CN206441100U - Radiator structure, two-way processor and multichannel process device heat abstractor and server - Google Patents

Radiator structure, two-way processor and multichannel process device heat abstractor and server Download PDF

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CN206441100U
CN206441100U CN201720004082.6U CN201720004082U CN206441100U CN 206441100 U CN206441100 U CN 206441100U CN 201720004082 U CN201720004082 U CN 201720004082U CN 206441100 U CN206441100 U CN 206441100U
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heat
radiator
groups
fins
heat sink
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曹书玮
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Huasheng Xintai Information Industry Development Co Ltd
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Huasheng Xintai Information Industry Development Co Ltd
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Abstract

The utility model provides a kind of radiator structure, including:For the heat sink with thermal source thermal contact conductance, one end of air-flow from the heat sink is flowed to the other end;First groups of fins, is arranged at the upper surface of the heat sink;Heat-transferring assembly, is arranged at the lower surface of the heat sink, and one end of the heat-transferring assembly is stretched out the heat sink and extended towards the front end in the air current flow direction;Second groups of fins, is arranged on the one end of the heat-transferring assembly away from the heat sink.It is respectively arranged at by the first groups of fins and heat-transferring assembly on the upper surface and lower surface of heat sink, increase space availability ratio, to increase the surface area that heat is distributed, effective solution heat pipe is installed on heat sink upper surface and causes reduction radiating fin quantity to cause the problem of heat-sinking capability declines, improve radiating efficiency, ensure heat-sinking capability, it is ensured that the radiating effect of radiator structure.The utility model also provides a kind of two-way processor heat abstractor, multichannel process device heat abstractor and server.

Description

Radiator structure, two-way processor and multichannel process device heat abstractor and server
Technical field
The utility model is related to technical field of heat dissipation, at more particularly to a kind of radiator structure, two-way processor and multichannel Manage device heat abstractor and server.
Background technology
For in current 2U (unit, the unit of server external dimensions) server architecture, in the casing of 1U half-breadths Under the limitation of space, the simple mode using air cooling is difficult to support and exceedes the processor that power is configured side by side for 145W two-way.It is logical Often, the heat dissipation design of density fin or extension heat pipe is passed through, it is ensured that the processing that up to power is configured side by side for 190W two-way The heat dispersion of device.
Using density fin heat dissipation design when, using close fin arrangement mode after preceding dredge, make the radiating fin in downstream Higher air mass flow can be obtained, to strengthen the radiating effect of downstream radiating fin;During using the heat dissipation design for extending heat pipe, The heat transfer of downstream processors to front fin is done into cooling radiating using heat pipe, to increase the heat transfer of downstream radiating fin Ability.
But, when either still extending the heat dissipation design of heat pipe using the heat dissipation design of density fin, all Existential Spaces Utilization rate is high, influence heat-sinking capability the problem of, moreover, needing to reduce the quantity of radiating fin while welding heat pipe, cause Heat-sinking capability declines, and then influences the reliability of server work.
Utility model content
Based on this, it is necessary to be welded in heat sink upper surface for current heat pipe and cause radiating fin quantity to reduce so as to lead Causing the problem of heat-sinking capability declines, there is provided the sky that a kind of utilization rate that can improve space, the first heat sink assembly of increase take Between, improve heat-sinking capability heat abstractor, while also providing a kind of electronic equipment containing above-mentioned heat abstractor.
Above-mentioned purpose is achieved through the following technical solutions:
A kind of radiator structure, including:
For the heat sink with thermal source thermal contact conductance, one end of air-flow from the heat sink is flowed to the other end;
First groups of fins, is arranged at the upper surface of the heat sink;
Heat-transferring assembly, is arranged at the lower surface of the heat sink, and the heat sink is stretched out in one end of the heat-transferring assembly And extend towards the front end in the air current flow direction;
Second groups of fins, is arranged on the one end of the heat-transferring assembly away from the heat sink.
In one of the embodiments, the heat-transferring assembly includes being arranged at the heat pipe heat of the heat sink marginal position, The heat pipe heat part is in contact with the heat sink, and remainder stretches out the heat sink, one end that the heat pipe heat is stretched out On be respectively provided with second groups of fins.
In one of the embodiments, the quantity of the heat pipe heat is two groups, and heat pipe heat is symmetricly set in described in two groups The marginal position of the heat sink.
In one of the embodiments, first groups of fins and second groups of fins are radiating fin, institute Heat sink is stated for soaking plate;
And the radiating that the density of the radiating fin in second groups of fins is more than or equal in first groups of fins The density of fin.
In one of the embodiments, the radiator structure also includes boss, and the boss is arranged at the heat sink Lower section;
The height of the boss is more than or equal to the height of the heat-transferring assembly.
Further relate to a kind of two-way processor heat abstractor, including two radiating knot as described above described in any technical characteristic Structure, two radiator structures are arranged before and after along air current flow direction;
Heat-transferring assembly in each radiator structure is located at the rear side radiating to extension in front of coupled heat sink The second groups of fins in structure is disposed adjacent with the first groups of fins in the radiator structure of front side.
In one of the embodiments, the lapping ends that heat-transferring assembly described in the rear side radiator structure stretches out are in front side Described in the radiator structure on the upper surface of heat sink.
In one of the embodiments, second groups of fins described in the rear side radiator structure on heat-transferring assembly Positioned at the outside of the first groups of fins described in the radiator structure of front side.
In one of the embodiments, heat-transferring assembly described in the radiator structure of front side stretches out one end of the heat sink Bending simultaneously extends towards outside, the second groups of fins described in the radiator structure of front side is located at first groups of fins Outside.
In one of the embodiments, the density of the radiating fin of the first groups of fins described in the radiator structure of front side Less than the density of the radiating fin of the first groups of fins described in the rear side radiator structure;
The density of the radiating fin of second groups of fins described in the rear side radiator structure is more than or equal to described first and dissipated The density of the radiating fin of backing group;
It is described scattered that the density of the radiating fin of second groups of fins described in the rear side radiator structure is more than or equal to front side The density of the radiating fin of second groups of fins in heat structure.
Further relate to a kind of multichannel process device heat abstractor, including the radiating knot described in multiple technical characteristics any as described above Structure, multiple radiator structures are arranged in order setting from front to back along air current flow direction;
Heat-transferring assembly in each radiator structure extends to coupled heat sink front, and the latter radiator structure In the second groups of fins be disposed adjacent with the first groups of fins in previous radiator structure.
Further relate to a kind of server, including housing, processor and the two-way processor described in any technical characteristic as described above Heat abstractor or the multichannel process device heat abstractor as described in above-mentioned technical characteristic;
The two-way processor heat abstractor or the multichannel process device heat abstractor are installed in the housing, described Processor is located at the heat sink of radiator structure in the two-way processor heat abstractor or the multichannel process device heat abstractor Lower section.
The beneficial effects of the utility model are:
Radiator structure of the present utility model, structure design advantages of simple, the first groups of fins is arranged at the upper table of heat sink On face, heat-transferring assembly is arranged on the lower surface of heat sink, i.e., be layered the first groups of fins and heat-transferring assembly and set.Such energy Enough reduce heat-transferring assembly and be arranged at the space taken at heat sink upper surface, to increase the space of the first groups of fins occupancy, Increase the volume of the first radiating subassembly, the heat-sinking capability of the first groups of fins is improved while space availability ratio is improved.Moreover, The end that heat-transferring assembly stretches out heat sink sets the second groups of fins, and heat-transferring assembly can transfer heat to the second groups of fins On, and shed by the second groups of fins.The surface area that heat is distributed can so be increased, dissipating for radiator structure is further improved Heat energy power.Thermal source produces heat when working, and heat is passed on heat-transferring assembly and the first groups of fins by heat sink, by dissipating Heat-transferring assembly below hot body conducts heat to the second groups of fins and shed, while passing through first above heat radiator body Radiating subassembly distributes heat, to ensure radiating effect.Heat abstractor of the present utility model passes through the first groups of fins and heat transfer Component is respectively arranged on the upper surface and lower surface of heat sink, increases space availability ratio, to increase the surface area that heat is distributed, Effectively solve current heat pipe be installed on heat sink upper surface and reduce radiating fin can installation site cause under heat-sinking capability The problem of drop, improve radiating efficiency, it is ensured that heat-sinking capability, it is ensured that the radiating effect of radiator structure.
Two-way processor heat abstractor of the present utility model is radiated by two radiator structures to two-way processor, by There is above-mentioned technique effect in radiator structure, including the two-way processor heat abstractor of above-mentioned radiator structure also has accordingly Technique effect, improves the heat-sinking capability of two-way processor heat abstractor.
Multichannel process device heat abstractor of the present utility model is radiated by multiple radiator structures to multichannel process device, by There is above-mentioned technique effect in radiator structure, including the multichannel process device heat abstractor of above-mentioned radiator structure also has accordingly Technique effect, improves the heat-sinking capability of multichannel process device heat abstractor.
Because two-way processor heat abstractor or multichannel process device heat abstractor have above-mentioned technique effect, include Stating the server of two-way processor heat abstractor or multichannel process device heat abstractor also has corresponding technique effect, to ensure The performance of server.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of the two-way processor heat abstractor of the embodiment of the utility model one;
Fig. 2 is the dimensional structure diagram of the front side radiator structure of the two-way processor heat abstractor shown in Fig. 1;
Fig. 3 is the rearview of the front side radiator structure of the two-way processor heat abstractor shown in Fig. 2;
Fig. 4 is the side view of the front side radiator structure of the two-way processor heat abstractor shown in Fig. 2;
Fig. 5 is the dimensional structure diagram of the rear side radiator structure of the two-way processor heat abstractor shown in Fig. 1;
Fig. 6 is that two-way processor heat abstractor of the present utility model is used with the current preceding radiating fin for dredging rear close design Heat-sinking capability curve ratio obtained by hot-fluid simulation software is relatively schemed;
Fig. 7 is the radiating fin of close design after two-way processor heat abstractor of the present utility model is dredged with present preceding not Thermal resistance value curve ratio produced by under homologous ray flow is relatively schemed;
Wherein:
100- two-way processor heat abstractors;
110- radiator structures;
111- heat sinks;
1111- boss;
The groups of fins of 112- first;
113- heat-transferring assemblies;
The groups of fins of 114- second.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, by the following examples, and tie Accompanying drawing is closed, radiator structure of the present utility model, two-way processor heat abstractor, multichannel process device heat abstractor and server are entered Row is further described.It should be appreciated that specific embodiment described herein is not used to only to explain the utility model Limit the utility model.
Referring to Fig. 1 to Fig. 5, the utility model provides a kind of radiator structure 110, and the radiator structure 110 is applied to multichannel In processor heat abstractor or two-way processor heat abstractor 100, and then it is applied in server, to ensure dissipating for processor Hot property, and then improve the reliability of processor work.It is preferred that radiator structure 110 of the present utility model is handled by two-way Device heat abstractor 100 may be particularly applicable in the server with 190W two-way processors, so that heat dispersion improves, improves and dissipates Heat energy power, meets the high wattage configuration needs of the server of 190W two-way processors.Certainly, radiator structure of the present utility model 110 apply also in the equipment that other need to radiate.
In an embodiment of the present utility model, radiator structure 110 includes heat sink 111, the first groups of fins 112, passed The hot groups of fins 114 of component 113 and second.The lower section of heat sink 111 has the thermal source of processor, and usual thermal source is processor Heater members such as chip etc., heater members can operationally produce substantial amounts of heat.Heat sink 111 is the biography for realizing heat Lead, thermal source can be contacted with heat sink 111, so that the heat of thermal source can pass to heat sink 111, and pass through heat sink 111 transfer heat to the first groups of fins 112 and heat-transferring assembly 113 again.First groups of fins 112 and the second groups of fins 114 can increase the surface area that heat is distributed, in order to which heat is distributed, and heat-transferring assembly 113 is used for conducting heat, by heat sink 111 heat is conducted to the second groups of fins 114 and the heat that sheds.First groups of fins 112 is arranged at the upper surface of heat sink 111 On.The heat that heater members are sent passes to the first groups of fins 112 by heat sink 111, and passes through the first groups of fins 112 Heat is distributed, it is ensured that radiating effect.Heat-transferring assembly 113 is arranged on the lower surface of heat sink 111, and the first groups of fins 112 It is oppositely arranged with the component of heat-transferring assembly 113.Heat-transferring assembly 113 can conduct the heat on heat sink 111 to heat-transferring assembly 113 On the second groups of fins 114, and shed heat via the second groups of fins 114.That is, heat-transferring assembly 113 is arranged at The surface for being not provided with the first groups of fins 112 on heat sink 111 and with heat sink 111 is sticked.That is the first groups of fins 112 with Heat-transferring assembly 113 is that layering is set, and so heat-transferring assembly 113 can be avoided to be installed on the upper surface of heat sink 111 and account for With the installing space of the first groups of fins 112, increase space availability ratio, improve radiating efficiency, it is ensured that the radiating of radiator structure 110 Ability.
Heat sink 111 can be by the heat transfer of thermal source to the groups of fins 112 of heat-transferring assembly 113 and first, and air-flow Flowed from one end of heat sink 111 to the other end, the direction of arrow shown in Fig. 1 is air current flow direction.When server works, Heater members can produce substantial amounts of heat, and because heater members are disposed on the lower section of heat sink 111, heat can pass through radiating Plate 111 passes to the groups of fins 112 of heat-transferring assembly 113 and first, moreover, heat-transferring assembly 113 is located at heat sink with heater members On 111 same surface, a part of heat of heater members can be also directly delivered on heat-transferring assembly 113.Heat-transferring assembly 113 Heat can be spread out of, while the first groups of fins 112 can also distribute heat, when air-flow from one end of heat sink 111 to When the other end flows, air-flow can drive heat to flow out radiator structure 110, and then discharge electronic equipment, to ensure radiator structure 110 radiating efficiency.Radiator structure 110 of the present utility model is set respectively by the first groups of fins 112 and heat-transferring assembly 113 In on the upper surface of heat sink 111 and lower surface so that the first groups of fins 112 is layered with heat-transferring assembly 113 and set, increase the The space that one groups of fins 112 takes, and then cause the heat dissipation capacity increase of the first groups of fins 112, improve radiator structure 110 Heat-sinking capability, to improve radiating efficiency.
Further, radiator structure 110 is installed on the installing plate of server.Radiator structure 110 also includes boss 1111, Boss 1111 is arranged at the lower section of heat sink 111, and height of the height more than or equal to heat-transferring assembly 113 of boss 1111.It is convex The padded certain height of heat sink 111 can be made there is pre-determined distance between heat sink 111 and installing plate by platform 1111.So It ensure that there is heat-transferring assembly 113 enough installing spaces to be welded on the lower surface of heat sink 111, it is effective to solve heat transfer Component 113, which is installed on the top of heat sink 111 occupancy the first groups of fins 112 space, causes the problem of heat-sinking capability declines, and improves The radiating effect of radiator structure 110.Meanwhile, thermal source is that, positioned at the lower section of boss 1111, thermal source passes through boss 1111 and radiating Plate 111 is contacted, and heat is passed into heat sink 111 by boss 1111.
As a kind of embodiment, heat-transferring assembly 113 includes being arranged at the heat pipe heat of the marginal position of heat sink 111, heat Pipe group part is in contact with heat sink 111, and remainder, which is stretched out on heat sink 111, one end that heat pipe heat is stretched out, is respectively provided with second Groups of fins 114.Heat pipe heat can guide the heat on heat sink 111 end of the heat pipe heat to the outside of the heat sink 111 The second groups of fins 114 on, the surface area that distributes of heat is increased by the second groups of fins 114, to improve radiator structure 110 Heat-sinking capability, it is ensured that radiating effect.
It is preferred that the quantity of heat pipe heat is two groups, two groups of heat pipe heats are symmetricly set in the marginal position of heat sink 111.Two Group heat pipe heat can increase the amount of heat on export heat sink 111, improve heat-sinking capability.Moreover, two groups of heat pipes are respectively arranged at The marginal position of heat sink 111, can make the substantially uniform export of the heat on heat sink 111, and thermal source is located at two groups of heat The centre position of pipe, can make to ensure that even heat is transferred on heat sink 111.Certainly, the quantity of heat pipe heat can also be one It is individual, the both sides of the edge of heat sink 111 are located at after a heat pipe heat bending, to increase heat-transfer capability.
Further, heat sink 111 is soaking plate.Soaking plate can reduce the thermal resistance of heat transfer so that heat can By the way that soaking plate is quick and uniform transmission, it is easy to heat transfer to the first groups of fins 112 and heat-transferring assembly 113, it is ensured that Thermal conduction effect, and then it is easy to radiating.First groups of fins 112 and the second groups of fins 114 are radiating fin.Pass through radiating The area that fin increase heat is distributed, improves radiating effect.Also, the density of the radiating fin in the second groups of fins 114 is big In the density equal to the first groups of fins 112.It can so be easy to air-flow to drive heat flowing, be distributed with significantly increasing heat Surface area, improve radiating efficiency, improve radiating effect.
The utility model additionally provides a kind of two-way processor heat abstractor 100, including dissipating in two above-described embodiments Heat structure 110, two radiator structures 110 are arranged before and after along air current flow direction.Specifically, using air current flow direction as base Standard, the radiator structure 110 being in contact prior to air-flow is the radiator structure 110 of front side, and the radiator structure 110 with air flow contacts is afterwards The radiator structure 110 of rear side.Heat-transferring assembly 113 in each radiator structure 110 prolongs to the coupled front of heat sink 111 Stretch, and the second groups of fins 114 in rear side radiator structure 110 and the first groups of fins in front side radiator structure 110 112 are disposed adjacent.Heat that front side radiator structure 110 distributes can be absorbed on front side of airflow passes after radiator structure 110 and is heated up, When flowing through rear side heat abstractor, the slightly higher air-flow of temperature can only take away the heat of radiator structure 110 on rear side of part, dissipate rear side The radiating effect of heat structure 110 is not good.It is of the present utility model double in order to ensure the radiating effect lifting of rear side radiator structure 110 Heat is guided to front side radiator structure by path processor heat abstractor 100 by the heat-transferring assembly 113 on rear side radiator structure 110 At 110, so enable to the second groups of fins 114 of rear side radiator structure 110 to be in contact with the air-flow of front end, so can Further the heat of reduction rear side radiator structure 110, improves heat-sinking capability.
Further, the lapping ends that heat-transferring assembly 113 stretches out in rear side radiator structure 110 are in front side radiator structure 110 On the upper surface of middle heat sink 111.So air current flow when, the first groups of fins that air-flow can be with front side radiator structure 110 112 can also be in contact while being in contact with the second groups of fins 114 of rear side radiator structure 110, can synchronously take away front side The heat of the heat sink 111 of dissipating bind structure and the heat sink 111 of rear side radiator structure 110, subsequent air-flow can also radiate with rear side First groups of fins 112 of structure 110 is in contact, and takes away the heat of rear side radiator structure 110, improves two-way processor radiating dress Put 100 heat-sinking capability, it is ensured that the radiating effect of two-way processor heat abstractor 100.The heat-transferring assembly of rear side radiator structure 110 The part of 113 stretching heat sinks 111 is overlapped on the heat sink 111 of front side radiator structure 110, does not interfere with front side radiator structure The setting of 110 the first groups of fins 112, to ensure the heat-sinking capability of rear side radiator structure 110, it is ensured that radiating effect.Moreover, Because the heat-transferring assembly 113 of rear side radiator structure 110 is that overlap joint is set, do not have between front side radiator structure 110 tangible Annexation, is easy to dismantle front side radiator structure 110 or rear side radiator structure 110 respectively.
Yet further, the second groups of fins 114 in rear side radiator structure 110 on heat-transferring assembly 113 dissipates positioned at front side The outside of first groups of fins 112 in heat structure 110.That is the first groups of fins 112 of front side radiator structure 110 is located at heat sink 111 centre position, the second groups of fins 114 of rear side radiator structure 110 is located at the heat sink 111 of front side radiator structure 110 Marginal position.The heat radiation energy of radiator structure 110 on rear side of can so ensureing on the premise of front side structure radiating effect is ensured Power.It is preferred that the quantity of the heat pipe heat of rear side radiator structure 110 and the second groups of fins 114 is two groups, two groups of heat pipe heat energy The heat-transfer capability of enough increase rear side radiator structures 110, heat is passed to front side, and pass through the heat transfer of rear side radiator structure 110 The second groups of fins 114 on component 113 is radiated, by increasing capacitance it is possible to increase the surface area that heat is distributed improves radiating effect.
Further, heat-transferring assembly 113 stretches out one end bending and the direction of heat sink 111 in front side radiator structure 110 Outside extend, make front side radiator structure 110 in the second groups of fins 114 be located at the first groups of fins 112 outside.In order to be lifted The heat-sinking capability of front side radiator structure 110, conducts heat to front side by the heat-transferring assembly 113 of front side radiator structure 110 and dissipates The front end of heat structure 110, can so increase the quantity of radiating fin, then heat radiation ability.Meanwhile, in order to avoid front side The heat-sinking capability of first groups of fins 112 of the second groups of fins 114 influence front side radiator structure 110 of radiator structure 110, will The heat pipe bending of the heat-transferring assembly 113 of front side radiator structure 110 simultaneously extends laterally, so flows through front side radiator structure 110 The air-flow of second groups of fins 114 does not interfere with the first groups of fins 112 and rear side radiator structure of front side radiator structure 110 110 heat-sinking capability.
As a kind of embodiment, the density of the radiating fin of first groups of fins 112 is small in front side radiator structure 110 The density of the radiating fin of first groups of fins 112 in rear side radiator structure 110.That is, front side radiator structure 110 First groups of fins 112 and the first groups of fins 112 of rear side radiator structure 110 arrangement mode close after being dredged before, so It can make the first groups of fins 112 on rear side of air current flow direction that there is higher air flow rate, reduce air-flow flow resistance, it is ensured that double The heat-sinking capability of path processor heat abstractor 100.The radiating fin of second groups of fins 114 is close in rear side radiator structure 110 Density of the degree more than or equal to the radiating fin of the first groups of fins 112.The surface area that heat is distributed can so be increased, improve and dissipate Heat energy power.The density of the radiating fin of second groups of fins 114 is more than or equal to front side radiator structure in rear side radiator structure 110 The density of the radiating fin of second groups of fins 114 in 110.The surface area that heat is distributed can so be increased, heat radiation energy is improved Power.It is preferred that in the present embodiment, after the density of the radiating fin of the second groups of fins 114 of front side radiator structure 110 is equal to The density of the radiating fin of first groups of fins 112 of side radiator structure 110 and the radiating fin of rear side radiator structure 110 The density of second groups of fins 114.
Radiator structure 110 of the present utility model is scattered by the way that the first groups of fins 112 and heat-transferring assembly 113 are respectively arranged at On the upper surface of hot plate 111 and lower surface so that the first groups of fins 112 is layered with heat-transferring assembly 113 to be set, and increase by first dissipates The space that backing group 112 takes, and then cause the heat dissipation capacity increase of the first groups of fins 112, improve the radiating of radiator structure 110 Ability, to improve radiating efficiency.First groups of fins 112 is radiated by the radiating fin of fins group close after preceding dredge, with The surface area that increase heat is distributed, improves radiating effect, moreover, being relatively arranged on the edge of heat sink 111 in heat-transferring assembly 113 Two heat pipe heats are fixed on by way of welding on the lower surface of heat sink 111 respectively, need not be reduced when so welding heat pipe The quantity of radiating fin in first groups of fins 112 so that the area of space availability ratio and radiating fin reaches optimization so that Radiator structure 110 has higher radiating efficiency on the premise of space-consuming is not increased, and improves heat-sinking capability.Meanwhile, heat transfer The bending part of the heat pipe heat of component 113 is reduced, and ensure that the heat transfer property of heat pipe heat, moreover it is possible to ensure the structural strength of heat pipe, Improve the reliability of radiator structure 110.
In order to verify the heat-sinking capability of two-way processor heat abstractor 100 of the present utility model, Fig. 6, which is shown, uses hot-fluid Two-way processor heat abstractor 100 of the present utility model obtained by simulation software (Flotherm) is close after being dredged with present preceding to be dissipated The heat-sinking capability of hot fin compares figure.The solid line drawn in Fig. 6 is close after being dredged before under flow system flow is 50CFM at present sets Heat-sinking capability curve produced by the radiating fin of meter, thick dashed line is the two-way of the present utility model in the case where flow system flow is 35CFM Heat-sinking capability curve produced by processor heat abstractor 100, choice refreshments line is then to be dredged before under flow system flow is 45CFM at present Heat-sinking capability curve produced by the radiating fin of close design afterwards;Moreover, the processor institute of square solid dot in Fig. 6 for 145W The cooling capacity and standard needed, circular solids point is the cooling capacity and standard needed for 120W processor, and peach heart solid dot is Cooling capacity and standard needed for 190W two-way processors.It can be seen that and set with electronics from the heat-sinking capability comparative result in Fig. 6 For to be illustrated exemplified by 190W two-way processors, if the cooling capacity of server 190W two-way processors, mesh can be met It is preceding it is preceding dredge after close radiating fin design need 45CFM to 50CFM flow system flow to meet cooling requirements, but this reality The flow system flow for only needing to below 35CFM with new radiator structure 110 just can meet cooling requirements.Moreover, common " electronics The flow system flow of the 1U half-breadth processors of equipment " just falls within 35CFM, therefore the energy of radiator structure of the present utility model 110 Radiating effect is enough obviously improved, the high wattage configuration of 190W processors is met.Meanwhile, when the wattage of processor is smaller, Heat dispersion is better.
Fig. 7 shows two-way processor heat abstractor 100 of the present utility model and current preceding thin rear close radiating fin Thermal resistance value curve ratio produced by under different system flow is relatively schemed, as can see from Figure 7:It is close compared to after dredging before current For radiating fin, two-way processor heat abstractor 100 of the present utility model is the first groups of fins of rear side radiator structure 110 The thermal resistance of 112 radiating fin is less than the thermal resistance of the radiating fin of close design back after preceding dredge, because thermal resistance value is lower, heat radiation energy Power is better, shows the first groups of fins of the front side radiator structure 110 of two-way processor heat abstractor 100 of the present utility model 112 radiating fin has obvious heat-sinking capability to improve;Similarly, the first groups of fins 112 of front side radiator structure 110 is scattered The heat-sinking capability of hot fin, which also has, significantly to be improved, and especially effect becomes apparent when low air quantity.
The utility model additionally provides a kind of multichannel process device heat abstractor, including the radiating knot in multiple above-described embodiments Structure 110, multiple radiator structures 110 are arranged in order setting from front to back along air current flow direction.Biography in each radiator structure 110 Hot component 113 extends to the front of coupled heat sink 111, and the second groups of fins 114 in latter radiator structure 110 with First groups of fins 112 is disposed adjacent in previous radiator structure 110.The structure of multichannel process device heat abstractor and two-way processor The structure of heat abstractor 100 is similar, increases the quantity of radiator structure 110, increased thermal source is radiated, it is ensured that at multichannel Device heat abstractor heat-sinking capability is managed, the reliability of work is improved.
The utility model additionally provides the two-way processing in a kind of server, including housing, processor and above-described embodiment Device heat abstractor 100 or multichannel process device heat abstractor.Two-way processor heat abstractor 100 or multichannel process device heat abstractor peace On bottom plate loaded on housing, processor is arranged at the lower section of the heat sink 111 of radiator structure 110.Server of the present utility model Ensure the heat dispersion of server by two-way processor heat abstractor 100 or multichannel process device heat abstractor, moreover, at two-way The first groups of fins 112 and heat-transferring assembly that reason device heat abstractor 100 or multichannel process device heat abstractor pass through radiator structure 110 113 layerings, which are set, can increase the quantity of radiating fin in the first groups of fins 112, improve space availability ratio, improve radiating effect Rate, then ensures the reliability of server work.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed, But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (13)

1. a kind of radiator structure, it is characterised in that including:
For the heat sink with thermal source thermal contact conductance, one end of air-flow from the heat sink is flowed to the other end;
First groups of fins, is arranged at the upper surface of the heat sink;
Heat-transferring assembly, is arranged at the lower surface of the heat sink, and the heat sink and court are stretched out in one end of the heat-transferring assembly Extend to the front end in the air current flow direction;
Second groups of fins, is arranged on the one end of the heat-transferring assembly away from the heat sink.
2. radiator structure according to claim 1, it is characterised in that the heat-transferring assembly includes being arranged at the heat sink The heat pipe heat of marginal position, the heat pipe heat part is in contact with the heat sink, and remainder stretches out the heat sink, described Second groups of fins is respectively provided with one end that heat pipe heat is stretched out.
3. radiator structure according to claim 2, it is characterised in that the quantity of the heat pipe heat is two groups, described in two groups The marginal position for being symmetricly set in the heat sink of heat pipe heat.
4. the radiator structure according to any one of claims 1 to 3, it is characterised in that first groups of fins with it is described Second groups of fins is radiating fin, and the heat sink is soaking plate;
And the radiating fin that the density of the radiating fin in second groups of fins is more than or equal in first groups of fins Density.
5. radiator structure according to claim 1, it is characterised in that the radiator structure also includes boss, the boss It is arranged at the lower section of the heat sink;
The height of the boss is more than or equal to the height of the heat-transferring assembly.
6. a kind of two-way processor heat abstractor, it is characterised in that including two dissipating as described in any one of claim 1 to 5 Heat structure, two radiator structures are arranged before and after along air current flow direction;
Heat-transferring assembly in each radiator structure is located at the rear side radiator structure to extension in front of coupled heat sink In the second groups of fins be disposed adjacent with the first groups of fins in the radiator structure of front side.
7. two-way processor heat abstractor according to claim 6, it is characterised in that described in the rear side radiator structure The lapping ends that heat-transferring assembly stretches out are described in the radiator structure of front side on the upper surface of heat sink.
8. two-way processor heat abstractor according to claim 7, it is characterised in that institute in the rear side radiator structure State the outside that second groups of fins on heat-transferring assembly is located at the first groups of fins described in the radiator structure of front side.
9. two-way processor heat abstractor according to claim 6, it is characterised in that described in the radiator structure of front side Heat-transferring assembly stretches out one end bending of the heat sink simultaneously towards outside extension, makes described in the radiator structure of front side second to dissipate Backing group is located at the outside of first groups of fins.
10. the two-way processor heat abstractor according to any one of claim 6 to 9, it is characterised in that the front side radiating The density of the radiating fin of first groups of fins described in structure is less than the first groups of fins described in the rear side radiator structure Radiating fin density;
The density of the radiating fin of second groups of fins described in the rear side radiator structure is more than or equal to first fin The density of the radiating fin of group;
The density of the radiating fin of second groups of fins described in the rear side radiator structure is more than or equal to the front side radiating knot The density of the radiating fin of second groups of fins in structure.
11. a kind of multichannel process device heat abstractor, it is characterised in that including multiple dissipating as described in any one of claim 1 to 5 Heat structure, multiple radiator structures are arranged in order setting from front to back along air current flow direction;
Heat-transferring assembly in each radiator structure extends to coupled heat sink front, and in the latter radiator structure Second groups of fins is disposed adjacent with the first groups of fins in previous radiator structure.
12. a kind of server, it is characterised in that including housing, processor and the two-way as described in any one of claim 6 to 10 Processor heat abstractor;
The two-way processor heat abstractor is installed in the housing, and the processor is located at two-way processor radiating dress Put the lower section of the heat sink of middle radiator structure.
13. a kind of server, it is characterised in that dissipated including housing, processor and multichannel process device as claimed in claim 11 Thermal;
The multichannel process device heat abstractor is installed in the housing, and the processor is located at multichannel process device radiating dress Put the lower section of the heat sink of middle radiator structure.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108710424A (en) * 2018-06-08 2018-10-26 山东超越数控电子股份有限公司 A kind of reinforcing VPX module heat dissipating methods
CN109062374A (en) * 2018-08-16 2018-12-21 郑州云海信息技术有限公司 Server
US10219365B1 (en) 2018-02-23 2019-02-26 Quanta Computer Inc. Bidirectional and uniform cooling for multiple components in a computing device
CN110739283A (en) * 2019-10-30 2020-01-31 英业达科技有限公司 kinds of radiator
CN110993576A (en) * 2019-12-23 2020-04-10 西安华为技术有限公司 Heat dissipation device and communication equipment
CN111031767A (en) * 2019-12-31 2020-04-17 联想(北京)有限公司 Electronic equipment and heat dissipation module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10219365B1 (en) 2018-02-23 2019-02-26 Quanta Computer Inc. Bidirectional and uniform cooling for multiple components in a computing device
CN108710424A (en) * 2018-06-08 2018-10-26 山东超越数控电子股份有限公司 A kind of reinforcing VPX module heat dissipating methods
CN109062374A (en) * 2018-08-16 2018-12-21 郑州云海信息技术有限公司 Server
CN109062374B (en) * 2018-08-16 2021-11-09 郑州云海信息技术有限公司 Server
CN110739283A (en) * 2019-10-30 2020-01-31 英业达科技有限公司 kinds of radiator
CN110993576A (en) * 2019-12-23 2020-04-10 西安华为技术有限公司 Heat dissipation device and communication equipment
CN110993576B (en) * 2019-12-23 2021-10-15 西安华为技术有限公司 Heat dissipation device and communication equipment
CN111031767A (en) * 2019-12-31 2020-04-17 联想(北京)有限公司 Electronic equipment and heat dissipation module
CN111031767B (en) * 2019-12-31 2021-01-15 联想(北京)有限公司 Electronic equipment and heat dissipation module

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