CN109462968A - A kind of radiator of multi-surface heat-producing device - Google Patents
A kind of radiator of multi-surface heat-producing device Download PDFInfo
- Publication number
- CN109462968A CN109462968A CN201811614086.1A CN201811614086A CN109462968A CN 109462968 A CN109462968 A CN 109462968A CN 201811614086 A CN201811614086 A CN 201811614086A CN 109462968 A CN109462968 A CN 109462968A
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- China
- Prior art keywords
- radiator
- heat
- electronic equipment
- fixed bracket
- producing device
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to heat abstractor technical fields, disclose a kind of radiator of multi-surface heat-producing device.The present invention is for the heat dissipation to the electronic equipment with multiple heating surfaces, and including radiator, heat pipe and the fixation bracket connecting with electronic equipment, and fixed bracket is the multi-plane structure contacted with each heating surface of electronic equipment；The face that the fixed bracket is contacted with the heating surface of electronic equipment is heating surface, and a support bracket fastened heating surface is fixedly connected with radiator, remaining heating surface passes through heat pipe and is connected with radiator.Present invention decreases the volumes of entire radiator, reduce weight, reduce costs simultaneously；The efficient heat dissipation of multi-panel may be implemented.
Description
Technical field
The invention belongs to heat abstractor technical fields, and in particular to a kind of radiator of multi-surface heat-producing device.
Background technique
With computer industry rapidly develop and the trend of electronic device diversification under, the effect of electronic equipment by
The reinforcement of step, automated production, Intelligent life etc. all be unable to do without electronic equipment, current market sales of various electric
Equipment can all generate heat in the operating condition, or even generate high temperature, and the service life of electronic equipment can exponentially as the temperature rises
Type drop, the heat dissipation effect of existing electronic electric equipment is all bad, even can lead to electronic component since temperature is excessively high sometimes
Damage, the operating temperature of electronic equipment depends on the quality of cooling system, so the quality of cooling system scheme makes with product
It is directly related with the height in service life.
There are many existing heat sink conception type, but are all based on simple plane greatly.Its method is to dissipate a standard
Hot device is directly placed on heat source, directly directly realizes that the heat of heat dissipation element distributes by radiator, or pass through heat transfer
Component come it is thermally conductive, such as heat pipe, indirectly by heat derives into standard radiator, finally by the form of heat convection by heat
It is exported from radiator.But when the heating surface of radiating element is more: it is abnormally-structured, if still using this side
Formula --- each flat heat source is placed into a radiator or heat pipe, to keep excellent heat dissipation effect, the volume of product
Will necessarily all have greatly improved with quality, at the same time, complex degree of structure rise meeting so that cooling system air duct cloth
Difficulty raising is set, will increase the resistance of air-flow in this way, under the effect of same heat loss through convection, it is necessary to increase the power of fan, this
The noise and energy consumption of sample electronic equipment can further increase.
Summary of the invention
In order to solve the above problems existing in the present technology, it is an object of that present invention to provide a kind of multi-surface heat-producing devices
Radiator.
The technical scheme adopted by the invention is as follows:
A kind of radiator of multi-surface heat-producing device, for the heat dissipation to the electronic equipment with multiple heating surfaces,
Including radiator, heat pipe and the fixation bracket connecting with electronic equipment, and fixed bracket is each fever table with electronic equipment
The multi-plane structure that face contacts；The face that the fixed bracket is contacted with the heating surface of electronic equipment is heating surface, fixed branch
One heating surface of frame is fixedly connected with radiator, remaining heating surface passes through heat pipe and is connected with radiator.
It may further be preferable that one end of the heat pipe is connected with fixed bracket, the other end of heat pipe is from radiator
One end is arranged in the inside of radiator, and the other end of heat pipe is in contact with multiple cooling fins of radiator.The other end of heat pipe
The case where when optimal set-up mode is through close to the other end of radiator, the cooling fin with radiator can be increased in this way
The quantity being in contact, heat on more convenient heat pipe is comprehensive to be distributed on radiator, accelerates the heat-conductive characteristic of heat pipe,
Indirectly improve the radiating efficiency of the electronic equipment as heat dissipation element.
It is even furthermore preferable that one end of the heat pipe using solder(ing) paste after weld formation hot setting in fixed bracket
On.The support bracket fastened main body heat dissipation position of fever face contact with electronic equipment is connected with radiator, can't be accounted for
With the great area of support bracket fastened heating surface, but can by most heat transfer to radiator, in combination with by
The heat dissipation in hot face itself greatly improves the radiating efficiency of electronic equipment.
It, in this way can be with it is even furthermore preferable that the other end of multiple heat-dissipating pipes is uniformly arranged in the inside of radiator
Being distributed on radiator for the even heat that a heat pipe absorbs is added, so that radiator heat absorption is more uniform, improves radiator
Heat absorption efficiency, and then the radiating efficiency of electronic equipment is further increased, while can be piled up at one to avoid heat-dissipating pipe, it influences to dissipate
The radiating efficiency of hot device.
It is even furthermore preferable that the fixed bracket is fixedly connected by screw with radiator, and screw and fixed branch
Spring washer is provided between frame.Connection between fixed bracket and radiator can also in such a way that solder(ing) paste is welded into
Row is fixed, and does not do specific restriction, as long as being connected firmly and convenient for thermally conductive.I.e. the head of screw of radiator and screw distinguishes position
In support bracket fastened two sides so that it is convenient on a heat sink tighten work, spring washer can be prevented when tightening firmly too
It causes fixed bracket to deform greatly, whole structure is destroyed, to influence radiating efficiency.
It is even furthermore preferable that the fixed bracket is fixedly connected by screw with electronic equipment.It is corresponding with screw
, what is cooperated on fixed bracket and electronic equipment is provided with threaded hole, convenient for the electronic equipment of heat dissipation element will be used as to be fixed on
Specified position will closely fit together between heat dissipation element and fixation when being also convenient for using screw installation, improve heat and pass
The efficiency passed.
It is even furthermore preferable that the fixed bracket is made of copper product or aluminum material.Copper product and aluminum material are
The good heat sink material of heat-conducting effect can be very good the heat transfer by electronic equipment to radiator.
It is even furthermore preferable that the surface of the radiator is provided with fan.Fan can accelerate the heat dissipation of radiator,
Heat is quickly taken away into spreader surface, to accelerate absorption of the radiator to the heat on fixed bracket and heat pipe, indirectly
Quickening electronic equipment heat dissipation.Fan uses existing common fan, is not specifically limited.
The invention has the benefit that
The configuration of the present invention is simple solves the case where multiple radiators and radiating subassembly is arranged in existing multi-panel heat dissipation element,
The volume for reducing entire radiator reduces whole weight, while reducing whole cost；The present invention utilizes fixation
Bracket contacts simultaneously with multiple heating surfaces of the electronic equipment as heat dissipation element, and support bracket fastened one of heating surface with
Radiator directly contacts, other heating surfaces are contacted by heat pipe with radiator, so that all radiating surfaces of electronic equipment can be with
Heat is conducted to radiator well simultaneously, to achieve the effect that rapid cooling；The fixation bracket directly contacted with radiator
Heating surface be fixedly connected with radiator, can be very good to deliver heat to radiator, and the heat transfer efficiency of heat pipe is also very high,
Therefore the efficient heat dissipation of multi-panel may be implemented.
Detailed description of the invention
Fig. 1 is three dimensional structure diagram of the invention；
Fig. 2 is main view of the invention；
Fig. 3 is the A of Fig. 2 to cross-sectional view.
In figure: 1- radiator；2- heat pipe；3- fixes bracket；4- screw；5- spring washer；6- threaded hole.
Specific embodiment
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Hereinafter reference will be made to the drawings, by way of example describe in detail it is provided by the invention it is a kind of based on deep learning and
The pedestrian traffic statistical method of multiple target tracking.It should be noted that being used to help for the explanation of these way of example
Assistant solves the present invention, but and does not constitute a limitation of the invention.
In some instances, it since some embodiments belong to existing or routine techniques, is not described or does not have
Detailed description.
In addition, technical characteristic described herein or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can also be combined in any suitable manner in one or more embodiments.For this field
Technical staff for, the step of should be readily appreciated that method related with embodiment provided herein or operation order can also change
Become.Any sequence in drawings and examples is merely illustrative purposes, requirement is not implied that in a certain order, unless bright
Really illustrate to require according to a certain sequence.
The terms "and/or", only a kind of incidence relation for describing affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate: individualism A, individualism B exist simultaneously tri- kinds of situations of A and B, the terms
"/and " it is to describe another affiliated partner relationship, indicate may exist two kinds of relationships, for example, A/ and B, can indicate: individually depositing
In A, two kinds of situations of individualism A and B, in addition, character "/" herein, typicallying represent forward-backward correlation object is a kind of "or" pass
System.
It should be noted that, in this document, such as first and second etc relational terms are used merely to an entity
Or operation is distinguished with another entity or operation, is existed without necessarily requiring or implying between these entities or operation
Any actual relationship or order.Moreover, the terms "include", "comprise" or its any other variant be intended to it is non-
It is exclusive to include, so that the process, method, article or equipment for including a series of elements not only includes those elements,
It but also including other elements that are not explicitly listed, or further include solid by this process, method, article or equipment
Some elements.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including
There is also other identical factors in the process, method, article or equipment of the element.
As shown in Figure 1, Figure 2 and Figure 3, the radiator of a kind of multi-surface heat-producing device of the present embodiment, for having
The heat dissipation of the electronic equipment of multiple heating surfaces, including radiator 1, heat pipe 2 and the fixation bracket 3 being connect with electronic equipment, and
Fixed bracket 3 is the multi-plane structure contacted with each heating surface of electronic equipment；The fixed bracket 3 and electronic equipment
The face of heating surface contact be heating surface, a heating surface of fixed bracket 3 is fixedly connected with radiator 1, remaining heating surface
Be connected with radiator 1 by heat pipe 2, the quantity of specific heating surface will according to the quantity of the radiating surface of electronic equipment come
Fixed, in the present embodiment there are three the radiating surface settings of electronic equipment, i.e., one of heating surface is fixedly connected with radiator, remaining
Two heating surfaces pass through heat pipe and are connected with radiator.Specific heating surface quantity is according to electronic equipment come fixed, at least
It can be radiated using radiator of the invention when being two.Radiator 1 uses existing radiator 1, can be with
Selector size and specific structure according to actual needs, are not specifically limited.
The configuration of the present invention is simple solves the case where multiple radiators and radiating subassembly is arranged in existing multi-panel heat dissipation element,
The volume for reducing entire radiator reduces whole weight, while reducing whole cost；The present invention utilizes fixation
Bracket contacts simultaneously with multiple heating surfaces of the electronic equipment as heat dissipation element, and support bracket fastened one of heating surface with
Radiator directly contacts, other heating surfaces are contacted by heat pipe with radiator, so that all radiating surfaces of electronic equipment can be with
Heat is conducted to radiator well simultaneously, to achieve the effect that rapid cooling；The fixation bracket directly contacted with radiator
Heating surface be fixedly connected with radiator, can be very good to deliver heat to radiator, and the heat transfer efficiency of heat pipe is also very high,
Therefore the efficient heat dissipation of multi-panel may be implemented.
Heat pipe 2 is a kind of heat transfer element, takes full advantage of the quick thermal transport property of heat-conduction principle and phase change medium, thoroughly
The heat of thermal objects is transmitted to outside heat source rapidly by superheater tube 2, and the capacity of heat transmission is more than the capacity of heat transmission of any known metal.
Heat pipe 2 is (to utilize the evaporation latent heat of liquid and condensation latent in the phase transition process of cold end condensation after the evaporation of hot end using medium
Heat), conduct heat quickly.General heat pipe 2 consists of a tube shell, a liquid suction core and an end cover.It is to be pumped into negative pressure shape inside heat pipe 2
State is filled with liquid appropriate, and this boiling point of liquid is low, readily volatilized.Tube wall has liquid-sucking core, is made of capillary-porous material.
2 one end of heat pipe is evaporation ends, and other end is condensation end, when 2 one end of heat pipe is heated, liquid rapid vaporization in capillary,
Steam flows to other end under the power of thermal diffusion, and releases heat in cold end condensation, and liquid leans on hair along porous material again
Spy is with evaporation ends are flowed back to, and so circulation is more than, until 2 both ends temperature of heat pipe is equal (stopping of steam thermal diffusion at this time).It is this
Circulation quickly carries out, and heat, which can be conducted continuously, to be come.
In the present embodiment it should be further noted that one end of the heat pipe 2 is connected with fixed bracket 3, heat pipe 2
The other end is arranged in the inside of radiator 1, and multiple cooling fins of the other end of heat pipe 2 and radiator 1 from one end of radiator 1
It is in contact, the case where when the optimal set-up mode of the other end of heat pipe 2 is through close to the other end of radiator 1, in this way may be used
To increase the quantity that is in contact with the cooling fin of radiator 1, heat on more convenient heat pipe 2 it is comprehensive be distributed to radiator
On 1, accelerate the heat-conductive characteristic of heat pipe 2, indirectly improves the radiating efficiency of the electronic equipment as heat dissipation element.
It needs to further explain in the present embodiment, one end of the heat pipe 2 uses solder(ing) paste high temperature after weld formation
Solidify in fixing on bracket 3, by the main body heat dissipation position of the fixation bracket 3 of the fever face contact with electronic equipment and radiator 1
It connects, the great area of heating surface of fixed bracket 3 can't be occupied, but most heat transfer can be given
Radiator 1 greatly improves the radiating efficiency of electronic equipment in combination with the heat dissipation of heating surface itself.
It needs to further explain in the present embodiment, the other end of multiple heat-dissipating pipes 2 is uniformly arranged in radiator 1
Inside, being distributed on radiator 1 for the even heat that heat pipe 2 absorbs can be added in this way, so that the heat absorption of radiator 1 is more
Uniformly, the heat absorption efficiency of radiator 1 is improved, and then further increases the radiating efficiency of electronic equipment, while can be to avoid heat dissipation
Pipe 2 is piled up at one, influences the radiating efficiency of radiator 1.
It needs to further explain in the present embodiment, the fixed bracket 3 connects by the way that screw 4 and radiator 1 are fixed
It connects, and is provided with spring washer 5 between screw 4 and fixed bracket 3, the connection between fixed bracket 3 and radiator 1 can also adopt
It is fixed with the welded mode of solder(ing) paste, does not do specific restriction, as long as being connected firmly and convenient for thermally conductive.Radiate
4, screw of device 1 and screw 4 are located at the two sides of fixed bracket 3 so that it is convenient to tighten work, spring on radiator 1
Washer 5 can prevent that fixed bracket 3 is firmly caused very much to deform greatly when tightening, and destroy whole structure, to influence to dissipate
The thermal efficiency.
It needs to further explain in the present embodiment, the fixed bracket 3 connects by the way that screw 4 and electronic equipment are fixed
It connects, corresponding, what is cooperated on fixed bracket 3 and electronic equipment is provided with threaded hole 6, convenient for that will be used as the electricity of heat dissipation element
Sub- equipment is fixed on specified position, is also convenient for closely being fitted between heat dissipation element and fixation when installing using screw 4
Together, the efficiency of heat transmitting is improved.In the present embodiment, it is all connected between each heating surface and electronic equipment there are two screw, two
A screw is set to different positions, to keep the fixation of balance.
It needs to further explain in the present embodiment, the fixed bracket 3 is made of copper product or aluminum material.Copper material
Material and aluminum material are the good heat sink material of heat-conducting effect, be can be very good the heat transfer of electronic equipment to radiator 1.
It needs to further explain in the present embodiment, the surface of the radiator 1 is provided with fan.Fan can lead to
It crosses screw to be fixed on radiator, while fan can accelerate the heat dissipation of radiator 1, heat is quickly taken away to 1 table of radiator
Indirectly accelerate the heat dissipation of electronic equipment to accelerate absorption of the radiator to the heat on fixed bracket and heat pipe in face.Fan
Using existing common fan, it is not specifically limited.
The invention patent provides the heat dissipation solution of a kind of abnormally-structured (multi-surface heat radiating structure), is meeting electronics
Under the premise of the radiating requirements of equipment, being spliced by multiple radiators 1 for complexity is replaced with 1 component of radiator of an entirety
Heat sink conception.On the one hand the reduction of heat dissipation element quantity can reduce the volume and quality of electronic equipment, still further aspect letter
Change the Duct design of electronic product, reduces vapour lock.The operating temperature of electronic component refers to the transient temperature at a certain moment, so
When considering heat dissipation, it is also necessary to consider how to store heat and how effectively dredge, so that whole system is not
The level of entire heat sink conception can be dragged down because local temperature is excessively high.Application based on heat transfer and thermal convection theory, this is dissipated
Hot scheme belongs to the heat dissipation solution of abnormally-structured customization, requires higher radiating requirements with the realization of simplest structure,
And the manufacture craft of product is simple, not will increase cost.
Radiating mode theoretically divides three kinds --- i.e. and the low-temperature condition of heat transfer, thermal convection and heat radiation, cooling system is
The target that we pursue, heat radiation accounts for the component very little of integral heat sink under this state, almost arrives negligible stage, so
For high-power heat-dissipation system, heat transfer and thermal convection need to be only considered.And heat transfer and thermal convection can be attributed to a public affairs
Formula: Q=σ A (T2-T1)/L, in formula, σ respectively indicates coefficient of heat transfer and thermal coefficient, and A indicates the contact area between element,
Temperature difference of the T2-T1 between element, L are the effective thickness of radiator 1.The temperature difference certainly want to it is the smaller the better, so improve dissipate
The most direct method of the thermal efficiency is to improve the thermal coefficient, increase contact area of living that radiate, and reduces the effective thickness of radiator 1.
When electronic equipment powers on, heat dissipation element is the origin of heat of cooling system, and heat passes through from heat dissipation element
Endlessly by heat dissipation element and heterotypic support, (the present embodiment middle finger has the fixed branch of multiple heating surfaces to the mode of heat transfer
Frame 3) contact surface pass to radiator 1, wherein what the quantity of heterotypic support and heat dissipation element contact surface was designed by heat dissipation element
Radiating surface determines (present invention is using three radiating surfaces as example).When heat transfer is to heterotypic support, cooling stand itself is equivalent
In a heat source, at this moment only needs to give consideration to how for heat to be transferred in space from heterotypic support and distribute.
Heterotypic support and heat dissipation element contact surface portion temperature highest, it is responsible for accepting the heat passed over by heat dissipation element
Amount, at this point, heterotypic support itself is a good conductor for heat.Heat is conducted to radiator 1 in two ways, first, by different
Type bracket itself, can be by selecting excellent heat-transfer matcrial, enhancing heat transfer, such as copper and aluminium；Heterotypic support man heat from
Contact surface is transferred to the contact surface of heterotypic support Yu radiator 1, in order to reduce the thermal resistance of radiator 1 Yu heterotypic support, in addition to adopting
Heterotypic support and radiator 1 can also be fixed by an entirety using solder(ing) paste with other than screw 4.Second, passing through two heat
Heat is directly directed to radiator 1 by pipe 2, and the quantity of heat pipe 2 is more, and structure is more complicated, cooling system configure heat pipe 2 quantity by
Depending on integral heat sink demand (present invention is example with two heat pipes 2).
Radiator 1 and heterotypic support are linked into an integrated entity by way of screw 4 or welding, at this moment heat transfer to heat dissipation
When device 1, radiator 1 itself becomes a heat source, and since its heat dissipation area is big, in design and air directly forms thermal convection,
If being reconfigured one fan, the coefficient of heat transfer of entire heat transfer be will increase very much, hence it is evident that improve the heat dissipation effect of cooling system.
The present invention is not limited to above-mentioned optional embodiment, anyone can show that other are various under the inspiration of the present invention
The product of form, however, make any variation in its shape or structure, it is all to fall into the claims in the present invention confining spectrum
Technical solution, be within the scope of the present invention.
Claims (8)
1. a kind of radiator of multi-surface heat-producing device, for the heat dissipation to the electronic equipment with multiple heating surfaces,
Be characterized in that: including radiator, heat pipe and the fixation bracket connecting with electronic equipment, and fixed bracket is every with electronic equipment
The multi-plane structure that a heating surface contacts；The face that the fixed bracket is contacted with the heating surface of electronic equipment is heated
Face, a support bracket fastened heating surface are fixedly connected with radiator, remaining heating surface passes through heat pipe and is connected with radiator.
2. a kind of radiator of multi-surface heat-producing device according to claim 1, it is characterised in that: the one of the heat pipe
End is connected with fixed bracket, and the other end of heat pipe is arranged in the inside of radiator from one end of radiator, and heat pipe is another
End is in contact with multiple cooling fins of radiator.
3. a kind of radiator of multi-surface heat-producing device according to claim 2, it is characterised in that: the one of the heat pipe
End using solder(ing) paste after weld formation hot setting on fixed bracket.
4. a kind of radiator of multi-surface heat-producing device according to claim 3, it is characterised in that: multiple heat-dissipating pipes
The other end is uniformly arranged in the inside of radiator.
5. a kind of radiator of multi-surface heat-producing device according to claim 1, it is characterised in that: the fixed bracket
It is fixedly connected by screw with radiator, and is provided with spring washer between screw and fixed bracket.
6. a kind of radiator of multi-surface heat-producing device according to claim 1, it is characterised in that: the fixed bracket
It is fixedly connected by screw with electronic equipment.
7. a kind of radiator of multi-surface heat-producing device according to claim 1, it is characterised in that: the fixed bracket
It is made of copper product or aluminum material.
8. a kind of radiator of multi-surface heat-producing device described in any one of -7 according to claim 1, it is characterised in that: institute
The surface for stating radiator is provided with fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811614086.1A CN109462968A (en) | 2018-12-27 | 2018-12-27 | A kind of radiator of multi-surface heat-producing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811614086.1A CN109462968A (en) | 2018-12-27 | 2018-12-27 | A kind of radiator of multi-surface heat-producing device |
Publications (1)
| Publication Number | Publication Date |
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| CN109462968A true CN109462968A (en) | 2019-03-12 |
Family
ID=65615261
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811614086.1A Pending CN109462968A (en) | 2018-12-27 | 2018-12-27 | A kind of radiator of multi-surface heat-producing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI757176B (en) * | 2021-05-13 | 2022-03-01 | 微星科技股份有限公司 | External reversible liquid cooling device |
| CN115226353A (en) * | 2022-07-26 | 2022-10-21 | 珠海格力电器股份有限公司 | Electrical box, control method and air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI757176B (en) * | 2021-05-13 | 2022-03-01 | 微星科技股份有限公司 | External reversible liquid cooling device |
| CN115226353A (en) * | 2022-07-26 | 2022-10-21 | 珠海格力电器股份有限公司 | Electrical box, control method and air conditioner |
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