CN217594235U - Dehumidification device, outdoor equipment and battery charging outfit - Google Patents

Abstract

The application provides a dehydrating unit, outdoor equipment and battery charging outfit relates to dehumidification technical field. Wherein, the dehydrating unit includes: semiconductor cooling module and liquid cooling system, semiconductor cooling module let in behind the signal of telecommunication, can form cold junction and hot junction, and the cold junction can absorb the heat in the gas around following for the gaseous temperature reduction in the periphery. When the temperature of the surrounding gas is lower than the dew point temperature, the water vapor in the gas is liquefied into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized. The heat on the hot junction of semiconductor cooling module can be taken away to liquid among the liquid cooling system, lets the cold junction of semiconductor cooling module absorb the heat in the surrounding gas sustainably, realizes improving semiconductor cooling module's dehumidification effect.

Description

Dehumidification device, outdoor equipment and battery charging outfit

Technical Field

The invention relates to the technical field of dehumidification, in particular to a dehumidification device, outdoor equipment and charging equipment.

Background

Outdoor equipment is equipped with charging pile, outdoor cabinet, etc. and is generally arranged in outdoor environment. Because the humidity is bigger in the outdoor environment, easily form the condensation in outdoor equipment inside. If the condensation is gathered on electronic devices such as circuit boards, copper bars and the like in the outdoor equipment, the problems of short circuit, electrochemical corrosion and the like of the electronic devices can be caused, not only is the user equipment damaged, but also safety accidents can be possibly caused.

Disclosure of Invention

In order to solve the above problem, an embodiment of the present application provides a dehumidification device, an outdoor device, and a charging device, where a heat end of a semiconductor cooling module in the dehumidification device is provided with a heat dissipation assembly, and a circulation channel is arranged inside the heat dissipation assembly and is communicated with a cooling source. When the dehumidifying device works, direct current is introduced into the semiconductor cooling module, liquid in the cooling source circulates in the circulating channel, heat of gas around the semiconductor cooling module can be transmitted to the cooling source through the semiconductor cooling module, the radiating assembly and the liquid in sequence, and the temperature of the gas around the semiconductor cooling module is reduced. When the temperature of the gas around the semiconductor cooling module is lower than the dew point temperature, the water vapor in the gas around the semiconductor cooling module begins to be condensed into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized.

Therefore, the following technical scheme is adopted in the embodiment of the application:

in a first aspect, the present application provides a dehumidification apparatus comprising: the semiconductor cooling module comprises a first end and a second end, wherein the first end is used for absorbing heat in ambient gas after direct current is introduced, water vapor in the ambient gas is liquefied into liquid water, and the second end releases heat; and the liquid cooling system is arranged at the second end of the semiconductor cooling module and used for enabling liquid in the liquid cooling system to exchange heat with the second end so as to reduce the temperature of the second end.

In this embodiment, after the semiconductor cooling module is supplied with the electric signal, a cold end and a hot end are formed, and the cold end can absorb heat from the surrounding gas, so that the temperature of the surrounding gas is reduced. When the temperature of the surrounding gas is lower than the dew point temperature, the water vapor in the gas is liquefied into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized. The heat on the hot junction of semiconductor cooling module can be taken away to liquid among the liquid cooling system, lets the cold junction of semiconductor cooling module absorb the heat in the surrounding gas sustainably, realizes improving semiconductor cooling module's dehumidification effect.

If install this dehydrating unit in outdoor equipment, can let the inside gas of outdoor equipment pass through the cold junction, can detach the inside gaseous vapor of outdoor equipment for the inside gaseous relative humidity of outdoor equipment reduces, avoids appearing short circuit, electrochemical corrosion scheduling problem.

In one embodiment, the semiconductor cooling module is a semiconductor chilling plate.

In this embodiment, the semiconductor cooling plate is a heat transfer tool with relatively low cost, and is a thermocouple formed by connecting a P-type semiconductor material and an N-type non-semiconductor material, and the purpose of cooling can be achieved by utilizing the peltier effect of the semiconductor materials, and after direct current is introduced, heat can be transferred from one end to the other end, so that a temperature difference is generated.

In one embodiment, further comprising: at least one heat sink disposed on an outer surface of the first end, respectively, for absorbing heat from the ambient gas.

In this embodiment, the plurality of heat dissipation fins are provided on the first end of the semiconductor cooling module, so that the contact area between the first end of the semiconductor cooling module and the ambient air can be increased, the speed of the semiconductor cooling module absorbing heat from the ambient air can be increased, and the condensation effect of the dehumidifying device can be improved.

In one embodiment, the liquid cooling system includes: and the heat dissipation assembly is arranged on the second end of the semiconductor cooling module and used for absorbing heat on the second end.

In this embodiment, a heat sink is disposed at the second end of the semiconductor cooling module to absorb heat at the second end, so that the semiconductor cooling module can continuously absorb heat in the ambient gas to reduce the temperature of the ambient gas around the semiconductor cooling module.

In one embodiment, at least one flow channel is disposed inside the heat dissipation assembly for allowing the liquid in the liquid cooling system to flow into the heat dissipation assembly.

In this embodiment, the inside of the heat dissipation assembly is designed to be a flow channel, and the flow channel is communicated with the outer surface of the heat dissipation assembly, so that the liquid can flow into the flow channel, take away the heat in the heat dissipation assembly, and the semiconductor cooling module can continuously absorb the heat in the surrounding gas, thereby reducing the temperature of the surrounding gas of the semiconductor cooling module.

In one embodiment, the liquid cooling system further comprises: and the cooling source is communicated with at least one circulation channel inside the heat dissipation assembly through a conduit and is used for circulating liquid in the liquid cooling system inside the heat dissipation assembly to take away heat in the heat dissipation assembly.

In this embodiment, the cooling source is communicated with the heat dissipation assembly through the conduit, and the cooling source can circulate the stored liquid in the heat dissipation assembly to take away heat in the heat dissipation assembly, so that the semiconductor cooling module can continuously absorb heat in the ambient gas, and the temperature of the ambient gas of the semiconductor cooling module can be reduced.

In one embodiment, the heat sink assembly is attached to the second end by a thermally conductive material.

In this embodiment, when the heat dissipation assembly is disposed on the semiconductor cooling module, the heat dissipation assembly can be attached to the semiconductor cooling module through the heat conductive material with relatively good heat conductivity, such as the heat conductive silicone grease and the heat conductive pad, so as to enhance the heat transfer between the semiconductor cooling module and the heat dissipation assembly.

In one embodiment, the method further comprises: and the air channel groove and the first end form a ventilation channel for allowing air inside the outdoor equipment to pass through the first end.

In this embodiment, the semiconductor cooling module is disposed on the air duct groove, and forms a ventilation channel together with the air duct groove, so that the gas inside the outdoor device passes through the first end of the semiconductor cooling module through the ventilation channel, thereby improving the condensation and dehumidification effects of the semiconductor cooling module.

In one embodiment, the method further comprises: and the at least one fan is arranged at one end or two ends of the ventilation channel and is used for pumping the gas inside the outdoor equipment into the ventilation channel and/or blowing the gas in the ventilation channel into the outdoor equipment.

In the embodiment, at least one fan is arranged at one end or two ends of the ventilation channel, so that the air inside the outdoor equipment can be pumped into the ventilation channel, the air in the ventilation channel is blown out to the inside of the outdoor equipment, and the condensation and dehumidification effects of the dehumidification device are improved.

In one embodiment, the method further comprises: and the drain hole is arranged on the air duct groove and used for draining liquid water in the ventilation channel.

In the embodiment, the air duct groove is provided with the drain hole to drain the liquid water in the ventilation channel, so that the liquid water is prevented from being gathered in the ventilation channel and being vaporized into the water vapor again along with the flowing of the gas, and the condensation and dehumidification effects of the dehumidification device are reduced.

In one embodiment, the method further comprises: the isolation baffle divides the ventilation channel into a condensation area and an air mixing area, the condensation area is an area where the semiconductor cooling module liquefies water vapor in part of gas entering the ventilation channel into liquid water, and the air mixing area is an area where gas flowing out of the condensation area is mixed with the other part of gas entering the ventilation channel.

In this embodiment, the ventilation channel is divided into a "condensation zone" and a "mixed air zone" by the isolation baffle, so that the low-temperature dehumidified air flowing out of the condensation zone is mixed with the air inside the outdoor equipment in the mixed air zone. The temperature of the gas after mixing is improved, and the temperature of the gas after avoiding the dehumidification is low excessively, enters into the inside back of outdoor equipment, leads to the problem that the inside gas of outdoor equipment appears the precooling condensation.

In a second aspect, the present application provides an outdoor device comprising: at least one dehumidification device according to each possible implementation of the first aspect, the dehumidification device is disposed inside the outdoor unit, and is configured to liquefy water vapor in the gas inside the outdoor unit into liquid water, so as to reduce humidity in the gas inside the outdoor unit. Wherein, outdoor equipment can be for having the electric pile, basic station, outdoor rack etc. of filling of liquid cooling system.

In a third aspect, the present application provides a charging apparatus comprising: the battery system comprises at least one battery module and at least one dehumidification device which can be realized according to the first aspect, wherein a liquid cooling system in the dehumidification device is in contact with the at least one battery module and is used for liquefying water vapor in gas in the outdoor equipment into liquid water, reducing humidity in the gas in the outdoor equipment, and enabling the liquid stored in the liquid cooling system to exchange heat with the at least one battery module to reduce the temperature of the at least one battery module. Wherein, battery charging outfit can be for having the electric pile, electric automobile etc. of filling of liquid cooling system.

Drawings

The drawings that accompany the detailed description can be briefly described as follows.

Fig. 1 is a schematic structural diagram of a first dehumidification device provided in an embodiment of the present application;

fig. 2 is a schematic perspective view of a second dehumidification apparatus provided in an embodiment of the present application;

fig. 3 is a schematic side view of a second dehumidification apparatus provided in an embodiment of the present application;

fig. 4 is a simplified structural schematic diagram of a second dehumidification device installed in outdoor equipment provided in an embodiment of the present application;

fig. 5 is a schematic perspective view of a third dehumidification apparatus provided in an embodiment of the present application;

FIG. 6 is a schematic side view of a third dehumidification apparatus provided in the embodiment of the present application;

fig. 7 is a simplified structural schematic diagram of a third dehumidification device provided in the embodiment of the present application and installed in outdoor equipment;

fig. 8 is a schematic side view of a fourth dehumidification device provided in the embodiment of the present application;

fig. 9 is a cross-sectional simplified structural schematic diagram of a ventilation channel in a fourth dehumidification device provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" should be interpreted broadly, such as may be a fixed connection, a removable connection, an interference connection or an integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In the prior art scheme, in order to prevent the inside condensation that forms of outdoor equipment, install heater and fan at outdoor equipment. When the relative humidity inside the outdoor equipment is high, the heater and the fan are controlled to work. The fan blows high-humidity air inside the outdoor equipment to the surface of the heater for heating. The higher the temperature of the gas, the greater the mass of water vapor that can be contained in a gas saturated state. After the temperature of the gas in the outdoor equipment is increased by the heater, the relative humidity of the gas is reduced, and the purpose of reducing the relative humidity and preventing condensation is achieved.

In the prior art, the principle of preventing the condensation formed inside the outdoor equipment is as follows: under the condition that the water vapor content in the gas is not changed, the temperature of the gas is increased to achieve the purpose of reducing the relative humidity. In order to ensure that the relative humidity is always kept at a low level, the heater and the fan need to be controlled again to work when the temperature of the air inside the outdoor cabinet is reduced. According to the implementation scheme, although the outdoor equipment can be placed inside to form condensation, the energy consumption of the outdoor equipment is increased.

In order to solve the great problem of energy consumption of current outdoor equipment, this application adds a dehydrating unit in outdoor equipment newly. The dehumidifying device comprises a semiconductor cooling module which is arranged inside outdoor equipment. After the semiconductor cooling module is connected with an electric signal, two ends, namely a first end and a second end, are formed, and the first end can absorb heat from the surrounding gas, so that the temperature of the surrounding gas is reduced. When the temperature of the surrounding gas is lower than the dew point temperature, the water vapor in the gas is liquefied into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized. If install this dehydrating unit in outdoor equipment, can let the inside gas of outdoor equipment loop through the cold junction, can detach the inside gaseous vapor of outdoor equipment for the inside gaseous relative humidity of outdoor equipment reduces, avoids appearing short circuit, electrochemical corrosion scheduling problem.

For convenience of description, the first end of the semiconductor cooling module that absorbs heat will be referred to as "cold end of the semiconductor cooling module", and the second end of the semiconductor cooling module that releases heat will be referred to as "hot end of the semiconductor cooling module".

The dehumidification device may further include a liquid cooling system including a heat dissipation assembly, a conduit, and a cooling source. The heat dissipation assembly is arranged on the hot end of the semiconductor cooling module, and a circulation passage for liquid circulation is arranged in the heat dissipation assembly. Both ends of the flow passage are respectively communicated with the cooling source through a conduit. When the relative humidity inside the outdoor equipment is high, the cooling source is controlled to provide power, and liquid in the cooling source is made to circulate in the cooling source, the conduit and the heat dissipation assembly. After the liquid with lower temperature flows into the heat dissipation assembly, the liquid can exchange heat with the gas inside the outdoor equipment through the heat dissipation assembly, and the heat of the gas inside the outdoor equipment is taken away, so that the temperature of the gas inside the outdoor equipment is reduced. When the temperature of the gas in the outdoor equipment is lower than the dew point temperature, the water vapor in the outdoor equipment begins to be condensed into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized. Because this application realization principle is opposite with prior art, need not the heater and heats, can reduce outdoor equipment's energy consumption.

Fig. 1 is a schematic structural diagram of a dehumidification device provided in an embodiment of the present application. As shown in fig. 1, the dehumidifying apparatus 100 includes a cooling source 110, a heat dissipating assembly 120, a duct 130, a semiconductor cooling module 140, and a plurality of heat dissipating teeth 150. The input end of the cooling source 110 is communicated with one end of the heat sink assembly 120 through a conduit 130, and the output end of the cooling source 110 is communicated with the other end of the heat sink assembly 120 through a conduit 130. The heat sink 120 is disposed on a surface of one side of the semiconductor cooling module 140. A plurality of heat dissipation teeth 150 are disposed on the other side surface of the semiconductor cooling module 140.

The cooling source 110 is a device in which the liquid cooling system exchanges heat with the external environment. The cooling source 110 may be a stand-alone device or may be a cooling source for a refrigeration system in an outdoor unit. If the cooling source 110 is a standalone device, the cooling source 110 may exchange heat with the air outside the outdoor device to transfer heat from the liquid in the cooling source 110 to the air outside the outdoor device to reduce the temperature of the liquid in the cooling source 110. If the cooling source 110 is a cooling source of a refrigeration system in outdoor equipment, the liquid in the cooling source 110 is reduced in temperature according to the cooling system, and the application is not limited herein. Alternatively, the cooling source 110 may be composed of a fan, a heat exchanger, a water pump, a water tank, and the like. The water tank is used for storing liquid, and the water pump provides power for liquid, lets liquid can circulate in radiator unit 120, and the heat exchanger is in with the heat transfer in the liquid to the air, and the fan blows out the gas after the intensification to the external environment in.

The liquid stored in the cooling source 110 may be water, refrigerant, or other liquid with relatively high heat exchange efficiency, and the application is not limited herein.

At least one flow channel is disposed inside the heat dissipation assembly 120. Each flow channel extends through the entire heat sink assembly 120 and has two ports, an input port and an output port, on the outer surface of the heat sink assembly 120. The input port communicates with the output port of the cooling source 110 through a conduit 130, and the output port communicates with the input port of the cooling source 110 through a conduit 130. After the liquid pumped by the cooling source 110 enters the circulation channel inside the heat dissipation assembly 120, the liquid exchanges heat with the heat dissipation assembly 120 to take out the heat on the heat dissipation assembly 120, thereby reducing the temperature of the heat dissipation assembly 120. Optionally, the inside of the heat dissipation assembly 120 may also be configured as a cavity structure, and two through holes are provided between the cavity structure and the outer surface of the heat dissipation assembly 120, and are used as an input port and an output port. The input port of the cavity structure is in communication with the output port of the cooling source 110 via a conduit 130, and the output port of the cavity structure is in communication with the input port of the cooling source 110 via a conduit 130. Other structures may be disposed inside the heat dissipation assembly 120 to reduce the temperature of the heat dissipation assembly 120, which is not limited herein.

The semiconductor cooling module 140 is disposed on the heat sink assembly 120, and is used for transferring heat of the gas around the semiconductor cooling module 140 to the heat sink assembly 120, so as to reduce the temperature of the gas around the semiconductor cooling module 140. Alternatively, the semiconductor cooling module 140 may be a semiconductor chilling plate. The semiconductor refrigerating sheet is a heat transfer tool, and utilizes the Peltier effect of semiconductor materials, and when a thermocouple formed by connecting a P-type semiconductor material and an N-type non-semiconductor material is connected with Direct Current (DC), heat can be transferred from one end to the other end, so that temperature difference is generated, and the aim of refrigeration can be fulfilled.

Referring to fig. 1, after the two ends of the semiconductor cooling module 140 are connected to the direct current, the cold end of the semiconductor cooling module 140 is the surface of the side away from the heat dissipation assembly 120, and the temperature of the gas around the semiconductor cooling module 140 is reduced by absorbing heat. The hot end of the semiconductor cooling module 140 is close to one side surface of the heat dissipation assembly 120, and the heat in the semiconductor cooling module 140 is transferred to the heat dissipation assembly 120 by releasing the heat and then is taken away by the liquid in the heat dissipation assembly 120.

In order to improve the heat transfer effect between the semiconductor cooling module 140 and the heat sink 120, a heat conductive material with relatively good heat conductivity, such as a heat conductive silicone grease or a heat conductive pad, is disposed between the semiconductor cooling module 140 and the heat sink 120. The hot end of the semiconductor cooling module 140 is thermally connected to the heat dissipation assembly 120 through a material with relatively good thermal conductivity, so as to enhance the heat transfer between the semiconductor cooling module 140 and the heat dissipation assembly 120.

The plurality of heat dissipation teeth 150 are disposed on the cold end of the semiconductor cooling module 140, which may increase the contact area of the cold end of the semiconductor cooling module 140 with the ambient gas. The larger the contact area of the cold end of the semiconductor cooling module 140 with the ambient gas, the faster the semiconductor cooling module 140 absorbs heat from the ambient gas, thereby improving the condensation effect of the dehumidification device.

Among the dehydrating unit of this application protection, be provided with radiator unit on semiconductor cooling module's the hot junction, radiator unit is inside to be provided with the circulation passageway, circulation passageway and cooling source intercommunication. When the dehumidifying device works, direct current is introduced into the semiconductor cooling module, liquid in the cooling source circulates in the circulation channel, and heat of gas around the semiconductor cooling module can be transmitted to the cooling source through the semiconductor cooling module, the radiating assembly and the liquid in sequence, so that the temperature of the gas around the semiconductor cooling module is reduced. When the temperature of the gas around the semiconductor cooling module is lower than the dew point temperature, the water vapor in the gas around the semiconductor cooling module begins to be condensed into liquid water, so that the water vapor content in the gas is reduced, and the condensation and dehumidification effects are realized.

Fig. 2-3 are schematic structural diagrams of a dehumidification device provided in an embodiment of the present application. As shown, the dehumidifying apparatus 200 includes a semiconductor cooling module 210, a plurality of heat dissipation teeth 220, an air duct groove 230, a drain hole 240, and at least one fan 250. The structure and the connection manner of the semiconductor cooling module 210 and the plurality of heat dissipation teeth 220 are the same as those of the dehumidifying apparatus 100 in fig. 1, and the description of the present application is not repeated here.

The semiconductor cooling module 210 is disposed on the air duct groove 230 to form a ventilation passage with the air duct groove 230. The heat dissipation teeth 220 are in the ventilation channel. The drain hole 240 is provided on the air duct groove 230 to collect condensed water in the ventilation channel. The at least one fan 250 may be disposed at an air inlet of the ventilation channel, or at an air outlet of the ventilation channel, or at the air inlet and the air outlet of the ventilation channel, and is used for pumping the air inside the outdoor device into the ventilation channel and blowing the air inside the ventilation channel out to the inside of the outdoor device.

When the dehumidifying device 200 starts the dehumidifying function, the semiconductor cooling module 210 is supplied with dc power and the fans 250 are supplied with current. Each fan 250 pumps the high humidity gas in the outdoor unit into the ventilation channel to dehumidify the gas in the outdoor unit. After the direct current is introduced into the semiconductor cooling module 210, the temperature of the cold end of the semiconductor cooling module 210 and the temperature of the plurality of heat dissipation teeth 220 are reduced, so that the heat of the gas in the ventilation channel can be absorbed, and the temperature reduction of the gas in the ventilation channel is realized. When the temperature of the gas in the ventilation channel is lower than the dew point temperature, the water vapor in the ventilation channel begins to condense into liquid water, so that the water vapor content in the gas is reduced. Upon the cold end of the semiconductor cooling module 210 and the plurality of heat sink fins 220 decreasing in temperature, the water vapor in the ventilation channel will generally form liquid water on the cold end of the semiconductor cooling module 210 and the plurality of heat sink fins 220. The liquid water on the cold end of the semiconductor cooling module 210 and the plurality of heat dissipation teeth 220 can drop on the plane where the drain holes 240 are located, and then the liquid water is discharged out of the ventilation channel through the drain holes 240, so that the condensation and dehumidification effects are realized. The heat on the hot end of the semiconductor cooling module 210 is taken out of the outdoor equipment through the liquid cooling system, so that the heat of the gas in the ventilation channel is transferred to the gas outside the outdoor equipment, and the temperature of the gas in the ventilation channel is reduced.

After the ventilation channel discharges low-temperature and low-humidity gas, the gas can be mixed with the gas inside the outdoor equipment, so that the relative humidity of the gas inside the outdoor equipment is reduced, and the problems of short circuit, electrochemical corrosion and the like are avoided. In addition, the relative temperature of the gas in the outdoor equipment is also reduced, and the gas can be neutralized with the heat generated by a heating device in the outdoor equipment, so that the temperature in the outdoor equipment is prevented from being increased.

In contrast to the dehumidification apparatus 100 shown in fig. 1, the dehumidification apparatus 200 shown in fig. 2-3 does not have a liquid cooling system composed of the cooling source 110, the heat dissipation assembly 120 and the conduit 130. The dehumidifying apparatus 200 can be applied to outdoor equipment having a liquid cooling system.

As shown in fig. 4, a liquid cooling system is disposed inside the outdoor device, and the liquid cooling system includes a cooling source and a plurality of liquid cooling charging modules. The liquid-cooled charging module includes a heat sink assembly, such as heat sink assembly 120 of fig. 1, in communication with the cooling source via a conduit. In the present application, the semiconductor cooling module 210 may be attached to the heat sink assembly through a heat conductive material.

When the dehumidifying device 200 starts the dehumidifying function, the heat at the hot end of the semiconductor cooling module 210 is transferred to the liquid through the heat dissipating component and then is carried into the cooling source by the liquid. The cooling source can exchange heat with the gas outside the outdoor equipment, the heat of the liquid in the cooling source is transferred to the gas outside the outdoor equipment, the heat of the gas in the ventilation channel is transferred to the gas outside the outdoor equipment, and therefore the temperature of the gas in the ventilation channel is reduced.

Fig. 5-6 are schematic structural diagrams of a dehumidification device provided in an embodiment of the present application. As shown, the dehumidifying apparatus 500 includes a heat dissipating member 510, a semiconductor cooling module 520, a plurality of heat dissipating teeth 530, an air duct groove 540, a water discharging hole 550, and at least one fan 560. Compared to the dehumidifying apparatus 200 shown in fig. 2-3, the dehumidifying apparatus 300 adds a heat dissipation assembly 510. Heat dissipation assembly 510 may be heat dissipation assembly 120 described in fig. 1. The other structure is the same as the dehumidifying apparatus 200 shown in fig. 2 to 3, and the description of the present application will not be repeated.

As shown in fig. 7, a liquid cooling heat dissipation system is arranged inside the outdoor device, the liquid cooling heat dissipation system includes a cooling source and a plurality of liquid cooling charging modules, and the plurality of liquid cooling charging modules are communicated with the cooling source through a conduit. In the present application, the heat dissipation module 510 of the dehumidification device 500 is provided with an input port 511 and an output port 512, and the input port 511 and the output port 512 are respectively connected to a cooling source through a pipe. The dehumidifier 500 is connected in parallel with each liquid-cooled charging module on the cooling source.

When the dehumidification device 500 is activated, the liquid in the cooling source is circulated in the heat dissipation assembly 510. The heat on the hot side of the semiconductor cooling module 520 is transferred through the heat sink assembly 510 into the liquid, which is then carried by the liquid into the cooling source. The cooling source can exchange heat with the gas outside the outdoor equipment, the heat of the liquid in the cooling source is transferred to the gas outside the outdoor equipment, the heat of the gas in the ventilation channel is transferred to the gas outside the outdoor equipment, and therefore the temperature of the gas in the ventilation channel is reduced.

Compared to the outdoor device shown in fig. 4, the liquid in the heat sink assembly needs to take away not only the heat at the hot end of the semiconductor cooling module, but also the heat in the liquid-cooled charging module. If the liquid-cooled charging module generates a large amount of heat, the temperature of the liquid in the heat dissipation assembly is relatively high. If the temperature of the liquid in the heat dissipation assembly is relatively high, possibly even higher than the temperature of the hot end of the semiconductor cooling module, the dehumidifying device 400 cannot perform the dehumidifying function. Therefore, in the outdoor device shown in fig. 7, the dehumidifying apparatus 500 and each liquid-cooled charging module are connected in parallel to the cooling source, and the heat dissipation assembly 510 in the dehumidifying apparatus 500 only carries away the heat at the hot end of the semiconductor cooling module, and is not affected by other devices.

Fig. 8-9 are schematic structural diagrams of a dehumidification device provided in an embodiment of the present application. As shown, the dehumidifying apparatus 800 includes a heat dissipating module 810, a semiconductor cooling module 820, a plurality of heat dissipating teeth 830, an air duct groove 840, a water drain hole 850, at least two fans 860, and a separation baffle 870. Compared with the dehumidifying apparatus 500 shown in fig. 5-6, the dehumidifying apparatus 800 is improved in the ventilation passage, and other structures are the same as the dehumidifying apparatus 500 shown in fig. 5-6, and the description of the present application will not be repeated. Alternatively, the dehumidifying apparatus 800 can be modified based on the dehumidifying apparatus 100 shown in fig. 1 or the dehumidifying apparatus 200 shown in fig. 2 to 3, which is not limited herein.

As shown in fig. 9, the partition 870 is provided in the ventilation passage, and divides the ventilation passage into a "condensation zone", an "air mixing zone", and an "air outlet zone". Wherein, the condensation area is close to the air inlet of the ventilation channel, and the process of condensing the water vapor in the gas into liquid water by the dehumidifying device 500 occurs in the area. The condensing area and the air mixing area are communicated, and the dehumidified air can enter the air mixing area from the condensing area. The air mixing area is also close to the air inlet of the ventilation channel, and air inside the outdoor equipment can enter the area. The dehumidified gas and the gas inside the outdoor equipment enter the air mixing area and are mixed in the area. The air mixing area is communicated with the air outlet, and mixed air can enter the air outlet from the air mixing opening. The air outlet is close to the air outlet of the ventilation channel, so that the mixed gas is further mixed in the area. Alternatively, the isolation barrier 870 may divide the ventilation channel into only a "condensation zone" and a "wind mixing zone".

In this application embodiment, cut apart "condensation zone", "mix wind district" and "air-out district" with ventilation channel through division barrier, let the gas that the low temperature dehumidification that the condensation zone flows mix wind district and outdoor equipment inside gas and mix. The temperature of the gas after mixing is improved, avoids the temperature of the gas after the dehumidification to hang down excessively, enters into the inside back of outdoor equipment, leads to the problem of precooling condensation to appear in the inside gas of outdoor equipment.

The embodiment of the application provides an outdoor equipment, and the outdoor equipment can be equipment such as charging pile, outdoor rack, basic station. The outdoor unit comprises at least one dehumidification device as described in figures 1-9 and the corresponding protection schemes described above, which is installed inside the outdoor unit. When the dehumidifying device starts to work, the water vapor in the outdoor equipment is removed by utilizing the principle of condensation and dehumidification, and the water vapor in the outdoor equipment is reduced. Since the outdoor equipment comprises the dehumidifying device, the outdoor equipment package has all or at least part of the advantages of the dehumidifying device.

The embodiment of the application provides a charging device, and the outdoor device can be equipment such as charging pile, electric automobile. The outdoor unit comprises at least one battery module and at least one dehumidifying apparatus as described in fig. 1-9 and the corresponding protection schemes described above, the dehumidifying apparatus is installed inside the outdoor unit, and a liquid cooling system in the dehumidifying apparatus is in contact with the at least one battery module, as shown in fig. 4 and 7. When the dehumidifying device starts to work, the water vapor in the outdoor equipment is removed by utilizing the condensation dehumidifying principle, the water vapor in the outdoor equipment is reduced, the liquid stored in the liquid cooling system is subjected to heat exchange with the at least one battery module, and the temperature of the at least one battery module is reduced. Since the outdoor equipment comprises the dehumidifying device, the outdoor equipment package has all or at least part of the advantages of the dehumidifying device.

The position relationship, number, structural shape, gas flow direction and the like of each component of the dehumidification device provided by the embodiment of the application are not limited to the embodiments, and all technical solutions realized under the principle of the application are within the protection scope of the scheme. Any one or more of the embodiments or illustrations in the specification are intended to be combined in any suitable manner within the scope of the present disclosure.

Finally, the above embodiments are merely used to illustrate the technical solutions of the present application. It will be understood by those skilled in the art that although the present application has been described in detail with reference to the foregoing embodiments, various changes in the embodiments described above may be made and equivalents may be substituted for elements thereof. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (13)

1. A dehumidification apparatus (100, 200,500, 800), comprising:

a semiconductor cooling module (140, 210,520, 820) comprising a first end and a second end, wherein the first end absorbs heat from ambient gas and liquefies water vapor in the ambient gas into liquid water after direct current is applied, and the second end releases heat;

and the liquid cooling system is arranged at the second end of the semiconductor cooling module and used for enabling liquid in the liquid cooling system to exchange heat with the second end so as to reduce the temperature of the second end.

2. A dehumidifying device as claimed in claim 1 wherein the semiconductor cooling module is a semiconductor chilling plate.

3. A dehumidifying device as claimed in claim 1, further comprising:

at least one heat sink (150, 220,530, 830) is disposed on an outer surface of the first end, respectively, for absorbing heat from the ambient gas.

4. A dehumidifying device as claimed in any one of claims 1 to 3 wherein the liquid cooling system comprises:

a heat sink assembly (120, 510, 810) disposed on an outer surface of the second end for absorbing heat on the second end.

5. Dehumidifier apparatus according to claim 4 wherein said heat sink assembly has at least one flow channel disposed therein for allowing liquid in said liquid cooling system to flow into said heat sink assembly.

6. The dehumidification apparatus of claim 5, wherein the liquid cooling system further comprises:

and the cooling source (110) is communicated with at least one circulation channel inside the heat dissipation assembly through a conduit and is used for enabling liquid in the liquid cooling system to circulate inside the heat dissipation assembly and carrying away heat in the heat dissipation assembly.

7. A dehumidifying device as claimed in any one of claims 5 or 6 wherein the heat sink assembly is connected to the second end by a thermally conductive material.

8. A dehumidifying device as claimed in any one of claims 1 to 3, further comprising:

an air duct channel (230, 540, 840) forming a ventilation channel with the first end for allowing air inside the outdoor unit to pass through the first end.

9. The dehumidification apparatus according to claim 8, further comprising:

at least one fan (250, 560, 860) arranged at one or both ends of the ventilation channel for pumping gas inside the outdoor unit into the ventilation channel and/or blowing gas in the ventilation channel into the outdoor unit.

10. The dehumidification apparatus according to claim 8, further comprising:

drain holes (240, 550, 850) are provided on the air duct groove for draining liquid water in the ventilation passage.

11. A dehumidifying device as claimed in claim 8 further comprising:

and the isolation baffle (870) divides the ventilation channel into a condensation area and an air mixing area, the condensation area is an area where the semiconductor cooling module liquefies water vapor in a part of gas entering the ventilation channel into liquid water, and the air mixing area is an area where gas flowing out of the condensation area is mixed with another part of gas entering the ventilation channel.

12. An outdoor unit, comprising:

at least one dehumidification apparatus as in claims 1-11 disposed within the outdoor unit for liquefying water vapor from a gas within the outdoor unit to liquid water to reduce humidity in the gas within the outdoor unit.

13. A charging device, comprising:

at least one of the battery modules is provided with a plurality of battery cells,

at least one dehumidification apparatus as in claims 1-11, wherein a liquid cooling system in said dehumidification apparatus is in contact with said at least one battery module for liquefying water vapor from gas inside said charging device to liquid water, reducing humidity in gas inside said charging device, and allowing liquid stored in said liquid cooling system to exchange heat with said at least one battery module, reducing temperature of said at least one battery module.

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