CN218764058U - Semiconductor refrigerating system and refrigerating equipment with same - Google Patents
Semiconductor refrigerating system and refrigerating equipment with same Download PDFInfo
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- CN218764058U CN218764058U CN202222868086.2U CN202222868086U CN218764058U CN 218764058 U CN218764058 U CN 218764058U CN 202222868086 U CN202222868086 U CN 202222868086U CN 218764058 U CN218764058 U CN 218764058U
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Abstract
The utility model discloses a semiconductor refrigerating system, which comprises a semiconductor refrigerating group, a heat dissipation structure connected with the hot end of the semiconductor refrigerating group, a cold dissipation structure connected with the cold end of the semiconductor refrigerating group and a heat insulation structure arranged between the heat dissipation structure and the cold dissipation structure, wherein the semiconductor refrigerating group comprises two semiconductor chips arranged at intervals; the heat dissipation structure comprises a heat dissipation base, wherein two bosses which are arranged at intervals are arranged on the heat dissipation base, and the heating end surfaces of the two semiconductor chips are respectively attached to the end surfaces of the two bosses; the heat insulating structure separates the two semiconductor chips. From this, through setting up the semiconductor chip that two intervals set up, not only increased the refrigeration volume, and through separating apart between two semiconductor chips of thermal-insulated structure to can avoid the mutual transmission of cold and hot volume between two semiconductor chips, and then guarantee semiconductor chip's radiating effect and refrigeration effect. Additionally, the utility model discloses still provide the refrigeration plant who has this semiconductor refrigerating system.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, concretely relates to semiconductor refrigerating system and have its refrigeration plant.
Background
At present, most of semiconductor refrigeration systems in the market are only provided with a single semiconductor chip, and when the capacity of refrigeration equipment is large, the semiconductor refrigeration systems cannot meet the low-temperature requirements. For this reason, some manufacturers replace the conventional low-power semiconductor chip by using a single high-power semiconductor chip, but cannot meet the low-temperature requirement due to the heat dissipation area and power problem. In addition, some manufacturers increase the cooling capacity by disposing two semiconductor chips side by side, but because the semiconductor chips have a relatively thin thickness (i.e., the cooling end face and the heating end face are relatively close to each other), and no thermal insulation material is disposed between the two semiconductor chips, the cooling capacity and the heating capacity between the two semiconductor chips are mutually transferred, so that the performance of the semiconductor chips is greatly reduced, and the low-temperature requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
In order to overcome the prior art defect, the utility model provides a semiconductor refrigerating system and have its refrigeration plant, through the semiconductor chip that sets up two intervals, not only increased the refrigerating output, and separated the division between with two semiconductor chips through thermal-insulated structure to can avoid the mutual transmission of cold and hot volume between two semiconductor chips, and then guarantee semiconductor chip's radiating effect and refrigeration effect.
The utility model discloses a solve the technical scheme that its problem adopted and be:
the utility model provides a semiconductor refrigerating system, includes semiconductor refrigeration group, with heat radiation structure that semiconductor refrigeration group hot junction links to each other, with the cold structure that looses that semiconductor refrigeration group cold junction links to each other and set up and be in heat radiation structure and the thermal-insulated structure of loosing between the cold structure, wherein:
the semiconductor refrigerating unit comprises two semiconductor chips which are arranged at intervals;
the heat dissipation structure comprises a heat dissipation base, wherein two bosses which correspond to the two semiconductor chips and are arranged at intervals are arranged on the heat dissipation base, and the heating end surfaces of the two semiconductor chips are respectively attached to the end surfaces of the two bosses;
the heat insulation structure separates the two semiconductor chips.
The utility model discloses a semiconductor refrigerating system, through setting up the semiconductor chip that two intervals set up, not only increased the refrigeration capacity, and through separating the two semiconductor chips between the thermal-insulated structure to can avoid the mutual transmission of cold and hot volume between the two semiconductor chips, and then guarantee semiconductor chip's radiating effect and refrigeration effect.
Further, heat radiation structure still includes the heat dissipation pipe and connects a plurality of heat dissipation steel wires of heat dissipation pipe, wherein:
the inside of the heat dissipation base is filled with a refrigerant, the heat dissipation conduit is communicated with the inside of the heat dissipation base, and the refrigerant can flow in the heat dissipation conduit;
the plurality of radiating steel wires are arranged on the radiating guide pipe in parallel to form a radiating net.
Therefore, the heat dissipation base is in contact with the hot end of the semiconductor chip and performs heat exchange in a heat conduction mode, the refrigerant in the heat dissipation base absorbs heat and is gasified, the gaseous refrigerant ascends along the heat dissipation guide pipe to flow and dissipates heat through the plurality of heat dissipation steel wires, then the gaseous refrigerant is liquefied when meeting cold, the liquid refrigerant descends along the heat dissipation guide pipe to flow back into the heat dissipation base, and the circulation is performed so as to dissipate the heat of the hot end of the semiconductor chip.
Furthermore, the cold dissipation structure comprises a cold guide block and a cold dissipation plate connected with the cold guide block, and the cold guide block is attached to the refrigeration end faces of the semiconductor chips.
Further, a plurality of first through-holes have been seted up on the heat dissipation base, a plurality of first screw holes have been seted up on the cold guide block, wherein:
the heat insulation piece is arranged in the first through holes in a penetrating mode, and counter bores are formed in the heat insulation piece; the heat dissipation base and the cold guide block penetrate through the counter bores through screws and are in threaded connection in the first threaded holes so as to achieve fixed connection.
From this, through setting up the heat insulating part, can separate screw and heat dissipation base and lead to the heat transfer in order to avoid direct contact between the two to prevent that the heat dissipation base produced from transmitting to leading cold on the piece through the screw, and then guaranteed leading cold refrigeration effect of piece.
Further, the heat insulation piece is a plastic cap.
Furthermore, the heat insulation structure comprises a first foam board and a second foam board which are mutually abutted, the other end of the first foam board is abutted with the heat dissipation base, and the other end of the second foam board is abutted with the cold conduction block;
the first foam board is provided with a first avoidance groove for the boss to pass through, and the second foam board is provided with a second avoidance groove for the semiconductor chip to pass through;
first bubble cotton board with set up respectively on the second bubble cotton board and supply the screw to pass first dodge the hole and the second dodge the hole.
Further, semiconductor chip includes the chip body and connects the power cord of chip body, on the cotton board of first bubble with the terminal surface of the cotton board looks butt of second bubble and/or on the cotton board of second bubble with be equipped with the viscose layer on the terminal surface of the cotton board looks butt of first bubble, first bubble cotton board with the cotton board mutual butt of second bubble is passed through the viscose layer will the power cord is glued tightly sealedly.
Further, the first foam board and the second foam board are both EVA foam boards.
Furthermore, a plurality of second through holes are formed in the cold dissipation plate, a plurality of second threaded holes are formed in the cold guide block, and the cold dissipation plate and the cold guide block penetrate through the second through holes through screws and are in threaded connection with the second threaded holes to achieve fixed connection.
Additionally, the utility model also provides a refrigeration plant, including the cabinet body and above-mentioned semiconductor refrigerating system.
To sum up, the utility model provides a pair of semiconductor refrigerating system and have its refrigeration plant has following beneficial effect:
(1) The utility model discloses a semiconductor refrigerating system, through setting up the semiconductor chip that two intervals set up, not only increased the refrigeration capacity, and through separating the two semiconductor chips between the thermal-insulated structure to can avoid the mutual transmission of cold and hot volume between the two semiconductor chips, and then guarantee semiconductor chip's radiating effect and refrigeration effect.
(2) The utility model discloses a semiconductor refrigerating system, this heat dissipation base and semiconductor chip's hot junction contact and carry out the heat exchange through heat-conducting mode, the gasification of refrigerant heat absorption in this heat dissipation base, gaseous state refrigerant rises along the heat dissipation pipe and flows and dispel the heat through a plurality of heat dissipation steel wires, gaseous state refrigerant meets cold liquefaction afterwards, liquid refrigerant flows back to in the heat dissipation base along the heat dissipation pipe decline, so circulate in order to dispel the heat to semiconductor chip's hot junction.
(3) The utility model discloses a semiconductor refrigerating system, through setting up the heat insulating part, can separate screw and heat dissipation base and lead to the heat transfer in order to avoid direct contact between the two to the heat that prevents heat dissipation base production passes through the screw and transmits to leading cold piece on, and then has guaranteed the refrigeration effect of leading cold piece.
Drawings
Fig. 1 is an exploded view of the semiconductor refrigeration system of the present invention;
fig. 2 is a schematic structural view of a heat dissipation base in the semiconductor refrigeration system of the present invention;
FIG. 3 is a schematic view of the structure of FIG. 2 from another perspective;
fig. 4 is a schematic structural view of a cold-conducting block in the semiconductor refrigeration system of the present invention;
fig. 5 is a schematic structural view of a cold dissipation plate in the semiconductor refrigeration system of the present invention;
fig. 6 is a schematic structural view of a first foam board in the semiconductor refrigeration system of the present invention;
fig. 7 is a schematic structural view of a second foam board in the semiconductor refrigeration system of the present invention;
fig. 8 is a schematic structural view of a part of the semiconductor refrigeration system of the present invention;
FIG. 9 is a schematic cross-sectional view of FIG. 8;
FIG. 10 is another cross-sectional view of FIG. 8;
fig. 11 is a schematic structural diagram of the semiconductor refrigeration system of the present invention;
fig. 12 is a schematic structural diagram of the refrigeration equipment of the present invention;
fig. 13 is a schematic structural view of fig. 12 from another angle.
Wherein the reference numerals have the following meanings:
1. a semiconductor refrigeration unit; 11. a semiconductor chip; 111. a chip body; 112. a power line; 2. a heat dissipation structure; 21. a heat dissipation base; 211. a third through hole; 212. a first through hole; 213. a fourth via hole; 214. a boss; 22. a heat dissipation conduit; 23. a heat dissipating steel wire; 3. a cold dissipation structure; 31. a cold conducting block; 311. a first threaded hole; 312. a second threaded hole; 313. a groove; 32. a cold dispersing plate; 321. cooling fins; 3211. a rib is protruded; 322. a second through hole; 4. a thermally insulating structure; 41. a first foam board; 411. a first avoidance slot; 412. a first avoidance hole; 42. a second foam board; 421. a second avoidance slot; 422. a second avoidance hole; 5. a thermal insulation member; 6. a screw; 7. a cabinet body; 8. a door body; 9. and (4) isolating nets.
Detailed Description
For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the module or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example one
Referring to fig. 1-11, the utility model provides a semiconductor refrigeration system at first, including semiconductor refrigeration group 1, heat radiation structure 2 that links to each other with this semiconductor refrigeration group 1 hot junction, with the scattered cold structure 3 that this semiconductor refrigeration group 1 cold junction links to each other and set up heat-proof structure 4 between heat radiation structure 2 and scattered cold structure 3. The semiconductor refrigeration set 1 comprises two semiconductor chips 11 arranged at intervals; the heat dissipation structure 2 comprises a heat dissipation base 21, wherein one end face of the heat dissipation base 21 is provided with two bosses 214 which correspond to the two semiconductor chips 11 and are arranged at intervals, and the heating end faces of the two semiconductor chips 11 are respectively attached to the end faces of the two bosses 214; the heat insulating structure 4 separates the two semiconductor chips 11.
Therefore, the refrigerating capacity is increased by arranging the two semiconductor chips 11 which are arranged at intervals, and the two semiconductor chips 11 are separated from each other through the heat insulation structure 4, so that the mutual transmission of the cold and heat between the two semiconductor chips 11 can be avoided, and the heat dissipation effect and the refrigerating effect of the semiconductor chips 11 are further ensured.
Referring to fig. 1-3, specifically, the heat dissipation structure 2 further includes a heat dissipation pipe 22 and a plurality of heat dissipation steel wires 23 connected to the heat dissipation pipe 22, a cavity is disposed inside the heat dissipation base 21, a refrigerant is filled in the cavity, and the heat dissipation pipe 22 is communicated with the cavity inside the heat dissipation base 21 so that the refrigerant can flow in the heat dissipation pipe 22; a plurality of heat dissipating steel wires 23 are arranged in parallel on the heat dissipating pipe 22 to form a heat dissipating mesh. Furthermore, two third through holes 211 which are arranged at intervals and communicated with the cavity are formed in the other end face of the heat dissipation base 21, and pipe orifices at two ends of the heat dissipation pipe 22 are respectively fixed on the two third through holes 211, so that the heat dissipation pipe is communicated with the cavity of the heat dissipation base 21; the heat dissipation base 21 further has a fourth through hole 213 communicating with the cavity, and the refrigerant can be filled into the cavity through the fourth through hole 213.
Therefore, in the operation process of the semiconductor chip 11, the heat dissipation base 21 is in contact with the hot end of the semiconductor chip 11 and performs heat exchange in a heat conduction manner, the refrigerant in the heat dissipation base 21 absorbs heat and is gasified and enters through the third through hole 211 on the heat dissipation base 21, then the gaseous refrigerant rises along the heat dissipation pipe 22 and flows through the plurality of heat dissipation steel wires 23 to perform heat dissipation, then the gaseous refrigerant is liquefied when encountering cold, the liquid refrigerant descends along the heat dissipation pipe 22 and flows back and flows into the cavity through the other third through hole 211 on the heat dissipation base 21, and the cycle is repeated so as to perform heat dissipation on the hot end of the semiconductor chip 11. Preferably, the heat dissipation duct 22 is arranged in a spiral or winding manner, so that the movement stroke of the refrigerant in the heat dissipation duct 22 can be increased, the gaseous refrigerant is promoted to be liquefied when cooled, and the heat dissipation is further promoted; in addition, the heat dissipating steel wires 23 are in an inverted U shape and are uniformly spaced on the heat dissipating pipe 22 and contact with the heat dissipating pipe 22, so that heat exchange can be performed by means of heat conduction, and heat dissipation is further promoted.
Therefore, the semiconductor refrigeration system absorbs heat of the hot end of the semiconductor chip 11 through the heat absorption and gasification of the refrigerant in the heat dissipation base 21, and then transfers the heat to the heat dissipation steel wire 23 through the heat dissipation pipe 22 for heat dissipation, the whole heat dissipation process is zero in noise, and the application of various places with high requirements on noise can be met.
In this embodiment, the heat dissipation base 21 is an aluminum box, and the heat dissipation pipe 22 is a copper pipe; the refrigerant can be a refrigerant in the prior art, such as an environment-friendly refrigerant R600A or R134A.
Referring to fig. 4-5, in particular, the cooling structure 3 includes a cooling block 31 and a cooling plate 32 connected to the cooling block 31, where the cooling block 31 is attached to the cooling end surfaces of the semiconductor chips 11. Preferably, the front surface of the cold dissipation plate 32 is provided with a plurality of cold dissipation fins 321 arranged at intervals, and the cold dissipation fins 321 are provided with a plurality of convex ribs 3211, so that the cold dissipation area of the cold dissipation fins 321 can be increased, and the refrigeration effect is further promoted; the backside of the cold plate 32 is disposed in direct contact with the cold block 31 for heat transfer. Furthermore, a plurality of second through holes 322 are further formed in the middle of the cold dissipating plate 32, a plurality of second threaded holes 312 are correspondingly formed in the cold conducting block 31, and the cold dissipating plate 32 and the cold conducting block 31 pass through the second through holes 322 through screws 6 and are in threaded connection with each other in the second threaded holes 312 to achieve fixed connection.
In this embodiment, the cold conducting block 31 and the cold dissipating plate 32 are made of a material capable of conducting heat in the prior art, for example, the cold conducting block 31 is made of an aluminum block, and the cold dissipating plate 32 is made of an aluminum plate.
Therefore, after the cold energy generated at the cold end of the semiconductor chip 11 is transferred to the cold dissipation plate 32 through the cold conduction block 31, the cold dissipation plate 32 is in contact with the air through the plurality of cold dissipation fins 321 to perform heat exchange, thereby achieving the effect of refrigeration.
Referring to fig. 1-4, the heat dissipating base 21 further has a plurality of first through holes 212 and a plurality of heat insulating members 5 respectively inserted into the first through holes 212, the heat insulating members 5 have counter bores, and the cold guiding block 31 has a plurality of first threaded holes 311. Therefore, the heat dissipation base 21 and the cold guide block 31 can be fixedly connected by passing the screw 6 through the counter bore and screwing in the first threaded hole 311. Preferably, the thermal insulation member 5 may be a plastic cap of the prior art.
From this, through setting up heat insulating part 5, can separate screw 6 and heat dissipation base 21 in order to avoid direct contact between the two and lead to the heat transfer to prevent that the heat that heat dissipation base 21 produced from transmitting to the cold guide block 31 through screw 6 on, and then guaranteed the refrigeration effect of cold guide block 31.
In addition, when the heat sink base 21 and the cooling block 31 are fixedly connected by the screw 6, one side of the end surface of the cooling block 31 is easily tilted, and the cooling block 31 and the cooling end surface of one semiconductor chip 11 of the two semiconductor chips 11 are not adhered to each other. For this reason, this application is through seting up in the middle part of leading cold block 31 and be banding recess 313 to the terminal surface both sides that give cold block 31 provide certain deformation space, guaranteed to be connected the back through screw 6 when leading cold block 31 and heat dissipation base 21, should lead the terminal surface both sides homoenergetic of cold block 31 and closely laminate with the refrigeration terminal surface of two semiconductor chips 11, thereby guaranteed refrigeration effect.
Referring to fig. 6-7, specifically, the heat insulation structure includes a first foam board 41 and a second foam board 42 that are mutually abutted and have different thicknesses, the first foam board 41 has a larger thickness and has the other end abutted with the heat dissipation base 21, and the second foam board 42 has a smaller thickness and has the other end abutted with the cold conduction block 31. Further, the first foam board 41 is provided with two first avoiding grooves 411 which are arranged at intervals and through which the bosses 214 of the heat dissipation base 21 can pass, and the second foam board 42 is provided with second avoiding grooves 421 which are arranged at intervals and through which the semiconductor chip 11 can pass; in addition, the first foam board 41 and the second foam board 42 are respectively provided with a first avoiding hole 412 and a second avoiding hole 422 through which the screw 6 can pass. Preferably, the first foam board 41 and the second foam board 42 are both made of EVA foam board in the prior art.
Therefore, the first avoiding groove 411 for the boss 214 to pass through is formed in the first foam board 41, and the second avoiding groove 421 for the semiconductor chip 11 to pass through is formed in the second foam board 42, so that the gap between the two semiconductor chips 11 can be filled, the two semiconductor chips 11 can be completely separated, the mutual transmission of cold and heat between the two semiconductor chips 11 can be avoided, and the heat dissipation effect and the refrigeration effect of the semiconductor chips 11 can be further ensured.
Further, the semiconductor chip 11 includes a chip body 111 and a power line 112 connected to the chip body 111, an adhesive layer (not shown) is disposed on an end surface of the first foam board 41 abutting against the second foam board 42 and/or an end surface of the second foam board 42 abutting against the first foam board 41, the first foam board 41 and the second foam board 42 abut against each other and the power line 112 is compressed and sealed by the adhesive layer, so as to prevent cold air leakage.
Example two
Referring to fig. 12-13, in addition, the present invention further provides a refrigeration device, which includes a cabinet 7, a door 8 and the semiconductor refrigeration system of the first embodiment. Specifically, the cabinet 7 is provided with an inner cavity, and the door 8 is rotatably disposed at the front side of the cabinet 7 and can open or close the inner cavity. The semiconductor refrigeration group 1, the heat dissipation base 21 and the cold conduction block 31 in the semiconductor refrigeration system are all connected with the back plate of the cabinet body 7 in an embedded manner, and the cold dissipation plate 32 is arranged in the inner cavity of the cabinet body 7, and the back of the cold dissipation plate 32 is in contact with the cold conduction block 31; the heat dissipation pipe 22 is connected to the heat dissipation base 21, penetrates through the cabinet 7, is installed outside the cabinet 7, and is installed through a plurality of installation blocks (not shown in the figure). In addition, the cabinet also comprises a separation net 9 connected to the back of the cabinet body 7, and the separation net 9 can prevent people from touching the heat dissipation guide pipe 22 and the heat dissipation steel wire 23 by mistake, so that the use safety is improved.
Preferably, the refrigeration device may be a refrigerator or a refrigerated wine cabinet.
To sum up, the utility model provides a pair of semiconductor refrigerating system and have its refrigeration plant has following beneficial effect:
(one) the utility model discloses a semiconductor refrigerating system, through setting up the semiconductor chip 11 that two intervals set up, not only increased the refrigerating output, and separated between with two semiconductor chip 11 through thermal-insulated structure 4 to can avoid the mutual transmission of cold and hot volume between two semiconductor chip 11, and then guarantee semiconductor chip 11's radiating effect and refrigeration effect.
(two) the utility model discloses a semiconductor refrigerating system, at semiconductor chip 11's operation in-process, the gasification of the refrigerant heat absorption in this heat dissipation base 21, gaseous refrigerant rises along heat dissipation pipe 22 and flows and dispel the heat through a plurality of heat dissipation steel wires 23, and gaseous refrigerant meets cold liquefaction afterwards, and liquid refrigerant flows back to in the heat dissipation base 21 along heat dissipation pipe 22 decline, so circulate in order to dispel the heat to semiconductor chip 11's hot junction.
(III) the utility model discloses a semiconductor refrigerating system through setting up heat insulating part 5, can separate screw 6 and heat dissipation base 21 and lead to the heat transfer in order to avoid direct contact between the two to the heat that prevents heat dissipation base 21 and produce passes through screw 6 and transmits to leading cold piece 31 on, and then has guaranteed leading cold piece 31's refrigeration effect.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced modules or components must be in a particular orientation, constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In addition, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically limited otherwise.
The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that modifications and embellishments may be made by those skilled in the art without departing from the principles of the present invention and are considered within the scope of the invention.
Claims (10)
1. The semiconductor refrigeration system is characterized by comprising a semiconductor refrigeration group, a heat dissipation structure connected with the hot end of the semiconductor refrigeration group, a cold dissipation structure connected with the cold end of the semiconductor refrigeration group and a heat insulation structure arranged between the heat dissipation structure and the cold dissipation structure, wherein:
the semiconductor refrigeration group comprises two semiconductor chips which are arranged at intervals;
the heat dissipation structure comprises a heat dissipation base, wherein two bosses which correspond to the two semiconductor chips and are arranged at intervals are arranged on the heat dissipation base, and the heating end surfaces of the two semiconductor chips are respectively attached to the end surfaces of the two bosses;
the heat insulation structure separates the two semiconductor chips.
2. The semiconductor cooling system according to claim 1, wherein the heat dissipation structure further comprises a heat dissipation duct and a plurality of heat dissipation wires connecting the heat dissipation duct, wherein:
the inside of the heat dissipation base is filled with a refrigerant, the heat dissipation conduit is communicated with the inside of the heat dissipation base, and the refrigerant can flow in the heat dissipation conduit;
the plurality of radiating steel wires are arranged on the radiating guide pipe in parallel to form a radiating net.
3. The semiconductor refrigeration system according to claim 2, wherein the cold dissipation structure comprises a cold conduction block and a cold dissipation plate connected with the cold conduction block, and the cold conduction block is attached to the refrigeration end faces of the semiconductor chips.
4. The semiconductor refrigeration system according to claim 3, wherein the heat dissipation base is provided with a plurality of first through holes, and the cold guide block is provided with a plurality of first threaded holes, wherein:
the heat insulation piece is arranged in the first through holes in a penetrating mode, and counter bores are formed in the heat insulation piece; the heat dissipation base and the cold guide block penetrate through the counter bores through screws and are in threaded connection in the first threaded holes so as to achieve fixed connection.
5. The semiconductor refrigeration system of claim 4 wherein the thermal shield is a plastic cap.
6. The semiconductor refrigeration system according to claim 4, wherein the heat insulation structure comprises a first foam board and a second foam board which are abutted against each other, the other end of the first foam board is abutted against the heat dissipation base, and the other end of the second foam board is abutted against the cold conduction block;
the first foam board is provided with a first avoidance groove for the boss to pass through, and the second foam board is provided with a second avoidance groove for the semiconductor chip to pass through;
the first foam board and the second foam board are respectively provided with a first avoidance hole and a second avoidance hole, wherein the first avoidance hole and the second avoidance hole can be penetrated by screws.
7. The semiconductor refrigeration system according to claim 6, wherein the semiconductor chip comprises a chip body and a power line connected with the chip body, an adhesive layer is arranged on an end surface of the first foam board abutting against the second foam board and/or an end surface of the second foam board abutting against the first foam board, and the first foam board and the second foam board abut against each other and are sealed by adhering the power line through the adhesive layer.
8. The semiconductor refrigeration system according to claim 6 or 7, wherein the first foam board and the second foam board are both EVA foam boards.
9. The semiconductor refrigeration system according to claim 3, wherein the cold dissipation plate is provided with a plurality of second through holes, the cold guide block is provided with a plurality of second threaded holes, and the cold dissipation plate and the cold guide block are fixedly connected by passing through the second through holes through screws and being in threaded connection with the second threaded holes.
10. Refrigeration device, characterized in that it comprises a cabinet and a semiconductor refrigeration system according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222868086.2U CN218764058U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating system and refrigerating equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222868086.2U CN218764058U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating system and refrigerating equipment with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218764058U true CN218764058U (en) | 2023-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222868086.2U Active CN218764058U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating system and refrigerating equipment with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218764058U (en) |
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- 2022-10-28 CN CN202222868086.2U patent/CN218764058U/en active Active
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