CN106993393B - Heat dissipation equipment and terminal - Google Patents
Heat dissipation equipment and terminal Download PDFInfo
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- CN106993393B CN106993393B CN201710112385.4A CN201710112385A CN106993393B CN 106993393 B CN106993393 B CN 106993393B CN 201710112385 A CN201710112385 A CN 201710112385A CN 106993393 B CN106993393 B CN 106993393B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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Abstract
The application discloses heat dissipation equipment and terminal is applied to in the terminal, include: a heat conductor and a first heat sink; the heat conductor is connected with at least two high-power-consumption chips in the terminal; the first radiator is connected with the heat conductor; the heat conductor is used for absorbing heat generated by at least two high-power chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation. The heat conductor in this application has thermal conductivity for absorb the heat that two at least high-power consumption chips produced, and conduct the heat to first radiator, make two at least high-power consumption chips can the first radiator of sharing dispel the heat, effectively utilized the heat-absorbing capacity of first radiator, improved loop heat pipe radiator's utilization ratio.
Description
Technical Field
The application relates to the technical field of terminals, in particular to a heat dissipation device and a terminal.
Background
For a high-power chip (such as a central processing unit and the like) in a terminal, a large amount of heat is generated in the operation process, and once the surface temperature of the high-power chip is too high, the working efficiency and the reliability of the high-power chip are affected, so that the most critical problem of the high-power chip in the operation process is the heat dissipation problem.
In the prior art, a heat sink is generally arranged near each high-power-consumption chip in order to improve the heat dissipation capacity, and the heat sink absorbs heat generated by the high-power-consumption chip and conducts the heat to the cooling device for cooling through the related pipeline.
However, in some cases, the heat absorbed by a single heat sink per unit time is much higher than the heat generated by a single high power consumption chip per unit time, and usually, 2 or more high power consumption chips are disposed on a single board of the terminal, so that a structure in which a heat sink is disposed near each high power consumption chip in the prior art may cause a problem that the heat absorption capacity of the heat sink cannot be fully utilized, and reduce the utilization rate of the heat sink.
Disclosure of Invention
The utility model aims at providing a heat radiation equipment and terminal can solve the problem that the radiator utilization ratio is low among the prior art.
In order to achieve the above purpose, the present application provides the following solutions:
a first aspect of the present application provides a heat dissipation apparatus, applied to a terminal, including: a heat conductor and a first heat sink; the heat conductor is connected with at least two high-power-consumption chips in the terminal; the first radiator is connected with the heat conductor; the heat conductor is used for absorbing heat generated by at least two high-power chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation. The heat conductor in this application has thermal conductivity for absorb the heat that two at least high-power consumption chips produced, and conduct the heat to first radiator, make two at least high-power consumption chips can the first radiator of sharing dispel the heat, effectively utilized the heat-absorbing capacity of first radiator, improved loop heat pipe radiator's utilization ratio. And compared with the prior art that one radiator is arranged near each high-power-consumption chip, the number of the radiators is reduced, so that the occupied space on the terminal single board is reduced, and the radiating cost is also reduced.
In one implementation, the heat conductor includes: the heat conduction substrate is arranged above the at least two high-power-consumption chips in the terminal in parallel, and the lower surface of the heat conduction substrate is directly connected with the upper surfaces of the at least two high-power-consumption chips; or; the lower surface of the heat-conducting substrate is connected with the upper surfaces of the at least two high-power-consumption chips through heat-conducting materials; the heat conducting substrate is used for absorbing heat generated by at least two high-power-consumption chips. The heat conducting substrate has heat conducting performance and is used for absorbing heat generated by the at least two high-power-consumption chips and conducting the heat to the first radiator, so that the at least two high-power-consumption chips can share the first radiator to dissipate heat, the heat absorbing capacity of the first radiator is effectively utilized, and the utilization rate of the loop heat pipe radiator is improved.
In one implementation, the heat sink in the first heat sink is directly connected to the heat conducting surface of the heat conducting substrate; or; and the heat absorbing device in the first radiator is connected with the heat conducting surface of the heat conducting substrate through a heat conducting material. The heat absorbing device in the first radiator can be directly connected with the heat conducting surface of the heat conducting substrate and can also be connected with the heat conducting surface of the heat conducting substrate through heat conducting materials, good thermal contact is guaranteed, and heat absorbed by the heat conducting substrate can be fully conducted to the heat absorbing device in the first radiator to absorb heat.
In one implementation, the heat dissipation apparatus in the present application further includes:
and the second heat radiator is arranged right above the high-power-consumption chip and positioned on the upper surface of the heat conduction substrate. When the heat emitted by the high-power-consumption chip is more, the loop heat pipe radiator is used for radiating the high-power-consumption chip, and the second radiator which is arranged right above the high-power-consumption chip and is positioned on the upper surface of the heat-conducting substrate can also be used for radiating the heat, so that the radiating effect is further enhanced.
A second aspect of the present application provides a terminal, comprising: at least two high-power chips and heat dissipation equipment; the heat dissipating apparatus includes: a heat conductor and a first heat sink; the heat conductor is connected with at least two high-power-consumption chips in the terminal; the first radiator is connected with the heat conductor; the heat conductor is used for absorbing heat generated by at least two high-power chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation. The heat conductor that sets up in this application terminal has thermal conductivity for absorb the heat that two at least high-power consumption chips produced, and conduct the heat to first radiator, make two at least high-power consumption chips can the first radiator of sharing dispel the heat, effectively utilized the heat-absorbing capacity of first radiator, improved loop heat pipe radiator's utilization ratio. And compared with the prior art that one radiator is arranged near each high-power-consumption chip, the number of the radiators is reduced, so that the occupied space on the terminal single board is reduced, and the radiating cost is also reduced.
In one implementation, the heat conductor includes: the heat conduction substrate is arranged above the at least two high-power-consumption chips in the terminal in parallel, and the lower surface of the heat conduction substrate is directly connected with the upper surfaces of the at least two high-power-consumption chips; or; the lower surface of the heat-conducting substrate is connected with the upper surfaces of the at least two high-power-consumption chips through heat-conducting materials; the heat conducting substrate is used for absorbing heat generated by at least two high-power-consumption chips. The heat conducting substrate has heat conducting performance and is used for absorbing heat generated by the at least two high-power-consumption chips and conducting the heat to the first radiator, so that the at least two high-power-consumption chips can share the first radiator to dissipate heat, the heat absorbing capacity of the first radiator is effectively utilized, and the utilization rate of the loop heat pipe radiator is improved.
In one implementation, the heat sink in the first heat sink is directly connected to the heat conducting surface of the heat conducting substrate; or; and the heat absorbing device in the first radiator is connected with the heat conducting surface of the heat conducting substrate through a heat conducting material. The heat absorbing device in the first radiator can be directly connected with the heat conducting surface of the heat conducting substrate and can also be connected with the heat conducting surface of the heat conducting substrate through heat conducting materials, good thermal contact is guaranteed, and heat absorbed by the heat conducting substrate can be fully conducted to the heat absorbing device in the first radiator to absorb heat.
In one implementation, the terminal in the present application further includes:
and the second heat radiator is arranged right above the high-power-consumption chip and positioned on the upper surface of the heat conduction substrate. When the heat emitted by the high-power-consumption chip is more, the loop heat pipe radiator is used for radiating the high-power-consumption chip, and the second radiator which is arranged right above the high-power-consumption chip and is positioned on the upper surface of the heat-conducting substrate can also be used for radiating the heat, so that the radiating effect is further enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it should be apparent that the drawings in the following description are only drawings of some embodiments of the present application.
FIG. 1 is a schematic diagram of a loop heat pipe radiator according to the prior art;
fig. 2 is a flowchart of a first embodiment of a heat dissipation apparatus of the present application;
fig. 3 is a flowchart of a second embodiment of a heat dissipation apparatus of the present application;
fig. 4 is a flowchart of a third embodiment of the heat dissipation apparatus of the present application.
Detailed Description
In order to reduce the higher temperature of a high-power chip in a terminal in the operation process, a radiator is usually installed near the high-power chip, as shown in fig. 1, the most widely used at present is a loop heat pipe radiator, which consists of an evaporator, a condenser and related pipelines, a refrigerant circulates in the evaporator, the condenser and the related pipelines, the evaporator is arranged above the high-power chip, the refrigerant absorbs heat in the evaporator, is gasified, flows into the condenser, releases heat in the condenser, is liquefied, and then flows back to the evaporator again, thereby completing a refrigeration cycle; the heat generated by the high-power consumption chip at the evaporator is transmitted to the condenser, and finally the heat is radiated to the environment through the condenser.
The heat absorbed per unit time by a single evaporator is much higher than the heat generated per unit time by a single high power consumption chip, for example: at present, the heat absorbed by a single evaporator in unit time reaches 1000W, the heat generated by a single high-power-consumption chip in unit time is usually less than 300W, and usually, 2 or more high-power-consumption chips are arranged on a single plate of a terminal, so that the problem that the heat absorption capacity of the evaporator cannot be fully utilized is caused by the structure that an evaporator is arranged above each high-power-consumption chip in the prior art, and the utilization rate of a loop heat pipe radiator is reduced.
The application provides a heat dissipation device, which can solve the problem of low utilization rate of a loop heat pipe radiator in the prior art.
One embodiment of the present invention discloses a heat dissipation device, which is applied to a terminal, wherein the terminal includes two cascaded high power chips, as shown in fig. 2, the heat dissipation device includes: a heat-conducting substrate 11, an evaporator 12, a condenser 13, a loop heat pipe line 14, and a fin radiator 15; wherein, the evaporator 12, the condenser 13 and the loop heat pipe pipeline 14 form a loop heat pipe radiator;
a heat conducting substrate 11 disposed in parallel above the two cascaded high power chips;
an evaporator 12 disposed above the heat conductive substrate 11 and at a position intermediate two cascaded high power consumption chips;
a condenser 13 connected to the evaporator 12 via a loop heat pipe line 14;
the heat conducting substrate 11 has heat conducting performance, and is used for absorbing heat generated by at least two high-power chips and conducting the absorbed heat to the evaporator 12; the refrigerant in the evaporator 12 absorbs heat at the evaporator 12, and the refrigerant after absorbing the heat phase change is transmitted to the condenser 13 for condensation phase change and heat release, thereby realizing the heat dissipation of the high-power chip;
in the application, a fin radiator 15 is also arranged vertically above the high-power-consumption chip and in the upper surface of the heat-conducting substrate; the finned radiator 15 can be directly welded on the upper surface of the heat conducting substrate and can also be connected with the upper surface of the heat conducting substrate through a heat conducting material, and the application is not specifically limited.
A capillary structure layer is arranged in the evaporator 12 to provide a circulating capillary driving force for the loop heat pipe radiator, and a liquid storage cavity is further arranged at the upper part or the periphery of the evaporator and used for storing a certain amount of refrigerant.
The condenser 13 is made of a material having good heat conductivity, such as: copper, aluminum, etc., without limitation in this application.
Wherein, fin radiator 15 sets up directly over the high-power consumption chip, can effectively utilize the heat dissipation space directly over the high-power consumption chip, further dispels the heat to the high-power consumption chip, reinforcing radiating effect.
Note that, the heat conductive substrate 11 in the present application is made of a material having high heat conductive performance, for example: VC (vapor chamber), the base plate of inlaying the heat pipe, copper, aluminum plate, etc., and this application does not do the specific restriction.
The lower surface of the heat conduction substrate 11 in this application with the upper surface of two at least high-power consumption chips directly links to each other, or, the lower surface of the heat conduction substrate 11 with the upper surface of two at least high-power consumption chips passes through the heat conduction material and links to each other, and this application does not do specifically and restricts.
The evaporator 12 in this application is directly connected to the upper surface of the heat conductive substrate 11, or the evaporator 12 is connected to the upper surface of the heat conductive substrate 11 through a heat conductive material, and this application is not specifically limited.
This application conducts the heat that two cascaded high-power consumption chips produced to evaporimeter 12 through heat conduction base plate 11 for two cascaded high-power consumption chips can dispel the heat by a evaporimeter 12 of sharing, effectively utilized evaporimeter 12's heat absorption capacity, loop heat pipe radiator's utilization ratio has been improved, and, compare with all setting up an evaporimeter near each high-power consumption chip among the prior art, the number of evaporimeter has been reduced, thereby the occupation of space on the terminal veneer has been reduced, the heat dissipation cost has also been reduced.
In addition, because of the high heat conductivity of the heat conducting substrate 11, the heat generated by the two cascaded high power consumption chips can be fully conducted out, and therefore, the evaporator 12 in the application can also be arranged at any position on the heat conducting surface of the heat conducting substrate 11, which is close to the high power consumption chip, so that the flexible configuration of hardware is facilitated, and the system maintenance is facilitated.
In addition, based on the heat absorbing capacity of the evaporator, the evaporator in this application can also absorb the heat that the high power consumption chip produced simultaneously, on this basis, this application provides another heat dissipation device, is applied to in the terminal, wherein, contains three high power consumption chips in the terminal, as shown in fig. 3, heat dissipation device includes: a heat conductive substrate 21, an evaporator 22, a condenser 23, a loop heat pipe line 24, and a fin radiator 25; the evaporator 22, the condenser 23 and the loop heat pipe pipeline 24 form a loop heat pipe radiator;
a heat conductive substrate 21 disposed in parallel above the three high power chips;
an evaporator 22 disposed above the heat conductive substrate 21 and at a middle position of the three high power consumption chips;
a condenser 23 connected to the evaporator 22 via a loop heat pipe line 24;
the heat conducting substrate 21 has heat conducting property, and is used for absorbing heat generated by at least two high power consumption chips and conducting the absorbed heat to the evaporator 22; the refrigerant in the evaporator 22 absorbs heat at the evaporator 22, and the refrigerant after absorbing the heat phase change is transmitted to the condenser 23 for condensation phase change and heat release, thereby realizing heat dissipation of the high-power consumption chip;
in the application, a fin radiator 25 is also arranged vertically above the high-power-consumption chip and in the upper surface of the heat-conducting substrate; the finned heat sink 25 may be directly welded to the upper surface of the heat conducting substrate, or may be connected to the upper surface of the heat conducting substrate through a heat conducting material, which is not specifically limited in the present application.
In addition, for a scene in which a single high-power chip exists in the terminal, the heat dissipation device in the present application may also be applied, based on which, the present application provides another heat dissipation device applied in the terminal, wherein the terminal includes one high-power chip, as shown in fig. 4, the heat dissipation device includes: a heat conductive substrate 31, an evaporator 32, a condenser 33, a loop heat pipe line 34, and a fin radiator 35; the evaporator 32, the condenser 33 and the loop heat pipe line 34 constitute a loop heat pipe radiator;
a heat conductive substrate 31 disposed in parallel above one high power consumption chip;
the evaporator 22 is arranged above the heat conducting substrate 31 and far away from the side where the high-power-consumption chip is located;
a condenser 33 connected to the evaporator 32 via a loop heat pipe line 34;
the heat conducting substrate 31 has heat conducting performance, and is used for absorbing heat generated by the high power consumption chip and conducting the absorbed heat to the evaporator 32; the refrigerant in the evaporator 32 absorbs heat at the evaporator 32, and the refrigerant after absorbing the heat phase change is transmitted to the condenser 33 for condensation phase change and heat release, thereby realizing the heat dissipation of the high-power consumption chip;
in the application, a fin radiator 35 is also arranged vertically above the high-power-consumption chip and in the upper surface of the heat-conducting substrate; the fin radiator 35 can be directly welded on the upper surface of the heat-conducting substrate and can also be connected with the upper surface of the heat-conducting substrate through a heat-conducting material, and the application is not specifically limited.
When the high-power-consumption chip emits more heat, the loop heat pipe radiator is used for radiating the high-power-consumption chip, and meanwhile, the fin radiator 35 can be used for radiating the high-power-consumption chip, so that the radiating effect is further enhanced; meanwhile, because the power consumption of the loop heat pipe radiator is large, when the heat emitted by the high-power-consumption chip is small, the loop heat pipe radiator can be removed, and only the fin radiator 35 is used for radiating the heat, so that the radiating cost is reduced.
It should be noted that, the three embodiments disclosed in the present application are all specific applications of the heat dissipation device in the terminal, and specific contents may be referred to each other.
One embodiment of the present invention discloses a terminal, including: at least two high-power chips and heat dissipation equipment;
the heat dissipating apparatus includes: a heat conductor and a first heat sink;
the heat conductor is connected with at least two high-power-consumption chips in the terminal;
the first radiator is connected with the heat conductor;
the heat conductor is used for absorbing heat generated by at least two high-power chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation.
The heat conductor includes: the heat conduction substrate is arranged above the at least two high-power-consumption chips in the terminal in parallel, and the lower surface of the heat conduction substrate is directly connected with the upper surfaces of the at least two high-power-consumption chips; or; the lower surface of the heat-conducting substrate is connected with the upper surfaces of the at least two high-power-consumption chips through heat-conducting materials; the heat conducting substrate is used for absorbing heat generated by at least two high-power-consumption chips.
The heat absorption device in the first radiator is directly connected with the heat conduction surface of the heat conduction substrate; or; and the heat absorbing device in the first radiator is connected with the heat conducting surface of the heat conducting substrate through a heat conducting material.
The terminal in this application still includes:
and the second heat radiator is arranged right above the high-power-consumption chip and positioned on the upper surface of the heat conduction substrate.
The heat dissipation device in the terminal of the application is arranged around the high-power-consumption chip and used for dissipating heat of the high-power-consumption chip, and please refer to the specific application of the heat dissipation device in the terminal disclosed in the above embodiment for the specific position relationship between the high-power-consumption chip and the heat dissipation device and the composition and connection relationship of each component in the heat dissipation device.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Claims (6)
1. A heat dissipation device is applied to a terminal, and is characterized by comprising: a heat conductor and a first heat sink;
the heat conductor is connected with at least two high-power-consumption chips in the terminal;
the first radiator is connected with the heat conductor; the first radiator is an evaporator, and the evaporator is connected with the condenser through a loop heat pipe pipeline;
the heat conductor is used for absorbing heat generated by at least two high-power-consumption chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation;
the heat conductor includes a heat conductive substrate, and the heat dissipating apparatus further includes: the second radiator is arranged right above the high-power-consumption chip and positioned on the upper surface of the heat-conducting substrate; the number of the high-power consumption chips is two or three; the evaporator is arranged above the heat conduction substrate and is positioned in the middle of the at least two high-power-consumption chips; the heat conducting substrate is arranged above the high-power-consumption chip in parallel; the second heat sink is a finned heat sink.
2. The heat dissipation apparatus of claim 1, wherein the heat conductive substrate is disposed in parallel above at least two high power chips in the terminal, and a lower surface of the heat conductive substrate is directly connected to upper surfaces of the at least two high power chips; or; the lower surface of the heat-conducting substrate is connected with the upper surfaces of the at least two high-power-consumption chips through heat-conducting materials; the heat conducting substrate is used for absorbing heat generated by at least two high-power-consumption chips.
3. The heat dissipating device of claim 2, wherein the heat sink of the first heat sink is directly connected to the thermally conductive surface of the thermally conductive substrate; or; and the heat absorbing device in the first radiator is connected with the heat conducting surface of the heat conducting substrate through a heat conducting material.
4. A terminal, comprising: at least two high-power chips and heat dissipation equipment;
the heat dissipating apparatus includes: a heat conductor and a first heat sink;
the heat conductor is connected with at least two high-power-consumption chips in the terminal;
the first radiator is connected with the heat conductor; the first radiator is an evaporator, and the evaporator is connected with the condenser through a loop heat pipe pipeline;
the heat conductor is used for absorbing heat generated by at least two high-power-consumption chips in the terminal and conducting the absorbed heat to the first radiator for heat dissipation;
the heat conductor includes a heat conductive substrate, and the heat dissipating apparatus further includes: the second radiator is arranged right above the high-power-consumption chip and positioned on the upper surface of the heat-conducting substrate; the number of the high-power consumption chips is two or three; the evaporator is arranged above the heat conduction substrate and is positioned in the middle of the at least two high-power-consumption chips; the heat conducting substrate is arranged above the high-power-consumption chip in parallel; the second heat sink is a finned heat sink.
5. The terminal according to claim 4, wherein the heat conducting substrate is disposed in parallel above at least two high power chips in the terminal, and a lower surface of the heat conducting substrate is directly connected to upper surfaces of the at least two high power chips; or; the lower surface of the heat-conducting substrate is connected with the upper surfaces of the at least two high-power-consumption chips through heat-conducting materials; the heat conducting substrate is used for absorbing heat generated by at least two high-power-consumption chips.
6. A terminal according to claim 5, wherein the heat sink of the first heat sink is directly connected to the thermally conductive surface of the thermally conductive substrate; or; and the heat absorbing device in the first radiator is connected with the heat conducting surface of the heat conducting substrate through a heat conducting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710112385.4A CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710112385.4A CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
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| CN106993393A CN106993393A (en) | 2017-07-28 |
| CN106993393B true CN106993393B (en) | 2020-11-17 |
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| CN201710112385.4A Active CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
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| CN108377632A (en) * | 2018-04-10 | 2018-08-07 | 珠海格力电器股份有限公司 | Air conditioner electrical apparatus box and air conditioner |
| WO2020102983A1 (en) * | 2018-11-20 | 2020-05-28 | 北京比特大陆科技有限公司 | Circuit board and supercomputing server |
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| CN1885530A (en) * | 2005-06-24 | 2006-12-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation module |
| CN102271479A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN102425968A (en) * | 2012-01-04 | 2012-04-25 | 中国电子科技集团公司第三十八研究所 | Compact type loop heat pipe device |
| CN202307865U (en) * | 2011-10-25 | 2012-07-04 | 吴哲元 | Heat radiation improvement device for electronic heating source |
| CN204796016U (en) * | 2015-07-14 | 2015-11-18 | 深圳Tcl新技术有限公司 | Heat abstractor and electron terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080218964A1 (en) * | 2007-03-05 | 2008-09-11 | Dfi, Inc. | Desktop personal computer and thermal module thereof |
| US9268376B2 (en) * | 2013-01-09 | 2016-02-23 | Google Technology Holdings LLC | Mobile computing device dock station with headset jack heat pipe interface |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1885530A (en) * | 2005-06-24 | 2006-12-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation module |
| CN102271479A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN202307865U (en) * | 2011-10-25 | 2012-07-04 | 吴哲元 | Heat radiation improvement device for electronic heating source |
| CN102425968A (en) * | 2012-01-04 | 2012-04-25 | 中国电子科技集团公司第三十八研究所 | Compact type loop heat pipe device |
| CN204796016U (en) * | 2015-07-14 | 2015-11-18 | 深圳Tcl新技术有限公司 | Heat abstractor and electron terminal |
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