WO2019015407A1

WO2019015407A1 - System for simultaneously realizing heat dissipation of cpu chip and server

Info

Publication number: WO2019015407A1
Application number: PCT/CN2018/089601
Authority: WO
Inventors: 朱建斌; 王丁会; 严峰; 王建波
Original assignee: 四川斯普信信息技术有限公司
Priority date: 2017-07-20
Filing date: 2018-06-01
Publication date: 2019-01-24
Also published as: CN107182191B; CN107182191A

Abstract

Disclosed is a system for simultaneously realizing heat dissipation of a CPU chip and a server. An outdoor natural cooling unit and an outdoor mechanical refrigerating unit are sequentially connected to a voltage stabilizing unit, a pump set unit and a refrigerating capacity distributing and heat-exchange unit to separately form a loop. The refrigerating capacity distributing and heat-exchange unit is connected to a CPU chip micro heat pipe radiating unit and a server backboard heat pipe radiating unit. The CPU chip micro heat pipe radiating unit is in contact with the CPU chip in the server. The server backboard heat pipe radiating unit is in contact with a heat dissipating port in the server. The system combines a natural cold source with the air-cooled water chiller unit cooling technology, so that the server is cooled by a heat pipe radiator near a heat source. By means of the reasonable distribution of the air flow, the PUE can be effectively reduced and the energy efficiency utilization rate is improved. The problem of local hot spots due to the unreasonable air flow distribution of a precise air conditioning unit can be solved. The space utilization rate of a machine room is improved and more cabinets and servers can be arranged in the machine room. Therefore, the economic benefit can be effectively improved and the space-saving effect is better.

Description

A system capable of simultaneously dissipating heat from a CPU chip and a server

Technical field

The present invention relates to the field of data center equipment environment control technology, and in particular, to a system capable of simultaneously dissipating heat from a CPU chip and a server.

Background technique

China's data center is developing rapidly, with a total of more than 400,000. The annual electricity consumption exceeds 1.5% of the total electricity consumption of the whole society. It is estimated that the data center energy consumption will be equivalent to one year's power generation of the Three Gorges Power Station, most of which are data centers. The PUE is still generally greater than 2.2, which is a big gap compared with the international advanced level. Data center IT equipment needs to be cooled around the clock. Usually, precision air conditioners are used for cooling in the equipment room to ensure the environmental control requirements of the data center. The energy consumption of data center air conditioning units accounts for 35%-45% of the total energy consumption of the equipment room, second only to the energy consumption of IT equipment in the data center, resulting in higher data center PUE and low energy efficiency. In actual operation, the main heat dissipating component in the server is the central processing unit CPU, which accounts for about 80% of the total heat dissipation of the server. The existing cooling method in the data center is usually the cooling environment and then the cooling equipment, such as GB50174-2008. The A and B equipment rooms described in the "Design Specification for Electronic Information System Room" require an ambient temperature of 23 °C ± 1 °C. Because the heating points in the equipment room are not evenly arranged in the equipment room, they are mainly concentrated in equipment and chips. The cooling method can only cause the ambient temperature in the equipment room to drop, but the temperature of the device itself and the chip has not dropped or the speed of the drop is too slow, and the temperature rise rate of the heat of the device and the chip cannot be caught up, resulting in energy loss and cooling effect. The local hot spot temperature is high and the PUE is not lowered.

Summary of the invention

The technical problem to be solved by the present invention is that the existing cooling method consumes a large amount of energy without lowering the temperature of the device itself and the chip, and the cooling effect is poor, and the purpose thereof is to provide a system capable of simultaneously dissipating heat to the CPU chip and the server, the system Combine the natural cold source with the cooling technology of the air-cooled chiller, and use the heat pipe radiator close to the heat source to cool the server. Through the reasonable organization of the airflow, the server- and chip-level cooling solution can effectively reduce the PUE. Improve energy efficiency, on the other hand, it can effectively solve the problem of local hot spots caused by unreasonable airflow organization of precision air conditioning units; at the same time effectively improve the space utilization of the equipment room, more cabinets and servers can be arranged, which can effectively improve economic benefits and land saving. Effect.

The invention is achieved by the following technical solutions:

A system capable of simultaneously dissipating heat from a CPU chip and a server, including an outdoor natural cooling unit and an outdoor mechanical refrigeration unit, wherein the outdoor natural cooling unit and the outdoor mechanical refrigeration unit are sequentially connected with a voltage stabilizing unit, a pump unit, and a cold The quantity distribution heat exchange unit, the cold quantity distribution heat exchange unit is respectively connected with the corresponding outdoor natural cooling unit and the outdoor mechanical refrigeration unit and each constitutes a loop, the cold quantity distribution heat exchange unit is connected with the indoor heat pipe heat dissipation unit, and the indoor heat pipe heat dissipation unit includes a CPU The chip micro heat pipe heat dissipation unit and the server back plate heat pipe heat dissipation unit, the CPU chip micro heat pipe heat dissipation unit and the cold distribution heat exchange unit connected to the outdoor natural cooling unit, the server back plate heat pipe heat dissipation unit and the cold connection with the outdoor mechanical refrigeration unit The heat transfer unit is connected, and the CPU chip micro heat pipe heat dissipation unit is in contact with the CPU chip in the server, and the heat generated by the CPU chip is absorbed and transmitted to the cold distribution heat exchange unit, and the heat dissipation port of the server backplane heat pipe heat dissipation unit and the server Contact and absorb and transfer heat generated by the server Delivered to the cold distribution heat exchange unit. At present, there are two types of cooling methods in the equipment room. One is to use a precision air conditioner for cooling in the equipment room. This method can reduce the temperature in the equipment room, but consumes more energy, and does not cool down the heating point. The temperature of the local heating point is always high, and also occupies the space in the machine room, the space utilization rate of the machine room is low, and the other way is to continuously cool the cooling water to the hot spot for cooling by means of water cooling. This method can achieve the cooling and cooling of the hot spot, but since the machine room is a precision part with live operation, the water cooling method will cause serious consequences once the cooling water leaks, and there will be water vapor on the outer wall due to the temperature difference of the pipe wall surface. The condensation on the water makes the entire cooling water pipeline have hidden dangers to the equipment in the equipment room. In this solution, the equipment and the chip are directly cooled by air cooling and natural cooling in the equipment room, and the cooling efficiency is high and the equipment or The chip causes damage, and the natural cold source outside the machine room is combined with the cooling technology of the air-cooled chiller. Cooling and chip-level devices. The precision air conditioner can be completely replaced, and through the reasonable organization of the airflow, the server-level cooling solution can be used to effectively reduce the PUE and improve the energy efficiency utilization. On the other hand, it can effectively solve the unreasonable airflow organization of the precision air conditioning unit. At the same time, through the complete replacement of the air conditioning unit, the space utilization of the equipment room can be effectively improved, and more cabinets and servers can be arranged, thereby effectively improving the economic efficiency and the effect of saving land.

The CPU is usually operated at a temperature between 60 and 80 ° C. It is directly cooled by a micro heat pipe. It requires only 35 to 50 ° C to meet the CPU cooling requirements. This temperature is the temperature above the natural environment throughout most of the year. Therefore, through the natural heat conduction, the heat transfer medium (cooling water) at a temperature of 35 to 50 ° C can be obtained throughout the year, and the CPU chip can be naturally dissipated through the micro heat pipe. The heat flux density of the micro heat pipe heat sink is much higher than that which can be achieved by air cooling. . The heat dissipation of other components in the server is achieved by air conditioning of the heat pipe of the server backplane. Through the processing method of the CPU micro heat pipe and the server backplane heat pipe or the ceiling heat pipe cooling unit, the safe and reliable operation of the equipment room equipment can be ensured, and the natural cooling can be fully utilized, thereby greatly reducing the heat dissipation power of the equipment room, saving the operating cost of the equipment room, and the unit failure. Low rate and easy maintenance.

Further, a gravity heat pipe is disposed between the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit, and the gravity heat pipe is simultaneously connected with the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit, and the CPU The chip micro heat pipe heat dissipation unit comprises a CPU micro heat pipe heat dissipation portion, a CPU micro heat pipe capillary tube and a CPU micro heat pipe heat absorption portion which are sequentially connected, and the CPU micro heat pipe heat absorption portion contacts the CPU chip in the server and absorbs heat generated by the CPU chip. The CPU micro heat pipe heat sink is connected to the gravity heat pipe. A base is also connected to the heat absorption part of the CPU micro heat pipe, and the base is in contact with the CPU chip in the server; the heat dissipation part of the CPU micro heat pipe includes a heat dissipation end of the capillary heat pipe and a cooling cavity, and the heat dissipation end of the capillary heat pipe is disposed in the cooling cavity In the body, the cooling chamber is provided with a flow channel for the gravity heat pipe refrigerant to flow and an inlet and an outlet for the gravity heat pipe refrigerant.

The heat of the server CPU chip passes through the heat-absorbing part of the micro-heat pipe directly contacting, passes through the refrigerant in the capillary heat pipe, and dissipates heat to the heat-dissipating part of the micro-heat pipe. This is the third-stage heat exchange cycle process, and the heat of the heat-dissipating part of the micro-heat pipe passes through the gravity heat pipe. The refrigerant is distributed to the chip cooling heat distribution heat exchanger, which is the second-stage heat exchange cycle process. The heat dissipation on the water side of the heat dissipation device of the chip is distributed to the outside through the cooling water, and the heat is taken by the natural cooling unit. Go, this is the first stage heat exchange cycle. The multi-stage heat exchange system is used to realize the heat dissipation from the server to the outdoor. The outdoor natural cooling unit and the outdoor mechanical refrigeration unit using the outdoor natural cold source can be independent of the server CPU chip micro heat pipe heat dissipation unit and the server back plate heat pipe heat dissipation unit, respectively. Two closed systems for cooling and cooling the data center. Since the chip is disposed in the server, its volume is small and the heat is high. The gravity heat pipe cannot directly enter the chip, and only the capillary heat pipe with small diameter and thin wall can be used, and the heat is sucked out by the contact method for conversion cooling.

The heat of the server CPU chip passes through the heat absorption part of the micro heat pipe which is directly contacted, and the refrigerant in the heat absorption part is heated and evaporated, and the refrigerant after the phase change enters the heat dissipation part of the micro heat pipe, and the heat dissipation part of the micro heat pipe exchanges heat with the heat absorption part of the gravity heat pipe, and the micro heat pipe The heat of the heat dissipating section is absorbed by the heat absorption part of the gravity heat pipe. After the condensation heat is formed in the heat dissipation section of the micro heat pipe, it is again returned to the heat absorption part of the micro heat pipe by capillary action; after the heat absorption part of the gravity heat pipe absorbs heat, the internal refrigerant absorbs heat. In phase change, the gaseous refrigerant enters the heat dissipation and distribution heat exchanger of the chip under the pressure difference in the tube, and exchanges heat with the circulating water in the heat dissipation and distribution heat exchanger of the chip, so that the heat dissipation and heat distribution of the chip form a gravity heat pipe. Heat dissipation part (condensation part); circulating water in the cold distribution heat exchanger is circulated to the outside under the action of the pump group, and the circulating water is cooled by the outdoor natural cooling unit; the temperature of the server CPU chip is high during the whole year. Low-temperature cooling water is produced by an outdoor natural cooling unit, and natural cooling source is used for heat dissipation to minimize energy consumption; gravity is not required by a refrigerant pump The tube heats the micro heat pipe, and then uses the micro heat pipe to dissipate the heat of the chip, and absorbs and releases the heat of the capillary heat pipe and the gravity heat pipe to change the heat of the phase change heat. The compressor and the refrigerant pump are not needed, and the heat conversion efficiency is very high, and the excess components are reduced. Safe and reliable, and save a lot of energy.

A gravity heat pipe is disposed between the heat pipe unit of the server backplane and the corresponding cold heat distribution unit, and the gravity heat pipe is simultaneously connected with the heat pipe unit of the backplane of the server and the corresponding cold heat distribution unit, and the heat pipe of the server back plate heats off. The unit includes a server backplane heat pipe evaporator, and the server backplane heat pipe evaporator is disposed at the heat dissipation port of the server and connected to the gravity heat pipe. The outdoor mechanical refrigeration unit and the outdoor natural cooling unit jointly assist the heat dissipation of the server, and adopt a two-stage heat exchange system. Under the action of the pump unit, the outdoor natural cooling unit and the outdoor mechanical refrigeration unit will heat the heat exchanger of the server back plate heat pipe. The heat generated in the unit is carried into the natural environment, which is the first-stage cyclic process; other devices other than the server CPU chip generate heat through the heat pipe unit of the server backplane, and are transferred to the server backplane heat pipe under the efficient heat transfer of the gravity heat pipe. The cold distribution heat exchanger, which is the second stage of the cycle.

The heat pipe of the server backplane takes heat from other parts of the server out of the equipment room to assist heat dissipation to the heat transfer of the heat pipe of the server backplane. The circulating water is cooled by the outdoor cooling device; the outdoor cooling unit is a natural cooling unit or a chiller. According to the working conditions of the ambient temperature, the two valves can be switched and used together to further apply the natural cold source to achieve energy saving; the outdoor natural cooling unit, the air-cooled chiller unit and the pump unit can be controlled by the frequency conversion technology. The return water temperature ensures the safety of the system. The fan of the heat pipe cooling system of the server backplane is stepless DC variable speed, which automatically adjusts the speed and automatically adjusts the heat dissipation.

In the case where the server generates less heat and the ambient humidity is high, the heat pipe unit of the server backplane may form a small amount of condensed water. Therefore, a condensate water collecting tray and a condensate drain pipe are disposed at the bottom of the heat pipe evaporator of the server backboard. The condensate drain pipe communicates with the condensate water trap to collect and discharge the condensed water; to prevent accidents, a water leakage sensor is arranged under the heat pipe evaporator of the server back plate to realize the positioning alarm detection.

In order to effectively monitor and protect the system, pressure sensors, flow sensors and temperature sensors are also provided, and the pressure sensor, the flow sensor and the temperature sensor are connected to the pipeline, and are arranged between the voltage stabilizing unit and the pump unit as needed. Between the cold distribution heat exchange unit and the outdoor natural cooling unit, between the cold distribution heat exchange unit and the outdoor mechanical refrigeration unit, set to the corresponding position as needed.

The natural cooling unit and the mechanical refrigeration unit can operate the natural cooling unit, adjust the valve and the heat exchanger by controlling the working load of the mechanical refrigeration unit or the number of the working table according to the change of the outdoor environment. The ratio of the cold load between the two can be adjusted. The cooling of the data center can be realized by the natural cooling unit as much as possible to improve the utilization of the natural cold source. As the outdoor environment is further reduced, the inverter fan or the variable frequency water pump can be used to achieve the Reasonable control of the temperature of the return water.

The mechanical refrigeration unit can adopt the chiller or the unit mechanical refrigeration condenser, which can respectively provide the cooling load and the unit type to provide the cooling load; the natural cooling unit adopts the air-cooled heat exchange device, which can be the air-cooled heat exchanger. It can be a cooling tower, and its power consumption unit only has an inverter fan, which can efficiently provide cooling capacity by directly utilizing a lower ambient temperature. In the multi-stage system, as the intermediate heat exchange unit, the cold-distribution heat exchange unit is preferably a plate heat exchanger or a shell-and-tube heat exchanger, and adopts a redundant structure which is mutually backup, and can be switched and used by the valve. Effectively improve the uniformity and safety of system cooling. These devices are available and can be purchased directly on the market.

In the two independent multi-stage heat exchange systems in the solution, the cooling water in the server chip cooling and cooling heat exchanger and the chilled water in the heat transfer cooling heat exchanger of the server back plate do not enter the machine room. Eliminate the danger of water in the equipment room and even equipment.

When the system starts, first start the heat pipe unit of the server backplane, and finally start the server CPU micro heat pipe heat dissipation device to avoid partial condensation of the micro heat pipe heat sink close to the CPU chip; when the system stops, first stop the server CPU micro heat pipe The heat sink prevents the condensed water from appearing in the heat sink of the micro heat pipe, and finally stops the heat pipe cooling unit of the server back plate.

The cooling system redundancy scheme includes redundancy of the server backplane heat pipe cooling unit to the server CPU chip micro heat pipe cooling unit; the server backplane heat pipe cooling unit itself has also considered the heat dissipation redundancy, and can complete the heat pipe heat dissipation unit stage. The total cooling capacity is provided; the cold-distribution heat exchanger unit realizes redundancy and can provide all the cooling capacity of the cold-distribution heat transfer stage.

Compared with the prior art, the present invention has the following advantages and beneficial effects:

1. By setting up the system in the data center, the thermal conduction effect of the capillary heat pipe is utilized to realize the natural heat dissipation of the CPU chip through the micro heat pipe. The heat flow density of the micro heat pipe heat sink is much higher than that of the air cooling, and the natural heat can be fully utilized. The source realizes the CPU chip level heat dissipation, improves the energy efficiency ratio of the refrigeration system, effectively reduces the PUE, and improves the energy utilization efficiency;

2. By setting up the system in the data center, the heat dissipation unit of the server backplane efficiently takes away the heat generated by other components other than the server CPU chip, thereby achieving server-level heat dissipation and changing the original cold environment and the post-cooling device. Optimize airflow organization to avoid local high temperature and local heat island phenomenon of server cabinet caused by uneven airflow;

3. By setting up the system in the data center, the outdoor natural cooling unit and the outdoor mechanical refrigeration unit using the outdoor natural cold source can form two separate independents from the server CPU chip micro heat pipe heat dissipation unit and the server back plate heat pipe heat dissipation unit, respectively. System to achieve efficient cooling and cooling of the data center;

4. By setting up the system in the data center, the temperature of the server CPU is high. The cooling water of 35 to 50 °C can be obtained through the outdoor natural cooling unit throughout the year, and the natural cooling source can be used for heat dissipation. Energy consumption; at the same time, the outdoor mechanical refrigeration unit of the heat pipe auxiliary cooling system of the server backboard can also make full use of the outdoor natural cooling source according to the outdoor ambient temperature to minimize the energy consumption;

5. By setting up the system in the data center, the CPU can naturally dissipate heat through the micro-heat pipe, and assist the heat dissipation through the heat pipe unit of the server backplane, which can increase the heat dissipation of the single server to 2-3KW (the heat dissipation of the single cabinet can be increased to 25-40KW), effectively improve the space utilization efficiency of the data center, and deploy more servers to effectively improve economic efficiency and achieve energy saving purposes;

6. By setting up the system in the data center, the cooling water in the heat dissipating heat exchanger of the chip and the chilled water in the heat exchanger of the heat exchanger of the server backplane are not in the machine room, completely eliminating the engine room or even The danger of the server entering the water;

7. By setting up the system in the data center, heat can be transferred by absorbing and releasing the latent heat of the capillary heat pipe and the gravity heat pipe refrigerant. No compressor or refrigerant pump is needed, the heat conversion efficiency is very high, and the redundant components are reduced, which is safe and reliable. And save a lot of energy;

8. Server-level environment management can be achieved by setting up the system in the data center.

DRAWINGS

The drawings are intended to provide a further understanding of the embodiments of the present invention, and are not intended to limit the embodiments of the invention. In the drawing:

Figure 1 is a schematic view of the structure of the present invention;

Figure 2 is a plan view of the structure of the present invention.

Marked and corresponding part names in the drawing:

1-Outdoor natural cooling unit, 1-1-natural air-cooled heat exchanger, 1-2-pressure gauge, 1-3-butterfly valve, 1-4-temperature gauge, 1-5-flow switch, 2-outdoor mechanical refrigeration Unit, 2-1-outdoor air-cooled chiller, 2-2-connected hose, 3-regulator unit, 4-pressure sensor, 5-temperature sensor, 6-mechanical refrigeration pump unit, 6-1-mechanical refrigeration Centrifugal pump, 6-2-Y filter, 6-3-check valve, 7-natural cooling pump unit, 7-1-natural cooling centrifugal pump, 8-server cooling capacity heat exchanger, 9- Indoor heat pipe cooling unit, 9-1-server back plate heat pipe evaporator, 9-2-CPU micro heat pipe cut-off valve, 9-3-CPU micro heat pipe heat sink, 9-4-CPU micro heat pipe capillary, 9-5-CPU Micro heat pipe heat absorption part, 9-6-server back plate heat pipe stop valve, 9-7-condensation water water tray, 9-8-condensation water drain pipe, 10-chip heat dissipation cold distribution heat exchanger, 11-natural Cooling unit inlet valve, 12-chip cooling capacity distribution heat exchanger outlet valve, 13-cooling distribution heat exchanger outlet bypass valve, 14-server cooling capacity distribution heat exchanger outlet valve, 15-chip cooling Quantity distribution heat exchanger inlet valve, 16-cooling distribution Influent bypass valve, 17-server allocation heat exchanger cold water inlet valve, 18 was naturally cooled centrifugal pumps the valve, mechanical refrigeration 19- centrifugal pumps the valve, inlet valve 20 mechanical refrigeration unit.

Detailed ways

The present invention will be further described in detail below with reference to the embodiments and the accompanying drawings. As a limitation of the invention.

Example:

As shown in FIG. 1 and FIG. 2, a system capable of simultaneously dissipating heat from a CPU chip and a server, including an outdoor natural cooling unit 1 and an outdoor mechanical refrigeration unit 2, the outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 are sequentially The voltage stabilizing unit 3, the pump unit and the cold distributed heat exchange unit are connected, and the cold distributed heat exchange unit is respectively connected with the corresponding outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2, and each constitutes a loop, which is convenient for description. The pump unit and the cold distribution heat exchange unit connected to the outdoor natural cooling unit 1 are respectively named a natural cooling pump unit unit 7 and a chip heat dissipation cold distribution heat exchanger 10, and a pump unit unit connected to the outdoor mechanical refrigeration unit 2 and The cold distribution heat exchange unit is named as the mechanical refrigeration pump unit unit 6 and the server heat dissipation cold distribution heat exchanger 8 respectively. The outdoor natural cooling unit 1 includes a pressure gauge 1-2, a connecting hose 2-2, a natural air-cooled heat exchanger 1-1, a thermometer 1-4, a flow switch 1-5, and a butterfly valve 1-3, a natural cooling pump. The group unit 7 includes a natural cooling centrifugal water pump 7-1, a Y-type filter 6-2, and a check valve 6-3. The outdoor mechanical refrigeration unit 2 includes an outdoor air-cooled chiller 2-1, a connecting hose 2-2, and a pressure. Table 1-2, temperature table 1-4, flow switch 1-5 and butterfly valve 1-3, mechanical refrigeration pump unit 6 includes mechanical refrigeration centrifugal water pump 6-1, Y-type filter 6-2 and check valve 6- 3. The outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 adopt a parallel cooling and cooling dual system. In this system, the outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 are relatively independent from each other. The outdoor natural cooling unit 1 is also provided with a pressure sensor 4, a temperature sensor 5, a natural cooling centrifugal water pump outlet valve 18, a chip cooling capacity distribution heat exchanger inlet valve 15, and a chip cooling capacity distribution heat exchanger outlet valve. 12. The natural cooling unit inlet valve 11, the outdoor mechanical refrigeration unit 2 is also provided with a mechanical refrigeration centrifugal water pump outlet valve 19, a server cooling capacity distribution heat exchanger inlet valve 17, a server cooling capacity distribution heat exchanger The water outlet valve 14, the mechanical refrigeration unit inlet valve 20, and the cold distribution heat exchanger outlet bypass valve 13 and the cold distribution heat exchanger inlet bypass valve 16 are disposed between the two pipelines, and the cooling capacity is exchanged. The heater outlet bypass valve 13 and the cold distribution heat exchanger inlet bypass valve 16 and both conduits are in communication.

The outdoor natural cooling unit 1 is operated by the natural cooling pump unit unit 7, and the cooling water is brought into the chip heat-dissipating cold-distribution heat exchanger 10 by cooling in the natural air-cooling heat exchanger 1-1, through heat exchange, The cooling water absorbs heat, and under the action of the natural cooling pump unit 7, the cooling water is brought back to the natural air-cooling heat exchanger 1-1 to cool the cooling water.

The indoor heat pipe heat dissipation unit 9 includes a CPU chip micro heat pipe heat dissipation unit and a server back plate heat pipe heat dissipation unit, and the CPU chip micro heat pipe heat dissipation unit includes a CPU micro heat pipe cut valve 9-2, a CPU micro heat pipe heat dissipation portion 9-3, and a CPU micro heat pipe capillary 9 -4, CPU micro heat pipe heat absorption part 9-5, one end is the CPU micro heat pipe radiator heat absorption part 9-5 directly in contact with the server CPU chip heat transfer, the other end and the gravity heat pipe circulation system for heat exchange, micro heat pipe heat sink Efficient treatment of heat flux density is much greater than the heat flux density that can be achieved by air cooling. By high-efficiency micro-heat pipe heat exchange, circulating water can be prevented from directly entering the server and the possibility of server damage caused by leakage of the circulating water system can be eliminated.

The CPU micro heat pipe heat absorption portion 9-5 directly contacts the server CPU chip through the susceptor to absorb heat, wherein the capillary heat pipe end portion which is tightly fixed is disposed; the heat dissipation portion of the CPU micro heat pipe heat dissipation portion 9-3 is composed of the capillary heat pipe The heat dissipating end and the heat dissipating end of the capillary heat pipe are composed of a cooling cavity, wherein the cooling cavity is provided with a flow channel groove for the gravity heat pipe refrigerant to flow, and an inlet and an outlet of the gravity heat pipe refrigerant.

The CPU micro heat pipe capillary 9-4 is filled with refrigerant inside, and is in a gas-liquid two-phase mixed state at normal temperature. One end of the CPU micro heat pipe heat absorption part 9-5 directly contacts the server CPU chip to absorb heat, and passes through the refrigerant circulation system in the capillary heat pipe. Perform heat exchange to bring heat to the CPU micro heat pipe radiator heat sink 9-3, which is the third stage cycle; the heat of the CPU micro heat pipe heat sink 9-3, and then pass the refrigerant in the gravity heat pipe to the chip heat dissipation The heat exchanger 10 is distributed, which is a second-stage cycle; the heat dissipation of the heat dissipation of the chip is distributed to the water on the water side of the heat exchanger 10, and is carried by the cooling water to the outside by the natural cooling unit 1 to dissipate the heat to the outside, which is the first The first cycle process.

In the mechanical air-cooled condenser of the outdoor mechanical refrigeration unit 2, the direct heat transfer by the compressor is performed, and the refrigerant phase change in the outdoor mechanical refrigeration unit 2 removes heat from the mechanical refrigeration unit, and the cold amount is carried to the server for cooling capacity distribution. In the heat exchanger 8. In the high temperature season, the chilled water provided by the chiller is used for heat exchange through the heat dissipation and distribution heat exchanger 8 of the server; in the transitional season and winter, the water supply bypass valve 13 and the cold distribution heat exchanger are adjusted by the cooling capacity distribution heat exchanger. The bypass valve 16 can fully utilize the cooling water provided by the natural cooling unit as a supplemental cold source for the chilled water of the chiller, and takes the heat away by the heat dissipation and distribution heat exchanger 8 of the server, fully utilizing the natural environment cold source, and greatly reducing Mechanical cooling power consumption, effectively improve the PUE value of the data center, improve energy utilization efficiency, which is the first cycle of mechanical refrigeration.

The server backplane heat pipe evaporator 9-1 transfers the heat outside the server CPU chip component to the server heat dissipation cold distribution heat exchanger 8 under the efficient heat transfer of the gravity heat pipe, which is a second-stage cycle process.

As shown in FIG. 2 , a schematic diagram of a server cooling system combining a server CPU chip micro heat pipe and a server back plate heat pipe, according to the layout requirements of the machine room, the server heat dissipation cold distribution heat exchanger 8 and the chip heat dissipation cold distribution heat exchanger 10, are set outside the machine room, can use the natural cold source of the outdoor mechanical refrigeration unit 2 corresponding to the server cooling capacity cooling heat exchanger 8 and the server back plate heat pipe evaporator 9-1, the outdoor natural air cooling unit 1 corresponding chip cooling The heat exchanger 10 and the CPU micro heat pipe radiator 9-3, two sets of cold distribution heat exchangers, form two systems which are relatively independent from each other, and improve the cooling load utilization efficiency.

The server CPU chip micro heat pipe cooling unit directly contacts the server CPU chip, and utilizes the heat transfer effect of the capillary heat pipe to directly dissipate heat to the high temperature chip; the heat pipe unit of the server back plate is disposed on the server back plate, and the remaining heat of the micro heat pipe is efficiently discharged.

The bottom of the server backplane heat pipe evaporator 9-1 is provided with a condensate water collecting tray 9-7 and a condensed water drain pipe 9-8, and the condensed water drain pipe 9-8 is connected with the condensed water water collecting plate 9-7 at the server. A water leakage sensor is disposed below the back plate heat pipe evaporator 9-1.

The server backplane heat pipe cooling unit directly dissipates heat generated by components other than the server CPU chip by setting a server backplane heat pipe radiator circulation fan, thereby effectively improving heat exchange efficiency. According to the different implementation methods of the system, the system ensures the safety of the system and the stability of the system operation by setting related instruments and related pressure storage equipment.

The micro heat pipe heat exchange component is used between the server CPU chip and the micro heat pipe heat exchange device to dissipate heat, which can avoid circulating water directly entering the server, prevent the possibility of server damage caused by the leakage of the circulating water system, and improve the safety performance.

The specific embodiments of the present invention have been described in detail with reference to the preferred embodiments of the present invention. All modifications, equivalent substitutions, improvements, etc., made within the spirit and scope of the invention are intended to be included within the scope of the invention.

Claims

A system capable of simultaneously dissipating heat from a CPU chip and a server, comprising: an outdoor natural cooling unit (1) and an outdoor mechanical refrigeration unit (2), the outdoor natural cooling unit (1) and an outdoor mechanical refrigeration unit (2) A voltage stabilizing unit (3), a pump unit and a cold distribution heat exchange unit are sequentially connected, and the cold heat transfer unit and the corresponding outdoor natural cooling unit (1) and the outdoor mechanical refrigeration unit (2) Connected and formed a loop, the cold heat distribution unit is connected with an indoor heat pipe heat dissipation unit (9), and the indoor heat pipe heat dissipation unit includes a CPU chip micro heat pipe heat dissipation unit and a server back plate heat pipe heat dissipation unit, a CPU chip micro heat pipe heat dissipation unit and an outdoor unit. The cooling unit of the natural cooling unit (1) is connected to the heat distribution unit, the heat pipe unit of the server backplane is connected with the cooling heat exchange unit connected to the outdoor mechanical refrigeration unit (2), and the CPU chip micro heat pipe cooling unit and the server The CPU chip contacts and transfers the heat generated by the CPU chip to the cold distribution heat exchange unit, and the heat dissipation port of the server backplane heat pipe cooling unit and the server Touch and heat generated by the server and transferred to the absorption refrigeration heat distribution means.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 1, wherein a gravity heat pipe is disposed between the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit, And the gravity heat pipe is simultaneously connected with the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 2, wherein the CPU chip micro heat pipe heat dissipation unit comprises a CPU micro heat pipe heat dissipation portion (9-3) and a CPU that are sequentially connected The micro heat pipe capillary (9-4) and the CPU micro heat pipe heat absorption part (9-5), and the CPU micro heat pipe heat absorption part (9-5) is in contact with the CPU chip in the server, and absorbs the heat generated by the CPU chip, CPU The micro heat pipe heat dissipation portion (9-3) is connected to the gravity heat pipe.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 3, wherein the CPU micro heat pipe heat absorption portion (9-5) is connected to a base, and the base and the server are CPU chip contact; the CPU micro heat pipe heat dissipation portion (9-3) includes a heat dissipation end of the capillary heat pipe and a cooling cavity, and the heat dissipation end of the capillary heat pipe is disposed in the cooling cavity, and the cooling cavity is provided with a gravity heat pipe refrigerant flow The runner channel and the inlet and outlet of the gravity heat pipe refrigerant.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 1, wherein a gravity heat pipe is disposed between the heat pipe heat dissipation unit of the server back plate and the corresponding cold heat distribution unit. And the gravity heat pipe is simultaneously connected with the heat pipe unit of the server back plate and the corresponding cold heat distribution unit.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 5, wherein the server backplane heat pipe heat dissipation unit comprises a server backplane heat pipe evaporator (9-1), and the server back The plate heat pipe evaporator (9-1) is placed at the vent of the server and connected to the gravity heat pipe.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to claim 6, wherein a bottom of the server backplane heat pipe evaporator (9-1) is provided with a condensate water tray (9- 7) and the condensate drain pipe (9-8), and the condensate drain pipe (9-8) is connected to the condensate water drain pan (9-7), and is arranged under the server back plate heat pipe evaporator (9-1) There is a leak sensor.
A system capable of simultaneously dissipating heat from a CPU chip and a server according to any one of claims 1 to 7, further comprising a pressure sensor (4), a flow sensor, and a temperature sensor (5). The pressure sensor (4), the flow sensor and the temperature sensor (5) are in communication with the pipeline.
The system capable of simultaneously dissipating heat from a CPU chip and a server according to any one of claims 1 to 7, characterized in that the outdoor natural cooling unit (1) is an air-cooled heat exchanger or a cooling tower. .
The system capable of simultaneously dissipating heat from a CPU chip and a server according to any one of claims 1 to 7, wherein the cold distribution heat exchange unit is a plate heat exchanger or a shell-and-tube type change Heater.