CN214676255U

CN214676255U - Air conditioner and electric control box

Info

Publication number: CN214676255U
Application number: CN202120351577.2U
Authority: CN
Inventors: 罗彬�; 谭志军; 王命仁; 马熙华
Original assignee: Midea Group Co Ltd; GD Midea Heating and Ventilating Equipment Co Ltd
Current assignee: Midea Group Co Ltd; GD Midea Heating and Ventilating Equipment Co Ltd; Guangdong Midea HVAC Equipment Co Ltd
Priority date: 2020-08-26
Filing date: 2021-02-08
Publication date: 2021-11-09
Anticipated expiration: 2031-02-08
Also published as: CN114110816A; WO2022042597A1; CN114110816B

Abstract

The utility model discloses an air conditioning equipment and automatically controlled box. The electric control box comprises a box body, a mounting plate and a radiator, wherein the box body is provided with a mounting cavity; the mounting plate is arranged in the mounting cavity, so that the mounting cavity forms a first cavity and a second cavity which are positioned at two sides of the mounting plate, and the mounting plate is provided with a first ventilation opening and a second ventilation opening; the radiator comprises a heat exchange main body and a collecting pipe assembly, wherein the collecting pipe assembly is used for providing refrigerant flow to the heat exchange main body, at least part of the heat exchange main body is arranged in the first cavity, the first ventilation opening and the second ventilation opening are provided with a spacing direction, and the flow direction of the refrigerant flow in the heat exchange main body is arranged along the spacing direction; the heat exchange body has a first temperature at a position near the first vent and a second temperature at a position near the second vent, the first temperature being greater than the second temperature. Therefore, the condensation water accumulation can be avoided, a drainage structure needs to be additionally arranged, the temperature of the radiator can be reduced by utilizing the evaporation and heat absorption of the condensation water, and the heat exchange performance of the radiator is improved.

Description

Air conditioner and electric control box

Technical Field

The utility model relates to an air conditioning technology field, concretely relates to air conditioning equipment and automatically controlled box.

Background

Electronic components are usually arranged in an electric control box of the air conditioning device, and the electronic components generate heat when working, so that the temperature in the electric control box is higher. The refrigerant in the radiator in the electric control box flows to enable the temperature of the radiator to be lower, and air with higher temperature in the electric control box is easy to condense when contacting the radiator, so that condensed water is formed on the surface of the radiator. If the generated condensed water flows to the position of the electronic element, the electronic element is easy to be short-circuited or damaged, and a fire hazard is generated more seriously.

SUMMERY OF THE UTILITY MODEL

The utility model provides an air conditioning device and automatically controlled box to the comdenstion water that the radiator produced among the solution prior art damages electronic component's technical problem easily.

In order to solve the technical problem, the utility model discloses a technical scheme be: there is provided an electronic control box comprising: the box body is provided with a mounting cavity; the mounting plate is arranged in the mounting cavity, so that the mounting cavity forms a first cavity and a second cavity which are positioned at two sides of the mounting plate, a first vent and a second vent are arranged on the mounting plate at intervals, so that the gas in the first cavity flows into the second cavity through the first vent, and the gas in the second cavity flows into the first cavity through the second vent; the radiator comprises a heat exchange body and a collecting pipe assembly, the collecting pipe assembly is used for providing a refrigerant flow to the heat exchange body, at least part of the heat exchange body is arranged in the first cavity, the first ventilation opening and the second ventilation opening are provided with a spacing direction, and the refrigerant flow in the heat exchange body is arranged along the spacing direction; wherein the heat exchange body has a first temperature at a position near the first vent and a second temperature at a position near the second vent, the first temperature being greater than the second temperature.

For solving the technical problem, the utility model discloses a another technical scheme is: the air conditioning device comprises an air conditioning body and the electric control box, wherein the electric control box is detachably connected with the air conditioning body.

The embodiment of the utility model provides a position department near first vent has first temperature through setting up the heat transfer main part, and position department near the second vent has the second temperature, first temperature is greater than the second temperature, make the quantity of the comdenstion water that the position department near the second vent produced more, when the higher air of temperature gets into first cavity through the second vent in first cavity, can contact with the comdenstion water and then make the comdenstion water evaporate, so, can avoid the comdenstion water to gather and need add drainage structures on the one hand, on the other hand also can utilize the comdenstion water evaporation endotherm and reduce the temperature of radiator, reduce the temperature of the refrigerant flow in the radiator, promote the heat transfer performance of radiator.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of an air conditioning system in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a heat exchange body of the heat exchanger of FIG. 1;

FIG. 3 is a schematic structural view of the single-layer microchannel and the multi-layer microchannel of FIG. 2;

FIG. 4 is a schematic block diagram of an embodiment of a manifold assembly of the heat exchanger of FIG. 1;

FIG. 5 is a schematic structural view of another embodiment of a header assembly of the heat exchanger of FIG. 1;

FIG. 6 is a schematic block diagram of yet another embodiment of a header assembly of the heat exchanger of FIG. 1;

FIG. 7 is a schematic structural diagram of a heat exchange body of a heat exchanger according to another embodiment of the present application;

FIG. 8 is a perspective view of the first tube of FIG. 7;

FIG. 9 is a schematic structural diagram of a heat exchange body of a heat exchanger according to another embodiment of the present application;

FIG. 10 is a schematic diagram of the heat exchanger of FIG. 9;

fig. 11 is a schematic perspective view of an electric control box in an embodiment of the present application with some components hidden;

FIG. 12 is a schematic perspective view of the heat sink of FIG. 11;

FIG. 13 is a schematic perspective view of a heat sink in another embodiment of the present application;

fig. 14 is a schematic perspective view illustrating a fixing bracket and a heat sink according to an embodiment of the present application;

FIG. 15 is a perspective view of a fixing bracket and a heat sink in accordance with another embodiment of the present application;

fig. 16 is a schematic perspective view illustrating a heat dissipation fixing plate and a heat sink according to an embodiment of the present application;

fig. 17 is a schematic plan view of a heat dissipation fixing plate according to an embodiment of the present application;

fig. 18 is a schematic cross-sectional view of a heat sink and an electronic control box according to another embodiment of the present application;

FIG. 19 is a cross-sectional view of a heat sink engaged with an electronic control box in another embodiment of the present application;

fig. 20 is a schematic perspective view illustrating a heat sink and a heat dissipating fin according to an embodiment of the present application;

FIG. 21 is a schematic perspective view of a heat sink and a heat dissipating fin according to another embodiment of the present application;

FIG. 22 is a schematic perspective view of a heat sink in another embodiment of the present application;

FIG. 23 is a schematic plan view of a heat sink engaged with an electronic control box in another embodiment of the present application;

FIG. 24 is a cross-sectional view of a heat sink engaged with an electronic control box in accordance with yet another embodiment of the present application;

FIG. 25 is a schematic plan view of a heat sink engaged with an electronic control box in accordance with yet another embodiment of the present application;

fig. 26 is a schematic cross-sectional view of a heat sink engaged with an electronic control box according to another embodiment of the present application;

FIG. 27 is a schematic plan view of a heat sink engaged with an electronic control box in accordance with yet another embodiment of the present application;

FIG. 28 is a cross-sectional view of the heat sink of FIG. 27 mated with the electronics compartment;

fig. 29 is a schematic cross-sectional view of a heat sink engaged with an electronic control box according to another embodiment of the present application;

fig. 30 is a schematic perspective view of an electric control box according to another embodiment of the present application with some components hidden;

fig. 31 is a schematic perspective view of an electric control box according to another embodiment of the present application with some components hidden;

fig. 32 is a schematic plan view of an electric control box according to another embodiment of the present application with some components hidden;

fig. 33 is a schematic sectional structure view of the electronic control box in fig. 32.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an air conditioning system according to an embodiment of the present application. As shown in fig. 1, the air conditioning system 1 mainly includes a compressor 2, a four-way valve 3, an outdoor heat exchanger 4, an indoor heat exchanger 5, a heat exchanger 6, an expansion valve 12, and an expansion valve 13. The expansion valve 13 and the heat exchanger 6 are disposed between the outdoor heat exchanger 4 and the indoor heat exchanger 5, and the compressor 2 provides a refrigerant flow circulating between the outdoor heat exchanger 4 and the indoor heat exchanger 5 through the four-way valve 3.

The heat exchanger 6 includes a first heat exchange path 610 and a second heat exchange path 611, a first end of the first heat exchange path 610 is connected to the outdoor heat exchanger 4 through an expansion valve 13, a second end of the first heat exchange path 610 is connected to the indoor heat exchanger 5, a first end of the second heat exchange path 611 is connected to a second end of the first heat exchange path 610 through an expansion valve 12, and a second end of the second heat exchange path 611 is connected to the suction port 22 of the compressor 2.

When the air conditioning system 1 is in the cooling mode, the path of the refrigerant flow is as follows:

the exhaust port 21 of the compressor 2, the connection port 31 of the four-way valve 3, the connection port 32 of the four-way valve 3, the outdoor heat exchanger 4, the heat exchanger 6, the indoor heat exchanger 5, the connection port 33 of the four-way valve 3, the connection port 34 of the four-way valve 3, and the suction port 22 of the compressor 2.

The path (main path) of the refrigerant flow of the first heat exchange channel 610 is: a first end of the first heat exchange channel 610-a second end of the first heat exchange channel 610-the indoor heat exchanger 5. The path (sub path) of the refrigerant flow of the second heat exchange channel 611 is: second end of the first heat exchange passage 610-expansion valve 12-

The first end of the second heat exchange channel 611-the second end of the second heat exchange channel 611-the suction port 22 of the compressor 2.

For example, the operating principle of the air conditioning system 1 at this time is: the outdoor heat exchanger 4 serves as a condenser, and outputs a medium-pressure medium-temperature refrigerant flow (the temperature may be 40 ° or less) through the expansion valve 13, the refrigerant flow of the first heat exchange channel 610 is the medium-pressure medium-temperature refrigerant flow, the expansion valve 12 converts the medium-pressure medium-temperature refrigerant flow into a low-pressure low-temperature refrigerant flow (the temperature may be 10 ° or less, and a gas-liquid two-phase refrigerant flow), and the refrigerant flow of the second heat exchange channel 611 is the low-pressure low-temperature refrigerant flow. The low-pressure low-temperature refrigerant flow of the second heat exchange channel 611 absorbs heat from the medium-pressure medium-temperature refrigerant flow of the first heat exchange channel 610, and further the refrigerant flow of the second heat exchange channel 611 is gasified, so that the refrigerant flow of the first heat exchange channel 610 is further supercooled. The gasified refrigerant flow of the second heat exchange channel 611 performs enhanced vapor injection on the compressor 2, so as to improve the refrigerating capacity of the air conditioning system 1.

The expansion valve 12 is used as a throttling component of the second heat exchange channel 611, and adjusts the flow rate of the refrigerant flow of the second heat exchange channel 611. The refrigerant flow of the first heat exchange channel 610 exchanges heat with the refrigerant flow of the second heat exchange channel 611 to supercool the refrigerant flow of the first heat exchange channel 610. Therefore, the heat exchanger 6 can be used as an economizer of the air conditioning system 1, and the supercooling degree is improved, so that the heat exchange efficiency of the air conditioning system 1 is improved.

Further, as understood by those skilled in the art, in the heating mode, the connection port 31 of the four-way valve 3 is connected to the connection port 33, and the connection port 32 of the four-way valve 3 is connected to the connection port 34. The refrigerant flow output from the compressor 2 through the discharge port 21 flows from the indoor heat exchanger 5 to the outdoor heat exchanger 4, and the indoor heat exchanger 5 serves as a condenser. At this time, the refrigerant flow output from the indoor heat exchanger 5 is divided into two paths, one of which flows into the first heat exchange channel 610 (main path), and the other of which flows into the second heat exchange channel 611 (auxiliary path) via the expansion valve 12. The refrigerant flow of the second heat exchange channel 611 can also realize supercooling of the refrigerant flow of the first heat exchange channel 610, and the refrigerant flow flowing through the second heat exchange channel 611 performs air supplement and enthalpy increase on the compressor 2, so that the heating capacity of the air conditioner is improved.

The present application further optimizes the following aspects based on the overall structure of the air conditioning system 1 described above:

1. micro-channel heat exchanger

As shown in fig. 2, the heat exchanger 6 comprises a heat exchange body 61, the heat exchange body 61 is provided with a plurality of microchannels 612, and the plurality of microchannels 612 are divided into a first microchannel and a second microchannel, wherein the first microchannel serves as a first heat exchange channel 610 of the heat exchanger 6, and the second microchannel serves as a second heat exchange channel 611 of the heat exchanger 6. Thus, first microchannel 610 is given the same reference number as first heat exchange channel 610 and second microchannel 611 is given the same reference number as second heat exchange channel 611.

The heat exchange body 61 may comprise a single plate body 613, the plate body 613 is provided with a plurality of microchannels 612, the plurality of microchannels 612 of the plate body 613 may be divided into first microchannels 610 and second microchannels 611 which are alternately arranged, and an extending direction D1 of the first microchannels 610 and an extending direction D2 of the second microchannels 611 are parallel to each other, for example, the extending direction D1 of the first microchannels 610 is the same as the extending direction D2 of the second microchannels 611. The board 613 may be a flat pipe so that a heat dissipation element or an electronic element may be disposed on the board 613. In other embodiments, the plate body 613 may also be a carrier with a cross section of other shapes, such as a cylinder, a rectangular parallelepiped, a cube, and the like. In other embodiments, as described below, the heat exchange body 61 may also include at least two plates disposed on top of each other or two tubes nested within each other.

The cross-sectional shape of each micro channel 612 perpendicular to its extension direction may be rectangular, with each micro channel 612 having a side of 0.5mm to 3 mm. The thickness between each micro channel 612 and the surface of plate body 613 and between micro channels 612 is 0.2mm-0.5mm so that micro channels 612 meet the requirements of pressure resistance and heat transfer performance. In other embodiments, the cross-sectional shape of the micro-channels 612 may be other shapes, such as circular, triangular, trapezoidal, elliptical, or irregular.

For example, in the cooling mode of the air conditioning system shown in fig. 1, a first refrigerant flow (i.e., a medium-pressure medium-temperature refrigerant flow) flows through the first microchannel 610, a second refrigerant flow (i.e., a low-pressure low-temperature refrigerant flow) flows through the second microchannel 611, the first refrigerant flow may be a liquid-phase refrigerant flow, and the second refrigerant flow may be a gas-liquid two-phase refrigerant flow. The second refrigerant stream absorbs heat from the first refrigerant stream of the first microchannel 610 during flow along the second microchannel 611 and is further vaporized to further subcool the first refrigerant stream.

It should be noted that the heat exchanger based on the micro-channel structure described above and below is not limited to the application scenario shown in fig. 1, and thus the first micro-channel 610 and the second micro-channel 611 and the "first" and "second" in the first refrigerant flow and the second refrigerant flow are only used for distinguishing different micro-channels and refrigerant flows, and should not be considered as limiting the specific application of the micro-channels and refrigerant flows. For example, in other embodiments or operation modes, the first refrigerant flow flowing through the first microchannel 610 absorbs heat of the second refrigerant flow of the second microchannel 611, and the states of the first refrigerant flow and the second refrigerant flow are not limited to the liquid phase or the gas-liquid two-phase as defined above.

As shown in fig. 1, the flow direction a1 of the first refrigerant flow is opposite to the flow direction a2 of the second refrigerant flow, so that a large temperature difference exists between the temperature of the first refrigerant flow and the temperature of the second refrigerant flow, and the heat exchange efficiency of the first refrigerant flow and the second refrigerant flow is improved.

Alternatively, the flow direction a1 of the first refrigerant stream may be the same as or perpendicular to the flow direction a2 of the second refrigerant stream.

Alternatively, heat exchange body 61 may comprise at least two sets of first microchannels 610 and second microchannels 611, which sets of first microchannels 610 and second microchannels 611 are spaced apart from each other in a direction perpendicular to the direction of extension D1, which is the width direction of plate body 613, as shown in fig. 2, and in other embodiments, which may be the thickness direction of plate body 613. For example, a first predetermined number of micro-channels in the plurality of micro-channels 612 are divided into first micro-channels 610, a second predetermined number of micro-channels in the plurality of micro-channels 612 are divided into second micro-channels 611, and the plurality of sets of first micro-channels 610 and the plurality of sets of second micro-channels 611 are alternately arranged in sequence, that is, the second micro-channels 611 are arranged between two sets of first micro-channels 610, and the first micro-channels 610 are arranged between two sets of second micro-channels 611, so that the at least two sets of first micro-channels 610 and the second micro-channels 611 are arranged at intervals to form the heat exchanger 6 in which the first micro-channels 610 and the second micro-channels 611 are alternately arranged, as shown in fig. 2. The first and second preset numbers may be equal, for example 3; in other embodiments, the first predetermined number and the second predetermined number may not be equal, for example, the first predetermined number is 3 and the second predetermined number is 2.

Alternatively, the first predetermined number and the second predetermined number may be 1, one microchannel in the plurality of microchannels 612 is the first microchannel 610, and one microchannel disposed adjacent to the first microchannel 610 is the second microchannel 611.

Taking the heat exchange body 61 provided with 10 × 10 microchannels 612 as an example, the cross-sectional area of the heat exchange body 61 is the same as that of the conventional channels, and refrigerant flows with the same mass and flow rate respectively flow through the 10 × 10 microchannels 612 and the conventional channels. The characteristic length Dh of each microchannel 612 is 1/10 for the conventional channel, where the pressure drop is related to L/(Dh)²) In proportion, maintaining the same pressure drop, the length L of the microchannel 612 is 1/100 the length of the conventional channel.

The effective heat exchange area of the microchannels 612 is 1/10 the effective heat exchange area of the conventional channels. Based on the formula: the heat transfer coefficient is constant, and the heat transfer coefficient of the micro-channel 612 is 10 times that of the conventional channel; based on the formula: the heat exchange amount is the heat exchange coefficient, and the heat exchange amount of the micro channel 612 is equal to that of the conventional channel. Thus, 10 x 10 microchannels 612 have a length 1/100 that is the length of a conventional channel, i.e., the same thermal load requirements can be met.

Through the above manner, the heat exchange main body 61 is provided with the plurality of first microchannels 610 and the plurality of second microchannels 611, so that the length of the heat exchange main body 61 is shortened, and the volume of the heat exchanger 6 is further reduced under the condition that the heat exchange amount of the economizer is equal.

As shown in fig. 3, the plurality of microchannels 612 may be arranged as a single layer microchannel or a multi-layer microchannel. In fig. 3, the cross-sectional area of the multi-layer microchannel is 4 times the cross-sectional area of the single-layer microchannel, the length of the single-layer microchannel is 4 times the length of the multi-layer microchannel, refrigerant flows with the same mass and flow rate respectively flow through the single-layer microchannel and the multi-layer microchannel, and the flow rate of the multi-layer microchannel is 1/4 of the flow rate of the single-layer microchannel.

Under the condition that the flow state of the refrigerant flow is laminar flow, the pressure drop of the multilayer microchannel is 1/16 of the pressure drop of the single-layer microchannel, wherein the characteristic length of the heat exchange coefficient is constant, the characteristic length is unchanged, the heat exchange coefficient is unchanged, the heat transfer area of the single-layer microchannel and the heat transfer area of the multilayer microchannel are unchanged, and the heat transfer quantity of the single-layer microchannel is identical to the heat transfer quantity of the multilayer microchannel. Therefore, when the flow velocity of the refrigerant flow is low and the flow state of the refrigerant flow is laminar, the larger the cross-sectional area of the plurality of microchannels 612 is, the shorter the length of the plurality of microchannels 612 is, and the flow resistance loss of the refrigerant flow can be reduced.

Under the condition that the flow state of the refrigerant flow is turbulent flow, the pressure drop of the multilayer microchannel is 1/48 of the pressure drop of the single-layer microchannel, at the moment, the heat exchange coefficient has a functional relation with the flow speed of the refrigerant flow, the larger the flow speed of the refrigerant flow is, the larger the heat exchange coefficient is, and therefore the heat transfer capacity of the single-layer microchannel is higher than that of the multilayer microchannel. As described above, when the heat transfer amount is satisfied, the pressure loss of the refrigerant flow can be reduced as the cross-sectional area of the plurality of microchannels 612 is increased.

1.1 manifold Assembly

As shown in fig. 4, the heat exchanger 6 further includes a header assembly 62, and the header assembly 62 and the heat exchange body 61 are horizontally disposed, for example, the header assembly 62 and the heat exchange body 61 are horizontally disposed. In other embodiments, the header assembly 62 is vertically disposed, i.e., the header assembly 62 is disposed along a direction perpendicular to the horizontal plane (i.e., the direction of gravity), and the heat exchange body 61 is horizontally disposed; or, the collecting pipe assembly 62 is vertically arranged, and the heat exchange main body 61 is vertically arranged; alternatively, the header assembly 62 is horizontally disposed and the heat exchange body 61 is vertically disposed.

The header assembly 62 includes a first header 621 and a second header 622, the first header 621 being provided with a first collecting passage, and the second header 622 being provided with a second collecting passage. The cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow (the first refrigerant flow or the second refrigerant flow) in the heat exchange body 61 is I-shaped. In other embodiments, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 may be L-shaped, U-shaped, G-shaped, or circular.

The first collecting channel is connected to the first microchannel 610 to provide the first refrigerant flow to the first microchannel 610 through the first collecting channel and/or to collect the first refrigerant flow flowing through the first microchannel 610. In this embodiment, the number of the first collecting pipes 621 is two, and the two first collecting pipes 621 are respectively connected to two ends of the first microchannel 610, so as to provide a first refrigerant flow to the first microchannel 610 by using one of the two first collecting pipes 621; and the other of the two first headers 621 is used to collect the first refrigerant flow passing through the first micro-channel 610.

For example, in the air conditioning system shown in fig. 1, the first end of the first microchannel 610 is connected to the outdoor heat exchanger 4 through the expansion valve 13 via one of the two first collecting pipes 621, so as to provide the first refrigerant flow to the first microchannel 610 in the cooling mode; the second end of the first microchannel 610 is connected to the indoor heat exchanger 5 through the other of the two first headers 621 to collect the first refrigerant flow flowing through the first microchannel 610. In the heating mode, since the flow direction of the first refrigerant flow in the first microchannels 610 is opposite, the functions of the two first collecting pipes 621 are interchanged compared to the cooling mode.

The second collecting channel is connected to the second microchannel 611 to supply the second refrigerant flow to the second microchannel 611 through the second collecting channel and/or to collect the second refrigerant flow flowing through the second microchannel 611. In this embodiment, the number of the second collecting pipes 622 is two, and the two second collecting pipes 622 are respectively connected to two ends of the second microchannel 611, so as to provide the second refrigerant flow to the second microchannel 611 by using one of the two second collecting pipes 622; and the second refrigerant flow flowing through the second microchannels 611 is collected by the other of the two second headers 622.

For example, in the air conditioning system shown in fig. 1, the first end of the second microchannel 611 is connected to the expansion valve 12 through one of the two second collecting pipes 622 to provide the second refrigerant flow to the second microchannel 611; the second end of the second microchannel 611 is connected to the suction port 22 of the compressor 2 through the other of the two second collecting pipes 622 to collect the second refrigerant flow passing through the second microchannel 611.

In an embodiment, the same end of the first microchannel 610 in the at least two groups of first microchannels 610 and the same end of the second microchannels 611 in the at least two groups of second microchannels 611 are connected to the same first collecting pipe 621, that is, the same end of all the first microchannels 610 of the heat exchanger 6 is connected to the same first collecting pipe 621, and the same end of all the second microchannels 611 of the heat exchanger 6 is connected to the same second collecting pipe 622, so as to avoid providing a corresponding collecting pipe for each microchannel, and reduce the cost.

In the embodiment shown in fig. 4, since the extending direction D1 of the first microchannel 610 and the extending direction D2 of the second microchannel 611 are parallel to each other, the extending directions of the first header 621 and the second header 622 are parallel to each other. However, in other embodiments, the extending directions of the first header 621 and the second header 622 may be adjusted according to the extending directions of the first microchannel 610 and the second microchannel 611, for example, arranged perpendicular to each other.

1.2 the first collecting pipe and the second collecting pipe are arranged at intervals

As shown in fig. 4, the first header 621 and the second header 622 are disposed at intervals along the extending direction of the heat exchange body 61, the extending direction of the heat exchange body 61 is the same as the extending direction D1 of the first microchannel 610 and the extending direction D2 of the second microchannel 611, the second microchannel 611 penetrates the first header 621 and is connected to the second header 622, wherein the first header 621 is disposed between the second header 622 and the heat exchange body 61, the second microchannel 611 penetrates the first header 621 and is inserted into the second header 622 and is fixed by welding, and the first microchannel 610 is inserted into the first header 621 and is fixed by welding. In other embodiments, the first microchannel 610 may be inserted into the first header 621 after penetrating the second header 622.

The distance between the first header 621 and the second header 622 is R-2R, where R is the maximum cross-sectional dimension of the first header 621 along the direction of the interval between the first header 621 and the second header 622. The cross-sectional shapes of the first header 621 and the second header 622 may be both circular, and R is the diameter of the first header 621 or the diameter of the second header 622. In other embodiments, the cross-sectional shapes of the first header 621 and the second header 622 may be configured to be other shapes, such as an oval shape, a square shape, a rectangle shape, or an irregular shape, and when the cross-sectional shapes of the first header 621 and the second header 622 are non-circular, R is the diameter of a circle circumscribed by the first header 621 or the second header 622.

Therefore, the distance between the first header 621 and the second header 622 is set to be large, so that the first header 621 and the second header 622 can be easily welded to the heat exchange body 61. In addition, the second microchannel 611 located between the first header 621 and the second header 622 does not exchange heat with the first microchannel 610, and by setting the distance between the first header 621 and the second header 622 to be small, the length of the second microchannel 611 located between the first header 621 and the second header 622 can be reduced, and the heat exchange area of the second microchannel 611 can be increased.

In other embodiments, the first header 621 and the second header 622 may be welded together to reduce the distance between the first header 621 and the second header 622.

In addition, the first microchannel 610 may bypass the second header 622 and then connect to the first header 621, for example, the first microchannel 610 is disposed outside the second header 622 and then connects to the first header 621 after bypassing the second header 622. Alternatively, the second microchannel 611 may bypass the first header 621 and then connect to the second header 622.

1.3 dividing the main header into two headers

As shown in fig. 5, the header assembly 62 includes a main header 623 and a flow dividing plate 624, and the flow dividing plate 624 is disposed in the main header 623 and is used for dividing the main header 623 into a first header 621 and a second header 622, i.e., the main header 623 is disposed as the first header 621 and the second header 622 separated by the flow dividing plate 624. At this time, as shown in fig. 5, the first microchannels 610 penetrate the sidewall of the main header 623 and are inserted into the first header 621, and the second microchannels 611 penetrate the sidewall of the main header 623 and the cutoff plate 624 and are inserted into the second header 622. In other embodiments, the second microchannels 611 extend through the sidewall of the header 623 and are inserted into the second header 622, while the first microchannels 610 extend through the sidewall of the header 623 and the cutoff plate 624 and are inserted into the first header 621. In comparison to the manifold assembly 62 shown in fig. 4: in this embodiment, the function of the first header 621 and the function of the second header 622 are simultaneously realized by one header 623, so that the cost and the volume of the header assembly 62 can be reduced.

In other embodiments, the header 623 may be divided into two first headers 621 or two second headers 622 using the cutoff plate 624. At this time, one end of the first microchannel 610 penetrates the sidewall of the main header 623 and is inserted into one of the first headers 621, and the other end of the first microchannel 610 penetrates the sidewall of the main header 623 and is inserted into the other of the first headers 621. One first header 621 of the two first headers 621 is configured to provide a first refrigerant flow to the first micro-channel 610, and the other first header 621 of the two first headers 621 is configured to collect the first refrigerant flow flowing through the first micro-channel 610, where the first micro-channel 610 is a U-shaped flow path.

Alternatively, one end of the second microchannel 611 penetrates the sidewall of the main header 623 and is inserted into one of the second headers 622, and the other end of the second microchannel 611 penetrates the sidewall of the main header 623 and the cutoff plate 624 and is inserted into the other of the second headers 622. One of the two second headers 622 is configured to provide a second refrigerant flow to the second microchannel 611, and the other of the two second headers 622 is configured to collect the second refrigerant flow flowing through the second microchannel 611, where the second microchannel 611 is a U-shaped flow path.

1.4 nesting arrangement of first header and second header

As shown in fig. 6, the diameter of the second header 622 is smaller than that of the first header 621, the first header 621 is sleeved outside the second header 622, and the first microchannel 610 penetrates through the sidewall of the first header 621 and is inserted into the first header 621. The second microchannels 611 extend through the sidewalls of the first header 621 and the second header 622 and are inserted into the second header 622. In other embodiments, the second header 622 may be sleeved outside the first header 621, and the second micro-channels 611 penetrate through the sidewall of the second header 622 and are inserted into the second header 622. The first microchannels 610 extend through the sidewalls of the second header 622 and the first header 621 and are inserted into the first header 621.

In comparison to the manifold assembly 62 shown in fig. 4: the nested arrangement allows for a reduction in the volume of the manifold assembly 62.

In other embodiments, it may be that the two first headers 621 are nested within each other, or that the two second headers 622 are nested within each other. At this time, one end of the first microchannel 610 penetrates the sidewall of the outer first header 621 and is inserted into the outer first header 621. The other end of the first microchannel 610 penetrates the sidewalls of the two first headers 621 and is inserted into the inner first header 621. The outer first collecting pipe 621 is configured to provide a first refrigerant flow to the first micro channel 610, and the inner first collecting pipe 621 is configured to collect the first refrigerant flow flowing through the first micro channel 610; or the inner first collecting pipe 621 is used for providing the first refrigerant flow to the first microchannel 610, and the outer first collecting pipe 621 is used for collecting the first refrigerant flow flowing through the first microchannel 610; the first microchannel 610 is a U-shaped flow path at this time.

Alternatively, one end of the second microchannel 611 penetrates the sidewall of the outer second header 622 and is inserted into the outer second header 622. The other end of the second microchannel 611 penetrates the sidewalls in the two second headers 622 and is inserted into the inner second header 622. The outer second collecting pipe 622 is configured to provide a second refrigerant flow to the second microchannel 611, and the inner second collecting pipe 622 is configured to collect the second refrigerant flow flowing through the second microchannel 611; alternatively, the inner second collecting pipe 622 is used for providing the second refrigerant flow to the second microchannel 611, and the outer second collecting pipe 622 is used for collecting the second refrigerant flow flowing through the second microchannel 611; the second microchannel 611 is a U-shaped flow path at this time.

2. Sleeve type heat exchanger

As shown in fig. 7, the heat exchanger 6 includes a heat exchange body 61, and the heat exchange body 61 includes a first tubular body 614 and a second tubular body 615 which are nested with each other. A plurality of first microchannels 610 are arranged in the first tube 614, a plurality of second microchannels 611 are arranged in the second tube 615, and the plurality of first microchannels 610 and the plurality of second microchannels 611 are the same as the microchannels 612 shown in fig. 2, so that the length of the heat exchange main body 61 is shortened, and the volume of the heat exchanger 6 is further reduced.

The plurality of first microchannels 610 of the first tubular body 614 serve as first heat exchange channels 610 of the heat exchanger 6 and the plurality of second microchannels 611 of the second tubular body 615 serve as second heat exchange channels 611 of the heat exchanger 6. Wherein, the extending direction of first microchannel 610 and the extending direction of second microchannel 611 are parallel to each other, for example, the extending direction of first microchannel 610 is the same as the extending direction of second microchannel 611.

In this embodiment, the first tube 614 is sleeved outside the second tube 615, and the outer surface of the first tube 614 is provided with at least one flat surface 616 to form a heat exchange contact surface of the first tube 614, as shown in fig. 8. Heat dissipation elements or electronic components may be disposed on the planar surface 616 for ease of mounting. In other embodiments, the second tube 615 can be disposed outside the first tube 614.

In the air conditioning system shown in fig. 1, the first refrigerant flow may be a liquid-phase refrigerant flow, and the second refrigerant flow may be a gas-liquid two-phase refrigerant flow. The second refrigerant stream absorbs heat from the first refrigerant stream of the first microchannels 610 during flow along the second microchannels 611 and is further vaporized to further subcool the first refrigerant stream. In other embodiments, the first refrigerant flow and the second refrigerant flow may adopt other arrangements described above.

In contrast to the heat exchanger 6 shown in fig. 2: the heat exchange body 61 has a large cross-sectional area, and pressure loss of the refrigerant flow can be reduced. In addition, the first pipe 614 is sleeved outside the second pipe 615, so that the heat exchange area between the first microchannels 610 and the second microchannels 611 can be increased, and the heat exchange efficiency between the first heat exchange channels 610 and the second heat exchange channels 611 can be increased.

Referring to fig. 4, the heat exchanger 6 further comprises a header assembly 62, the header assembly 62 comprises a first header 621 and a second header 622, the first header 621 is provided with a first header passage, and the second header 622 is provided with a second header passage. The cross-sectional shape of the heat exchanger 6 is I-shaped, for example, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 is I-shaped. In other embodiments, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 may be L-shaped, U-shaped, G-shaped, or circular.

The first collecting channel is connected to the first microchannels 610 to provide a first refrigerant flow to the plurality of first microchannels 610 through the first collecting channel and/or to collect the first refrigerant flow flowing through the plurality of first microchannels 610. The number of the first collecting pipes 621 is two, and the two first collecting pipes 621 are respectively connected to two ends of the first pipe body 614, so that one of the two first collecting pipes 621 is used for providing a first refrigerant flow to the plurality of first microchannels 610; and the other of the two first headers 621 is used to collect the first refrigerant flow passing through the plurality of first microchannels 610.

The second collecting channel is connected to the second microchannels 611 to provide a second refrigerant flow to the plurality of second microchannels 611 through the second collecting channel and/or to collect the second refrigerant flow flowing through the plurality of second microchannels 611. The number of the second collecting pipes 622 is two, and the two second collecting pipes 622 are respectively connected to two ends of the second pipe 615, so as to provide a second refrigerant flow to the plurality of second microchannels 611 by using one of the two second collecting pipes 622; and the second refrigerant flow passing through the second microchannels 611 is collected by the other of the two second headers 622.

Alternatively, the heat exchange body 61 may include at least two sets of the first and

second tubes

614 and 615, the at least two sets of the first and

second tubes

614 and 615 being spaced apart from each other in a direction perpendicular to the extending direction. For example, the at least two sets of first and

second tubes

614 and 615 may include a first set of first and

second tubes

614 and 615 nested within each other, a second set of first and

second tubes

614 and 615 nested within each other, the first and second sets of first and

second tubes

614 and 615 nested within each other being spaced apart from the second set of first and

second tubes

614 and 615 along a direction perpendicular to the extending direction.

The same end of the first tube 614 of the at least two groups of first tubes 614 and the same end of the second tube 615 of the at least two groups of first tubes 615 are connected to the same first header 621, and the same end of the second tube 615 of the at least two groups of first tubes 614 and the same end of the second tube 615 of the at least two groups of second tubes 615 are connected to the same second header 622, so that the cost can be reduced.

The manifold assembly 62 may also be provided in the various manifold arrangements described above, such as the first manifold 621 and the second manifold 622 spaced apart from each other, the manifold 623 and the cutoff 624, or the first manifold 621 and the second manifold 622 nested within each other, as described above. At this time, the first tube 614 with the first micro-channel 610 thereon and the second tube 615 with the second micro-channel 611 thereon can be matched with the above-mentioned header in the manner described above, and are not described herein again.

3. The heat exchanger has a first plate body and a second plate body which are arranged in a stacked manner

As shown in fig. 9, the heat exchanger 6 includes a heat exchange body 61, and the heat exchange body 61 includes a first plate body 631 and a second plate body 632, and the first plate body 631 and the second plate body 632 are stacked on each other.

A plurality of first microchannels 610 are disposed in the first plate 631, a plurality of second microchannels 611 are disposed in the second plate 632, and the plurality of first microchannels 610 and the plurality of second microchannels 611 are the same as the microchannels 612 shown in fig. 2, and are not described herein again. Therefore, the length of the heat exchange body 61 is shortened, and the volume of the heat exchanger 6 is reduced.

The first plurality of microchannels 610 of the first plate body 631 serves as a first heat exchange channel 610 of the heat exchanger 6 and the second plurality of microchannels 611 of the second plate body 632 serves as a second heat exchange channel 611 of the heat exchanger 6. Wherein, the extending direction of first microchannel 610 and the extending direction of second microchannel 611 are parallel to each other, for example, the extending direction of first microchannel 610 is the same as the extending direction of second microchannel 611. Since the first plate body 631 and the second plate body 632 are stacked on each other, the contact area between the first plate body 631 and the second plate body 632 is increased to increase the heat exchange area between the first heat exchange channel 610 and the second heat exchange channel 611, thereby improving the heat exchange efficiency.

In an embodiment, the number of the first plate 631 may be two, and the second plate 632 is sandwiched between the two first plates 631, for example, the first plate 631, the second plate 632, and the first plate 631 are stacked in sequence. The second plate body 632 is clamped between the two first plate bodies 631, so that the second refrigerant flow of the second plate body 632 absorbs heat of the first refrigerant flows of the two first plate bodies 631 at the same time, and the first refrigerant flows of the two first plate bodies 631 are cooled. In addition, a heat dissipation element or an electronic element may be disposed in heat conductive connection with the first plate 631, for example, the heat dissipation element or the electronic element may be disposed on a surface of the first plate 631 away from the second plate 632 for easy installation. In an embodiment, the two first plates 631 may be two independent plates. In other embodiments, the two first plate bodies 631 may also be integrally connected in a U shape, and the first microchannels 610 in the two first plate bodies 631 are in U-shaped communication, so that the inlet and the outlet of the first microchannel 610 are located on the same side of the heat exchange body 61.

In other embodiments, the number of the second plate 632 may be two, and the first plate 631 is sandwiched between the two second plates 632. At this time, a heat dissipation element or an electronic element may be disposed in thermal conductive connection with the second board body 632.

As shown in fig. 10, the heat exchanger 6 further comprises a header pipe assembly 62, the header pipe assembly 62 comprises a first header 621 and a second header 622, the first header 621 is provided with a first header passage, and the second header 622 is provided with a second header passage. The cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 is I-shaped. In other embodiments, the cross-sectional shape of the heat exchanger 6 along the flow direction of the refrigerant flow in the heat exchange body 61 may be L-shaped, U-shaped, G-shaped, or circular.

The first collecting channel is connected to the first microchannels 610 to provide a first refrigerant flow to the plurality of first microchannels 610 through the first collecting channel and/or to collect the first refrigerant flow flowing through the plurality of first microchannels 610. The number of the first collecting pipes 621 is two, and the two first collecting pipes 621 are respectively connected to two ends of the first plate body 631, so as to provide a first refrigerant flow to the plurality of first microchannels 610 by using one of the two first collecting pipes 621; and the other of the two first headers 621 is used to collect the first refrigerant flow passing through the plurality of first microchannels 610.

The second collecting channel is connected to the second microchannels 611 to provide a second refrigerant flow to the plurality of second microchannels 611 through the second collecting channel and/or to collect the second refrigerant flow flowing through the plurality of second microchannels 611. The number of the second collecting pipes 622 is two, and the two second collecting pipes 622 are respectively connected to two ends of the second plate body 632, so as to provide a second refrigerant flow to the plurality of second microchannels 611 by using one of the two second collecting pipes 622; and the second refrigerant flow passing through the second microchannels 611 is collected by the other of the two second headers 622.

second plate bodies

631 and 632 spaced apart from each other in a direction perpendicular to the extending direction. For example, as shown in fig. 10, the heat exchange body 61 includes three sets of first plate bodies 631 and second plate bodies 632, and the three sets of first plate bodies 631 and second plate bodies 632 are arranged at intervals in a direction perpendicular to the extending direction of the first microchannels 610 or the extending direction of the second microchannels 611.

The same end of the first plate 631 of the at least two groups of first plate 631 and the same end of the second plate 632 are connected to the same first collecting pipe 621, the same end of the second plate 632 of the at least two groups of first plate 631 and the second plate 632 are connected to the same second collecting pipe 622, for example, the same end of all the first plates 631 of the heat exchange main body 61 is connected to the same first collecting pipe 621, and the same end of all the second plates 632 of the heat exchange main body 61 is connected to the same second collecting pipe 622, so that the cost is reduced.

In this embodiment, the first header 621 and the second header 622 are disposed at intervals along the extending direction of the heat exchange body 61. The second plate body 632 penetrates through the first header 621 and is inserted into the second header 622, wherein the first header 621 is disposed between the second header 622 and the heat exchange main body 61, the second plate body 632 penetrates through the first header 621 and is inserted into the second header 622 and welded and fixed, and the first plate body 631 is inserted into the first header 621 and welded and fixed. In other embodiments, the first plate 631 may penetrate the second header 622 and then be connected to the first header 621.

The distance between the first header 621 and the second header 622 is R-2R, where R is the maximum cross-sectional dimension of the first header 621 along the direction of the interval between the first header 621 and the second header 622. The cross-sectional shapes of the first header 621 and the second header 622 may be both circular, and R is the diameter of the first header 621 or the diameter of the second header 622. Further, as described above, when the cross-sectional shapes of the first header 621 and the second header 622 are non-circular, R is the diameter of the circle circumscribed by the first header 621 or the second header 622.

The manifold assembly 62 may also be provided in the various manifold arrangements described above, such as the manifold 623 and cutoff 624 arrangement described above, or the first and

second manifolds

621 and 622 nested within one another. At this time, the first plate 631 with the first micro-channels 610 thereon and the second plate 633 with the second micro-channels 611 thereon can be matched with the above-mentioned header in the manner described above, and will not be described again.

4. Heat exchanger as radiator

The present application may also use the heat exchanger 6 as a heat sink (hereinafter, the heat sink 6 is described), the heat sink 6 includes a heat exchange main body 61 and a current collecting pipe assembly 62, and the heat sink 6 is disposed on the electronic control box 7 to dissipate heat for the electronic control box 7 and the electronic components 71 therein. It is noted that, as will be appreciated by those skilled in the art, references herein to the heat sink 6 shall include the various forms of heat exchangers described hereinabove and shall not be limited to a particular embodiment.

As shown in fig. 11, the electronic control box 7 may include a box body 72 and an electronic component 71, the box body 72 is provided with a mounting cavity 721, and the electronic component 71 is disposed in the mounting cavity 721. The box 72 is generally made of sheet metal, and the electronic components 71 disposed in the mounting cavity 721 may be a compressor, a blower, a capacitor, an electronic controller, a common mode inductor, and the like.

As shown in fig. 11, the box body 72 includes a top plate (not shown in the figure, disposed opposite to the bottom plate 723, and covering the opening of the installation cavity 721), a bottom plate 723 and a circumferential side plate 724, the top plate and the bottom plate 723 are disposed opposite to each other at intervals, and the circumferential side plate 724 is connected to the top plate and the bottom plate 723, so as to form the installation cavity 721.

Specifically, in fig. 11, the bottom plate 723 and the top plate are rectangular, the number of the circumferential side plates 724 is four, and the four circumferential side plates 724 are respectively connected to corresponding sides of the bottom plate 723 and the top plate, and further enclose the bottom plate 723 and the top plate to form the rectangular electronic control box 7. The size of the long side of the backplane 723 is the length of the electronic control box 7, and the size of the short side of the backplane 723 is the width of the electronic control box 7. The height of the circumferential side plate 724 perpendicular to the bottom plate 723 is the height of the electronic control box 7. As shown in fig. 11, the length of the electrical control box 7 in the X direction is the length of the electrical control box 7, the length of the electrical control box 7 in the Y direction is the height of the electrical control box 7, and the length of the electrical control box 7 in the Z direction is the width of the electrical control box 7.

In other embodiments, the bottom plate 723 and the top plate of the box body 72 may also be in the shape of a circle, a trapezoid, a triangle, etc., the circumferential side plate 724 is also disposed around the periphery of the bottom plate 723 to form the electronic control box 7 in other shapes, and the shape of the electronic control box 7 may be specifically set according to needs, which is not specifically limited in this embodiment.

The following embodiments will describe in detail the specific combination of the heat sink 6 and the electronic control box 7.

5. The heat exchange main body is L-shaped or U-shaped

Generally, the heat exchange body 61 is arranged in a straight bar shape, as shown in fig. 10, and the heat exchange body 61 has an overall length, an overall width and an overall height. Wherein the overall length is the length of the heat exchange body 61 in the extending direction thereof, i.e., the length of the heat exchange body 61 in the X direction shown in fig. 10. The overall width is the length of the heat exchange body 61 in a direction perpendicular to the extension direction of the heat exchange body 61 and perpendicular to the plane of the heat exchange body 61, i.e. the length of the heat exchange body 61 in the Y direction shown in fig. 10. The overall height is the length of the heat exchange body 61 in the Z direction shown in fig. 10.

Wherein the plane of the heat exchange body 61 refers to the plane of the header assembly 62, i.e., the XOZ plane shown in fig. 10.

In order to guarantee the heat exchange effect of the heat radiator 6, under the condition that the size of the cross section of the heat radiator 6 is not changed, the extension length of the heat exchange main body 61 needs to be increased to increase the heat exchange area, and then the heat exchange effect is improved. If adopt straight strip heat transfer main part 61, can lead to heat transfer main part 61's whole length longer for the volume of automatically controlled box 7 with radiator 6 complex is great, is unfavorable for the miniaturized design of automatically controlled box 7.

Therefore, referring to fig. 11 and 12, in order to reduce the overall length of the heat exchange main body 61, the heat exchange main body 61 may be divided into a first extension portion 617 and a second extension portion 618, and the second extension portion 618 is connected to an end portion of the first extension portion 617 and is bent toward one side of the first extension portion 617.

By bending the heat exchange main body 61 to form the first extending part 617 and the second extending part 618 which are connected in a bending manner, the overall length of the heat exchange main body 61 can be reduced under the condition that the heat exchange main body 61 has a sufficiently long extending length, and further, the length of the electric control box 7 matched with the radiator 6 along the X direction can be reduced, so that the volume of the electric control box 7 can be reduced.

In the present embodiment, as shown in fig. 11 and 12, the heat exchange body 61 may be provided on the bottom plate 723 of the electronic control box 7.

Specifically, the first extension 617 may be disposed parallel to the bottom plate 723, so as to fully utilize the length dimension of the bottom plate 723, and to dispose the heat exchange body 61 as long as possible, so as to improve the heat exchange effect. The second extension portion 618 may be disposed parallel to the circumferential side plate 724 to reduce a space occupied by the second extension portion 618 in the X direction.

Optionally, the first extending portion 617 may abut against the bottom plate 723, or be disposed at a distance from the bottom plate 723, and the second extending portion 618 may abut against the circumferential side plate 724, or be disposed at a distance from the circumferential side plate 724, which is not particularly limited in this embodiment of the application.

Alternatively, the heat exchange body 61 may be provided on the circumferential side plate 724 of the electronic control box 7. Specifically, the first extension 617 may be disposed parallel to one of the circumferential side plates 724, and the second extension 618 may be disposed parallel to the circumferential side plate 724 adjacent to the circumferential side plate 724, so as to dispose the heat sink 6 on one side of the mounting cavity 721.

Or, the heat exchange main body 61 may also be fixed at other positions of the electronic control box 7 according to the arrangement position of the electronic component 71, and the like, and this embodiment of the present application is not particularly limited.

Further, as shown in fig. 12, the number of the second extensions 618 may be one, and one second extension 618 is connected to one end of the first extension 617, so that the heat exchange body 61 is L-shaped.

As shown in fig. 13, the number of the second extending portions 618 may be two, and two second extending portions 618 are respectively connected to two opposite ends of the first extending portion 617 and respectively bent toward the same side of the first extending portion 617.

Specifically, the two second extending portions 618 may be disposed at opposite ends of the first extending portion 617 at a parallel interval, so as to further reduce the overall length of the heat exchange body 61 and the volume of the heat sink 6 while ensuring the heat exchange effect of the heat exchange body 61. The two second extending portions 618 are bent and disposed on the same side of the first extending portion 617, and are located on opposite sides of the first extending portion 617 with respect to the two second extending portions 618, respectively, so that the overall width of the heat sink 6 can be reduced.

Further, two second extensions 618 may be disposed perpendicular to the first extension 617 to form the U-shaped heat exchange body 61. Thus, not only the overall length of the heat exchange body 61 can be reduced, but also the space occupied by the second extending portions 618 in the X direction can be reduced, and interference between the two second extending portions 618 and the electronic component 71 disposed in the mounting cavity 721 can be avoided.

Alternatively, the two second extending portions 618 may be disposed obliquely with respect to the first extending portion 617, and the angles of inclination of the two second extending portions 618 with respect to the first extending portion 617 may be the same or different, so as to shorten the overall width of the electrical control box 7.

Further, the extension length of the first extension portion 617 is set to be greater than that of the second extension portion 618, so that the first extension portion 617 is disposed along the length direction of the electrical control box 7, and the second extension portion 618 is disposed along the width or height direction of the electrical control box 7.

Further, as shown in fig. 11, the number of the heat sinks 6 provided in the mounting cavity 721 may be one, and one heat sink 6 may be provided in the mounting cavity 721 extending in the length direction of the case 72. Alternatively, one heat sink 6 may be provided in the mounting chamber 721 to extend in the height direction of the case 72.

Alternatively, the number of the heat sinks 6 provided in the mounting cavity 721 may be at least two, for example, the number of the heat sinks 6 may be two, three, four, or five, etc. Through setting up a large amount of radiators 6, can promote the radiating effect of automatically controlled box 7.

Specifically, the number of the radiators 6 disposed in the mounting cavity 721 may be two, the heat exchange main bodies 61 of the two radiators 6 are both L-shaped, the two radiators 6 are disposed at intervals along the length direction (X direction) of the electronic control box 7, that is, the first extension portions 617 of the two radiators 6 are disposed at intervals along the length direction (X direction) of the electronic control box 7, and the second extension portions 618 of the two radiators 6 are respectively located on the sides of the two first extension portions 617, which are away from each other, so as to avoid interference with the electronic component 71 disposed in the mounting cavity 721.

Alternatively, the two heat sinks 6 may also be arranged side by side at intervals in the width direction (Z direction) of the electrical control box 7, that is, the first extension portions 617 of the two heat sinks 6 extend in the length direction (X direction) of the electrical control box 7 and are arranged side by side at intervals in the width direction (Z direction) of the electrical control box 7, and the second extension portions 618 of the two heat sinks 6 may be respectively located on the same side or different sides of the corresponding first extension portions 617.

5.1. Fixing support

At present, the economizer arranged in the electric control box 7 has large volume and irregular shape, so that the fixed structure of the economizer is complicated, and the installation efficiency is low. And radiator 6 in this application embodiment is the platelike setting, can be convenient for install and fix radiator 6, and then promote assembly efficiency.

In this embodiment, as shown in fig. 14, the electrical control box 7 may include a fixing bracket 73, and the fixing bracket 73 is connected between the heat exchange body 61 and the box body 72 to fix the heat exchange body 61 in the electrical control box 7.

Alternatively, in this embodiment, the fixing bracket 73 may be connected between the first extending portion 617 and the circumferential side plate 724, and the fixing bracket 73 may also be connected between the second extending portion 618 and the circumferential side plate 724, and the connection structure is substantially the same, and the connection structure between the heat exchange body 61 and the box body 72 will be described below by taking the example that the fixing bracket 73 is connected between the first extending portion 617 and the circumferential side plate 724.

As shown in fig. 14, the fixing bracket 73 may include a first fixing portion 731 and a second fixing portion 732 connected in a bent manner, the first fixing portion 731 is connected to the first extending portion 617 in a welded manner, and the second fixing portion 732 is fastened to the circumferential side plate 724.

Specifically, the first fixing part 731 is welded to one of the main surfaces of the heat exchange body 61 to increase the welding area between the fixing bracket 73 and the heat exchange body 61, thereby improving the welding strength. By welding the first fixing part 731 and the first extending part 617, it is possible to prevent the micro channel formed in the heat exchange body 61 from being damaged by perforating the first extending part 617. The second fixing portion 732 may be screwed, snapped, or bonded to the circumferential side plate 724 to facilitate maintenance or replacement of the heat sink 6.

Wherein, the main surface of the heat exchange body 61 refers to the surface of the heat exchange body 61 with larger surface area, and in the present embodiment, as shown in fig. 10, the main surface of the heat exchange body 61 refers to the surface parallel to the XOZ plane.

Alternatively, as shown in fig. 14, the second fixing part 732 is vertically connected to the first fixing part 731 to form an L-shaped fixing bracket 73. By vertically connecting the first fixing part 731 and the second fixing part 732, the force applied to the fixing bracket 73 can be more uniform.

Alternatively, as shown in fig. 15, the fixing bracket 73 may include a first fixing portion 731, a second fixing portion 732, and a third fixing portion 733 that are connected in a bending manner, the first fixing portion 731 and the third fixing portion 733 are disposed at an interval and connected to the bottom plate 723, the second fixing portion 732 and the bottom plate 723 are disposed at an interval to enclose the clamping groove 734, the first extending portion 617 may be welded to a side of the second fixing portion 732 away from the clamping groove 734, at this time, the heat exchange body 61 may be disposed at an interval with the bottom plate 723 to disconnect the contact between the heat exchange body 61 and the electrical control box 7, thereby avoiding heat exchange between the heat exchange body 61 and the electrical control box 7, and reducing the heat dissipation efficiency of the heat sink 6.

Specifically, the first fixing portion 731 and the third fixing portion 733 are bent and connected to opposite ends of the second fixing portion 732, and are located on the same side of the second fixing portion 732 to enclose an Contraband-shaped holding groove 734. The first fixing portion 731 and the end portion of the third fixing portion 733 remote from the second fixing portion 732 are connected to the bottom plate 723. The connection manner of the second fixing portion 732 and the heat exchange body 61 may be the same as that in the above embodiment, and the connection manner of the first fixing portion 731 and the third fixing portion 733 and the bottom plate 723 may be the same as that in the above embodiment, please refer to the description in the above embodiment, and the description thereof is omitted.

Alternatively, the first extending portion 617 may be provided in the holding groove 734, opposite sides of the first extending portion 617 in the entire width direction of the heat exchange body 61 may be respectively brought into contact with the bottom plate 723 and the second fixing portion 732, and opposite sides of the first extending portion 617 in the entire height direction of the heat exchange body 61 may be respectively brought into contact with the first fixing portion 731 and the third fixing portion 733, so that the first extending portion 617 may be held and fixed. Through the fixed heat transfer main part 61 of the mode that adopts the centre gripping, can avoid damaging heat transfer main part 61 to also can be convenient for maintain or change heat transfer main part 61.

As will be appreciated by those skilled in the art, the above-described fixing bracket may be used to fix various forms of heat sinks disclosed herein, and its fixing position is not limited to the specific positions described above.

5.2. The radiator is arranged in the electric control box

Further, as shown in fig. 11, the heat sink 6 is disposed in the mounting cavity 721 of the electronic control box 7. Specifically, the heat sink 6 may be thermally conductively connected to the electronic component 71 disposed in the mounting cavity 721, for dissipating heat from the electronic component 71.

Specifically, in the embodiment shown in fig. 11, the electronic component 71 may be thermally conductively coupled to the first extension 617 and/or the second extension 618. As will be appreciated by those skilled in the art, the various forms of heat sinks 6 disclosed herein may also be disposed within the mounting cavity 721 of the electronic control box 7 or applied to dissipate heat from the electronic control box 7, and may be thermally conductively connected to the electronic components 71 in a direct or indirect manner.

When the heat sink 6 is disposed in the mounting cavity 721, in the embodiment shown in fig. 11, the electronic component 71 may be thermally connected to the first extension portion 617, and the electronic component 71 may be disposed on the same side of the first extension portion 617 as the second extension portion 618, so as to shorten the height, i.e., the dimension in the Y direction, of the electronic control box 7.

Alternatively, the electronic component 71 may be thermally connected to the second extending portion 618, and specifically, the electronic component 71 may be disposed on a side of the second extending portion 618 facing the first extending portion 617, so as to shorten the length, i.e., the dimension in the X direction, of the electrical control box 7.

Alternatively, the electronic components 71 may be partially disposed on the first extension 617 and partially disposed on the second extension 618, so as to make the electronic components 71 uniformly distributed.

Since the number of the electronic components 71 is large, if the electronic components 71 are connected to the heat exchange body 61 one by one, the mounting of the electronic components 71 becomes complicated, and the mounting efficiency is low.

Therefore, as shown in fig. 11 and 16, a heat dissipation fixing plate 74 may be further disposed in the electronic control box 7, the electronic component 71 is disposed on the heat dissipation fixing plate 74, and then the heat dissipation fixing plate 74 is disposed on the heat exchange main body 61, so that the electronic component 71 and the heat exchange main body 61 are thermally connected through the heat dissipation fixing plate 74, and thus, the installation efficiency of the electronic component 71 can be greatly improved.

Specifically, the heat dissipation fixing plate 74 may be disposed on the first extending portion 617 and/or the second extending portion 618, and the electronic component 71 may be disposed on a side of the heat dissipation fixing plate 74 facing away from the first extending portion 617 and/or the second extending portion 618.

Further, the heat dissipation fixing plate 74 may be disposed on the main surface of the heat exchange body 61 to increase a contact area between the heat dissipation fixing plate 74 and the heat exchange body 61, thereby improving heat conduction efficiency. In addition, the main surface of the heat exchange body 61 has a large supporting surface for the heat radiation fixing plate 74, so that the mounting stability of the electronic component 71 can be improved.

The heat dissipation fixing plate 74 may be made of a metal plate or an alloy plate with good heat conductivity, for example, the heat dissipation fixing plate 74 may be made of an aluminum plate, a copper plate, an aluminum alloy plate, or the like, so as to improve heat conduction efficiency.

Alternatively, as shown in fig. 17, a heat pipe 741 may be embedded in the heat dissipation fixing plate 74, and the heat pipe 741 is used to rapidly conduct heat from a concentrated high-density heat source and further diffuse the heat to the surface of the whole heat dissipation fixing plate 74, so that the heat on the heat dissipation fixing plate 74 is uniformly distributed, and the heat exchange effect between the heat dissipation fixing plate 74 and the heat exchange main body 61 is enhanced.

As shown in the upper drawing in fig. 17, the heat pipe 741 may be elongated, the number of the heat pipes 741 may include a plurality of heat pipes 741, and the plurality of heat pipes 741 may be arranged in parallel at intervals. Alternatively, as shown in the lower drawing of fig. 17, the plurality of heat pipes 741 may be connected in sequence to form a ring or a frame, and the embodiment of the present application is not particularly limited.

5.3. The radiator is arranged outside the electric control box

As shown in fig. 18, the heat sink 6 is disposed outside the electronic control box 7, and a mounting hole 726 may be opened in the box body 72 of the electronic control box 7, and the electronic component 71 may be thermally connected to the heat sink 6 through the mounting hole 726.

Specifically, as shown in fig. 18, the heat sink fixing plate 74 may be attached to the heat sink 6 and the mounting opening 726 may be blocked, and the electronic component 71 may be disposed on a side surface of the heat sink fixing plate 74 facing away from the heat sink 6.

Alternatively, as shown in fig. 19, a heat pipe 741 may be provided to thermally connect the electronic component 71 and the heat sink 6. For example, the heat pipe 741 may include a heat absorbing end 741a and a heat releasing end 741b, the heat absorbing end 741a of the heat pipe 741 may be inserted into the mounting cavity 721 and thermally connected to the electronic component 71 to absorb heat of the electronic component 71, and the heat releasing end 741b of the heat pipe 741 may be disposed outside the electronic control box 7 and thermally connected to the heat sink 6 to dissipate heat from the heat releasing end 741b of the heat pipe 741 by using the heat sink 6.

5.4. Radiating fin

Since the electronic component 71 generates a large amount of heat during operation, and the electronic control box 7 is usually in a relatively closed environment, if the heat in the electronic control box 7 cannot be discharged in time, the temperature in the installation cavity 721 of the electronic control box 7 is high, and thus the electronic component 71 may be damaged. Although the refrigerant flowing through the heat sink 6 disposed in the mounting cavity 721 carries away part of the heat, the heat dissipation performance of the electronic control box 7 is still poor.

Therefore, as shown in fig. 11 and 20, the heat dissipation fins 75 may be disposed in the electronic control box 7, and the heat dissipation fins 75 are connected to the heat exchange main body 61 in a heat conducting manner, so that the heat exchange main body 61 and the air in the electronic control box 7 are increased in contact area by the heat dissipation fins 75, the heat exchange with the air is facilitated, the temperature in the mounting cavity 721 is reduced, and the electronic element 71 is protected.

Alternatively, one of the electronic element 71 and the heat dissipation fin 75 may be disposed on the first extension portion 617, and the other of the electronic element 71 and the heat dissipation fin 75 may be disposed on the second extension portion 618, so that the electronic element 71 and the heat dissipation fin 75 are disposed in a staggered manner, interference between the electronic element 71 and the heat dissipation fin 75 is avoided, and a distance between the electronic element 71 and the heat dissipation fin 75 is set to be larger, so that temperatures of refrigerants contacting the heat dissipation fin 75 and the electronic element 71 are both lower, and a heat dissipation effect of the heat exchange main body 61 is improved.

Further, as shown in fig. 20, the number of the heat radiating fins 75 may be one, and the dimension of the heat radiating fins 75 in the overall height direction of the heat exchanging body 61 is larger than the overall height of the heat exchanging body 61. The heat radiating fins 75 may be attached to the surface of the heat exchange body 61 by welding, bonding, or fastening. By arranging the heat radiating fins 75 with small quantity and large surface area, on one hand, the heat radiating fins 75 can be conveniently connected with the heat exchange main body 61, and the installation efficiency of the heat radiating fins 75 and the heat exchange main body 61 is improved; on the other hand, the contact area between the heat dissipation fins 75 and the air can be increased, and the heat exchange effect is enhanced.

As shown in fig. 21, the number of the heat dissipation fins 75 may be multiple, the size of each heat dissipation fin 75 along the overall height direction of the heat exchange main body 61 is equal to the size of each plate body along the overall height direction of the heat exchange main body 61, each heat dissipation fin 75 is attached to one plate body, and the multiple heat dissipation fins 75 may be arranged at intervals along the overall height direction of the heat exchange main body 61 to increase the contact area between the heat dissipation fins 75 and the air. Through setting up radiating fin 75 to the spaced a plurality of, not only can guarantee radiating fin 75's heat exchange efficiency, also can save the material moreover, reduction in production cost.

In other embodiments, the heat dissipating fins 75 may also extend to the outside of the electronic control box, for example, a mounting opening is formed on the box body 72, the heat exchanging main body 61 is disposed in the box body 72 and is thermally connected to the electronic component 71, and one side of the heat dissipating fins 75 is thermally connected to the heat exchanging main body 61 and extends to the outside of the box body 72 through the mounting opening, and the heat dissipating capability of the heat exchanging main body 61 can be further improved by air cooling assistance.

It is noted that the fin structures described above are applicable to the various forms of heat exchangers described herein, and should not be limited to a particular embodiment, as will be appreciated by those skilled in the art.

G-type heat exchange main body and matching relation of G-type heat exchange main body and electronic element

Referring to fig. 22, the structure of the heat sink 6 in the present embodiment is substantially the same as that of the heat sink 6 in the above embodiment, except that in the present embodiment, the heat sink 6 further includes a third extending portion 619. Wherein the first extension 617 and the third extension 619 are spaced apart and side by side, and the second extension 618 is connected between adjacent ends of the first extension 617 and the third extension 619.

Specifically, the third extension 619 is connected to an end of the second extension 618 facing away from the first extension 617, and is bent toward a side of the second extension 618 facing the first extension 617 to be spaced apart from the first extension 617. Like this, can be under the unchangeable circumstances of the extension length of guaranteeing heat transfer main part 61, reduce heat transfer main part 61's whole length and whole width to further reduce the volume with radiator 6 complex automatically controlled box 7.

Alternatively, as shown in fig. 22, the number of the second extending portions 618 is two, two of the second extending portions 618 are respectively connected to two opposite ends of the first extending portion 617 in a bending manner, the number of the third extending portions 619 is one, and one of the third extending portions 619 is disposed at an end portion of one of the second extending portions 618, which is away from the first extending portion 617, and is bent in a direction close to the other second extending portion 618, so as to form the G-shaped heat exchange main body 61.

Alternatively, the number of the second extending portions 618 may be one, one second extending portion 618 is connected to one end of the first extending portion 617 in a bending manner, the number of the third extending portions 619 is one, and one third extending portion 619 is arranged at an end of the second extending portion 618 facing away from the first extending portion 617 and is bent towards the first extending portion 617.

Or, the number of the second extending portions 618 may be two, two second extending portions 618 are respectively connected to two opposite ends of the first extending portion 617 in a bending manner, the number of the third extending portions 619 is two, and two third extending portions 619 are respectively connected to ends of the two second extending portions 618 departing from the first extending portion 617 and extend in a direction approaching each other, so as to further reduce the overall length of the heat exchange main body 61.

Further, the third extension part 619 may be disposed in parallel with the first extension part 617 at an interval to avoid the third extension part 619 from increasing the overall width of the heat exchange body 61, and it may also be convenient to dispose the electronic element 71 and the like in the interval between the first extension part 617 and the third extension part 619 to sufficiently utilize the inner space of the electrical control box 7.

Specifically, the electronic element 71 may be disposed on the first extension 617 and thermally connected to the first extension 617, and the electronic element 71 may be located in a space between the first extension 617 and the third extension 619. Alternatively, the electronic element 71 may be disposed on the third extension 619 and thermally conductively coupled to the third extension 619, with the electronic element 71 being located in the space between the first extension 617 and the third extension 619. By arranging the electronic element 71 in the space between the first extension 617 and the third extension 619, the space between the first extension 617 and the third extension 619 may be fully utilized, making the structure of the electronic element 71 and the heat exchanging body 61 more compact. Alternatively, the electronic element 71 may be disposed on the first extension portion 617 and the third extension portion 619 at the same time, and the electronic element 71 is thermally connected to the first extension portion 617 and the third extension portion 619 at the same time, so as to further improve heat exchange between the heat sink 6 and the electronic element 71 and improve heat dissipation efficiency of the electronic element 71.

Further, the kinds of the electronic components 71 are various, and the electronic components 71 can be classified into those which are liable to malfunction and those which are not liable to malfunction according to the frequency of malfunction when the electronic components 71 are used. Since the space between the first extension portion 617 and the third extension portion 619 is small, it is not convenient to disassemble and assemble the electronic component 71, in this embodiment, the electronic component 71 which is not easy to malfunction can be further disposed between the first extension portion 617 and the third extension portion 619, so as to reduce the maintenance probability of the electronic component 71.

Further, the heat dissipation fixing plate 74 may be fixed to the third extension 619, in addition to the first extension 617 and/or the second extension 618 in the manner described in the above embodiments.

Specifically, the heat dissipation fixing plate 74 may be disposed on a side of the third extending portion 619 facing the first extending portion 617, and the electronic component 71 may be disposed on a side of the heat dissipation fixing plate 74 facing the first extending portion 617, so that the electronic component 71 and the heat exchange main body 61 are more compact, and the electronic component does not occupy too much of the internal space of the electronic control box 7.

Likewise, in this embodiment, the heat dissipation fins 75 may be fixed to the third extension 619 in addition to the first extension 617 and/or the second extension 618 in the manner described in the above embodiments.

Specifically, one of the heat dissipation fin 75 and the electronic element 71 may be disposed on the first extension portion 617, and the other of the heat dissipation fin 75 and the electronic element 71 may be disposed on the second extension portion 618 and/or the third extension portion 619, so that the heat dissipation fin 75 and the electronic element 71 are disposed in a staggered arrangement with respect to each other.

Alternatively, the number of the heat dissipation fins 75 may be one, and one heat dissipation fin 75 is provided on the second extension portion 618 or the third extension portion 619. Alternatively, the number of the heat dissipation fins 75 may also be two, and the two heat dissipation fins 75 are respectively disposed on the second extension portion 618 and the third extension portion 619, so as to increase the contact area between the heat dissipation fins 75 and the air and improve the heat dissipation effect of the heat sink 6.

7. The heat dissipation plate is arranged at the position where the temperature of the radiator is higher

Referring to fig. 23, the electronic control box 7 of the present embodiment includes a box body 72, a heat sink 6 and an electronic component 71, the box body 72 is provided with a mounting cavity 721, the heat sink 6 is at least partially disposed in the mounting cavity 721, and the electronic component 71 is disposed in the mounting cavity 721. The structures of the box 72 and the heat sink 6 are substantially the same as those of the above embodiments, and please refer to the description of the above embodiments.

Optionally, the heat exchange main body 61 may be entirely disposed in the installation cavity 721 of the electronic control box 7, and the heat exchange main body 61 may also be partially disposed in the installation cavity 721 of the electronic control box 7, and partially protrudes out of the electronic control box 7, so as to be connected to the header assembly 62 and an external pipeline.

The temperature of the radiator 6 is low due to the flow of the refrigerant flow, and the temperature in the installation cavity 721 of the electronic control box 7 is high due to the heat generated by the electronic element 71 in the electronic control box 7, so that the air with high temperature in the electronic control box 7 is easy to condense when contacting the radiator 6, and further condensed water is formed on the surface of the radiator 6. If the generated condensed water flows to the position of the electronic component 71, the electronic component 71 is easily short-circuited or damaged, and a fire hazard is more seriously generated.

Therefore, as shown in fig. 23, the heat exchange body 61 may be divided into a first end 61a and a second end 61b along the flow direction of the refrigerant flow, and the temperature of the heat exchange body 61 gradually decreases in the direction from the first end 61a to the second end 61b, that is, the temperature of the first end 61a is higher than that of the second end 61 b. The electronic element 71 is disposed at a position close to the first end 61a, and thermally connects the electronic element 71 with the heat exchange body 61. It should be noted that, since the heat exchange body 61 needs to exchange heat with the internal environment of the electronic control box 7 or the internal elements thereof, the temperature of the heat exchange body 61 described above and below refers to the surface temperature of the heat exchange body 61. Specifically, the surface temperature variation of the heat exchange body 61 is determined by the heat exchange channels adjacent to the surface. For example, when the heat exchange channel adjacent to the surface of the heat exchange main body 61 is a main channel, the refrigerant flow of the main channel is continuously absorbed by the refrigerant flow of the sub channel along with the flow, so the surface temperature of the heat exchange main body 61 gradually decreases along the refrigerant flow direction of the main channel, and at this time, the first end 61a is located upstream of the second end 61b along the refrigerant flow direction of the main channel. When the heat exchange channel adjacent to the surface of the heat exchange body 61 is a bypass channel, the surface temperature of the heat exchange body 61 gradually decreases and increases along the refrigerant flow direction of the bypass channel, and at this time, the first end 61a is located downstream of the second end 61b along the refrigerant flow direction of the bypass channel.

Therefore, by dividing the heat exchange body 61 into the first end 61a with a higher temperature and the second end 61b with a lower temperature according to the temperature change on the heat exchange body 61, since the temperature difference between the first end 61a with a higher temperature and the hot air is smaller, the condensed water is not generated or the amount of the generated condensed water is smaller, and by disposing the electronic element 71 at a position close to the first end 61a, the probability of the electronic element 71 contacting the condensed water can be reduced, thereby protecting the electronic element 71.

It should be noted that, since the air conditioner generally has a cooling mode and a heating mode, there may be a case where the refrigerant flows in opposite directions in the two modes. At this time, the temperature of the heat exchange body 61 has an opposite trend from the first end 61a to the second end 61b, that is, in one mode, the temperature of the heat exchange body 61 is gradually decreased from the first end 61a to the second end 61b, and in another mode, the temperature of the heat exchange body 61 is gradually increased from the first end 61a to the second end 61 b. In the present embodiment, it is preferable to ensure that the temperature of the heat exchange body 61 gradually decreases from the first end 61a to the second end 61b in the cooling mode for the following reasons:

when the ambient temperature is low, for example, when the air conditioner works in winter to perform heating, the temperature of the air in the electronic control box 7 is low, and at this time, the temperature difference between the air in the electronic control box 7 and the radiator 6 is small, so that the air is not easy to condense to form condensed water. When the ambient temperature is high, for example, when the air conditioner is operated in summer to cool, the temperature of the air in the electronic control box 7 is high, the temperature difference between the air in the electronic control box 7 and the radiator 6 is large, and the air is easy to condense to form condensed water. Therefore, in the present embodiment, it may be provided that, at least in the cooling mode of the air conditioner, the temperature of the heat exchange body 61 is gradually decreased in the direction from the first end 61a to the second end 61b to avoid the heat sink 6 from generating condensed water in the cooling mode.

Further, the electronic element 71 is arranged at a position close to the first end 61a, which means that the position of the heat-conducting connection of the electronic element 71 on the heat exchanging body 61 has a first distance from the first end 61a and a second distance from the second end 61b, and the first distance is smaller than the second distance.

Specifically, since the temperature of the heat exchange body 61 gradually decreases in the direction from the first end 61a to the second end 61b, the temperature of the first end 61a is the highest, the temperature of the second end 61b is the lowest, and the higher the temperature of the heat exchange body 61 is, the smaller the temperature difference with the air in the electrical control box 7 is, and the less condensed water is condensed. The lower the temperature of the heat exchange body 61 is, the greater the temperature difference with the hot air is, and the more easily the condensed water is condensed. That is, the probability of generating the condensed water gradually increases in the direction from the first end 61a to the second end 61b of the heat exchange body 61. Therefore, by disposing the electronic component 71 close to the end of the heat exchange body 61 where the temperature is high, that is, at a position where condensed water is not easily accumulated, the risk of the electronic component 71 contacting the condensed water can be reduced, thereby protecting the electronic component 71.

Further, as shown in fig. 23, the extending direction of the heat exchanging main body 61 may be arranged along the vertical direction, and the first end 61a may be arranged at the upper portion of the second end 61b, so that when the condensed water is generated at the position of the heat exchanging main body 61 close to the second end 61b, the condensed water may flow downwards along the vertical direction, that is, the condensed water may flow in the direction away from the electronic element 71, thereby avoiding the electronic element 71 from contacting with the condensed water.

Alternatively, the extending direction of the heat exchange body 61 may be set along the horizontal direction as required, so that the condensed water generated near the second end 61b can be separated from the heat exchange body 61 rapidly under the action of gravity, and can be prevented from contacting the electronic component 71. Or, in other embodiments, the extending direction of the heat exchange main body 61 may be inclined with respect to the horizontal direction, and this embodiment is not specifically limited.

It will be appreciated that the structure of the heat sink 6 in this embodiment may be the same as that in the above-described embodiment, i.e. using the bent heat exchange body 61. Alternatively, the heat sink 6 of the present embodiment may be configured by using a straight heat exchange body 61. Alternatively, other types of heat sinks may be used in addition to the heat sink 6 provided with the micro channels, and the specific structure of the heat sink 6 is not limited in the embodiments of the present application. In addition, other embodiments of the present application that apply heat sinks to electrical control boxes may employ the various heat sinks disclosed herein, or other heat sinks known in the art.

7.1. The flow direction of the refrigerant flow in the heat exchange main body is fixed

As described above, since the flow directions of the refrigerant flows for heating or cooling are opposite when the air conditioning system is in the cooling mode and the heating mode, the temperature of the heat exchange body 61 along the extending direction thereof changes with the change of the operating state of the air conditioning apparatus, and it cannot be ensured that the temperature of the first end 61a is always higher than the temperature of the second end 61 b. For example, in the air conditioning system 1 shown in fig. 1, the refrigerant in the first heat exchange path 610 (main path) may flow in opposite directions in the cooling and heating modes.

Therefore, as shown in fig. 23, the electrical control box further includes a first unidirectional conducting device 701, a second unidirectional conducting device 702, a third unidirectional conducting device 703 and a fourth unidirectional conducting device 704. Wherein, the inlet of the first one-way conduction device 701 is connected with one end of the indoor unit (for example, the indoor heat exchanger 5 in fig. 1), and the outlet of the first one-way conduction device 701 is connected with the header pipe assembly 62 near the first end 61 a; the inlet of the second one-way conduction device 702 is connected with the header pipe assembly 62 close to the second end 61b, and the outlet of the second one-way conduction device 702 is connected with one end of the indoor unit; the inlet of the third one-way communication device 703 is connected to one end of a throttle valve (e.g., the expansion valve 13 in fig. 1), and the outlet of the third one-way communication device 703 is connected to the header assembly 62 near the first end 61 a; the inlet of the fourth one-way flow device 704 is connected to the manifold assembly 62 near the second end 61b and the outlet of the fourth pilot flow device is connected to one end of the throttle.

The air conditioning system 1 is in the cooling mode, the refrigerant flow output by the compressor 2 flows to the outdoor heat exchanger 4 for heat exchange, the refrigerant flow continues to flow to the throttle valve (the expansion valve 13), then enters the header assembly 62 close to the first end 61a through the third one-way conduction device 703, and flows to the second end 61b through the heat exchange main body 61, so that the refrigerant flow exchanges heat (i.e., subcools) with the auxiliary circuit in the direction from the first end 61a to the second end 61b, and the temperature of the heat exchange main body 61 is continuously reduced in the direction from the first end 61a to the second end 61 b. The refrigerant flowing out of the second end 61b flows through the second one-way conduction device 702 and is discharged to the indoor heat exchanger 5 for heat exchange.

The air conditioning system 1 is in a heating mode, a refrigerant flow output by the compressor 2 flows to the indoor heat exchanger 5 for heat exchange, the refrigerant flow continues to flow to the electronic control box 7, enters the header assembly 62 close to the first end 61a through the first one-way conduction device 701, and flows to the second end 61b through the heat exchange main body 61, so that the refrigerant flow exchanges heat (i.e., subcools) with an auxiliary circuit in a direction from the first end 61a to the second end 61b, and the temperature of the heat exchange main body 61 is continuously reduced in a direction from the first end 61a to the second end 61 b. The refrigerant flowing out of the second end 61b passes through the fourth check valve 704 and is discharged to the throttle valve, and enters the outdoor heat exchanger 4 for heat exchange.

In conclusion, this application sets up four one-way conduction devices through between first end 61a and second end 61b, can be so that the flow direction of the refrigerant flow in heat transfer main part 61 is fixed, and then guarantees that electronic component 71 is located the higher one side of heat transfer main part 61 temperature all the time, avoids contacting with the comdenstion water that produces.

Optionally, the first unidirectional conducting device 701, the second unidirectional conducting device 702, the third unidirectional conducting device 703 and the fourth unidirectional conducting device 704 may all be set as one-way valves, in other embodiments, the first unidirectional conducting device 701, the second unidirectional conducting device 702, the third unidirectional conducting device 703 and the fourth unidirectional conducting device 704 may also be set as solenoid valves, and the embodiment of the present application does not specifically limit the types of the unidirectional conducting devices.

8. Mounting plate for preventing condensed water from exposing

Referring to fig. 24, the electronic control box 7 in the present embodiment includes a box body 72, a mounting plate 76, an electronic component 71, and a heat sink 6.

The box body 72 is provided with a mounting cavity 721, the mounting plate 76 is disposed in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 on two sides of the mounting plate 76, the electronic element 71 is disposed in the second chamber 7214, at least a part of the heat exchange body 61 is disposed in the first chamber 7212 and is in heat conduction connection with the electronic element 71, and the mounting plate 76 is used for blocking condensed water on the heat sink 6 from flowing into the second chamber 7214.

By providing the mounting plate 76 in the electrical control box 7 to partition the mounting cavity 721, and respectively disposing the heat exchange body 61 and the electronic element 71 in the first chamber 7212 and the second chamber 7214 which are independent of each other, the electronic element 71 can be completely isolated from the condensed water, thereby preventing the electronic element 71 from being short-circuited or damaged due to the contact with the condensed water.

Further, the heat dissipation fixing plate 74 may be used to indirectly connect the electronic component 71 with the heat exchange body 61.

Specifically, the mounting plate 76 may be provided with an avoiding hole 762 at a position corresponding to the heat dissipation fixing plate 74, the heat dissipation fixing plate 74 is connected to the heat exchange main body 61 and blocks the avoiding hole 762, and the electronic component 71 is disposed on a side of the heat dissipation fixing plate 74 away from the heat exchange main body 61. In this way, the electronic component 71 and the heat exchange body 61 may be thermally connected by the heat dissipation fixing plate 74, and the first chamber 7212 and the second chamber 7214 may be spaced apart by the heat dissipation fixing plate 74, so as to prevent the condensed water from flowing into the second chamber 7214 provided with the electronic component 71 through the avoiding hole 762, and further prevent the condensed water from contacting the electronic component 71.

Further, if more condensed water is generated on the heat exchange main body 61, the condensed water will fall under the action of gravity after being accumulated, and the dropped condensed water not only easily generates larger noise, but also is more dispersed and is not beneficial to being discharged out of the electric control box 7.

Therefore, as shown in fig. 24, a baffle 77 may be provided in the electrical control box 7, the baffle 77 being provided on the lower side of the radiator 6 for collecting the condensed water dripping from the radiator 6. The setting of guide plate 77 not only can reduce the height that the comdenstion water drips, and then the noise reduction, guide plate 77 also has certain accumulation effect to the comdenstion water moreover, is convenient for discharge automatically controlled box 7 together after converging the comdenstion water.

As shown in fig. 24, the radiator 6 is fixed to a bottom plate 723 of the electrical control box 7, one end of the baffle 77 is connected to the bottom plate 723, the other end of the baffle 77 extends toward the inside of the first chamber 7212, and a projection of the radiator 6 in the vertical direction falls on the inside of the baffle 77. Therefore, the condensed water dropping from the radiator 6 can be ensured to be positioned on the guide plate 77, and the condensed water is prevented from dropping to other positions of the electric control box 7.

It is understood that the radiator 6 may also be disposed on the mounting plate 76, in which case one end of the guide plate 77 is connected to the mounting plate 76, the other end of the guide plate 77 extends toward the inside of the first chamber 7212, and the projection of the radiator 6 in the vertical direction falls on the inside of the guide plate 77.

Furthermore, as shown in fig. 25, in order to facilitate the condensed water on the flow guide plate 77 to be discharged out of the electronic control box 7 in time, a water outlet 725 may be formed in the bottom wall of the box body 72, the flow guide plate 77 is disposed in an inclined manner with respect to the bottom wall of the box body 72, and the condensed water is guided by the flow guide plate 77 and then discharged out of the box body 72 through the water outlet 725.

Specifically, the drain 725 may be formed in the circumferential side plate 724 of the electronic control box 7, the baffle 77 is connected to the mounting plate 76 or the bottom plate 723 of the box body 72, and is inclined toward the drain 725, so that condensed water drops on the baffle 77 and then converges at the drain 725 along the inclined baffle 77, and then is drained from the drain 725.

The number and size of the water outlets 725 can be flexibly set according to the amount of condensed water, and the embodiment of the present application is not particularly limited.

In this embodiment, the flow direction of the refrigerant flow in the heat exchange main body 61 may be set along the horizontal direction, that is, the extending direction of the heat exchange main body 61 is set along the horizontal direction, on one hand, the flow path of the condensed water on the heat exchange main body 61 may be shortened, so that the condensed water drops onto the flow guide plate 77 as soon as possible under the action of gravity, so that the condensed water is discharged out of the electronic control box 7 in time, and is prevented from contacting with the electronic element 71 arranged in the installation cavity 721; on the other hand, the baffle 77 can be prevented from interfering with the heat exchange main body 61, so that the relatively long heat exchange main body 61 can be arranged, and the heat exchange efficiency of the radiator 6 is improved.

9. The heat dissipation plate is arranged at the position with higher temperature of the radiator and absorbs heat by utilizing the evaporation of condensed water

Referring to fig. 26, the electronic control box 7 in the present embodiment includes a box body 72, a mounting plate 76, and a heat sink 6.

The box body 72 is provided with a mounting cavity 721, the mounting plate 76 is arranged in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 which are positioned at two sides of the mounting plate 76, the mounting plate 76 is provided with a first vent 764 and a second vent 766 at intervals, so that the gas in the first chamber 7212 flows into the second chamber 7214 through the first vent 764, and the gas in the second chamber 7214 flows into the first chamber 7212 through the second vent 766. At least a part of the heat exchange body 61 is disposed in the first chamber 7212, and a flow direction of the refrigerant flow in the heat exchange body 61 is disposed along a spacing direction of the first vent 764 and the second vent 766, a temperature of the heat exchange body 61 gradually increases in a direction from the second vent 766 to the first vent 764, that is, a temperature of the heat exchange body 61 at a position near the first vent 764 is higher than a temperature of the heat exchange body 61 at a position near the second vent 766. As described above, the refrigerant flow mentioned herein may be a main refrigerant flow or a sub-refrigerant flow in the air conditioning system shown in fig. 1.

In this embodiment, the heat exchange body 61 may be disposed in a horizontal direction, a vertical direction, or other directions, which is not limited herein. Meanwhile, the number, the position and the extending direction of the first ventilation openings 764 and the second ventilation openings 766 are not limited.

Because the temperature of the heat exchange main body 61 close to the second ventilation opening 766 is low, the amount of condensed water generated at the position close to the second ventilation opening 766 is large, in the embodiment, the mounting plate 76 is arranged inside the electronic control box 7, the first ventilation opening 764 and the second ventilation opening 766 are arranged on the mounting plate 76 at intervals along the flow direction of the refrigerant flow, and when air with high temperature in the second chamber 7214 enters the first chamber 7212 through the second ventilation opening 766, the air can be in contact with the condensed water and further the condensed water is evaporated, so that on one hand, a drainage structure can be avoided from being accumulated, on the other hand, the temperature of the radiator 6 can be reduced by utilizing the evaporation and heat absorption of the condensed water, the temperature of the refrigerant flow in the radiator 6 is reduced, and the heat exchange performance of the radiator 6 is improved.

It should be noted here that the flow direction of the refrigerant flow in the heat exchange main body 61 is set along the spacing direction of the first ventilation opening 764 and the second ventilation opening 766, and the flow direction of the refrigerant flow is parallel to the spacing direction, and may include a certain inclination angle between the flow direction of the refrigerant flow and the spacing direction.

As described above, since the air conditioner generally has the cooling mode and the heating mode, there may be a case where the refrigerant flows in opposite directions in the two modes. Therefore, it is preferable to ensure that the temperature of the heat exchange body 61 gradually increases in the direction from the second vent 766 to the first vent 764 in the cooling mode for the following reasons:

when the ambient temperature is low, for example, when the air conditioner works in winter to perform heating, the temperature of the air in the electric control box 7 is low, the temperature difference between the air in the electric control box 7 and the radiator 6 is small, and the air is not easy to condense to form condensed water. When the external environment temperature is high, for example, when the air conditioner works in summer to refrigerate, the temperature of the air in the electric control box 7 is high, the temperature difference between the air in the electric control box 7 and the radiator 6 is large, and the air is easy to condense to form condensed water. Therefore, in the present embodiment, it may be provided that, at least in the cooling mode of the air conditioner, the temperature of the heat exchange body 61 gradually increases in the direction from the second vent 766 to the first vent 764 to avoid the heat sink 6 from generating condensed water in the cooling mode.

Further, the electronic control box 7 may further include an electronic component 71, and the electronic component 71 is thermally connected to the heat sink 6, so as to dissipate heat of the electronic component 71 by using the heat sink 6.

Optionally, an electronic component 71 may be disposed within the first chamber 7212. In order to reduce the possibility of the electronic component 71 coming into contact with the condensed water, the electronic component 71 may be disposed at a position of the heat exchange body 61 near the first ventilation opening 764 and thermally connected to the heat exchange body 61.

Specifically, in the process that the airflow flows from the second ventilation opening 766 to the first ventilation opening 764, the airflow continuously exchanges heat with the heat sink 6, so that the temperature of the airflow is gradually reduced, and because the temperature of the heat exchange main body 61 near the first ventilation opening 764 is higher, the temperature difference between the airflow and the heat sink 6 can be reduced, the probability of condensation of the airflow at the position of the heat exchange main body 61 near the first ventilation opening 764 is reduced, and by arranging the electronic element 71 at the position of the heat exchange main body 61 near the first ventilation opening 764, the electronic element 71 on the heat exchange main body 61 can be prevented from contacting with the condensed water, so that the electronic element 71 on the heat exchange main body 61 is protected.

Alternatively, the first ventilation opening 764 and the second ventilation opening 766 may be provided at intervals in the horizontal direction, and in this case, the extending direction of the heat exchange body 61 is also provided in the horizontal direction. When the amount of the condensed water generated at the position close to the second ventilation opening 766 is too large to be evaporated, the condensed water flows downwards along the vertical direction, and the condensed water is separated from the heat exchange main body 61 after flowing for a certain distance due to the fact that the length of the heat exchange main body 61 in the vertical direction is small, so that the condensed water drops.

Therefore, in order to prevent the condensed water from dropping, the first ventilation opening 764 and the second ventilation opening 766 may be spaced apart from each other in the vertical direction, the first ventilation opening 764 is located above the second ventilation opening 766, and the extending direction of the heat exchange main body 61 is also set in the vertical direction. At this time, when the amount of the condensed water generated near the second ventilation opening 766 is too large to evaporate, the condensed water will flow downward along the vertical direction, and since the length of the heat exchange main body 61 along the vertical direction is too long, the flow path of the condensed water will be extended, the contact area between the hot air and the condensed water will be increased, and then the evaporation amount of the condensed water will be increased, and the condensed water will be prevented from dripping. And by disposing the first ventilation opening 764 at an upper portion of the second ventilation opening 766 and disposing the electronic component 71 at a position close to the first ventilation opening 764, the condensed water can be made to flow in a direction away from the electronic component 71, avoiding the electronic component 71 from contacting with the condensed water.

Alternatively, the electronic component 71 may be disposed in the second chamber 7214 and thermally connected to the heat sink 6 by the heat dissipation fixing plate 74. The connection manner between the electronic component 71 and the heat dissipation fixing plate 74 can be the same as that in the above embodiments, please refer to the description in the above embodiments.

Further, in order to increase the flow speed of the air in the first and

second chambers

7212 and 7214, a heat dissipation fan 78 may be disposed in the electronic control box 7 to enhance the convection effect of the first and

second chambers

7212 and 7214 by using the heat dissipation fan 78.

As shown in fig. 26, a heat dissipation fan 78 may be provided in the second chamber 7214, the heat dissipation fan 78 providing forced convection in the second chamber 7214 from the second vent 766 to the first chamber 7212.

Specifically, since the electronic component 71 is disposed in the second chamber 7214, the temperature in the second chamber 7214 is higher than the temperature in the first chamber 7212 due to the heat generated by the operation of the electronic component 71, and the flow of high-temperature air from the second vent 766 to the first chamber 7212 can be accelerated by disposing the heat dissipation fan 78 in the second chamber 7214, so as to increase the evaporation rate of the condensed water.

Further, the heat dissipation fan 78 may be disposed at a position close to the first ventilation opening 764 to increase a distance between the heat dissipation fan 78 and the second ventilation opening 766, so as to increase a radiation range of the heat dissipation fan 78, so that the heat dissipation fan 78 can blow more air into the second ventilation opening 766.

Further, a temperature sensor (not shown) may be disposed in the electronic control box 7, and the temperature sensor is used for detecting the temperature in the second chamber 7214, so as to control the heat dissipation fan 78 to start operating or increase the rotation speed when the temperature sensor detects that the temperature in the second chamber 7214 exceeds a temperature threshold.

Specifically, a temperature sensor may be provided within the second chamber 7214 of the electrical control pod 7 for detecting the temperature within the second chamber 7214. When the temperature in the second chamber 7214 is increased to exceed the temperature threshold value due to the heat generated by the operation of the electronic component 71, the temperature sensor is triggered, the temperature sensor transmits a high-temperature trigger signal to the main board, and the main board starts the cooling fan 78, so that the flow of the air in the second chamber 7214 is accelerated by the cooling fan 78, the circulation speed of the air between the first chamber 7212 and the second chamber 7214 is accelerated, and the evaporation speed of the condensed water is accelerated. When the temperature in the second chamber 7214 decreases and is below the temperature threshold, the temperature sensor is triggered, the temperature sensor transmits a low-temperature trigger signal to the motherboard, and the motherboard further turns off the heat dissipation fan 78 to save energy.

The temperature threshold may be set according to needs, and the embodiment of the present application is not particularly limited.

10. The heat radiator is provided with a heat radiation plate at the upstream and heat radiation fins at the downstream

Referring to fig. 27, in the present embodiment, the electronic control box 7 includes a box body 72, a heat sink 6, an electronic component 71 and a heat dissipation fin 75.

Wherein, the box body 72 is provided with a mounting cavity 721, and at least part of the heat exchange main body 61 is arranged in the mounting cavity 721; the electronic component 71 is connected to the heat exchange body 61 at a first position in a heat conducting manner, and the heat dissipation fins 75 are connected to the heat exchange body 61 at a second position in a heat conducting manner, wherein the first position and the second position are spaced from each other along a flow direction of a refrigerant flow of the heat exchange body 61. As described above, the refrigerant flow mentioned herein may be a main refrigerant flow or a sub-refrigerant flow in the air conditioning system shown in fig. 1.

In this embodiment, the electronic element 71 and the heat dissipating fins 75 are arranged at intervals along the flow direction of the refrigerant flow of the heat exchange main body 61, so that the space on the heat exchange main body 61 can be fully utilized, the heat exchange main body 61 can be utilized to dissipate heat of the electronic element 71, and the heat dissipating fins 75 can be utilized to reduce the temperature in the installation cavity 721 of the electronic control box 7, thereby protecting the electronic element 71 arranged in the installation cavity 721.

Further, the heat exchange body 61 includes a first end 61a and a second end 61b spaced apart from each other along the flow direction of the refrigerant flow, wherein the temperature of the heat exchange body 61 gradually decreases in a direction from the first end 61a to the second end 61b, i.e., the temperature of the first end 61a is greater than that of the second end 61 b. The first position is disposed closer to the first end 61a than the second position.

Specifically, since the temperature of the surface of the heat exchange body 61 changes along with the flowing direction of the refrigerant flow during the operation of the heat exchange body 61, and a first end 61a with a higher temperature and a second end 61b with a lower temperature are formed, and since the temperature difference between the first end 61a with a higher temperature and the hot air in the mounting cavity 721 is small, condensed water is not easily generated, the electronic element 71 can be disposed close to the first end 61a, that is, the first position is disposed close to the first end 61 a. Because the temperature difference between the lower second end 61b of temperature and the hot-air in installation cavity 721 is great, produce the comdenstion water easily, so, can be close to second end 61b with radiating fin 75 and set up, the lower radiating fin 75 of temperature can guarantee that radiating fin 75 and hot-air have enough big difference in temperature on the one hand, be convenient for dispel the heat to automatically controlled box 7, the comdenstion water that condensation formed also can evaporate under the effect of hot-air on the other hand radiating fin 75, the comdenstion water evaporation is endothermic, in order to further reduce the temperature of refrigerant flow, promote the heat transfer effect of radiator 6.

10.1 accelerating the flow velocity of the Heat dissipating airflow

Further, a heat dissipation fan 78 can be further arranged in the electronic control box 7, and the heat dissipation fan 78 is used for forming heat dissipation airflow acting on the heat dissipation fins 75 in the electronic control box 7, so that the flow speed of the heat dissipation airflow can be accelerated, and the heat exchange effect is further improved.

Alternatively, the heat dissipation fan 78 may be provided at a position close to the heat dissipation fins 75 to directly act on the heat dissipation fins 75.

Alternatively, as shown in fig. 28, it is also possible to provide a mounting plate 76 in the electronic control box 7, the mounting plate 76 being provided in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 located on both sides of the mounting plate 76, the mounting plate 76 being provided with a first ventilation opening 764 and a second ventilation opening 766 at intervals, so that the gas in the first chamber 7212 flows into the second chamber 7214 through the first ventilation opening 764, the gas in the second chamber 7214 flows into the first chamber 7212 through the second ventilation opening 766, at least a part of the heat exchange body 61 is located in the first chamber 7212, and the electronic element 71 and the heat dissipation fan 78 are provided in the second chamber 7214.

Through adopting mounting panel 76 to separate installation cavity 721 and form two mutually independent first cavity 7212 and second cavity 7214, can form the air current of circulation flow in first cavity 7212 and second cavity 7214 to the increase with the amount of wind of locating the contact of radiating fin 75 in first cavity 7212, and can be convenient for the air current after the cooling dispels the heat for the electronic component 71 that sets up in second cavity 7214, avoid the gas mixed flow, in order to promote radiating fin 75's radiating efficiency.

The heat dissipation fan 78 disposed in the second chamber 7214 is configured to accelerate the flow rate of the air in the second chamber 7214, so as to accelerate the circulation speed of the air between the first chamber 7212 and the second chamber 7214, and improve the heat dissipation efficiency of the electronic control box 7.

Further, the flow direction of the cooling airflow passing through the cooling fins 75 may be set to be perpendicular to the flow direction of the cooling airflow.

As shown in fig. 27 and 28, when the refrigerant flow in the heat exchange body 61 is in the horizontal direction, the heat dissipation airflow may be set to flow in the vertical direction to avoid flowing to the position of the electronic component 71.

Specifically, the first ventilation opening 764 and the second ventilation opening 766 may be provided at vertically spaced intervals on opposite sides of the heat dissipation fin 75. The number and arrangement density of the first ventilation openings 764 and the second ventilation openings 766 can be set as required.

Alternatively, when the refrigerant flow in the heat exchange body 61 is in the vertical direction, the heat dissipation airflow may be set to flow in the horizontal direction to avoid the heat dissipation airflow from flowing to the position of the electronic component 71. Or, the flow direction of the heat dissipation airflow and the flow direction of the refrigerant flow can be set to be along other two mutually perpendicular directions, which is not specifically limited in the embodiments of the present application.

Further, when the first ventilation opening 764 and the second ventilation opening 766 which are vertically disposed are employed, the first ventilation opening 764 may be disposed at an upper portion of the second ventilation opening 766 so that the hot air introduced into the first chamber 7212 through the second ventilation opening 766 automatically rises to a position of the heat exchange body 61 and exchanges heat with the heat exchange body 61.

Alternatively, the heat dissipation fan 78 may be disposed at a position close to the first ventilation opening 764 so that the cool air at the top of the first chamber 7212 enters the second chamber 7214 in time, and the heat dissipation fan 78 may accelerate the cool air to improve the heat dissipation efficiency of the electronic component 71.

11. Internal circulation

Under the usual situation, in order to cool down the electronic control box 7, the box body 72 of the electronic control box 7 is usually provided with heat dissipation holes communicated with the mounting cavity 721, so as to perform heat exchange with the outside air through natural convection of the heat dissipation holes, and further cool down the electronic control box 7. However, the heat dissipation holes are formed in the box body 72, so that the sealing performance of the electronic control box 7 is reduced, and external impurities such as moisture and dust enter the installation cavity 721 through the heat dissipation holes, thereby damaging the electronic components arranged in the installation cavity 721.

In order to solve the above problem, the present embodiment may provide the case body 72 of the electronic control case 7 as a sealing structure. Specifically, referring to fig. 29, the electronic control box 7 includes a box body 72, a mounting plate 76, a heat sink 6, an electronic component 71, and a heat dissipation fan 78.

The box body 72 is provided with a mounting cavity 721, the mounting plate 76 is arranged in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 which are positioned at two sides of the mounting plate 76, the mounting plate 76 is provided with a first ventilation opening 764 and a second ventilation opening 766 which are spaced, and the first ventilation opening 764 and the second ventilation opening 766 are communicated with the first chamber 7212 and the second chamber 7214; the heat sink 6 is at least partially disposed within the first chamber 7212; the electronic component 71 is arranged in the second chamber 7214 and is in heat conduction connection with the heat sink 6; the heat dissipation fan 78 is used to supply air so that the air in the first chamber 7212 flows into the second chamber 7214 through the first ventilation opening 764.

In the present embodiment, at least a portion of the heat sink 6 is disposed in the first chamber 7212, the electronic component 71 and the heat dissipation fan 78 are disposed in the second chamber 7214, and the mounting plate 76 is provided with the first ventilation opening 764 and the second ventilation opening 766 for communicating the first chamber 7212 and the second chamber 7214 at intervals, so that the electronic component 71 generates heat to make the temperature of the air in the second chamber 7214 higher, the heat dissipation fan 78 sends hot air into the second ventilation opening 766, the hot air naturally rises to contact with the heat sink 6 disposed in the first chamber 7212 due to the lower density of the hot air, the heat sink 6 is used for cooling the hot air to form cold air, the cold air flows into the second chamber 7214 from the first ventilation opening 764, the heat dissipation fan 78 is used for accelerating the cold air to cool the electronic component 71 disposed in the second chamber 7214 by the cold air, the temperature of the cold air after heat exchange with the electronic component 71 is increased, the cold air after the temperature risees further continues to get into second ventilation opening 766 under radiator fan 78's effect to this circulation, and then the mode through the inner loop is cooled down for the electronic component 71 of locating in automatically controlled box 7, compares in the mode of adopting to set up the louvre on automatically controlled box 7 and cools down, and automatically controlled box 7 in this application is totally enclosed automatically controlled box 7, can effectively solve waterproof, protection against insects, dustproof, dampproofing scheduling problem, and then promote the automatically controlled reliability of automatically controlled box 7.

As shown in fig. 29, the heat dissipation fan 78 is installed in the first ventilation opening 764, and the plane of the heat dissipation fan 78 is coplanar with the plane of the mounting plate 76.

Specifically, the heat dissipation fan 78 may be fixed in the first ventilation opening 764 through a fan bracket (not shown), and the plane where the heat dissipation fan 78 is located is specifically a plane perpendicular to the rotation axis direction of the heat dissipation fan 78. By disposing the heat dissipation fan 78 in the first ventilation opening 764, the distance between the heat dissipation fan 78 and the first chamber 7212 can be shortened, so that the cool air can be conveniently discharged out of the first chamber 7212, and the heat dissipation fan 78 can be prevented from occupying the space in the second chamber 7214, so that the arrangement of the elements in the electronic control box 7 is more compact, and the size of the electronic control box 7 is reduced.

Since the electronic components 71 are generally mounted on the mounting plate 76, if the plane of the heat dissipation fan 78 is coplanar with the plane of the mounting plate 76, the airflow direction of the heat dissipation fan 78 is generally perpendicular to the plane of the mounting plate 76, so that the airflow direction of the heat dissipation fan 78 cannot directly act on the electronic components 71, and the flow path of the airflow in the second chamber 7214 is extended.

Therefore, as shown in fig. 11 and 29, an air guiding cover 79 may be further disposed in the electronic control box 7, and the air guiding cover 79 is disposed at the periphery of the heat dissipating fan 78 and used for guiding the air blown by the heat dissipating fan 78, so that the air outlet direction of the heat dissipating fan 78 faces the electronic component 71.

Specifically, the wind scooper 79 is connected to the mounting plate 76, and the wind outlet of the wind scooper 79 faces the position of the electronic component 71, so that the airflow of the cooling fan 78 flows to the position of the electronic component 71 after being guided by the wind scooper 79, on one hand, the cool air can directly act on the electronic component 71 to improve the cooling efficiency of the electronic component 71, and on the other hand, the wind scooper 79 can also increase the speed of the cool air flowing through the electronic component 71 to further improve the cooling efficiency of the electronic component 71.

In another embodiment, as shown in FIG. 30, the plane of the heat dissipation fan 78 is perpendicular to the plane of the mounting plate 76, and the leeward side of the heat dissipation fan 78 is disposed toward the first ventilation opening 764.

Specifically, the heat dissipation fan 78 may be disposed on a side of the mounting plate 76 facing the second chamber 7214, a rotation axis direction of the heat dissipation fan 78 is parallel to a plane of the mounting plate 76, and a leeward side of the heat dissipation fan 78 refers to an air inlet side of the heat dissipation fan 78. In this embodiment, the heat dissipation fan 78 may be disposed between the first ventilation opening 764 and the electronic component 71, and the cold air entering the second chamber 7214 through the first ventilation opening 764 is accelerated by the heat dissipation fan 78 and then flows out, so as to increase the flow speed of the cold air and improve the heat dissipation efficiency of the electronic control box 7.

Further, as shown in fig. 30, in order to accelerate the cold air entering through the first ventilation opening 764 by the heat dissipation fan 78, a return air duct 791 may be further disposed in the electronic control box 7, and the return air duct 791 is connected between the first ventilation opening 764 and the heat dissipation fan 78, and is used for conveying the air in the first chamber 7212 to the heat dissipation fan 78. Thus, the cold air entering through the first ventilation opening 764 is sent to the heat dissipation fan 78 through the return air duct 791, and is accelerated by the heat dissipation fan 78, so as to increase the flowing speed of the cold air and improve the heat dissipation efficiency of the electronic control box 7.

Further, as shown in fig. 30, a supply air duct 792 may be provided in the electronic control box 7, wherein the supply air duct 792 is connected to a side of the cooling fan 78 away from the return air duct 791, and is used for guiding air blown by the cooling fan 78, so that the air flow guided by the supply air duct 792 flows toward the electronic component 71.

Specifically, the air duct 792 can be used to guide air blown by the heat dissipation fan 78, so that the air outlet direction of the heat dissipation fan 78 faces the electronic component 71, so as to increase the proportion of cold air flowing to the electronic component 71, thereby improving the heat dissipation efficiency of the electronic component 71.

In another embodiment, as shown in fig. 31, the heat radiation fan 78 may also be provided as a centrifugal fan.

The centrifugal fan is a machine that increases the pressure of gas and discharges the gas by means of input mechanical energy. The centrifugal fan operates on the principle of accelerating air by means of an impeller rotating at high speed. Therefore, in the present embodiment, the centrifugal fan 78 is provided as the cooling fan, so that on the one hand, high-speed cold air can be obtained and the heat dissipation efficiency of the electronic component 71 can be improved, and on the other hand, the centrifugal fan can simplify the structure of the cooling fan 78 and improve the mounting efficiency as compared with the cooling fan 78 provided with the return air duct 791 and the air supply duct 792.

Optionally, when the electronic components 71 are disposed at different positions, the air guiding cover 79 and the air duct 792 are added to make the direction of the guided air flow more constant, so that although the heat dissipation efficiency of a part of the electronic components 71 in the air flow direction can be improved, the heat dissipation effect of the electronic components 71 at a position deviating from the air flow direction by a larger distance is poorer.

Therefore, air guide plates (not shown) may be provided at intervals on the mounting plate 76, and an air guide flow passage may be formed between the air guide plates to guide air blown by the heat dissipation fan 78.

For example, two air guiding plates spaced in parallel may be disposed between the electronic components 71 disposed in a dispersed manner, and the extending direction of the air guiding plates is along the spacing direction of the electronic components 71, so as to define an air guiding flow channel between the two air guiding plates along the spacing direction of the electronic components 71. The cold air blown by the heat dissipation fan 78 firstly flows to the position of the partial electronic element 71 to dissipate heat of the electronic element 71, and the air passing through the partial electronic element 71 further flows to the position of the other partial electronic element 71 through the air guide flow channel to dissipate heat of the other partial electronic element 71, so that heat dissipation of the electronic element 71 is more balanced, and damage caused by overhigh temperature of the partial electronic element 71 is avoided.

Wherein, the heat sink 6 may be disposed inside the electrical control box 7, that is, the heat exchange main body 61 may be disposed inside the first chamber 7212, so as to cool the air in the first chamber 7212.

Alternatively, it is also possible to arrange the heat sink 6 outside the electrical control box 7 and to arrange at least a partial extension of the heat sink 6 inside the first chamber 7212. For example, when the heat sink 6 includes the heat exchange body 61, the integrated piping component 62, and the heat radiation fins 75, a mounting port (not shown) communicating with the first chamber 7212 may be opened in the case 72. At this time, the heat exchange body 61 is coupled to the outer sidewall of the case 72, and the heat radiating fins 75 are coupled to the heat exchange body 61 and inserted into the first chamber 7212 through the fitting hole.

The matching manner between the heat sink 6 and the electronic control box 7 in this embodiment is the same as that in the above embodiment, please refer to the description in the above embodiment, and details are not repeated here.

As shown in fig. 31, the electronic component 71 may be disposed in the air blowing range of the heat dissipation fan 78, so that the heat dissipation fan 78 directly acts on the electronic component 71 to cool down.

The electronic component 71 may include a primary heating element with a large heat generation amount, such as the common mode inductor 711, the reactance 712, and the capacitor 713, and a secondary heating element with a small heat generation amount, such as the fan module 714. In order to improve the heat dissipation efficiency of the main heating element, the distance between the main heating element and the first ventilation opening 764 may be set smaller than the distance between the secondary heating element and the first ventilation opening 764, that is, the main heating element with a larger heat generation amount may be disposed at a position close to the first ventilation opening 764, and the secondary heating element with a smaller heat generation amount may be disposed at a position away from the first ventilation opening 764, so that the air with a lower temperature entering through the first ventilation opening 764 first acts on the main heating element with a larger heat generation amount, thereby improving the heat dissipation efficiency of the main heating element with a larger heat generation amount.

Optionally, the second ventilation opening 766 may be disposed at the end of the air supply of the heat dissipation fan 78 and disposed at a position close to the electronic component 71 with a large heat generation amount, so as to expand the radiation range of the heat dissipation fan 78 and improve the circulation efficiency of the air in the second chamber 7214, and on the other hand, the hot air after heat exchange with the electronic component 71 with a large heat generation amount may be discharged out of the second chamber 7214 in time, thereby avoiding increasing the temperature of the whole second chamber 7214.

Further, the second ventilation opening 766 may be disposed at a position close to the first ventilation opening 764 to shorten a circulation path of air in the second chamber 7214, reduce air flow resistance, and improve circulation efficiency of air, thereby improving heat dissipation efficiency of the electronic control box 7.

Further, the first ventilation opening 764 and the second ventilation opening 766 can be sized according to the arrangement of the electronic components 71.

Specifically, the number of the second ventilation openings 766 may be plural, and the plural second ventilation openings 766 are provided at different positions of the mounting plate 76, respectively. The size of the second ventilation openings 766 provided at the position of the electronic component 71 with a large calorific value may be set relatively large, the number of the second ventilation openings 766 may also be set relatively large, and the distribution density of the plurality of second ventilation openings 766 may be set relatively large. The size of the second ventilation openings 766 provided at the position of the electronic component 71 with a small amount of heat generation can be set relatively small, the number of the second ventilation openings 766 can also be set relatively small, and the distribution density of the plurality of second ventilation openings 766 can be set relatively small.

Further, the size of the first ventilation opening 764 can be set larger than the size of the second ventilation opening 766 to increase the amount of return air and increase the efficiency of the heat dissipation fan 78.

12. Natural convection current

Referring to fig. 32 and 33, in the present embodiment, the electronic control box 7 includes a box body 72, a mounting plate 76, a heat sink 6, and a main heating element 715.

The box body 72 is provided with a mounting cavity 721, the mounting plate 76 is arranged in the mounting cavity 721, so that the mounting cavity 721 forms a first chamber 7212 and a second chamber 7214 which are positioned at two sides of the mounting plate 76, and the mounting plate 76 is provided with a first ventilation opening 764 and a second ventilation opening 766 which are spaced in the vertical direction; the heat sink 6 is at least partially disposed within the first chamber 7212; the primary heating element 715 is disposed within the second chamber 7214; the first and

second vents

764 and 766 communicate the first and

second chambers

7212 and 7214 to form a circulating cooling air flow between the first and

second chambers

7212 and 7214 using a temperature difference between the main heating element 715 and the heat sink 6.

Specifically, the main heating element 715 is disposed in the second chamber 7214, the temperature in the second chamber 7214 is increased due to heat generated by the operation of the main heating element 715, since the density of the hot air is low, the hot air naturally rises and enters the first chamber 7212 through the first ventilation opening 764 at the top of the second chamber 7214, the hot air contacts the heat sink 6 and exchanges heat with the heat sink 6, the temperature of the hot air is reduced, the density of the hot air is increased, the hot air naturally sinks to the bottom of the first chamber 7212 under the action of gravity and enters the second chamber 7214 through the second ventilation opening 766, the temperature of the main heating element 715 disposed in the second chamber 7214 is reduced, and the hot air after exchanging heat with the main heating element 715 further rises to the position of the first ventilation opening 764, so as to form an internal circulation airflow between the first chamber 7212 and the second chamber 7214.

In this embodiment, the first ventilation opening 764 and the second ventilation opening 766 communicating the first chamber 7212 and the second chamber 7214 are formed in the mounting plate 76, and the first ventilation opening 764 and the second ventilation opening 766 are arranged in the vertical direction, so that the self gravity of air can be utilized to circulate between the first chamber 7212 and the second chamber 7214, so as to cool the electronic component 71 arranged in the second chamber 7214, and the overall temperature of the electronic control box 7 can be reduced.

Further, the heat sink 6 may be disposed at an upper side of the main heat generating element 715 in a gravity direction, that is, the heat sink 6 is disposed at a position near the top of the first chamber 7212, and the main heat generating element 715 is disposed at a position near the bottom of the second chamber 7214. By such an arrangement, the distance between the heat sink 6 and the first ventilation opening 764 can be reduced, so that the hot air entering the first chamber 7212 through the first ventilation opening 764 quickly contacts with the heat sink 6 to be cooled, and naturally sinks under the action of gravity. By reducing the distance between the main heating element 715 and the second ventilation opening 766, the hot air entering the second chamber 7214 through the second ventilation opening 766 quickly contacts with the main heating element 715 to be heated, and naturally rises under the action of buoyancy, so that the circulation speed of the air flow in the electronic control box 7 can be increased, and the heat dissipation efficiency is improved.

Further, as shown in fig. 33, a secondary heating element 716 may be further disposed in the electronic control box 7, and the secondary heating element 716 is disposed in the second chamber 7214 and is connected to the heat exchange main body 61 in a heat conduction manner, wherein the heat generation amount of the secondary heating element 716 is smaller than that of the main heating element 715.

Specifically, in this embodiment, the main heating element 715 with a large heat generation amount may be disposed at a position close to the second ventilation opening 766, so that, on one hand, the cold air entering through the first chamber 7212 may first contact the electronic element 71 with a large heat generation amount, thereby improving the heat dissipation efficiency of the electronic element 71, and on the other hand, the cold air and the electronic element 71 with a large heat generation amount may have a large temperature difference therebetween, so that the cold air may be rapidly heated, and then rapidly raised by buoyancy. The sub-heater 716 with a small amount of heat generation is provided on the heat exchange body 61 and is in contact with the heat exchange body 61, so that the electronic component 71 with a small amount of heat generation can be directly cooled by the heat exchange body 61. In this way, by providing the main heating element 715 having a large heat generation amount and the sub-heating element 716 having a small heat generation amount in different regions, the distribution of the electronic components 71 can be made reasonable, and the internal space of the electronic control box 7 can be fully utilized.

Optionally, the secondary heating element 716 is connected to the heat exchanging body 61 through a heat radiation fixing plate 74 to improve the assembly efficiency of the secondary heating element 716.

The connection manner of the secondary heating element 716 and the heat exchange main body 61 may be the same as that in the above embodiments, and specific reference is made to the description in the above embodiments, which is not repeated herein.

Alternatively, it is also possible to arrange the heat sink 6 outside the electrical control box 7 and to arrange at least a partial extension of the heat sink 6 inside the first chamber 7212.

The matching manner of the heat sink 6 and the electronic control box 7 is the same as that in the above embodiment, please refer to the description in the above embodiment.

The structures in the above embodiments may be combined with each other, and it is understood that, besides the aforementioned heat sink 6, other types of heat sinks 6 may also be adopted in the above embodiments, and the embodiments of the present application are not particularly limited.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. An electrical control box, comprising:

the box body is provided with a mounting cavity;

the mounting plate is arranged in the mounting cavity, so that the mounting cavity forms a first cavity and a second cavity which are positioned at two sides of the mounting plate, a first vent and a second vent are arranged on the mounting plate at intervals, so that the gas in the first cavity flows into the second cavity through the first vent, and the gas in the second cavity flows into the first cavity through the second vent; and

the radiator comprises a heat exchange body and a collecting pipe assembly, wherein the collecting pipe assembly is used for providing a refrigerant flow to the heat exchange body, at least part of the heat exchange body is arranged in the first cavity, the first ventilation opening and the second ventilation opening are provided with a spacing direction, and the refrigerant flow in the heat exchange body is arranged along the spacing direction;

wherein the heat exchange body has a first temperature at a position near the first vent and a second temperature at a position near the second vent, the first temperature being greater than the second temperature.

2. The electrical control box according to claim 1, comprising an electronic component in thermally conductive connection with the heat exchange body at a location of the heat exchange body proximate to the first vent.

3. The electronic control box according to claim 2, wherein the electronic component is disposed in the second chamber, the electronic control box comprises a heat dissipation fixing plate, the heat dissipation fixing plate is connected to the heat exchange main body, the mounting plate is provided with an avoiding hole at a position corresponding to the heat dissipation fixing plate, the heat dissipation fixing plate blocks the avoiding hole, and the electronic component is disposed on one side of the heat dissipation fixing plate away from the heat exchange main body.

4. The electrical control box according to claim 3, wherein the electrical control box comprises a heat dissipation fan disposed in the second chamber, the heat dissipation fan providing forced convection in the second chamber from the second air vent to the first chamber.

5. The electrical control box according to claim 4, wherein the heat dissipation fan is disposed at a position close to the first ventilation opening.

6. The electronic control box according to claim 4, wherein the electronic control box comprises a temperature sensor for detecting the temperature in the second chamber to control the heat dissipation fan to start operating or increase the rotation speed when the temperature sensor detects that the temperature in the second chamber exceeds a temperature threshold.

7. The electrical control box according to claim 1, wherein the first ventilation opening and the second ventilation opening are spaced apart from each other in a vertical direction, and the first ventilation opening is located above the second ventilation opening.

8. The electrical control box according to claim 1, wherein the heat sink is configured to act as an economizer for an air conditioning device, and the first temperature of the heat exchange body is greater than the second temperature at least in a cooling mode of the air conditioning device.

9. The electrical control box of claim 1, wherein a first heat exchange channel and a second heat exchange channel are disposed in the heat exchange body, the manifold assembly includes a first manifold and a second manifold, the first manifold is provided with a first manifold channel for providing a first refrigerant flow to the first heat exchange channel and/or collecting the first refrigerant flow flowing through the first heat exchange channel, the second manifold is provided with a second manifold channel for providing a second refrigerant flow to the second heat exchange channel and/or collecting the second refrigerant flow flowing through the second heat exchange channel, such that heat exchange occurs between the first refrigerant flow flowing through the first heat exchange channel and the second refrigerant flow flowing through the second heat exchange channel, wherein the second refrigerant flow absorbs heat from the first refrigerant flow during flow along the second heat exchange channel, so that the first refrigerant stream is subcooled, or the first refrigerant stream absorbs heat from the second refrigerant stream during the flow along the first heat exchange channel, so that the second refrigerant stream is subcooled.

10. An air conditioning device, characterized in that the air conditioning device comprises an air conditioning body and an electric control box according to any one of claims 1 to 9, wherein the electric control box is detachably connected with the air conditioning body.