CN101287347A - Heat pipe radiating device - Google Patents
Heat pipe radiating device Download PDFInfo
- Publication number
- CN101287347A CN101287347A CNA2007100738881A CN200710073888A CN101287347A CN 101287347 A CN101287347 A CN 101287347A CN A2007100738881 A CNA2007100738881 A CN A2007100738881A CN 200710073888 A CN200710073888 A CN 200710073888A CN 101287347 A CN101287347 A CN 101287347A
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- CN
- China
- Prior art keywords
- heat
- pipe
- transfer segment
- heat transfer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 abstract 11
- 230000017525 heat dissipation Effects 0.000 abstract 3
- 239000012080 ambient air Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 230000005494 condensation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation device of heat tubes, comprising a bottom plate and a plurality of radiating fins which are arranged on the bottom plate. A groove is formed on the surface of the bottom plate and at least one first heat tube and a second heat tube are respectively bended and embedded in the groove of the bottom plate; furthermore, the first heat tube comprises at least three heat transmission sections which are respectively a first heat transmission section and two second heat transmission sections formed by the back bending of the two ends of the first heat transmission; the second heat tube comprises at least two heat transmission sections and one second heat transmission section of the first heat tube is positioned between the two heat transmission sections of the second heat tube. The two second heat transmission sections which are formed by the oppositely back bending of both ends of the first heat transmission section of the first heat tube of the heat dissipation device of heat tubes can conduct the heat absorbed by the first heat transmission section to the two sides of the bottom plate while the two heat transmission sections of the second heat tube further uniformly spread the conducted heat from the second heat tube on the bottom plate and dissipate the heat to the ambient air by the cooling fins, thus improving the overall performance of the heat dissipation device.
Description
Technical field
The present invention relates to a kind of heat-pipe radiating apparatus, particularly a kind of heat-pipe radiating apparatus of cool electronic components and parts.
Background technology
Along with the continuous development of electronic industry technology, the speed of service of electronic devices and components is accelerated, and the heat of generation is many, and the temperature of system and electronic devices and components itself is raise, and gets rid of as untimely heat with its generation, will cause the decline of its service behaviour.For guaranteeing the electronic devices and components operate as normal, usually at its mounted on surface one heat abstractor so that its heat is distributed fast.
The traditional heat-dissipating device comprises a base plate that joins with electronic devices and components and the some radiating fins that are arranged on the base plate.Base plate is used for absorbing the heat that electronic devices and components produce, and by radiating fin heat is dispersed in the air again.And the volume of electronic component is more and more littler, caloric value is more concentrated, be confined to the intrinsic heat conductivity of metal self, the heat of base plate center is often too concentrated, can't be delivered on the radiating fin fast and dispel the heat, influence radiating effect, be difficult to obtain breakthrough raising.
For this reason, industry more and more is used for heat abstractor with heat pipe.The heat pipe pyroconductivity is much higher than as simple metal such as copper, aluminium, and the non-directional that conducts heat, certain-length is arranged, and can therefore, to heat dispersion tangible castering action be arranged with heat transferred to more remote.
Summary of the invention
The present invention aims to provide a kind of heat abstractor of heat dispersion preferably that has.
A kind of heat-pipe radiating apparatus, be used for electronic element radiating, it comprises a base plate and is located at most fin on the base plate, this base plate one surface is formed with groove, at least one first heat pipe and one second heat pipe bend respectively and are embedded in the above-mentioned base plate groove, and first heat pipe comprises at least three heat transfer segment, is respectively first heat transfer segment and two ends thereof oppositely back bending and second heat transfer segment of stretching out respectively; Second heat pipe comprises at least two heat transfer segment, and one second heat transfer segment of first heat pipe is between two heat transfer segment of second heat pipe.
Compared with prior art, 2 second heat transfer segment that the opposite back bending in the first heat transfer segment two ends of this heat-pipe radiating apparatus first heat pipe forms, the heat that its first heat transfer segment absorbs can be conducted to the base plate both sides, and two heat transfer segment of second heat pipe further are diffused into the heat that the conduction of first heat pipe is come on the base plate uniformly, dispel the heat in the air towards periphery by radiating fin again, the performance of heat abstractor integral body is improved.
With reference to the accompanying drawings, the invention will be further described in conjunction with concrete execution mode.
Description of drawings
Fig. 1 is the exploded view of first embodiment of heat-pipe radiating apparatus of the present invention.
Fig. 2 is the three-dimensional combination figure of Fig. 1.
Fig. 3 is the exploded view of second embodiment of the invention.
Fig. 4 is the exploded view of third embodiment of the invention.
Embodiment
Heat-pipe radiating apparatus of the present invention is to be used for central processing unit electronic components such as (figure do not show) is dispelled the heat.
Seeing also Fig. 1 and Fig. 2, is first embodiment of heat-pipe radiating apparatus of the present invention.This heat-pipe radiating apparatus comprise a base plate 10, be arranged at the groups of fins 20 on the base plate 10 and be embedded in base plate 10 and groups of fins 20 between one first heat pipe 36 and 2 second heat pipes 32.
This base plate 10 adopts the good materials of heat conductivility such as copper, aluminium to make, and it is roughly rectangular.The bottom of base plate 10 is used for contacting with heat-generating electronic elements (figure does not show), and to absorb heat, its upper surface offers one first groove 14 and 2 second grooves 12 that match with first, second heat pipe 36,32 respectively.First groove 14 is roughly S-shaped, 2 second grooves 12 roughly take the shape of the letter U and opening direction is opposite.These first groove, 14 two ends are crisscross arranged with 2 second grooves, 12 two ends respectively.Opposite edges place, base plate 10 both sides symmetry offers two fixing holes 16.
Groups of fins 20 is made up of some fin 22 interval stacked arrangement, and each fin 22 adopts the good materials of heat conductivility such as copper, aluminium to make.Groups of fins 20 is fixed in base plate 10 upper surfaces by modes such as welding and contacts with first, second heat pipe 36,32, thereby both can directly absorb heat from heat pipe 32,36, can absorb heat from base plate 10 again, fixing hole 16 corresponding sections on itself and base plate 10 are provided with finless two holding parts 18, so that fastener is installed.
2 second heat transfer segment 364 that the reverse back bending in first heat transfer segment, 362 two ends of above-mentioned first heat pipe 36 forms, heat is conducted to the base plate both sides simultaneously, and first heat transfer segment 322 of second heat pipe 32 and second heat transfer segment 324 further are diffused into the heat that 36 conduction of first heat pipe are come on the base plate 10 uniformly, dispel the heat in the air towards periphery by radiating fin 22 again, the heat dispersion of heat abstractor is improved.
Fig. 3 is the second embodiment of the present invention, compare with first embodiment, its difference is: 2 S shape heat pipes 40 of present embodiment employing replace 3 heat pipes in the foregoing description, and two sections interlaced settings that this two S shape heat pipe 40 leans on mutually, when satisfying the heat radiation requirement, reduce heat pipe quantity, reduce cost.
Fig. 4 is the third embodiment of the present invention, compares with first embodiment, and the U-shaped opening direction of 2 second heat pipes 42 is identical, and its each heat pipe comprises as first heat transfer segment 422 of evaporation section with as second heat transfer segment 424 of condensation segment; First heat pipe 44 is a M shape, comprises first heat transfer segment 442 that is positioned at the base plate middle part and 2 second heat transfer segment 444 that formed by the reverse back bending in first heat transfer segment, 442 two ends.First heat pipe 44 and 2 second heat pipes 42 are arranged in groove with matching on the base plate.Wherein one second heat transfer segment 444 of first heat pipe is positioned at relatively and is positioned at the base plate middle part and extends the 3rd heat transfer segment 448 with its first heat transfer segment, 442 rightabouts bending away from base plate center, another second heat transfer segment 444.Second heat transfer segment 444 and the 3rd heat transfer segment 448 away from the base plate middle part lays respectively between first heat transfer segment 422 and second heat transfer segment 424 of corresponding second heat pipe 42 as condensation segment relatively, and be positioned at second heat transfer segment 444 in the middle part of the base plate and first heat transfer segment 442 as evaporation section, between 2 second heat pipes 42.Such setting increases the contact area of base plate and heat pipe, and the heat transfer area at corresponding thermal source place further strengthens, and radiating effect further improves.
Claims (10)
1. heat-pipe radiating apparatus, be used for electronic element radiating, it comprises a base plate and is located at some fin on the base plate, this base plate one surface is formed with groove, at least one first heat pipe and one second heat pipe bend respectively and are embedded in the above-mentioned base plate groove, it is characterized in that: first heat pipe comprises at least three heat transfer segment, be respectively the reverse back bending of difference of first heat transfer segment and two ends thereof and extended second heat transfer segment, second heat pipe comprises at least two heat transfer segment, and at least one second heat transfer segment of first heat pipe is between two heat transfer segment of second heat pipe.
2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: first heat transfer segment of this first heat pipe and second heat pipe all is positioned at the base plate middle part, and second heat transfer segment all is positioned at relatively away from the base plate center.
3. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: this heat-pipe radiating apparatus comprises 2 second heat pipes, all roughly takes the shape of the letter U.
4. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: this first heat pipe is roughly S-shaped.
5. heat-pipe radiating apparatus as claimed in claim 4 is characterized in that: second heat pipe is also S-shaped, and one second heat transfer segment of second heat pipe is between two heat transfer segment of first heat pipe.
6. heat-pipe radiating apparatus as claimed in claim 1, it is characterized in that: this heat-pipe radiating apparatus comprises one first heat pipe and 2 second heat pipes, one second heat transfer segment of first heat pipe is positioned at relatively away from the base plate middle part, its first heat transfer segment and another second heat transfer segment are positioned at the base plate middle part, and second heat transfer segment that is positioned at base plate middle part is extended the 3rd heat transfer segment with the bending of himself first heat transfer segment rightabout, the 3rd heat transfer segment with lay respectively between two heat transfer segment of second heat pipe away from second heat transfer segment in the middle part of the base plate relative.
7. heat-pipe radiating apparatus as claimed in claim 6 is characterized in that: described first heat pipe roughly is M shape.
8. heat-pipe radiating apparatus as claimed in claim 7 is characterized in that: described 2 second heat pipes roughly take the shape of the letter U.
9. as each described heat-pipe radiating apparatus in the claim 1 to 8, it is characterized in that: all heat transfer segment of this first heat pipe and second heat pipe are flat segments and space, be arranged in parallel.
10. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: this heat pipe is flat, and it is exposed to roughly coplane of the surface of base plate and surface that base plate is provided with groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100738881A CN101287347A (en) | 2007-04-11 | 2007-04-11 | Heat pipe radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100738881A CN101287347A (en) | 2007-04-11 | 2007-04-11 | Heat pipe radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101287347A true CN101287347A (en) | 2008-10-15 |
Family
ID=40059230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100738881A Pending CN101287347A (en) | 2007-04-11 | 2007-04-11 | Heat pipe radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101287347A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068208A (en) * | 2012-12-20 | 2013-04-24 | 武汉光迅科技股份有限公司 | Butterfly radiator and optical module group and optical module group single plate with butterfly radiator |
| CN104582436A (en) * | 2014-12-24 | 2015-04-29 | 杭州华为数字技术有限公司 | Radiating device |
| CN104617060A (en) * | 2013-09-24 | 2015-05-13 | 奥普蒂兹公司 | Low profile sensor package with cooling feature and method of making same |
| CN105932828A (en) * | 2016-07-10 | 2016-09-07 | 襄阳华博士新能源科技有限公司 | Motor with heat conduction pipe |
| CN107763589A (en) * | 2017-11-01 | 2018-03-06 | 宏力照明集团有限公司 | A kind of improved radiator for integrated level high light source |
-
2007
- 2007-04-11 CN CNA2007100738881A patent/CN101287347A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068208A (en) * | 2012-12-20 | 2013-04-24 | 武汉光迅科技股份有限公司 | Butterfly radiator and optical module group and optical module group single plate with butterfly radiator |
| CN104617060A (en) * | 2013-09-24 | 2015-05-13 | 奥普蒂兹公司 | Low profile sensor package with cooling feature and method of making same |
| US9666625B2 (en) | 2013-09-24 | 2017-05-30 | Optiz, Inc. | Method of making low profile sensor package with cooling feature |
| CN104617060B (en) * | 2013-09-24 | 2018-03-06 | 奥普蒂兹公司 | The encapsulation of low profile sensor and the method for manufacturing it with air-circulation features |
| CN104582436A (en) * | 2014-12-24 | 2015-04-29 | 杭州华为数字技术有限公司 | Radiating device |
| CN104582436B (en) * | 2014-12-24 | 2018-03-27 | 杭州华为数字技术有限公司 | A kind of heat abstractor |
| CN105932828A (en) * | 2016-07-10 | 2016-09-07 | 襄阳华博士新能源科技有限公司 | Motor with heat conduction pipe |
| CN107763589A (en) * | 2017-11-01 | 2018-03-06 | 宏力照明集团有限公司 | A kind of improved radiator for integrated level high light source |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
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Open date: 20081015 |