CN106993393A - A kind of heat dissipation equipment and terminal - Google Patents
A kind of heat dissipation equipment and terminal Download PDFInfo
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- CN106993393A CN106993393A CN201710112385.4A CN201710112385A CN106993393A CN 106993393 A CN106993393 A CN 106993393A CN 201710112385 A CN201710112385 A CN 201710112385A CN 106993393 A CN106993393 A CN 106993393A
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- power consumption
- radiator
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of heat dissipation equipment and terminal, applied in terminal, including：Heat transfer device and the first radiator；The heat transfer device is connected with least two high power consumption chips in terminal；First radiator is connected with the heat transfer device；The heat transfer device is radiated for absorbing the heat that at least two high power consumption chips in terminal are produced, and the heat of absorption being conducted to the first radiator.Heat transfer device in the application has heat conductivility, for absorbing the heat that at least two high power consumption chips are produced, and conduct heat to the first radiator, at least two high power consumption chips to share the first radiator to be radiated, the heat absorption capacity of the first radiator is effectively utilized, the utilization rate of loop heat pipe radiator is improved.
Description
Technical field
The application is related to field of terminal technology, more particularly to a kind of heat dissipation equipment and terminal.
Background technology
Substantial amounts of heat can be produced in the process of running for the high power consumption chip (such as central processing unit) in terminal, and
Its operating efficiency and reliability can be influenceed if high power consumption chip surface temperature is too high, therefore, is existed for high power consumption chip
It is exactly heat dissipation problem the problem of most critical in running.
In the prior art heat dissipation problem, radiator master are solved by way of radiator is installed near high power consumption chip
To be made up of heat sink, cooling device and associated pipe, in the prior art in order to improve heat-sinking capability, generally in each Gao Gong
One heat sink is all set near consumption chip, and heat sink will absorb the heat that high power consumption chip is produced, and heat is passed through
Associated pipe, which is conducted to cooling device, to be cooled down.
But in some cases, single heat sink unit interval systemic heat will be significantly larger than single high power consumption
The heat produced in the chip unit interval, also, the high power consumption core of 2 or more generally can be set on a veneer of terminal
Piece, therefore, sets the structure of a heat sink near each high power consumption chip in the prior art, can produce heat absorption dress
The problem of heat absorption capacity can not be fully utilized is put, the utilization rate of radiator is reduced.
The content of the invention
The purpose of the application is to provide a kind of heat dissipation equipment and terminal, can solve the problem that radiator utilization rate is low in the prior art
The problem of.
To achieve the above object, this application provides following scheme：
The first aspect of the application provides a kind of heat dissipation equipment, applied in terminal, including：Heat transfer device and first dissipate
Hot device；The heat transfer device is connected with least two high power consumption chips in terminal；First radiator and the heat transfer device phase
Connection；The heat transfer device is used to absorb the heat that at least two high power consumption chips in terminal are produced, and the heat of absorption is passed
The first radiator is directed to be radiated.Heat transfer device in the application has heat conductivility, for absorbing at least two high power consumption cores
The heat that piece is produced, and conduct heat to the first radiator so that at least two high power consumption chips can share the first radiating
Device is radiated, and is effectively utilized the heat absorption capacity of the first radiator, improves the utilization rate of loop heat pipe radiator.Also,
Compared with a radiator is set near each high power consumption chip in the prior art, the number of radiator is reduced, from
And the occupancy in space on terminal veneer is reduced, also reduce radiating cost.
In one implementation, the heat transfer device includes：Heat-conducting substrate, the heat-conducting substrate be arranged in parallel in the terminal
At least two high power consumption chips top, the upper table of the lower surface of the heat-conducting substrate and at least two high power consumptions chip
Face is joined directly together；Or；The upper surface of the lower surface of the heat-conducting substrate and at least two high power consumptions chip passes through heat conduction
Material is connected；The heat-conducting substrate is used to absorb the heat that at least two high power consumption chips are produced.Heat-conducting substrate has thermal conductivity
Can, for absorbing the heat that at least two high power consumption chips are produced, and conduct heat to the first radiator so that at least two
High power consumption chip can share the first radiator and be radiated, and be effectively utilized the heat absorption capacity of the first radiator, improve ring
The utilization rate of road heat-pipe radiator.
In one implementation, the thermal conductive surface of the heat sink and the heat-conducting substrate in first radiator is direct
It is connected；Or；Heat sink in first radiator is connected with the thermal conductive surface of the heat-conducting substrate by Heat Conduction Material.First
Heat sink in radiator can be joined directly together with the thermal conductive surface of heat-conducting substrate, can also be passed through with the thermal conductive surface of heat-conducting substrate
Heat Conduction Material is connected, it is ensured that good thermo-contact, the heat that heat-conducting substrate absorbs fully is conducted into the first radiator
Heat sink absorbed heat.
In one implementation, the heat dissipation equipment in the application also includes：
It is arranged on directly over high power consumption chip and positioned at the second radiator of heat-conducting substrate upper surface.When high power consumption chip
When institute's liberated heat is more, while being radiated using loop heat pipe radiator to high power consumption chip, it can also use and set
Put the second radiator directly over high power consumption chip and positioned at heat-conducting substrate upper surface to radiate to it, further enhance
Radiating effect.
The second aspect of the application provides a kind of terminal, including：At least two high power consumption chips and heat dissipation equipment；Institute
Stating heat dissipation equipment includes：Heat transfer device and the first radiator；The heat transfer device and at least two high power consumption chip phases in terminal
Even；First radiator is connected with the heat transfer device；The heat transfer device is used to absorb at least two high power consumptions in terminal
The heat that chip is produced, and the heat of absorption is conducted to the first radiator radiated.The heat conduction set in the application terminal
Utensil has heat conductivility, for absorbing the heat that at least two high power consumption chips are produced, and conducts heat to the first radiator,
At least two high power consumption chips to share the first radiator to be radiated, be effectively utilized the heat absorption energy of the first radiator
Power, improves the utilization rate of loop heat pipe radiator.Also, with being set in the prior art near each high power consumption chip
One radiator is compared, and reduces the number of radiator, so as to reduce the occupancy in space on terminal veneer, also reduces radiating
Cost.
In one implementation, the heat transfer device includes：Heat-conducting substrate, the heat-conducting substrate be arranged in parallel in the terminal
At least two high power consumption chips top, the upper table of the lower surface of the heat-conducting substrate and at least two high power consumptions chip
Face is joined directly together；Or；The upper surface of the lower surface of the heat-conducting substrate and at least two high power consumptions chip passes through heat conduction
Material is connected；The heat-conducting substrate is used to absorb the heat that at least two high power consumption chips are produced.Heat-conducting substrate has thermal conductivity
Can, for absorbing the heat that at least two high power consumption chips are produced, and conduct heat to the first radiator so that at least two
High power consumption chip can share the first radiator and be radiated, and be effectively utilized the heat absorption capacity of the first radiator, improve ring
The utilization rate of road heat-pipe radiator.
In one implementation, the thermal conductive surface of the heat sink and the heat-conducting substrate in first radiator is direct
It is connected；Or；Heat sink in first radiator is connected with the thermal conductive surface of the heat-conducting substrate by Heat Conduction Material.First
Heat sink in radiator can be joined directly together with the thermal conductive surface of heat-conducting substrate, can also be passed through with the thermal conductive surface of heat-conducting substrate
Heat Conduction Material is connected, it is ensured that good thermo-contact, the heat that heat-conducting substrate absorbs fully is conducted into the first radiator
Heat sink absorbed heat.
In one implementation, the terminal in the application also includes：
It is arranged on directly over high power consumption chip and positioned at the second radiator of heat-conducting substrate upper surface.When high power consumption chip
When institute's liberated heat is more, while being radiated using loop heat pipe radiator to high power consumption chip, it can also use and set
Put the second radiator directly over high power consumption chip and positioned at heat-conducting substrate upper surface to radiate to it, further enhance
Radiating effect.
Brief description of the drawings
, below will be to institute in embodiment in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the application
The accompanying drawing of example.
Fig. 1 is loop heat pipe radiator structural representation disclosed in prior art；
Fig. 2 is the flow chart of the heat dissipation equipment embodiment one of the application；
Fig. 3 is the flow chart of the heat dissipation equipment embodiment two of the application；
Fig. 4 is the flow chart of the heat dissipation equipment embodiment three of the application.
Embodiment
In order to reduce the higher temperature in the process of running of the high power consumption chip in terminal, it will usually attached in high power consumption chip
Near to install radiator, as shown in figure 1, most widely used at present is exactly loop heat pipe radiator, loop heat pipe radiator is by steaming
Device, condenser and associated pipe composition are sent out, refrigerant is circulated in evaporator, condenser and associated pipe, evaporated
Device is arranged on above high power consumption chip, and refrigerant flows into condenser, then the heat release in condenser in evaporator after endothermic gasification
After liquefaction, evaporator is flow back into again, so as to complete a kind of refrigeration cycle；The heat that high power consumption chip at evaporator is produced is passed
Condenser is transported to, distributes heat into environment eventually through condenser.
Single evaporator unit interval systemic heat will be significantly larger than generation in the single high power consumption chip unit interval
Heat, for example：Current single evaporator unit interval systemic heat reaches 1000W, and single high power consumption chip unit
The heat produced in time is typically smaller than 300W, also, generally can set the high power consumption of 2 or more on a veneer of terminal
Chip, therefore, evaporator suction can be produced by setting the structure of an evaporator above each high power consumption chip in the prior art
The problem of heat energy power can not be fully utilized, reduces the utilization rate of loop heat pipe radiator.
The application provides a kind of heat dissipation equipment, can solve the problem that loop heat pipe radiator utilization rate is low in the prior art and asks
Topic.
One embodiment of the present of invention discloses a kind of heat dissipation equipment, applied in terminal, wherein, two are included in terminal
The high power consumption chip of cascade, as shown in Fig. 2 the heat dissipation equipment includes：Heat-conducting substrate 11, evaporator 12, condenser 13, loop
Heat pipe pipeline 14 and fin radiator 15；Wherein, evaporator 12, condenser 13 and loop circuit heat pipe pipeline 14 constitute loop heat
Tube radiator；
It is set in parallel in the heat-conducting substrate 11 above the high power consumption chip of two cascades；
It is arranged on the evaporation of the top of heat-conducting substrate 11 and the high power consumption chip middle position positioned at two cascades
Device 12；
The condenser 13 being connected by loop circuit heat pipe pipeline 14 with evaporator 12；
The heat-conducting substrate 11 has heat conductivility, for absorbing the heat that at least two high power consumption chips are produced, and will
The heat of absorption is conducted to evaporator 12；Refrigerant in evaporator 12 absorbs heat at evaporator 12, absorbs heat phase transformation
Refrigerant transfer afterwards to condenser 13 carries out condensation phase transformation, heat is released, so as to realize the radiating to high power consumption chip；
In the application also directly over high power consumption Chip Vertical, and fin radiating is provided with the heat-conducting substrate upper surface
Device 15；Fin radiator 15 can be directly welded on heat-conducting substrate upper surface, can also be by Heat Conduction Material and heat-conducting substrate
Surface is connected, and the application is not specifically limited.
There is capillary structure layer inside evaporator 12, circulation REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power, evaporator are provided for loop heat pipe radiator
Top or surrounding are additionally provided with liquid storage cylinder, for laying in a certain amount of refrigerant.
Condenser 13 is made up of the good material of heat conductivility, such as：Copper, aluminium etc., the application is not limited.
Wherein, fin radiator 15 is arranged on directly over high power consumption chip, can be effectively using directly over high power consumption chip
Heat-dissipating space, further high power consumption chip is radiated, strengthen radiating effect.
It should be noted that the heat-conducting substrate 11 in the application is made up of the material of high thermal conductivity, such as：VC
(vapour chamber, vapor chamber), the substrate of embedding heat pipe, copper coin, aluminium sheet etc., the application is not specifically limited.
The upper surface of the lower surface of heat-conducting substrate 11 in the application and at least two high power consumptions chip is joined directly together,
Or, the lower surface of the heat-conducting substrate 11 is connected with the upper surface of at least two high power consumptions chip by Heat Conduction Material, this
Application is not specifically limited.
The upper surface of evaporator 12 and heat-conducting substrate 11 in the application is joined directly together, or, evaporator 12 and heat-conducting substrate
11 upper surface is connected by Heat Conduction Material, and the application is not specifically limited.
The application is conducted the heat that the high power consumption chip of two cascades is produced to evaporator 12 by heat-conducting substrate 11, is made
The high power consumption chips of two cascades can share an evaporator 12 and be radiated, be effectively utilized the heat absorption energy of evaporator 12
Power, improves the utilization rate of loop heat pipe radiator, also, with being set in the prior art near each high power consumption chip
One evaporator is compared, and reduces the number of evaporator, so as to reduce the occupancy in space on terminal veneer, also reduces radiating
Cost.
Further, since the high thermal conductivity of heat-conducting substrate 11, the heat that the high power consumption chip of two cascades can be produced
Fully export, therefore, the evaporator 12 in the application can also be arranged on any close to Gao Gong on the thermal conductive surface of heat-conducting substrate 11
At the position for consuming chip, consequently facilitating the flexible configuration of hardware, is conducive to system maintenance.
In addition, the evaporator in the heat absorption capacity based on evaporator, the application can also absorb the production of high power consumption chip simultaneously
Raw heat, based on this, this application provides another heat dissipation equipment, applied in terminal, wherein, three are included in terminal
High power consumption chip, as shown in figure 3, the heat dissipation equipment includes：Heat-conducting substrate 21, evaporator 22, condenser 23, loop circuit heat pipe pipe
Road 24 and fin radiator 25；Wherein, evaporator 22, condenser 23 and loop circuit heat pipe pipeline 24 constitute loop heat pipe heat dissipation
Device；
It is set in parallel in the heat-conducting substrate 21 above three high power consumption chips；
It is arranged on the top of heat-conducting substrate 21 and positioned at the evaporator 22 of three high power consumption chip middle positions；
The condenser 23 being connected by loop circuit heat pipe pipeline 24 with evaporator 22；
The heat-conducting substrate 21 has heat conductivility, for absorbing the heat that at least two high power consumption chips are produced, and will
The heat of absorption is conducted to evaporator 22；Refrigerant in evaporator 22 absorbs heat at evaporator 22, absorbs heat phase transformation
Refrigerant transfer afterwards to condenser 23 carries out condensation phase transformation, heat is released, so as to realize the radiating to high power consumption chip；
In the application also directly over high power consumption Chip Vertical, and fin radiating is provided with the heat-conducting substrate upper surface
Device 25；Fin radiator 25 can be directly welded on heat-conducting substrate upper surface, can also be by Heat Conduction Material and heat-conducting substrate
Surface is connected, and the application is not specifically limited.
In addition, for there is the scene of single high power consumption chip in terminal, the radiating in the application can also be applied to set
It is standby, based on this, this application provides another heat dissipation equipment, applied in terminal, wherein, a high power consumption is included in terminal
Chip, as shown in figure 4, the heat dissipation equipment includes：Heat-conducting substrate 31, evaporator 32, condenser 33, loop circuit heat pipe pipeline 34 with
And fin radiator 35；Wherein, evaporator 32, condenser 33 and loop circuit heat pipe pipeline 34 constitute loop heat pipe radiator；
It is set in parallel in the heat-conducting substrate 31 above a high power consumption chip；
It is arranged on the top of heat-conducting substrate 31 and away from the evaporator 22 of high power consumption chip side；
The condenser 33 being connected by loop circuit heat pipe pipeline 34 with evaporator 32；
The heat-conducting substrate 31 has heat conductivility, the heat for absorbing the generation of high power consumption chip, and by the heat of absorption
Amount is conducted to evaporator 32；Refrigerant in evaporator 32 absorbs heat at evaporator 32, absorbs the refrigeration after heat phase transformation
Agent is transmitted to condenser 33 and carries out condensation phase transformation, heat is released, so as to realize the radiating to high power consumption chip；
In the application also directly over high power consumption Chip Vertical, and fin radiating is provided with the heat-conducting substrate upper surface
Device 35；Fin radiator 35 can be directly welded on heat-conducting substrate upper surface, can also be by Heat Conduction Material and heat-conducting substrate
Surface is connected, and the application is not specifically limited.
When high power consumption chip institute liberated heat is more, high power consumption chip is dissipated using loop heat pipe radiator
While hot, it can also be radiated using fin radiator 35, further enhance radiating effect；Simultaneously as loop is warm
The power consumption of tube radiator is larger, when high power consumption chip institute liberated heat is less, can remove loop heat pipe radiator, only make
It is radiated with fin radiator 35, reduction radiating cost.
It should be noted that above three embodiment disclosed in the present application be heat dissipation equipment in the terminal specifically should
With particular content can be with cross-referenced.
One embodiment of the present of invention discloses a kind of terminal, including：At least two high power consumption chips and heat dissipation equipment；
The heat dissipation equipment includes：Heat transfer device and the first radiator；
The heat transfer device is connected with least two high power consumption chips in terminal；
First radiator is connected with the heat transfer device；
The heat transfer device is used to absorbing the heat that at least two high power consumption chips in terminal are produced, and by the heat of absorption
Conduction to the first radiator is radiated.
The heat transfer device includes：Heat-conducting substrate, at least two high power consumptions that the heat-conducting substrate be arranged in parallel in the terminal
The top of chip, the upper surface of the lower surface of the heat-conducting substrate and at least two high power consumptions chip is joined directly together；Or；
The lower surface of the heat-conducting substrate is connected with the upper surface of at least two high power consumptions chip by Heat Conduction Material；The heat conduction
Substrate is used to absorb the heat that at least two high power consumption chips are produced.
The thermal conductive surface of heat sink and the heat-conducting substrate in first radiator is joined directly together；Or；Described first
Heat sink in radiator is connected with the thermal conductive surface of the heat-conducting substrate by Heat Conduction Material.
Terminal in the application also includes：
It is arranged on directly over high power consumption chip and positioned at the second radiator of heat-conducting substrate upper surface.
Heat dissipation equipment in the application terminal is arranged on high power consumption chip circumference, for being radiated to high power consumption chip,
The position relationship of specific high power consumption chip and heat dissipation equipment, and the composition and annexation of each part please in heat dissipation equipment
The concrete application of heat dissipation equipment in the terminal with reference to disclosed in above example.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "front", "rear", " left side ",
The orientation or position relationship of the instruction such as " right side ", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are based on shown in the drawings
Orientation or position relationship, are for only for ease of the description present invention and simplify description, rather than indicate or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Claims (8)
1. a kind of heat dissipation equipment, applied in terminal, it is characterised in that including：Heat transfer device and the first radiator；
The heat transfer device is connected with least two high power consumption chips in terminal；
First radiator is connected with the heat transfer device；
The heat transfer device is used to absorb the heat that at least two high power consumption chips in terminal are produced, and the heat of absorption is conducted
Radiated to the first radiator.
2. heat dissipation equipment according to claim 1, it is characterised in that the heat transfer device includes：Heat-conducting substrate, the heat conduction
Substrate-parallel sets the top of at least two high power consumption chips in the terminal, the lower surface of the heat-conducting substrate with it is described at least
The upper surface of two high power consumption chips is joined directly together；Or；The lower surface of the heat-conducting substrate and at least two high power consumption
The upper surface of chip is connected by Heat Conduction Material；The heat-conducting substrate is used to absorb the heat that at least two high power consumption chips are produced
Amount.
3. heat dissipation equipment according to claim 2, it is characterised in that heat sink in first radiator with it is described
The thermal conductive surface of heat-conducting substrate is joined directly together；Or；The thermal conductive surface of heat sink and the heat-conducting substrate in first radiator
It is connected by Heat Conduction Material.
4. the heat dissipation equipment according to claim 1-3 any one, it is characterised in that also include：
It is arranged on directly over high power consumption chip and positioned at the second radiator of heat-conducting substrate upper surface.
5. a kind of terminal, it is characterised in that including：At least two high power consumption chips and heat dissipation equipment；
The heat dissipation equipment includes：Heat transfer device and the first radiator；
The heat transfer device is connected with least two high power consumption chips in terminal；
First radiator is connected with the heat transfer device；
The heat transfer device is used to absorb the heat that at least two high power consumption chips in terminal are produced, and the heat of absorption is conducted
Radiated to the first radiator.
6. terminal according to claim 5, it is characterised in that the heat transfer device includes：Heat-conducting substrate, the heat-conducting substrate
The top at least two high power consumption chips be arrangeding in parallel in the terminal, the lower surface of the heat-conducting substrate and described at least two
The upper surface of high power consumption chip is joined directly together；Or；The lower surface of the heat-conducting substrate and at least two high power consumptions chip
Upper surface by Heat Conduction Material be connected；The heat-conducting substrate is used to absorb the heat that at least two high power consumption chips are produced.
7. terminal according to claim 6, it is characterised in that heat sink and the heat conduction in first radiator
The thermal conductive surface of substrate is joined directly together；Or；The thermal conductive surface of heat sink and the heat-conducting substrate in first radiator passes through
Heat Conduction Material is connected.
8. the terminal according to claim 5-7 any one, it is characterised in that also include：
It is arranged on directly over high power consumption chip and positioned at the second radiator of heat-conducting substrate upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710112385.4A CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710112385.4A CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106993393A true CN106993393A (en) | 2017-07-28 |
| CN106993393B CN106993393B (en) | 2020-11-17 |
Family
ID=59411502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710112385.4A Active CN106993393B (en) | 2017-02-28 | 2017-02-28 | Heat dissipation equipment and terminal |
Country Status (1)
| Country | Link |
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| CN (1) | CN106993393B (en) |
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| CN108377632A (en) * | 2018-04-10 | 2018-08-07 | 珠海格力电器股份有限公司 | Air conditioner electrical box and air-conditioning |
| WO2020102983A1 (en) * | 2018-11-20 | 2020-05-28 | 北京比特大陆科技有限公司 | Circuit board and supercomputing server |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106993393B (en) | 2020-11-17 |
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