CN202585391U - Liquid-cooling heat dispassion system - Google Patents
Liquid-cooling heat dispassion system Download PDFInfo
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- CN202585391U CN202585391U CN 201220123455 CN201220123455U CN202585391U CN 202585391 U CN202585391 U CN 202585391U CN 201220123455 CN201220123455 CN 201220123455 CN 201220123455 U CN201220123455 U CN 201220123455U CN 202585391 U CN202585391 U CN 202585391U
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Abstract
The utility model discloses a liquid-cooling heat dispassion system. An electronic device on which the system is located has at least one heat source, such as a central processing unit (CPU) of computer, a video graphic array (VGA) chip or a light emitting diode (LED) chip and the like. The liquid-cooling heat dispassion system comprises a heat absorption device, a heat dispassion device and a pipeline device, wherein the heat absorption device is capable of collecting heat energy from the heat source by using metal characteristics, storing the heat energy in the liquid of an inner cavity and transferring the liquid through a built-in power system; the heat dispassion device is used for receiving the liquid with heat energy transferred by the heat absorption device and carrying out heat exchange between the heat energy in the liquid and the low-temperature air on the surface through the structure of the heat dispassion device, so as to reduce the temperature of the liquid and complete the dispassion effect; and the pipeline device is used for liquid flow, so as to connect the heat absorption device with the heat dispassion device to form a circulation loop. The heat absorption device further comprises a main metal cavity, a heat absorption bottom block, and an inlet and an outlet which are arranged at the sides of the main cavity. The heat absorption bottom block is welded with the main metal cavity in a sealing manner; and a sealing ring is clamped at the inner side of a welding face between the heat absorption bottom block and the main metal cavity.
Description
Technical field
The utility model relates to the electronic equipment dissipating heat system, specifically, is the heat radiation cooling system that is used in electronic products such as computer.
Background technology
Current electronic device such as computer are in running, and chip elements such as CPU, GPU can produce the extra heat radiation servicing unit of huge caloric requirement it is distributed or shifts, and can be operated in the admissible temperature range to guarantee this electronic product.
At present this auxiliary radiating device has polytype, like air-cooled radiator, and liquid cooling heat radiator, semiconductor refrigerating and other type of cooling, semiconductor refrigerating is used in minority's product because of cost and technology, and air-cooled is the most common mode.Air-cooled radiator mainly is fan to be installed driving air-flow on the metal fin, through with the fin heat exchange, cool off thereby need the equipment of heat radiation to lower the temperature.Increasingly high based on following electronic equipment integrated level, electronic chip unit's density of heat flow rate is increasing, and simple dependence strengthens distinguished and admirable and area of dissipation exists certain technical bottleneck and restriction.So in performance, the agree cooling scheme of balance of technology and economic performance is able to popularization in electronic device field to liquid cooling heat radiator as a kind of, the market acceptance improves fast.Patent CN101228495A has just provided a kind of computer cooling system; It has adopted the technology of liquid cooling heat radiator; A kind of fluid storage compartment with storage cooling fluid promptly is provided; Heat exchange interface, cooling fluid are assembled and are transmitted by computer processor and be dissipated to the heat of cooling fluid through heat exchange interface, and pumping installations is used for keeping liquid between fluid storage compartment and heat abstractor, to circulate; But its fluid storage compartment complex structure, the storage liquid time has been grown easy leakage to computer processor, the danger that causes computer to damage, and also the heat-conductive characteristic of heat exchange interface is also good inadequately, and radiating effect is good inadequately, and the manufacturing cost of entire product is high.
The utility model content
This practicality patent is exactly better in radiating effect together to the existing various radiating mode advantages of combination of the shortcoming proposition of above prior art products; The cooling system of a kind of electronic product that manufacturing cost is lower relatively; Specifically provide a kind of liquid cooling heat radiation system, the electronic equipment that this product is directed against has at least one thermal source, like the CPU of computer; VGA chip or emitting led chip etc., this cooling system comprises:
Heat sink: utilize metallic character to collect heat energy and be stored in the liquid of inner chamber, liquid transfer is gone out through built-in power set from thermal source;
Heat abstractor: receive the liquid of the tool heat energy of heat sink transmission, the heat energy in the liquid and the Cryogenic air on surface are done heat exchange,, accomplish the effect of dispelling the heat to reduce the temperature of liquid through self structure;
Plumbing installation: be used for liquid flow,, make it form circulation circuit to connect heat sink and heat abstractor;
Described heat sink also comprises the master metal cavity, sole piece and be arranged on the import and the outlet of main cavity side absorbs heat.
Said heat absorption sole piece and the seal weld of master metal cavity are connected together, and the solder side inboard between said heat absorption sole piece and the master metal cavity accompanies sealing ring.
Described plumbing installation is metal, plastic cement or elastomeric material.
Said master metal cavity is one-body molded by Forging Technology with the heat absorption sole piece, and promptly the master metal cavity is end sealing with the heat absorption sole piece, the counterbore type of an end opening.
Described master metal cavity is end sealing, the counterbore type of an end opening, and welding of said master metal cavity inner chamber bottom surface or locking have heat-absorbing block.
Described metallic cavity is provided with at least one auxiliary wind-cooling heat dissipating device, thereby forms the product with liquid cooling and air-cooled double heat dissipation.
Described metallic cavity is outside equipped with at least one auxiliary conductor refrigeration sheet device, thereby forms the product of the double heat dissipation with liquid cooling, conductor refrigeration.
Described master metal cavity is outside equipped with at least one auxiliary conductor refrigeration sheet device, the wind-cooling heat dissipating device that at least one is auxiliary, thereby form have liquid cooling, the product of triple heat dissipations of air-cooled and conductor refrigeration.
The heat abstractor of aforesaid a kind of liquid cooling heat radiation system; Described heat abstractor; Comprise at least one metal heat-conducting pipe, at least one group of metal fins and at least one fluid storage compartment and supporting seal and accessory, said accessory comprises support, is placed on; Said fluid storage compartment is provided with import and outlet, is connected with the metal heat-conducting pipe; Metal heat-conducting pipe and metal fins are formed integrative-structure spare through the tin cream solder reflow process, pass to metal fins by the liquid heat energy in the metal heat-conducting pipe, thereby metal fins is through forming heat abstractor with extraneous air heat exchange cooling.
The heat abstractor of aforesaid a kind of liquid cooling heat radiation system, described heat abstractor comprises at least one flat metal tube; At least one group fastens technology by punching press and processes the metal fins group; Form with at least one fluid storage compartment and support, fluid storage compartment has import and outlet, can be connected with plumbing installation.Flat metal tube and fin are formed integrative-structure spare through soldering processes, pass to fin by the liquid heat energy in the flat metal tube, thereby fin is through forming heat abstractor with extraneous air heat exchange cooling.
The purpose of the utility model is to provide the cooling heat radiator of a kind of economy, low manufacturing cost that operability is high; Come to substitute the air-cooled radiator that can't satisfy the growing heat loss solution of electronic equipment such as computer or the mode of other single heat radiations, and can in the narrow and small even airtight device space, accomplish heat transmission and dissipation.Simultaneously, product component of the present invention is simplified, and assembly technology is simple, security reliability high (especially to the leak of liquid risk), and later maintenance cost is extremely low, installs and uses fast and convenient.Appearance tactile impression is high-grade, meets current electronic product fashion-orientation trend.
Description of drawings
Fig. 1 is the overall diagram of the utility model product.
Fig. 2 is the utility model product dismounting figure.
Fig. 3 is the utility model product heat sink front explosive view.
Fig. 4 is the utility model product heat sink reverse side explosive view.
Fig. 5 is the utility model heat sink forging and pressing integrated formed structure figure.
Fig. 6 is the utility model heat sink counterbore type structure chart.
This utility model of Fig. 7 heat abstractor new departure one structure chart.
The part dismounting figure of this utility model of Fig. 8 heat abstractor new departure one.
Fig. 9 is the utility model heat abstractor new departure two structure charts.
Figure 10 is the utility model heat abstractor new departure two structure dismounting figure.
Figure 11 is the utility model heat abstractor reflow soldering process explosive view.
Figure 12 is the utility model heat abstractor reflow soldering process partial view.
Figure 13 is the utility model heat abstractor soldering processes scheme one explosive view.
Figure 14 is the utility model heat abstractor soldering processes scheme two explosive views.
Embodiment
Like Fig. 1 is the overall diagram of the utility model product; The utility model provides a kind of cooling system that is used for electronic equipment, and this electronic equipment has at least one thermal source, like the CPU of computer; VGA chip or emitting led chip etc.; The cooling system of this programme comprises: heat sink 4, and utilize metallic character to collect heat energy and be stored in the liquid of inner chamber from thermal source, through built-in power set liquid transfer is gone out; Heat abstractor 1, the liquid of the tool heat energy that the reception heat sink transmits is done heat exchange through self structure with the heat energy in the liquid and the Cryogenic air on surface, to reduce the temperature of liquid, the effect of completion heat radiation; Plumbing installation 3 is used for liquid flow, to connect heat sink 4 and heat abstractor 1, makes it form circulation circuit; Like Fig. 2 is the utility model product dismounting figure, and heat sink 4 all is provided with import and outlet with heat abstractor 1, connects through plumbing installation 3, and described plumbing installation can be metal, plastic cement or elastomeric material.The radiating fin group arranged outside of heat abstractor 1 has fan 2, connects the import of heat abstractor 1 and heat sink 4 and the plumbing installation 3 of outlet and passes through pipe clamp 5 fixed interfaces, and heat sink 4 is through installing the thermal source face that fastener 6 is fixed on electronic product, closely contact.
Like Fig. 3 is the front explosive view of the utility model product heat sink 4, is followed successively by master metal cavity 7, sealing ring 8 and heat absorption sole piece 9 from top to bottom; Fig. 4 is the reverse side explosive view of the utility model product heat sink 4; Be followed successively by heat absorption sole piece 9, sealing ring 8 and master metal cavity 7; Heat absorption sole piece 9 and the contact-making surface between the master metal cavity 7 in Fig. 3 and Fig. 4 are solder side 10; Be provided with sealing ring in two solders side, 10 inboards, be used for sealing, prevent leak of liquid.
Like Fig. 5 is the utility model heat sink 4 forging and pressing integrated formed structure figure, and in this programme, the master metal cavity 7 of heat sink 4 is integrated through Forging Technology with heat absorption sole piece 9, and master metal cavity 7 inside bottom are provided with integrated heat-absorbing block 11.
Fig. 6 is the utility model heat sink 4 counterbore type structure charts, and in the present embodiment, master metal cavity 7 also is one-body molded counterbore type with heat absorption sole piece 9, i.e. upper opening, bottom lock, absorb heat fast 11 through bottom surface 12 welding or locking in master metal cavity bottom bottom surface.
Fig. 7 is the utility model heat abstractor new departure one structure chart; This programme is to be outside equipped with at least one auxiliary wind-cooling heat dissipating device at described heat sink 4; Thereby form the product with liquid cooling and air-cooled double heat dissipation, plumbing installation 3 connects the interior liquid of cavity of heat sink 4 and heat abstractor 1, and the power set that are provided with in the heat sink 4 are pump; Keep liquid in cavity, to circulate, heat abstractor 1 is outside equipped with fan 2 and is used for wind-cooling heat dissipating; The side of the master metal cavity 7 of heat sink 4 also is provided with the extension block 15 of heat-absorbent surface; On extension block 15, closely weld or lock metal heat-conducting pipe 17 is arranged; Adopt welding fixing in the present embodiment; Metal heat-conducting pipe 17 is applied on the metal fins 13, and metal fins 13 assemblies are provided with fan 2, the cold heat radiation of the laggard sector-style of switching on.
Like Fig. 8; Part dismounting figure for the utility model heat abstractor new departure one; Inboard at the extension block 15 of heat sink 4 is provided with solder side, and the extension lateral surface of metal heat-conducting pipe 17 is a solder side 32, and solder side 32 is close to the medial surface of extension block 15 and is welded together; Metal heat-conducting pipe 17 is on metal fins 13, and metal fins 13 assemblies are provided with fan 2.
Like Fig. 9 is the utility model heat abstractor new departure two structure charts, in this programme, on the extension block heat sink 4, is connected with outside metal heat-conducting pipe 17 and the metal fins 13, also is provided with the semiconductor refrigeration radiating device.Like Figure 10 is the utility model heat abstractor new departure two structure dismounting figure; Extension block 15 is provided with screw; Semiconductor chilling plate 14 cold junctions are close to extension block 15, and semiconductor chilling plate is fixed with screw, metal fins 13 and metal heat-conducting pipe 17 form air-cooled heat dissipation structure and be fixed on the extension block 15; Metal heat-conducting pipe 17 is close to semiconductor chilling plate 14 hot junctions, and metal fins 13 assemblies are provided with fan 2.
Figure 11 is the utility model heat abstractor reflow soldering process explosive view, and the heat abstractor of present embodiment is by the fluid storage compartment 23 that is positioned at the bottom, metal fins 16, be positioned at metal fins 16 both sides support 19, be positioned at the lid 18 on metal fins 16 tops; Fluid storage compartment 23 sides are provided with imports and exports 22; The side also is provided with side cover 21 simultaneously, and two holes of side cover are passed in import and export 22, and fluid storage compartment 23 upper ends are connected with the metal copper pipe 17 that passes metal fins 16; Through seal 20 sealings, the support 19 at two ends is fixed on 16 groups of both sides of metal fins.
Figure 12 is the utility model heat abstractor reflow soldering process partial view; It is the assembly drawing of the metal fins group 16 of Figure 12; All be up and down metal fins 16, the relative face of metal fins 16 is provided with the groove of weld metal heat pipe 17, and metal fins 16 snaps together up and down.
Figure 13 is the utility model heat abstractor soldering processes scheme one explosive view; Fins group 24 among Figure 13 all is to adopt punching press to fasten technology to process with fins group 25; Flat metal tube 30 both sides in centre position are respectively arranged with hydroecium 29 and hydroecium 28; Both sides have fastened support 26 and support 27 respectively, and hydroecium 28 is provided with import and outlet.
Figure 14 is the utility model heat abstractor soldering processes scheme two explosive view explosive views; Fins group 31 among Figure 14 is to adopt punching press to fasten technology to process; Flat metal tube 30 both sides in centre position are respectively arranged with hydroecium 29 and hydroecium 28; Both sides have fastened support 26 and support 27 respectively, and hydroecium 28 is provided with import and outlet.
The product of the utility model is except adopting the heat sink of metal material; Say so more specifically and adopt copper or aluminium material, when master metal cavity 7 was arranged with the heat absorption sole piece in 9 minutes, adopt the welding procedure welded seal fixing together; The risk of having avoided cooling fluid to leak; Give a kind of heat sink of moulding together simultaneously, be close to the heat absorption bottom surface this moment in the inside of heat sink and be provided with heat absorption soon, endothermic effect is better; Give the scheme that combines wind-cooling heat dissipating, semiconductor refrigeration radiating simultaneously; Improved radiating effect, satisfied the electronic product that higher heat radiation requires, the utility model scheme is to provide a kind of economy, cooling heat radiator that operability is high; Come to substitute the air-cooled radiator that can't satisfy the growing heat loss solution of electronic equipment such as computer, and can in the narrow and small even airtight device space, accomplish heat transmission and dissipation.Simultaneously, product component of the present invention is simplified, and assembly technology is simple, security reliability high (especially to the leak of liquid risk), and later maintenance cost is extremely low, installs and uses fast and convenient.Appearance tactile impression is high-grade, meet current electronic product fashion-orientation trend, and the heat-conductive characteristic of heat exchange interface is also fine, good heat dissipation effect, and efficient is high, and the relative existing product of the manufacturing cost of entire product is lower.
Claims (10)
1. liquid cooling heat radiation system, this electronic equipment has at least one thermal source, and said thermal source is CPU or the VGA chip or the emitting led chip of computer, and this cooling system comprises:
Heat sink: utilize metallic character to collect heat energy and be stored in the liquid of inner chamber, liquid transfer is gone out through built-in power set from thermal source,
Heat abstractor: receive the liquid of the tool heat energy of heat sink transmission, the heat energy in the liquid and the Cryogenic air on surface are done heat exchange through self structure,
Plumbing installation: be used for liquid flow,, make it form circulation circuit to connect heat sink and heat abstractor,
It is characterized in that: described heat sink also comprises the master metal cavity, sole piece and be arranged on the import and the outlet of main cavity side absorbs heat.
2. a kind of liquid cooling heat radiation system according to claim 1 is characterized in that said heat absorption sole piece and the seal weld of master metal cavity are connected together, and the solder side inboard between said heat absorption sole piece and the master metal cavity accompanies sealing ring.
3. according to right 1 said a kind of liquid cooling heat radiation system, it is characterized in that described pipeline is metal, plastic cement or elastomeric material.
4. a kind of liquid cooling heat radiation system according to claim 1 is characterized in that said master metal cavity is one-body molded by Forging Technology with the heat absorption sole piece, and promptly the master metal cavity is end sealing with the heat absorption sole piece, the counterbore type of an end opening.
5. according to right 1 described a kind of liquid cooling heat radiation system, it is characterized in that described master metal cavity is end sealing, the counterbore type of an end opening, welding of said master metal cavity inner chamber bottom surface or locking have heat-absorbing block.
6. according to the described a kind of liquid cooling heat radiation system of one of claim 1 to 5, it is characterized in that being provided with at least one auxiliary wind-cooling heat dissipating device in described metallic cavity.
7. according to the described a kind of liquid cooling heat radiation system of one of claim 1 to 5, it is characterized in that being outside equipped with at least one auxiliary conductor refrigeration sheet device in described metallic cavity.
8. a kind of liquid cooling heat radiation system according to claim 6 is characterized in that being outside equipped with at least one auxiliary conductor refrigeration sheet device at described master metal cavity.
9. the heat abstractor of a kind of liquid cooling heat radiation system according to claim 1; Comprise at least one metal heat-conducting pipe; At least one group of metal fins and at least one fluid storage compartment and supporting seal and accessory; Said accessory comprises support, lid, and said fluid storage compartment is provided with import and outlet, is connected with the metal heat-conducting pipe; Metal heat-conducting pipe and metal fins are formed integrative-structure spare through the tin cream solder reflow process, pass to metal fins by the liquid heat energy in the metal heat-conducting pipe, thereby metal fins is through forming heat abstractor with extraneous air heat exchange cooling.
10. the heat abstractor of a kind of liquid cooling heat radiation system according to claim 1 comprises at least one flat metal tube, and at least one group fastens technology by punching press and process the metal fins group; Form with at least one fluid storage compartment and support; Fluid storage compartment has into and exports, and can be connected with plumbing installation, and flat metal tube and fin are formed integrative-structure spare through soldering processes; Liquid heat energy by in the flat metal tube passes to fin, thereby fin is through forming heat abstractor with extraneous air heat exchange cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220123455 CN202585391U (en) | 2012-03-28 | 2012-03-28 | Liquid-cooling heat dispassion system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220123455 CN202585391U (en) | 2012-03-28 | 2012-03-28 | Liquid-cooling heat dispassion system |
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| CN202585391U true CN202585391U (en) | 2012-12-05 |
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| CN 201220123455 Expired - Lifetime CN202585391U (en) | 2012-03-28 | 2012-03-28 | Liquid-cooling heat dispassion system |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
| CN105263301A (en) * | 2015-11-12 | 2016-01-20 | 深圳市研派科技有限公司 | Liquid cooling system and liquid cooling row |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| WO2016155081A1 (en) * | 2015-03-31 | 2016-10-06 | 广东申菱空调设备有限公司 | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device |
| CN106020398A (en) * | 2016-06-17 | 2016-10-12 | 广东工业大学 | CPU cooling device |
| CN106385789A (en) * | 2016-11-29 | 2017-02-08 | 昆山市宝福通电子科技有限公司 | Heat radiation fin used for liquid cooling system and liquid cooling radiator adopting the same |
| CN108227351A (en) * | 2018-03-13 | 2018-06-29 | 苏州科勒迪电子有限公司 | It can be applied to the liquid-cooling type radiator of fluorescent wheel heat dissipation |
| CN108681192A (en) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | It can be applied to the liquid-cooling type radiator of dmd chip heat dissipation |
-
2012
- 2012-03-28 CN CN 201220123455 patent/CN202585391U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016155081A1 (en) * | 2015-03-31 | 2016-10-06 | 广东申菱空调设备有限公司 | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device |
| US10356949B2 (en) | 2015-03-31 | 2019-07-16 | Guangdong Shenling Environmental Systems Co., Ltd. | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device |
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
| CN105263301A (en) * | 2015-11-12 | 2016-01-20 | 深圳市研派科技有限公司 | Liquid cooling system and liquid cooling row |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN105700652B (en) * | 2016-03-16 | 2023-08-11 | 深圳市超频三科技股份有限公司 | Radiator |
| CN106020398A (en) * | 2016-06-17 | 2016-10-12 | 广东工业大学 | CPU cooling device |
| CN106385789A (en) * | 2016-11-29 | 2017-02-08 | 昆山市宝福通电子科技有限公司 | Heat radiation fin used for liquid cooling system and liquid cooling radiator adopting the same |
| CN108227351A (en) * | 2018-03-13 | 2018-06-29 | 苏州科勒迪电子有限公司 | It can be applied to the liquid-cooling type radiator of fluorescent wheel heat dissipation |
| CN108681192A (en) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | It can be applied to the liquid-cooling type radiator of dmd chip heat dissipation |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 B03 / B04 / B05, 15 / F, Yicheng Huanzhi center, the intersection of Renmin Road and Bayi Road, Jinglong community, Longhua street, Longhua District, Shenzhen, Guangdong Patentee after: Shenzhen angpai Technology Co.,Ltd. Address before: 518000 12c1, Shenkan building, Shangbu Middle Road, Futian District, Shenzhen, Guangdong Patentee before: SHENZHEN APALTEK Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |
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| CX01 | Expiry of patent term | ||
| DD01 | Delivery of document by public notice |
Addressee: Li Jing Document name: Notification of qualified procedures |
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| DD01 | Delivery of document by public notice |