CN210808094U - Circuit board, heat exchange system and refrigerating system - Google Patents
Circuit board, heat exchange system and refrigerating system Download PDFInfo
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- CN210808094U CN210808094U CN201922128964.5U CN201922128964U CN210808094U CN 210808094 U CN210808094 U CN 210808094U CN 201922128964 U CN201922128964 U CN 201922128964U CN 210808094 U CN210808094 U CN 210808094U
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Abstract
The utility model discloses a circuit board relates to heat transfer technical field, including mainboard, heat radiation module and first protection cover, heat radiation module with the mainboard connection for reduce the temperature of mainboard, first protection cover is detained outside heat radiation module and with mainboard sealing connection for form first adiabatic cavity. The utility model discloses all arrange the mainboard under heat dissipation module and the first protection cover in the first heat chamber for microthermal heat dissipation module and mainboard can not contact with the outside air, avoid generating the comdenstion water on heat dissipation module or on the mainboard, influence the normal use of circuit board, thereby realize not receiving under ambient temperature's influence, can utilize the heat dissipation module who is less than ambient temperature to cool down the heat dissipation to the circuit board, the radiating efficiency of circuit board has been improved, the job stabilization nature of circuit board has been guaranteed, the life of circuit board has been prolonged. The utility model also provides a heat transfer system and refrigerating system.
Description
Technical Field
The utility model relates to a heat transfer technical field, in particular to circuit board, heat transfer system and refrigerating system.
Background
The circuit board is at the working process, the circuit board can generate heat, work under the long-term high temperature condition, can accelerate the ageing of components and parts on the circuit board, influence the life and the job stabilization nature of circuit board, in order to guarantee that the circuit board normally works, need dispel the heat to the circuit board, but because during the circuit board heat dissipation, if the temperature of circuit board or the temperature of the heat transfer medium that the heat dissipation used are less than ambient temperature, steam in the environment just condenses on the circuit board easily, form the comdenstion water, make the circuit board break down, influence normal use. Therefore, when the existing circuit board is cooled, in order to avoid generating condensed water, the circuit board can only be cooled to a temperature higher than the temperature of the environment, the temperature of the circuit board is still higher when the circuit board works, the reliability of the circuit board is low, and the service life of the circuit board is short.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board aims at providing one kind and does not receive the ambient temperature restriction, can effectively carry out radiating circuit board.
In order to achieve the above object, the utility model provides a circuit board, including mainboard, heat dissipation module and first protection casing, heat dissipation module with the mainboard connection for reduce the temperature of mainboard, first protection casing is detained outside heat dissipation module and with mainboard sealing connection for form first adiabatic cavity.
The first insulating chamber may be filled with an insulating material or otherwise, such that the first insulating chamber does not substantially or completely exchange heat, preferably a vacuum insulating chamber. The vacuum heat insulation chamber has good heat insulation effect, easy manufacture and low cost.
Preferably, the mainboard further comprises a heating module, and the heating module is connected with the heat dissipation module. The main heating element of mainboard is assembled to the module that generates heat, is the main position that generates heat of mainboard, concentrates the heat on the module that generates heat, effectively reduces the temperature of other parts of mainboard, has guaranteed the reliability of mainboard, is convenient for concentrate the heat dissipation to the mainboard simultaneously.
Preferably, the utility model discloses still include and lead the warm plate, lead the warm plate with the module laminating generates heat, thermal module with it links to each other to lead the warm plate. On can transferring the heat of the module that generates heat to the temperature guide plate fast through the temperature guide plate, then on transferring the heat to the heat dissipation module through the temperature guide plate, realized the high-efficient heat dissipation cooling of the module that generates heat.
Preferably, the heat dissipation module is a heat dissipation tube, and the heat dissipation tube is arranged in a serpentine shape and embedded in the heat conduction plate. The radiating module is arranged into the radiating pipe, so that the heat exchange medium can flow in the radiating module conveniently, the radiating pipe is arranged in a snake shape and is embedded into the heat guide plate, the base area of the heat guide plate and the radiating pipe is greatly increased, the heat exchange efficiency is improved, and the heat guide plate can radiate and cool more easily.
Preferably, the utility model discloses still include the second safety cover, the second safety cover with first safety cover sets up relatively, the second safety cover with mainboard sealing connection for form the adiabatic cavity of second. Utilize the thermal insulation cavity of second to protect the offside of mainboard also, can avoid like this when the radiating module dispels the heat, the opposite side of mainboard produces the comdenstion water because of the temperature reduction, has guaranteed mainboard job stabilization nature and reliance.
Preferably, the heat dissipation module is disposed below the main board. With the heat radiation module setting in the below of mainboard, the mainboard is in the top of heat radiation module and first protection cover, even first protection cover outside has produced the comdenstion water, the comdenstion water also can flow to the direction of keeping away from the mainboard under the effect of gravity, can not drip on the mainboard, has guaranteed the drying of mainboard.
The utility model also provides a heat transfer system, including compressor, cross valve, indoor heat exchanger, outdoor heat exchanger and outdoor automatically controlled board, outdoor automatically controlled board be above embodiment the circuit board, the compressor the cross valve indoor heat exchanger with outdoor heat exchanger passes through the heat transfer route that the pipeline intercommunication constitutes can let heat transfer medium circulation, the compressor passes through the cross valve with indoor heat exchanger with outdoor heat exchanger intercommunication is used for realizing the heat transfer route of indoor heat exchanger refrigeration/heating switches, heat radiation module with outdoor heat exchanger with heat transfer route intercommunication between the indoor heat exchanger is used for letting the heat transfer medium after the condensation flow through heat radiation module.
The utility model discloses a let the heat transfer medium after the condensation flow in heat dissipation module, take away heat radiation module's heat, again because heat radiation module's heat is from the mainboard, thereby the heat dissipation cooling of outdoor automatically controlled board has been realized, simultaneously because first protection cover has been detained at the heat dissipation module dustcoat, make the heat dissipation module of cooling and near the lower mainboard of heat dissipation module temperature, can directly not contact with outdoor environment direct contact, thereby avoid producing the comdenstion water on heat dissipation module or mainboard because mainboard heat dissipation cooling, the stability of outdoor automatically controlled board work has been guaranteed, can set up the lower position of heat transfer medium temperature with heat dissipation module in heat transfer route like this, do not worry because of the temperature is less than ambient temperature and produce the problem that the comdenstion water influences the mainboard and use.
Preferably, a first one-way throttling module is arranged between the heat dissipation module and the outdoor heat exchanger, and is used for throttling and conducting when the heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger, and conducting and not throttling when the heat exchange medium flows from the indoor heat exchanger to the outdoor heat exchanger.
And a second one-way throttling module is arranged between the heat dissipation module and the indoor heat exchanger and is used for throttling and conducting when the heat exchange medium flows from the indoor heat exchanger to the outdoor heat exchanger, and conducting and not throttling when the heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger.
Adopt first one-way throttle module and the one-way throttle module of second for the heat transfer medium that the heat transfer route flowed into in the heat radiation module all can be throttled and cooled down no matter under refrigeration or heating mode, makes the heat transfer medium temperature by further reduction before getting into heat radiation module, thereby further improves the radiating efficiency of mainboard, reduces the temperature of mainboard, has guaranteed the work efficiency of outdoor automatically controlled board.
Preferably, the four-way valve is a four-way reversing valve and comprises four interfaces which are respectively a D interface, an S interface, an E interface and a C interface, the D interface and the S interface are communicated with the compressor, the E interface is communicated with the indoor heat exchanger, and the C interface is communicated with the outdoor heat exchanger. Through four interfaces of the four-way valve, the four-way valve switches the communication of the four valve ports, and the rapid and stable switching of the refrigeration mode and the heating mode of the indoor heat exchanger is realized.
The utility model also provides a refrigerating system, including compressor, indoor heat exchanger, outdoor heat exchanger and outdoor automatically controlled board, outdoor automatically controlled board is more than the circuit board, the compressor indoor heat exchanger with outdoor heat exchanger passes through the refrigeration route that the pipeline intercommunication constitutes indoor heat exchanger, heat radiation module with indoor heat exchanger with refrigeration route intercommunication between the outdoor heat exchanger is used for letting the process the heat transfer medium of outdoor heat exchanger condensation flows through heat radiation module.
The utility model provides a refrigerating system can not generate raw condensation water on outdoor automatically controlled board when outdoor automatically controlled board dispels the heat, so connect heat radiation module between outdoor heat exchanger and indoor heat exchanger for in heat transfer medium after outdoor heat exchanger condensation can flow into heat radiation module, heat transfer medium temperature after the condensation is low, more is favorable to improving the heat dissipation cooling of outdoor automatically controlled board.
And a throttling module is arranged between the heat dissipation module and the outdoor heat exchanger and used for throttling and conducting when a heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger.
The throttling module is utilized to throttle and cool the heat exchange medium flowing from the outdoor heat exchanger to the heat dissipation module, then the temperature of the heat exchange medium subjected to throttling and cooling is further reduced and flows into the heat dissipation module, and the efficiency of the heat dissipation module in cooling the outdoor electric control panel is improved.
The utility model discloses a circuit board adopts first protection cover, utilizes first protection cover is detained outside the radiating module and with mainboard sealing connection for form first adiabatic cavity. The mainboard under heat dissipation module and the first protection cover is arranged in the first insulation cavity, so that the low-temperature heat dissipation module and the mainboard can not contact with the outside air, condensate water is prevented from being generated on the heat dissipation module or the mainboard, the normal use of the circuit board is influenced, the heat dissipation module which is lower than the ambient temperature can be utilized to cool and dissipate the circuit board under the influence of the ambient temperature, the heat dissipation efficiency of the circuit board is improved, the working stability of the circuit board is ensured, and the service life of the circuit board is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment 1 of the circuit board of the present invention;
fig. 2 is a schematic structural diagram of embodiment 2 of the circuit board of the present invention;
fig. 3 is a schematic structural diagram of embodiment 3 of the heat exchange system of the present invention;
FIG. 4 is a schematic flow diagram of the heat exchange system of FIG. 3;
fig. 5 is a schematic structural diagram of embodiment 4 of the refrigeration system of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, "and/or" in the whole text includes three schemes, taking a and/or B as an example, including a technical scheme, and a technical scheme that a and B meet simultaneously; in addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The specific structure of the circuit board in embodiment 1 of the present invention will be mainly described below, referring to fig. 1, in embodiment 1, the circuit board includes a main board 101, a heat dissipation module 102 and a first protection cover 103, the heat dissipation module 102 is connected to the main board 101 for reducing the temperature of the main board 101, and the first protection cover 103 is covered and buckled outside the heat dissipation module 102 and hermetically connected to the main board 101 for forming a first insulation chamber 104.
The first insulating chamber 104 may be filled with an insulating material or wrapped with an insulating material, and the first insulating chamber 104 does not substantially or completely exchange heat, and preferably, the first insulating chamber 104 is a vacuum insulating chamber. The vacuum heat insulation chamber has good heat insulation effect, easy manufacture and low cost.
The utility model discloses a circuit board utilizes first protection casing 103 cover to detain outside heat dissipation module 102 and with mainboard 101 sealing connection, forms first adiabatic chamber 104, with heat dissipation module 102 and all arrange first adiabatic chamber 104 in with near mainboard 101 of heat dissipation module 102. Thus, the heat dissipation module 102 and the motherboard 101 near the heat dissipation module 102 are both isolated from the outside, and the heat of the heat dissipation module 102 and the motherboard 101 near the heat dissipation module 102 cannot be transferred to the outside of the first protection cover 103, so that when the heat dissipation module 102 dissipates heat to the motherboard 101 at a low temperature, even if the temperature is lower than the ambient temperature outside the first protection cover 103, because the heat cannot be transferred through the first heat insulation chamber 104, the heat dissipation module 102 and the motherboard 101 near the heat dissipation module 102 cannot exchange heat with the environment, and therefore, no condensate water is generated on the heat dissipation module 102 or the motherboard 101 near the heat dissipation module 102, and meanwhile, because the low temperature of the heat dissipation module 102 or the motherboard 101 near the heat dissipation module 102 cannot be transferred to the first protection cover 103, the temperature of the first protection cover 103 is consistent with the outdoor temperature, no condensate water is generated on the first protection cover 103, and the temperature outside the first protection, on can not transmitting the mainboard 101 in heat dissipation module 102 and the first protection casing 103 yet, avoid high temperature to influence heat dissipation module 102's radiating efficiency, thereby influence the utility model discloses a reliability and life.
This embodiment realizes not receiving under ambient temperature's influence, can utilize lower temperature, and the radiating module 102 that is less than ambient temperature even cools down the heat dissipation to the mainboard 101 of circuit board, has improved the radiating efficiency of circuit board, has guaranteed the job stabilization nature of circuit board, has prolonged the life of circuit board.
Referring to fig. 2, on the basis of embodiment 1 of the present invention, further, the main board 101 of the circuit board of embodiment 2 of the present invention further includes a heating module 105, and the heating module 105 is connected to the heat dissipation module 102. The main heating elements of the motherboard 101 are integrated by the heating module 105, which is a main heating part of the motherboard 101, and the heat is concentrated in the heating module 105, so that the temperature of other parts of the motherboard 101 is effectively reduced, the reliability and reliability of the motherboard 101 are ensured, and meanwhile, the motherboard 101 is conveniently subjected to centralized heat dissipation.
Further, the circuit board of the embodiment of the present invention further includes a temperature guiding plate 106, the temperature guiding plate 106 is attached to the heating module 105, and the heat dissipation module 102 is connected to the temperature guiding plate 106. The heat of the heating module 105 can be quickly transferred to the heat conducting plate 106 through the heat conducting plate 106, and then the heat is transferred to the heat dissipation module 102 through the heat conducting plate 106, so that the efficient heat dissipation and cooling of the heating module 105 are realized. The temperature conducting plate 106 may be made of aluminum plate, copper plate or other heat conductive material.
In addition, the heat dissipation module 102 is preferably a heat dissipation tube in the actual use process, and of course, other heat dissipation modules 102 such as a heat dissipation fin and a heat dissipation net can also be used, the heat dissipation tube is mainly used for facilitating the flow of a heat exchange medium in the heat dissipation module 102, the heat dissipation tube is arranged in a serpentine shape and is embedded into the heat conduction plate 106, the contact area between the heat conduction plate 106 and the heat dissipation tube is greatly increased, the heat exchange efficiency between the heat conduction plate 106 and the heat dissipation tube is improved, and the rapid cooling of the heat conduction plate 106 is facilitated, so that the rapid cooling of the main.
In order to further improve the stability of embodiment 2, this embodiment further includes a second protection cover 107, the second protection cover 107 is disposed opposite to the first protection cover 103, and the second protection cover 107 is hermetically connected to the main board 101 to form a second heat insulation chamber 108.
When the heat dissipation module 102 dissipates heat to the motherboard 101, except that the temperature of the motherboard 101 on the side where the heat dissipation module 102 is disposed is decreased, the temperature of the opposite side of the motherboard 101 in the same area is also decreased, and if the area is in direct contact with air, because the temperature of the area is low, condensed water is likely to be formed on the motherboard 101 in the area, thereby affecting the normal use of the embodiment.
And after adding second safety cover 107, can avoid when heat radiation module 102 dispels the heat, mainboard 101's opposite side produces the comdenstion water because the temperature reduces, and the principle has guaranteed with first safety cover 103 the utility model discloses the stability of work and the reliability of product. The second insulating chamber 108 is also preferably a vacuum chamber.
Meanwhile, in order to further improve the capability of the embodiment against condensed water, the heat dissipation module 102 is disposed below the main board 101. Set up like this and make mainboard 101 in heat dissipation module 102's top, even first protection casing 103 has produced the comdenstion water outward, the comdenstion water also can flow to the direction of keeping away from mainboard 101 from first protection casing 103 under the effect of gravity, can not drip on mainboard 101, has guaranteed mainboard 101's drying to guarantee the normal use of this embodiment, prolonged the life of this embodiment.
Referring to fig. 3 to 4, the utility model discloses embodiment 3 still provides a heat exchange system, this heat exchange system, including compressor 201, four-way valve 202, indoor heat exchanger 203, outdoor heat exchanger 204 and outdoor automatically controlled board 205, outdoor automatically controlled board 205 is embodiment 2's circuit board, compressor 201, four-way valve 202, indoor heat exchanger 203 and outdoor heat exchanger 204 constitute the heat transfer route that can let heat transfer medium circulation through the pipeline intercommunication, compressor 201 communicates with indoor heat exchanger 203 and outdoor heat exchanger 204 through four-way valve 202, be used for realizing the heat transfer route switching of indoor heat exchanger 203 refrigeration/heating, heat dissipation module 102 and the heat transfer route intercommunication between outdoor heat exchanger 204 and the indoor heat exchanger 203, be used for letting the heat transfer medium after the condensation flow through heat dissipation module 102. Preferably, the heat exchange medium in this embodiment is a refrigerant commonly used in the market, such as R22, R410, R32, and the like.
In this embodiment, the four-way valve 202 is a four-way reversing valve, and includes four valve ports, i.e., a D port, an S port, an E port, and a C port, where the D port and the S port are both communicated with the compressor 201, the E port is communicated with the indoor heat exchanger 203, and the C port is communicated with the outdoor heat exchanger 204. Through four interfaces of four-way valve 202, four-way valve 202 switches the communication of four valve ports, and the quick and stable switching between the cooling mode and the heating mode of indoor heat exchanger 203 is realized.
The specific structure of the outdoor electronic control board 205 refers to the above embodiment 2, and since the heat exchange system adopts all the technical solutions of the above embodiment 2, the heat exchange system at least has all the beneficial effects brought by the technical solution of the above embodiment 2, and details are not repeated here.
The embodiment 3 of the utility model provides a heat transfer system takes away the heat of thermal module 102 through letting the low temperature heat transfer medium after the condensation flow in thermal module 102 to realize thermal module 102's cooling, because the heat of thermal module 102 is come from mainboard 101 again, thereby realized the mainboard 101 heat dissipation cooling of outdoor automatically controlled board 205. Because the first protective cover 103 is covered on the heat dissipation module 102, the cooled heat dissipation module 102 and the mainboard 101 with lower temperature near the heat dissipation module 102 can not directly contact with the air of the outdoor environment, thereby avoiding generating condensed water on the heat dissipation module 102 or the mainboard 101 due to the heat dissipation and cooling of the mainboard 101 and ensuring the working stability of the outdoor electric control board 205.
Meanwhile, because the heat dissipation module 102 does not need to be worried about the generation of condensed water due to the low temperature of the heat dissipation module 102, the heat dissipation module 102 can be arranged at the position of the heat exchange channel where the temperature of the heat exchange medium is low, even the lowest position, and the temperature of the heat exchange medium is lower than the outdoor temperature without influence. The heat exchange medium with lower temperature enters the heat dissipation module 102, and more heat in the heat dissipation module 102 can be absorbed in unit time, so that the heat dissipation efficiency of the outdoor electric control board 205 through the heat dissipation module 102 is higher, the temperature reduction is more, the outdoor electric control board 205 is prevented from working in a high-temperature state, the service life of the outdoor electric control board 205 is prolonged, and the problem that the outdoor electric control board 205 cannot be cooled by the heat exchange medium with the temperature lower than the ambient temperature is solved.
Preferably, in this embodiment, a first one-way throttling module 206 is disposed between the heat dissipation module 102 and the outdoor heat exchanger 204, and is used for conducting throttling when the heat exchange medium flows from the outdoor heat exchanger 204 to the indoor heat exchanger 203, and conducting non-throttling when the heat exchange medium flows from the indoor heat exchanger 203 to the outdoor heat exchanger 204.
A second one-way throttling module 207 is arranged between the heat dissipation module 102 and the indoor heat exchanger 203, and is used for throttling and conducting when the heat exchange medium flows from the indoor heat exchanger 203 to the outdoor heat exchanger 204, and conducting and not throttling when the heat exchange medium flows from the outdoor heat exchanger 204 to the indoor heat exchanger 203.
The first one-way throttling module 206 and the second one-way throttling module 207 preferably adopt one-way throttling valves, and the first one-way throttling module 206 and the second one-way throttling module 207 are adopted, so that the heat exchange medium flowing into the heat dissipation module 102 can be throttled, depressurized and cooled down no matter in the cooling or heating mode of a heat exchange passage, the temperature of the heat exchange medium is further reduced before the heat exchange medium enters the heat dissipation module 102, the heat dissipation efficiency of the outdoor electronic control board 205 can be further improved by the heat exchange medium with lower temperature entering the heat dissipation module 102, the temperature of the outdoor electronic control board 205 is reduced, and the working efficiency of the outdoor electronic control board 205 is ensured.
Referring to fig. 4, the present embodiment is divided into two states, namely, a cooling mode of the indoor heat exchanger 203 and a heating mode of the indoor heat exchanger 203, when in operation.
In this embodiment, when the indoor heat exchanger 203 is refrigerating, the four-way reversing valve is powered off, the heat exchange medium comes out from the compressor 201, is condensed by the outdoor heat exchanger 204, is throttled and cooled to a low-temperature state by the first one-way throttling module 206, the low-temperature heat exchange medium passes through the heat dissipation module 102, takes away heat of the heat dissipation module 102 and the heat conduction plate 106, the heat conduction plate 106 takes away heat of the outdoor electric control plate 205 again, heat dissipation and cooling of the outdoor electric control plate 205 are realized, then the heat exchange medium passes through the second one-way throttling module 207, is not throttled and is directly conducted to enter the indoor heat exchanger 203 for evaporation and refrigeration, and finally returns to the.
In this embodiment, when the indoor heat exchanger 203 heats, the four-way reversing valve is energized, the heat transfer medium comes out from the compressor 201, the heat is condensed and heated by the indoor heat exchanger 203, the heat is throttled and cooled to a low-temperature state by the second one-way throttling module 207, the low-temperature heat transfer medium passes through the heat dissipation module 102, the heat of the heat dissipation module 102 and the heat conduction plate 106 is taken away, then the heat of the outdoor electric control plate 205 is taken away by the heat conduction plate 106, the heat dissipation and cooling of the outdoor electric control plate 205 are realized, then the heat transfer medium passes through the first one-way throttling module 206, the heat transfer medium is directly conducted without throttling and enters the outdoor heat exchanger 204 to be.
By using the scheme of the invention, the condensed and throttled heat exchange medium is radiated to the outdoor electric control plate 205 in the refrigeration or heating mode of the indoor heat exchanger 203, and the temperature of the heat exchange medium in the whole heat exchange cycle is almost the lowest, so that the heat radiation effect is optimal. Because the space of the heat dissipation module 102 is subjected to sealing vacuum treatment, even if the temperature in the first insulation chamber 104 is lower than the ambient temperature, the heat dissipation module 102 and the heating module 105 of the outdoor electronic control board 205 do not generate condensed water, and the reliability of the outdoor electronic control board 205 is not affected. The outdoor electric control board 205 in this embodiment is low in temperature through heat dissipation, and the service life of the outdoor electric control board 205 is prolonged, so that the service life of the heat exchange system is prolonged.
Meanwhile, the heat dissipation effect of the embodiment is good, so that the working frequency of the outdoor electric control plate 205 during the working of the heat exchange system can be improved, the heat generation of the outdoor electric control plate 205 is avoided, and the heat exchange effect, especially the high-temperature refrigeration effect, of the heat exchange system is greatly improved.
In addition, since the heat dissipation efficiency of the heat dissipation module 102 is improved, the area of the heat conduction plate 106 can be reduced appropriately, thereby reducing the cost of raw materials.
Referring to fig. 5, embodiment 4 of the present invention further provides a refrigeration system, including a compressor 301, an indoor heat exchanger 302, an outdoor heat exchanger 303 and an outdoor electronic control board 304, where the outdoor electronic control board 304 is the circuit board of embodiment 2, the compressor 301, the indoor heat exchanger 302 and the outdoor heat exchanger 303 form a refrigeration passage of the indoor heat exchanger 302 through pipeline communication, and the refrigeration passage between the heat dissipation module 102 and the indoor heat exchanger 302 and the outdoor heat exchanger 303 is communicated to allow a heat exchange medium condensed by the outdoor heat exchanger 303 to flow through the heat dissipation module 102. Preferably, the heat exchange medium in this embodiment is a refrigerant commonly used in the market, such as R22, R410, R32, and the like.
The utility model provides a refrigerating system is because outdoor automatically controlled board 304 is when the heat dissipation, even the temperature of heat dissipation module 102 is less than ambient temperature, can not produce the comdenstion water on outdoor automatically controlled board 304 yet, so connect heat dissipation module 102 between outdoor heat exchanger 303 and indoor heat exchanger 302, make in heat transfer medium after outdoor heat exchanger 303 condensation can flow into heat dissipation module 102, heat transfer medium temperature after the condensation is low, more be favorable to improving the radiating efficiency of outdoor automatically controlled board 304.
A throttling module 305 is arranged between the heat dissipation module 102 and the outdoor heat exchanger 303 for throttling conduction when the heat exchange medium flows from the outdoor heat exchanger 303 to the indoor heat exchanger 302. By using the throttling module 305, the heat exchange medium flowing from the outdoor heat exchanger 303 into the heat dissipation module 102 is throttled and cooled, and then the temperature of the throttled and cooled heat exchange medium is further reduced and flows into the heat dissipation module 102, so that the efficiency of cooling the outdoor electric control board 304 by the heat dissipation module 102 is improved.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (11)
1. The circuit board is characterized by comprising a mainboard, a heat dissipation module and a first protection cover, wherein the heat dissipation module is connected with the mainboard and used for reducing the temperature of the mainboard, and the first protection cover is buckled outside the heat dissipation module and hermetically connected with the mainboard and used for forming a first heat insulation chamber.
2. The circuit board of claim 1, wherein the motherboard further comprises a heat generating module, the heat generating module being connected with the heat dissipating module.
3. The circuit board of claim 2, further comprising a heat conducting plate, wherein the heat conducting plate is attached to the heat generating module, and the heat dissipating module is connected to the heat conducting plate.
4. The circuit board of claim 3, wherein the heat dissipation module is a heat dissipation tube, and the heat dissipation tube is arranged in a serpentine shape and embedded in the heat conducting plate.
5. The circuit board of claim 1, further comprising a second protective enclosure disposed opposite the first protective enclosure, the second protective enclosure sealingly connected to the motherboard for forming a second insulating chamber.
6. The circuit board of claim 1, wherein the heat dissipation module is disposed below the motherboard.
7. A heat exchange system is characterized by comprising a compressor, a four-way valve, an indoor heat exchanger, an outdoor heat exchanger and an outdoor electric control plate, wherein the outdoor electric control plate is a circuit board as claimed in any one of claims 1 to 6, the compressor, the four-way valve, the indoor heat exchanger and the outdoor heat exchanger are communicated through pipelines to form a heat exchange passage capable of enabling a heat exchange medium to circulate, the compressor is communicated with the indoor heat exchanger and the outdoor heat exchanger through the four-way valve to realize the switching of the heat exchange passages for refrigerating/heating of the indoor heat exchanger, and a heat dissipation module is communicated with the heat exchange passage between the outdoor heat exchanger and the indoor heat exchanger to enable the condensed heat exchange medium to flow through the heat dissipation module.
8. The heat exchange system of claim 7, wherein a first one-way throttling module is disposed between the heat dissipation module and the outdoor heat exchanger for throttling conduction when the heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger and conducting non-throttling conduction when the heat exchange medium flows from the indoor heat exchanger to the outdoor heat exchanger,
and a second one-way throttling module is arranged between the heat dissipation module and the indoor heat exchanger and is used for throttling and conducting when the heat exchange medium flows from the indoor heat exchanger to the outdoor heat exchanger, and conducting and not throttling when the heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger.
9. The heat exchange system of claim 7 wherein the four-way valve is a four-way reversing valve comprising four ports, namely a D port, an S port, an E port and a C port, wherein the D port and the S port are both in communication with the compressor, the E port is in communication with the indoor heat exchanger, and the C port is in communication with the outdoor heat exchanger.
10. A refrigeration system, which is characterized by comprising a compressor, an indoor heat exchanger, an outdoor heat exchanger and an outdoor electric control board, wherein the outdoor electric control board is the circuit board of any one of claims 1 to 6,
the compressor, the indoor heat exchanger and the outdoor heat exchanger are communicated through a pipeline to form a refrigerating passage of the indoor heat exchanger,
the heat dissipation module is communicated with a refrigeration passage between the indoor heat exchanger and the outdoor heat exchanger, and is used for enabling heat exchange media condensed by the outdoor heat exchanger to flow through the heat dissipation module.
11. The refrigeration system according to claim 10, wherein a throttle module is disposed between the heat rejection module and the outdoor heat exchanger for throttling communication when the heat exchange medium flows from the outdoor heat exchanger to the indoor heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922128964.5U CN210808094U (en) | 2019-11-29 | 2019-11-29 | Circuit board, heat exchange system and refrigerating system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922128964.5U CN210808094U (en) | 2019-11-29 | 2019-11-29 | Circuit board, heat exchange system and refrigerating system |
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| CN210808094U true CN210808094U (en) | 2020-06-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111902033A (en) * | 2020-09-09 | 2020-11-06 | 南京工业职业技术大学 | Unmanned aerial vehicle with circuit board heat radiation structure |
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2019
- 2019-11-29 CN CN201922128964.5U patent/CN210808094U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111902033A (en) * | 2020-09-09 | 2020-11-06 | 南京工业职业技术大学 | Unmanned aerial vehicle with circuit board heat radiation structure |
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