the first radiating channel, and a radiating fan assembly is arranged on each radiating fin group.
2. The semiconductor refrigeration and heat dissipation module according to claim 1, wherein the number of the heat dissipation fin sets is two, the two semiconductor refrigeration fins are mounted on the bottom surface of the substrate at positions corresponding to the heat dissipation fin sets, the two gold-plated plates are provided, and the two gold-plated plates are respectively disposed on the semiconductor refrigeration fins.
3. The semiconductor refrigeration and heat dissipation module of claim 2, further comprising a plurality of temperature sensors and a PCB, wherein the temperature sensors are connected to the heat sink and the gold-plated board, the PCB is fixed to the base, and the temperature sensors are respectively connected to the PCB.
4. The semiconductor refrigeration and heat dissipation module of claim 3, wherein the temperature sensors comprise four, two sensors are respectively connected to the two heat dissipation fin sets, and the sensors are installed in the second heat dissipation channel, and the other two sensors are respectively connected to the two plated metal plates.
5. The semiconductor refrigeration and heat dissipation module of claim 1, 2, 3 or 4, wherein the semiconductor refrigeration sheet is fixed with the gold-plated plate and the heat sink by silver glue.
6. The semiconductor refrigeration and heat dissipation module according to claim 1, 2, 3 or 4, wherein the semiconductor refrigeration sheet is made of a silver cold plate, and the surface of the semiconductor refrigeration sheet is made of a gold plating process.
7. The semiconductor refrigeration and heat dissipation module of claim 1, 2, 3 or 4, wherein the heat dissipation fan assembly comprises a fixing bracket and a fan module, the fixing bracket covers the heat dissipation fin set and is fixed with the substrate, an air outlet is arranged on one surface of the fixing bracket, the fan module is arranged on the air outlet, and an air inlet is arranged on the other surface of the fixing bracket.
8. The semiconductor refrigeration and heat dissipation module according to claim 7, wherein the fixing bracket comprises a top plate and side plates vertically connected to two sides of the top plate, connecting wings are disposed on edges of the side plates, through holes are disposed on the connecting wings, a plurality of fixing posts are disposed on the base plate corresponding to the connecting wings, the connecting wings are sleeved on the fixing posts through the through holes, threads are disposed on outer walls of the fixing posts, and nuts are screwed on the fixing posts to fix the connecting wings on the base plate.
9. The semiconductor refrigeration and heat dissipation module of claim 8, wherein the air outlet is formed in one side plate, the air outlet is opposite to the first heat dissipation channel, the air inlet is formed in the top plate and the other side plate, and the air inlet is opposite to the first heat dissipation channel and the second heat dissipation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922203700.1U CN211782083U (en) | 2019-12-10 | 2019-12-10 | Semiconductor refrigeration heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922203700.1U CN211782083U (en) | 2019-12-10 | 2019-12-10 | Semiconductor refrigeration heat dissipation module |
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| CN211782083U true CN211782083U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922203700.1U Active CN211782083U (en) | 2019-12-10 | 2019-12-10 | Semiconductor refrigeration heat dissipation module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115371287A (en) * | 2022-08-22 | 2022-11-22 | 广西自贸区见炬科技有限公司 | Compact thermoelectric semiconductor refrigeration module with high refrigeration power density |
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2019
- 2019-12-10 CN CN201922203700.1U patent/CN211782083U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115371287A (en) * | 2022-08-22 | 2022-11-22 | 广西自贸区见炬科技有限公司 | Compact thermoelectric semiconductor refrigeration module with high refrigeration power density |
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