CN218764061U - Novel semiconductor refrigeration module - Google Patents
Novel semiconductor refrigeration module Download PDFInfo
- Publication number
- CN218764061U CN218764061U CN202222869500.1U CN202222869500U CN218764061U CN 218764061 U CN218764061 U CN 218764061U CN 202222869500 U CN202222869500 U CN 202222869500U CN 218764061 U CN218764061 U CN 218764061U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- base
- dissipation base
- refrigeration module
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel semiconductor refrigeration module, including semiconductor chip, heat dissipation base and the cold base that looses, seted up the through-hole on this heat dissipation base, set up threaded hole on this cold base that looses, pass through-hole and threaded connection through the screw in order to realize fixed connection in threaded hole between this heat dissipation base and the cold base that looses. In addition, still include the heat insulating part of wearing to establish in first through-hole, set up the counter bore that can supply the screw to pass in this heat insulating part, the top of this heat insulating part is equipped with the sealing layer. The semiconductor refrigeration module of the utility model can separate the screw and the heat dissipation base by arranging the heat insulation piece so as to avoid the direct contact between the screw and the heat dissipation base to cause heat transfer; through set up the sealing layer on the heat insulating part, can completely cut off screw and air to prevent that the hot-air that the heat dissipation base produced from transmitting to the cold base that looses through the screw, thereby guaranteed the refrigeration effect of the cold base that looses and the radiating effect of heat dissipation base, and then guaranteed semiconductor refrigeration module's working property.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, concretely relates to novel semiconductor refrigeration module.
Background
An existing semiconductor refrigeration module generally includes a semiconductor chip, a cooling aluminum disposed at one end of the semiconductor chip, a cooling aluminum disposed at the other end of the semiconductor chip, and a thermal insulation layer disposed between the cooling aluminum and the cooling aluminum. Wherein, the cooling aluminum and the heat dissipation aluminum are fixedly connected by passing through fasteners such as screws. Therefore, after the semiconductor refrigeration module starts to work, because the two ends of the screw are respectively in direct contact with the cold dissipation aluminum and the heat dissipation aluminum, the cold air generated by the cold dissipation aluminum and the heat generated by the heat dissipation aluminum are mutually transmitted through the screw, and the refrigeration effect of the cold dissipation aluminum and the heat dissipation effect of the heat dissipation aluminum are greatly reduced, so that the performance of the semiconductor refrigeration module is reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, the utility model provides a novel semiconductor refrigeration module through setting up the heat insulating part, can separate screw and heat dissipation base in order to avoid direct contact between the two to prevent that the heat dissipation base produced from transmitting to the cold base that looses through the screw on, and then guaranteed semiconductor refrigeration module's working property.
The utility model discloses a solve the technical scheme that its problem adopted and be:
the utility model provides a novel semiconductor refrigeration module, including semiconductor chip, with the heat dissipation base that semiconductor chip's the terminal surface of heating laminated mutually and with the cold base that looses that semiconductor chip's refrigeration terminal surface laminated mutually, wherein:
the heat dissipation base is provided with a through hole, the cooling dissipation base is provided with a threaded hole, and the heat dissipation base and the cooling dissipation base penetrate through the through hole through a screw and are in threaded connection in the threaded hole to realize fixed connection;
the heat insulation piece is arranged in the through hole in a penetrating mode, a counter bore through which the screw can penetrate is formed in the heat insulation piece, and a sealing layer is arranged at the top of the heat insulation piece.
The semiconductor refrigeration module of the utility model can separate the screw and the heat dissipation base by arranging the heat insulation piece so as to avoid the direct contact between the screw and the heat dissipation base to cause heat transfer; through set up the sealing layer on the heat insulating part, can completely cut off screw and air to prevent that the hot-air that the heat dissipation base produced from transmitting to the cold base that looses through the screw, and then guaranteed the refrigeration effect of the cold base that looses and the radiating effect of heat dissipation base, thereby guaranteed semiconductor refrigeration module's working property. In addition, the screw hole is formed in the cooling base, so that the screw can be directly and fixedly connected to the cooling base, a nut does not need to be embedded in the cooling base, and the assembly process is more convenient.
Further, the heat insulation piece is a plastic cap, and the sealing layer is an adhesive layer.
The heat-radiating base is provided with a heat-radiating base, the heat-radiating base is provided with a heat-insulating layer, the heat-insulating layer comprises a cotton pad and a foam board which are vertically overlapped, the cotton pad is abutted against the heat-radiating base, and the foam board is abutted against the cold-radiating base;
the cotton pad with offer respectively on the cystosepiment and supply first dodge hole and the second that the screw passed dodges the hole.
Further, the cotton pad is EVA foam cotton pad, and the cystosepiment is EPS cystosepiment.
Furthermore, a boss for placing the semiconductor chip is arranged on the cooling base, and the refrigerating end face of the semiconductor chip is attached to the boss;
the cotton pad is provided with a first avoidance groove for the semiconductor chip to pass through, and the foam board is provided with a second avoidance groove for the boss to pass through.
Furthermore, a wire groove for placing the power line of the semiconductor chip is further formed in the foam board, and the cotton pad is stacked on the foam board and tightly presses the power line in the wire groove.
Further, still including connect the installing support on the heat dissipation base and install radiator fan on the installing support, wherein:
the heat dissipation base is provided with a plurality of heat dissipation fins, and the heat dissipation fan is used for introducing external air into the heat dissipation base and discharging the external air after exchanging heat with the plurality of heat dissipation fins.
Further, still include the cooling fan that looses connected on the base of cooling, wherein:
the cooling fan is used for introducing external air into the cooling base and discharging the air after being refrigerated by the cooling fins.
Further, the semiconductor chips are provided with two, and the two semiconductor chips are arranged at a transverse interval.
Furthermore, the heat dissipation bases are also provided with two heat dissipation bases which are respectively arranged corresponding to the two semiconductor chips, and the two heat dissipation bases are integrally formed.
In summary, the novel semiconductor refrigeration module provided by the present invention can separate the screw from the heat dissipation base by providing the heat insulation member to avoid direct contact between the screw and the heat dissipation base to cause heat transfer; through set up the sealing layer on the heat insulating part, can completely cut off screw and air to prevent that the hot-air that the heat dissipation base produced from transmitting to the cold base that looses through the screw, and then guaranteed the refrigeration effect of the cold base that looses and the radiating effect of heat dissipation base, thereby guaranteed semiconductor refrigeration module's working property. In addition, the threaded holes are formed in the cooling base, so that the screws can be directly and fixedly connected to the cooling base, nuts do not need to be embedded in the cooling base, and the assembling process is more convenient and faster.
Drawings
Fig. 1 is an exploded view of a semiconductor refrigeration module according to the present invention;
fig. 2 is a schematic structural view of a heat dissipation base in the semiconductor refrigeration module of the present invention;
fig. 3 is a schematic structural view of a cooling base in the semiconductor refrigeration module of the present invention;
fig. 4 is a schematic structural view of a heat insulating member in the semiconductor refrigeration module of the present invention;
fig. 5 is a schematic structural view of a cotton pad in the semiconductor refrigeration module of the present invention;
fig. 6 is a schematic structural diagram of a foam board in the semiconductor refrigeration module according to the present invention;
fig. 7 is a schematic structural diagram of the semiconductor refrigeration module of the present invention;
fig. 8 is a top view of the semiconductor refrigeration module of the present invention;
FIG. 9 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 8;
fig. 10 is a schematic cross-sectional view of B-B in fig. 8.
Wherein the reference numerals have the following meanings:
1. a semiconductor chip; 11. a power line; 2. a heat dissipation base; 21. a heat dissipating fin; 22. a through hole; 3. a cooling base; 31. cooling fins; 32. a boss; 33. a threaded hole; 4. a thermal insulation member; 41. a counter bore; 5. a screw; 61. a cotton pad; 611. a first avoidance slot; 612. a first avoidance hole; 62. a foam board; 621. a second avoidance slot; 622. a wire slot; 623. a second avoidance hole; 7. mounting a bracket; 8. a heat-dissipating fan; 9. a cooling fan.
Detailed Description
For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the module or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1-10, the utility model provides a novel semiconductor refrigeration module, including semiconductor chip 1, with the heat dissipation base 2 that semiconductor chip 1's the terminal surface that heats laminated mutually and with the cold base 3 that looses that semiconductor chip 1's refrigeration terminal surface laminated mutually, seted up a plurality of through-holes 22 on this heat dissipation base 2, seted up a plurality of screw holes 33 corresponding with a plurality of through-holes 22 on this scattered cold base 3. Thus, when the screw 5 is screwed into the screw hole 33 through the through hole 22, the heat dissipation base 2 and the cooling base can be fixedly connected. Simultaneously, in order to avoid semiconductor refrigeration module during operation, this heat dissipation base 2's heat and the cold wind accessible screw 5 mutual transmission of cold base 3 dispel, this application has still set up heat insulating part 4. Specifically, the heat insulating member 4 is inserted into the through hole 22 to separate the screw 5 from the heat dissipating base 2, and a counter bore 41 through which the screw 5 can pass is formed in the heat insulating member 4. In addition, the top of the heat insulating member 4 is provided with a sealing layer (not shown) for insulating air.
Thus, by providing the thermal insulator 4, the screw 5 can be spaced apart from the heat dissipation base 2 to avoid direct contact therebetween resulting in heat transfer; through set up the sealing layer on heat insulating part 4, can completely cut off screw 5 and air to prevent that the hot-air that heat dissipation base 2 produced from transmitting to scattered cold base 3 through screw 5 on, and then guaranteed the refrigeration effect of scattered cold base 3 and the radiating effect of heat dissipation base 2, thereby guaranteed semiconductor refrigeration module's working property. In addition, through set up screw hole 33 on cooling base 3 looses for screw 5 can direct fixed connection on cooling base 3 looses, need not on cooling base 3 pre-buried nut looses, makes the assembling process more convenient.
In this embodiment, the heat insulation member 4 is a plastic cap, and the sealing layer is a glue layer; after the screw 5 passes through the plastic cap, glue is applied to the top of the screw 5 to form the glue layer.
Further, referring to fig. 1 and 7, the heat dissipation base 2 is made of heat dissipation aluminum, and a plurality of heat dissipation fins are arranged on the heat dissipation aluminum at intervals; the cooling base 3 is cooling aluminum, and a plurality of cooling fins which are arranged at intervals are arranged on the cooling aluminum; the top of the heat dissipation aluminum is provided with a heat dissipation fan 8, and the bottom of the cold dissipation aluminum is provided with a cold dissipation fan 9. Specifically, the top of the heat dissipation base 2 is connected with a mounting bracket 7, a fan mounting position is arranged on the mounting bracket 7, and the heat dissipation fan 8 is mounted on the mounting bracket 7 through the fan mounting position; the cooling fan 9 is directly installed at the bottom of the cooling aluminum.
In this embodiment, the heat dissipation fan 8 and the mounting bracket 7, the mounting bracket 7 and the heat dissipation aluminum, and the cooling fan 9 and the cooling aluminum are all fixed by screws.
Therefore, when the semiconductor refrigeration module starts to work, the cooling fan 8 can introduce external air into the cooling base 2, exchange heat with the plurality of cooling fins 21 and then discharge the air; the cooling fan can introduce the external air into the cooling base 3, and discharge the air after being cooled by the cooling fins 31.
Further, in the semiconductor refrigeration module of this application, its semiconductor chip 1 is provided with two, and two semiconductor chips 1 are horizontal interval arrangement and all are located between heat dissipation base 2 and the cold base 3 that looses. Similarly, the two heat dissipation bases 2 and the two heat dissipation fans 8 are respectively provided and are respectively arranged corresponding to the two semiconductor chips 1, and the two heat dissipation bases 2 are integrally formed. Specifically, two bosses 32 arranged at intervals are integrally formed at the top of the cooling base 3, the two semiconductor chips 1 are respectively placed on the two bosses 32, the refrigerating end surfaces of the two semiconductor chips 1 are respectively attached to the top surfaces of the two bosses 32, and the heating end surfaces of the two semiconductor chips 1 are respectively attached to the bottom surfaces of the two cooling bases 2.
Therefore, by adopting the two semiconductor chips 1, the refrigerating capacity is greatly increased, and the requirement of lower temperature is met; through with two heat dissipation base 2 integrated into one piece for the assembly is simple and convenient more.
Referring to fig. 5-6, the semiconductor refrigeration module further includes a thermal insulation layer disposed between the heat dissipation base 2 and the cooling dissipation base 3, the thermal insulation layer includes a cotton pad 61 and a foam board 62 stacked up and down, the cotton pad 61 abuts against the heat dissipation base 2, and the foam board 62 abuts against the cooling dissipation base 3. Specifically, the cotton pad 61 and the foam board 62 are respectively provided with a first avoiding hole 612 and a second avoiding hole 623 through which the screw 5 can pass, the foam board 62 is provided with a second avoiding groove 621 through which the boss 32 can pass, and the cotton pad 61 is provided with a first avoiding groove 611 through which the semiconductor chip 1 can pass. In addition, the foam board 62 is further provided with a slot 622 for placing the power line 11 of the semiconductor chip 1, and the cotton pad 61 is stacked on the foam board 62 and presses the power line 11 in the slot 622.
From this, through setting up cotton pad 61 and cystosepiment 62, not only play thermal-insulated heat retaining function, and when cotton pad 61 received the extrusion, thereby it has the buffering rebound effect and can avoid heat dissipation base 2 directly with semiconductor chip 1 crushing. In addition, the cotton pad 61 can also press the power line 11 in the wire groove 622 to ensure the tightness.
In this embodiment, the cotton pad 61 is an EVA foam cotton pad, and the foam board 62 is an EPS foam board.
In summary, the novel semiconductor refrigeration module provided by the present invention can separate the screw 5 from the heat dissipation base 2 by providing the heat insulation member 4 to avoid the direct contact between the two to cause heat transfer; through set up the sealing layer on heat insulating part 4, can completely cut off screw 5 and air to prevent that the hot-air that heat dissipation base 2 produced from transmitting to scattered cold base 3 through screw 5 on, and then guaranteed the refrigeration effect of scattered cold base 3 and the radiating effect of heat dissipation base 2, thereby guaranteed semiconductor refrigeration module's working property. In addition, through set up screw hole 33 on cooling base 3 looses for screw 5 can direct fixed connection on cooling base 3 looses, need not on cooling base 3 pre-buried nut looses, makes the assembling process more convenient.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced modules or components must be in a particular orientation, constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In addition, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically limited otherwise.
The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as the protection scope of the present invention.
Claims (10)
1. The utility model provides a novel semiconductor refrigeration module, its characterized in that, including semiconductor chip, with the heat dissipation base that semiconductor chip's terminal surface of heating laminated mutually and with the cold base that looses that semiconductor chip's refrigeration terminal surface laminated mutually, wherein:
the heat dissipation base is provided with a through hole, the cooling dissipation base is provided with a threaded hole, and the heat dissipation base and the cooling dissipation base penetrate through the through hole through a screw and are in threaded connection in the threaded hole to realize fixed connection;
the heat insulation piece is arranged in the through hole in a penetrating mode, a counter bore through which the screw can penetrate is formed in the heat insulation piece, and a sealing layer is arranged at the top of the heat insulation piece.
2. A semiconductor refrigeration module as recited in claim 1, wherein the thermal shield is a plastic cap and the sealing layer is a glue layer.
3. The semiconductor refrigeration module according to claim 1, further comprising a thermal insulation layer disposed between the heat dissipation base and the cold dissipation base, wherein the thermal insulation layer comprises a cotton pad and a foam board stacked up and down, the cotton pad abuts against the heat dissipation base, and the foam board abuts against the cold dissipation base;
the cotton pad with offer respectively on the cystosepiment and supply first dodge hole and the second that the screw passed dodges the hole.
4. A semiconductor refrigeration module as recited in claim 3, wherein the cotton pad is an EVA foam cotton pad and the foam board is an EPS foam board.
5. The semiconductor refrigeration module according to claim 3, wherein the cooling base is provided with a boss for placing the semiconductor chip, and the refrigeration end face of the semiconductor chip is attached to the boss;
the cotton pad is provided with a first avoidance groove for the semiconductor chip to pass through, and the foam board is provided with a second avoidance groove for the boss to pass through.
6. The semiconductor refrigeration module according to claim 3, wherein the foam board is further provided with a wire groove for placing the power wire of the semiconductor chip, and the cotton pad is stacked on the foam board and presses the power wire in the wire groove.
7. The semiconductor refrigeration module of claim 1 further comprising a mounting bracket attached to the heat sink base and a heat sink fan mounted on the mounting bracket, wherein:
the heat dissipation base is provided with a plurality of heat dissipation fins, and the heat dissipation fan is used for introducing external air into the heat dissipation base and discharging the external air after exchanging heat with the plurality of heat dissipation fins.
8. The semiconductor refrigeration module of claim 1 further comprising a cold dissipation fan coupled to the cold dissipation base, wherein:
the cooling fan is used for introducing external air into the cooling base and discharging the air after being refrigerated by the cooling fins.
9. The semiconductor refrigeration module of claim 1 wherein there are two semiconductor chips and the two semiconductor chips are laterally spaced apart.
10. A semiconductor refrigeration module as recited in claim 9 wherein said heat dissipation base is also provided in two and respectively disposed in correspondence with said two semiconductor chips, said two heat dissipation bases being integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222869500.1U CN218764061U (en) | 2022-10-28 | 2022-10-28 | Novel semiconductor refrigeration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222869500.1U CN218764061U (en) | 2022-10-28 | 2022-10-28 | Novel semiconductor refrigeration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218764061U true CN218764061U (en) | 2023-03-28 |
Family
ID=85703014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222869500.1U Active CN218764061U (en) | 2022-10-28 | 2022-10-28 | Novel semiconductor refrigeration module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218764061U (en) |
-
2022
- 2022-10-28 CN CN202222869500.1U patent/CN218764061U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202085437U (en) | Variable-frequency air conditioner heat radiator | |
| WO2006056105A1 (en) | Thermoelectric refrigerating module | |
| CN216057054U (en) | High-efficient radiating internet gateway | |
| CN204478325U (en) | Electric-controlled plate radiator, electronic control module and air-conditioner outdoor unit | |
| CN218764061U (en) | Novel semiconductor refrigeration module | |
| CN207282486U (en) | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor | |
| CN214199271U (en) | High-performance refrigeration module with simple structure | |
| CN209842547U (en) | High-efficiency energy-saving combined radiator | |
| CN211745110U (en) | Electrical apparatus box heat radiation structure and air conditioner | |
| CN211044149U (en) | Sealed heat dissipation box | |
| CN114630527A (en) | Phase change cooling GaN-HEMT power amplifier with casing protection | |
| CN220138304U (en) | Chip heat radiation structure based on refrigerating sheet | |
| CN219288057U (en) | Radiating device and low-temperature performance test equipment | |
| CN206531339U (en) | A kind of refrigerator | |
| CN219893691U (en) | Heat abstractor for microelectronic components and parts | |
| CN218587538U (en) | Heat radiation structure of automatically controlled box | |
| CN218764059U (en) | Heat radiation structure and semiconductor refrigeration system with same | |
| CN219046591U (en) | Circuit board chip radiating shell | |
| CN210694651U (en) | Electric control assembly and air conditioner | |
| CN218764058U (en) | Semiconductor refrigerating system and refrigerating equipment with same | |
| CN219372660U (en) | High temperature resistant multilayer circuit board | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN221532033U (en) | Combined refrigerating sheet structure | |
| CN219122916U (en) | TV advertisement machine | |
| CN214846537U (en) | Heat dissipation case capable of reducing air inlet temperature |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |