CN209472944U - Electronic load radiator - Google Patents
Electronic load radiator Download PDFInfo
- Publication number
- CN209472944U CN209472944U CN201821985598.4U CN201821985598U CN209472944U CN 209472944 U CN209472944 U CN 209472944U CN 201821985598 U CN201821985598 U CN 201821985598U CN 209472944 U CN209472944 U CN 209472944U
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- heat
- heat pipe
- radiating substrate
- gear piece
- oxide
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Abstract
Electronic load radiator designed by the utility model, it includes fastening gear piece block, it is mounted on the first heat-radiating substrate and the second heat-radiating substrate for fastening gear piece block upper and lower ends, metal-oxide-semiconductor installation position is equipped on first heat-radiating substrate and the second heat-radiating substrate, it further includes that upper end strip flattens heat pipe and lower end strip flattening heat pipe, first heat-radiating substrate bottom surface opens up upper end heat pipe fitting groove along its length, second heat-radiating substrate top surface opens up lower end heat pipe fitting groove along its length, upper end strip flattens heat pipe and is located in the heat pipe fitting groove of upper end, lower end strip flattens heat pipe and is located in the heat pipe fitting groove of lower end, the top and bottom that upper end strip flattens heat pipe are bonded the first heat-radiating substrate respectively and fasten gear piece block, the top and bottom that lower end strip flattens heat pipe are bonded respectively fastens gear piece block and the second heat-radiating substrate.The utility model good heat dissipation effect, heat dissipating mass are small, heatsink mass is light, radiator is at low cost, and metal-oxide-semiconductor reliable long-term working is high, and power power density is high.
Description
Technical field
The utility model relates to electronic circuit technology fields, in particular to a kind of electronic load radiator.
Technical background
High-power electronic load main power consumption device is MOS (Metal Oxide Semiconductor, metal oxide
Semiconductor) pipe and its is large number of, calorific value is huge when work, if heat cannot be distributed in time, metal-oxide-semiconductor
Temperature can gradually rise, once temperature is more than the junction temperature of metal-oxide-semiconductor, metal-oxide-semiconductor will be burnt, so as to cause entire electronic load
It can not work normally.
The Chinese patent of Publication No. CN106558562A discloses a kind of high-power electronic load metal-oxide-semiconductor radiator,
High-power MOS tube is set on circuit board by the device, and circuit board is placed on radiator, and metal-oxide-semiconductor is contacted with heat-radiating substrate surface,
When the circuit is operating, the heat that metal-oxide-semiconductor distributes is distributed rapidly by radiator by fan, if larger in circuit power
When, the quantity of metal-oxide-semiconductor can be more, and the power loss of single metal-oxide-semiconductor can be bigger, according to this metal-oxide-semiconductor radiator structure,
The length that radiator and circuit board can only be increased to radiate to metal-oxide-semiconductor, does so the weight of the depth and radiator that will increase cabinet
Amount, while the effective rate of utilization of this radiator structure radiator is low, heat dissipation effect is bad, and power power density is lower.
Utility model content
The purpose of this utility model seeks to provide that a kind of good heat dissipation effect, heat dissipating mass is small, heatsink mass is light, heat dissipation
Device is at low cost, and metal-oxide-semiconductor reliable long-term working is high, the high electronic load radiator of power power density.
In order to achieve this, electronic load radiator designed by the utility model, it includes fastening gear piece block, is mounted on
The first heat-radiating substrate and the second heat-radiating substrate for fastening gear piece block upper and lower ends, on the first heat-radiating substrate and the second heat-radiating substrate
Equipped with metal-oxide-semiconductor installation position, it is characterised in that: it further includes that upper end strip flattens heat pipe and lower end strip flattening heat pipe, and first dissipates
Hot substrate bottom surface opens up upper end heat pipe fitting groove along its length, and the second heat-radiating substrate top surface opens up lower end heat pipe along its length
Fitting groove, upper end strip flatten heat pipe and are located in the heat pipe fitting groove of upper end, and lower end strip flattens heat pipe and is located at the assembly of lower end heat pipe
In slot, the top and bottom that upper end strip flattens heat pipe are bonded the first heat-radiating substrate respectively and fasten gear piece block, lower end strip pressure
The top and bottom of flat heat pipe are bonded respectively fastens gear piece block and the second heat-radiating substrate.
Described to fasten the multi-disc fastening gear piece that gear piece block includes superposition, each thickness for fastening gear piece is equal, and adjacent two
The spacing that piece fastens gear piece is equal.
Each thickness for fastening gear piece is equal and thickness range is 0.3~0.6mm.
The spacing of adjacent two panels fastening gear piece is equal and spacing range is 2~4mm.
The quantity for fastening the fastening gear piece for including in gear piece block is 14~22.
A kind of high-power electronic load radiator structure based on above-mentioned radiator, four electronic load radiators are side by side
It is fixed between the first fan fixed plate and the second fan fixed plate and forms load heat dissipation group, pacify side by side in the first fan fixed plate
Equipped with the first fan corresponding with four electronic load radiators, the second fan fixed plate has been mounted side by side and four electronic loads
Radiator corresponds to the second fan, which is set to the cabinet that volume is 2U (unit indicates server external dimensions)
It is interior.
The advantages of the utility model by above-mentioned design, has radiator small in size, good heat dissipation effect, in same 4U body
More heat spreader modules and metal-oxide-semiconductor can be placed using the utility model in product cabinet, use this practical new under same volume
Type can dissipate more heats, so that the long-term functional reliability of the metal-oxide-semiconductor in cabinet is significantly improved, in addition, comparing
Scheme the utility model of background technique can install more heat spreader modules and metal-oxide-semiconductor in same 4U volume cabinet,
And more heats can be dissipated with higher power density.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the configuration schematic diagram of the utility model；
Fig. 3 is the mounting structure schematic diagram that strip flattens heat pipe in the utility model；
Fig. 4 is that the structural schematic diagram in 2U cabinet is arranged in load heat dissipation group in the utility model；
Fig. 5 is that the structural schematic diagram in 4U cabinet is arranged in load heat dissipation group in the utility model；
Wherein, the 1-the first heat-radiating substrate, the 1.1-the second heat-radiating substrate, 2-upper end strips flatten heat pipe, 2.1-lower ends
Strip flattens heat pipe, 2.2-condensation ends, 2.3-evaporation ends, 3-fastening gear piece blocks, 3.1-fastening gear pieces, 4-load heat dissipations
Group, 5-metal-oxide-semiconductors, 6-MOS pipe press strips, 7-circuit boards, the 8-the first fan, the 8.1-the second fan, 9-insulating heat-conductive pads,
10-the first fan fixed plate, the 11-the second fan fixed plate, 12-metal-oxide-semiconductor installation positions, 13-metal-oxide-semiconductor pin welding holes,
14-upper end heat pipe fitting grooves, 15-lower end heat pipe fitting grooves.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
The utility model relates to a kind of electronic load radiator, as shown in Figures 1 to 3, it include fasten gear piece block 3, peace
Mounted in the first heat-radiating substrate 1 and the second heat-radiating substrate 1.1 for fastening 3 upper and lower ends of gear piece block, the first heat-radiating substrate 1 and second dissipates
Metal-oxide-semiconductor installation position 12 (for installing the tube body of metal-oxide-semiconductor 5) is equipped on hot substrate 1.1, it further includes that upper end strip flattens heat
Pipe 2 and lower end strip flatten heat pipe 2.1, and 1 bottom surface of the first heat-radiating substrate opens up upper end heat pipe dress along 3 length direction of gear piece block is fastened
Slot allocation 14 (welding groove), 1.1 top surface of the second heat-radiating substrate open up lower end heat pipe fitting groove 15 along 3 length direction of gear piece block is fastened,
Upper end strip flattens heat pipe 2 and is located in upper end heat pipe fitting groove 14, and lower end strip flattens heat pipe 2.1 and is located at lower end heat pipe fitting groove
In 15, the top and bottom that upper end strip flattens heat pipe 2 are bonded the first heat-radiating substrate 1 respectively and fasten gear piece block 3, lower end strip
The top and bottom for flattening heat pipe 2.1 are bonded respectively fastens gear piece block 3 and the second heat-radiating substrate 1.1.Above-mentioned upper end strip flattens
The design that heat pipe 2 and lower end strip flatten heat pipe 2.1 advantageously reduces the volume of electronic load radiator.Hot biography is utilized in heat pipe
The quick thermal transport property of principle and refrigerant is led, the heat of thermal objects can be transmitted to outside heat source rapidly.
In above-mentioned technical proposal, upper end strip flattens heat pipe 2 and lower end strip flattening heat pipe 2.1 can be cracking by metal-oxide-semiconductor
5 heat carries out bulk temperature that is balanced, and cooperating metal-oxide-semiconductor 5 on the quick reduction heat-radiating substrate of fastening gear piece block 3.
It is described to fasten the multi-disc fastening gear piece 3.1 that gear piece block 3 includes superposition, each fastening gear piece in above-mentioned technical proposal
3.1 thickness is equal, and the spacing that adjacent two panels fastens gear piece 3.1 is equal.Above-mentioned fastening gear piece block 3 is to fasten gear piece by multi-disc
3.1 are fastened by respective button point or so superposition.
In above-mentioned technical proposal, each thickness for fastening gear piece 3.1 is equal and thickness range is 0.3~0.6mm.
The spacing of adjacent two panels fastening gear piece 3.1 is equal and spacing range is 2~4mm.It is described to fasten the fastening for including in gear piece block 3
The quantity of gear piece 3.1 is 14~22.The design of above-mentioned parameter can reduction under the premise of guaranteeing heat dissipation effect as far as possible it is single
The volume of electronic load radiator.
In above-mentioned technical proposal, the upper end strip flattens heat pipe 2 and lower end strip flattens the condensation end 2.2 of heat pipe 2.1
It is respectively positioned on the front end for fastening gear piece block 3, upper end strip flattens heat pipe 2 and lower end strip flattens the evaporation ends 2.3 of heat pipe 2.1
Positioned at the rear end for fastening gear piece block 3；The left and right sides of first heat-radiating substrate, 1 bottom surface opens up upper end heat pipe dress along its length
Slot allocation 14 is respectively provided with upper end strip in each upper end heat pipe fitting groove 14 and flattens heat pipe 2, a left side for 1.1 top surface of the second heat-radiating substrate
Right two sides open up lower end heat pipe fitting groove 15 along its length, and strip flattening in lower end is respectively provided in each lower end heat pipe fitting groove 15
Heat pipe 2.1.
In above-mentioned technical proposal, it further includes circuit board 7 and insulating heat-conductive pad 9, fastens and is respectively mounted at left and right sides of gear piece block 3
Circuit board 7, circuit board 7 are equipped with metal-oxide-semiconductor pin welding hole 13 (for realizing respective devices in the pin and circuit board 7 of metal-oxide-semiconductor 5
Electrical connection), insulating heat-conductive is set between each metal-oxide-semiconductor installation position 12 and corresponding metal-oxide-semiconductor 5 of first heat-radiating substrate 1
Insulating heat-conductive pad 9 is arranged in pad 9 between each metal-oxide-semiconductor installation position 12 and corresponding metal-oxide-semiconductor 5 of second heat-radiating substrate 1.1, adjacent
Two metal-oxide-semiconductors 5 the correspondence metal-oxide-semiconductor peace of the first heat-radiating substrate 1 or the second heat-radiating substrate 1.1 is fixed on by metal-oxide-semiconductor press strip 6
It fills on position 12, in the pin access corresponding metal-oxide-semiconductor pin welding hole 13 of circuit board 7 of each metal-oxide-semiconductor 5.9 energy of insulating heat-conductive pad
The radiating rate for further speeding up metal-oxide-semiconductor 5 improves the radiating efficiency of the utility model.Metal-oxide-semiconductor 5 is adjacent two-by-two, passes through metal-oxide-semiconductor
Press strip 6 is fixed, such insulating heat-conductive pad 9 there is no need to open up via hole install metal-oxide-semiconductor 5 (5 bottom of Mos pipe is charged metal,
If opening up installation via hole on insulating heat-conductive pad 9, the distance of metal to radiator that Mos pipe 5 charges is nearest, the work of metal-oxide-semiconductor 5
It is easy to pass on radiator by via hole as voltage) so that the utility model adapts to higher 5 operating voltage of Mos pipe, and
Improve safety.
A kind of high-power electronic load radiator structure based on above-mentioned radiator, four electronic load radiators are side by side
It is fixed between the first fan fixed plate 10 and the second fan fixed plate 11 and forms load heat dissipation group 4, the first fan fixed plate 10
On the first fan 8 corresponding with four electronic load radiator rear ends has been mounted side by side, the second fan fixed plate 11 is mounted side by side
There is the second fan 8.1 corresponding with four electronic load radiator front ends, which is set to the cabinet that volume is 2U
It is interior, as shown in Figure 4.The heat dissipation wind channel that first fan 8, the second fan 8.1 are formed around load heat dissipation group 4 is more conducive to
5 heat of metal-oxide-semiconductor sheds.
In above-mentioned technical proposal, the front end of each circuit board 7 is fixedly connected with first in four electronic load radiators
Fan fixed plate 10, the rear end of each circuit board 7 are fixedly connected with the second fan fixed plate 11.
In above-mentioned technical proposal, described in two groups load heat dissipation group 4 be superposed in volume be 4U cabinet in, such as Fig. 5 institute
Show.Same 4U volume lower case placed more heat spreader modules, and same 4U volume lower case placed more MOS
Pipe 5, can dissipate more heats, and under same power condition, the heat on single metal-oxide-semiconductor 5 is smaller, and temperature is lower, causes
The long-term functional reliability of metal-oxide-semiconductor 5 is higher.
The scheme introduced in background technique be that 3 big heat spreader modules, Mei Ge great can be set in a 4U cabinet
Heat spreader module on 40 metal-oxide-semiconductors are installed, 120 metal-oxide-semiconductors, each big heat spreader module can dissipate 2KW's altogether
Heat can dissipate altogether the heat of 6kw.After the embodiment of the utility model, in same size inside a 4U cabinet
Under can place 8 above-mentioned electronic load radiators, 24 metal-oxide-semiconductors can be set in each electronic load radiator, 192 altogether
Metal-oxide-semiconductor, each electronic load radiator can dissipate the heat of 1KW, can dissipate the heat of 8KW in total, therefore this is practical new
Type has higher power density.
The content that this specification is not described in detail belongs to the prior art well known to professional and technical personnel in the field.
Claims (10)
1. a kind of electronic load radiator, it includes fastening gear piece block (3), is mounted on and fastens the of gear piece block (3) upper and lower ends
It is equipped on one heat-radiating substrate (1) and the second heat-radiating substrate (1.1), the first heat-radiating substrate (1) and the second heat-radiating substrate (1.1)
Metal-oxide-semiconductor installation position (12), it is characterised in that: it further includes that upper end strip flattens heat pipe (2) and lower end strip flattening heat pipe
(2.1), the first heat-radiating substrate (1) bottom surface opens up upper end heat pipe fitting groove (14), the second heat-radiating substrate (1.1) top along its length
Face opens up lower end heat pipe fitting groove (15) along its length, and upper end strip flattens heat pipe (2) and is located at upper end heat pipe fitting groove (14)
In, lower end strip flatten heat pipe (2.1) be located in lower end heat pipe fitting groove (15), upper end strip flatten heat pipe (2) top surface with
Bottom surface is bonded the first heat-radiating substrate (1) respectively and fastens gear piece block (3), and lower end strip flattens the top and bottom of heat pipe (2.1)
Fitting fastens gear piece block (3) and the second heat-radiating substrate (1.1) respectively.
2. electronic load radiator according to claim 1, it is characterised in that: the fastening gear piece block (3) includes superposition
Multi-disc fasten gear piece (3.1), each thickness for fastening gear piece (3.1) is equal, and adjacent two panels fastens the spacing of gear piece (3.1)
It is equal.
3. electronic load radiator according to claim 2, it is characterised in that: each thickness for fastening gear piece (3.1)
Degree is equal and thickness range is 0.3~0.6mm.
4. electronic load radiator according to claim 2, it is characterised in that: adjacent two panels fastens between gear piece (3.1)
It is 2~4mm away from equal and spacing range.
5. electronic load radiator according to claim 2, it is characterised in that: include in the fastening gear piece block (3)
The quantity for fastening gear piece (3.1) is 14~22.
6. electronic load radiator according to claim 1, it is characterised in that: the upper end strip flatten heat pipe (2) and
The condensation end (2.2) that lower end strip flattens heat pipe (2.1) is respectively positioned on the front end for fastening gear piece block (3), and upper end strip flattens heat pipe
(2) and the evaporation ends (2.3) of lower end strip flattening heat pipe (2.1) are respectively positioned on the rear end for fastening gear piece block (3)；First heat dissipation
The left and right sides of substrate (1) bottom surface opens up upper end heat pipe fitting groove (14), each upper end heat pipe fitting groove (14) along its length
It is inside respectively provided with upper end strip and flattens heat pipe (2), the left and right sides of the second heat-radiating substrate (1.1) top surface opens up lower end along its length
Heat pipe fitting groove (15), the interior lower end strip that is respectively provided with of each lower end heat pipe fitting groove (15) flatten heat pipe (2.1).
7. electronic load radiator according to claim 1, it is characterised in that: it further includes that circuit board (7) and insulation are led
Heat pad (9) is fastened and is respectively mounted circuit board (7) at left and right sides of gear piece block (3), and circuit board (7) is equipped with metal-oxide-semiconductor pin welding hole
(13), insulating heat-conductive is set between each metal-oxide-semiconductor installation position (12) and corresponding metal-oxide-semiconductor (5) of first heat-radiating substrate (1)
It pads (9), insulating heat-conductive is set between each metal-oxide-semiconductor installation position (12) and corresponding metal-oxide-semiconductor (5) of the second heat-radiating substrate (1.1)
It pads (9), two adjacent metal-oxide-semiconductors (5) are fixed on the first heat-radiating substrate (1) or the second heat-radiating substrate by metal-oxide-semiconductor press strip (6)
(1.1) on correspondence metal-oxide-semiconductor installation position (12), the corresponding metal-oxide-semiconductor pin weldering of pin access circuit board (7) of each metal-oxide-semiconductor (5)
It connects in hole (13).
8. a kind of high-power electronic load radiator structure based on radiator described in claim 7, it is characterised in that: described in four
Electronic load radiator is fixed between the first fan fixed plate (10) and the second fan fixed plate (11) to be formed to load side by side to be dissipated
Hot group (4), the first fan (8) corresponding with four electronic load radiators has been mounted side by side in the first fan fixed plate (10),
The second fan (8.1) corresponding with four electronic load radiators, load heat dissipation has been mounted side by side in second fan fixed plate (11)
Group (4) is set in the cabinet that volume is 2U.
9. high-power electronic load radiator structure according to claim 8, it is characterised in that: four electronic loads dissipate
The front end of each circuit board (7) is fixedly connected with the first fan fixed plate (10) in hot device, and the rear end of each circuit board (7) is fixed to be connected
Connect the second fan fixed plate (11).
10. high-power electronic load radiator structure according to claim 8, it is characterised in that: load heat dissipation described in two groups
Group (4) is superposed in the cabinet that volume is 4U.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821985598.4U CN209472944U (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821985598.4U CN209472944U (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209472944U true CN209472944U (en) | 2019-10-08 |
Family
ID=68088701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821985598.4U Active CN209472944U (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209472944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413956A (en) * | 2018-11-29 | 2019-03-01 | 武汉精能电子技术有限公司 | Electronic load radiator |
-
2018
- 2018-11-29 CN CN201821985598.4U patent/CN209472944U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413956A (en) * | 2018-11-29 | 2019-03-01 | 武汉精能电子技术有限公司 | Electronic load radiator |
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