CN107182191B - System capable of simultaneously realizing heat dissipation of CPU chip and server - Google Patents
System capable of simultaneously realizing heat dissipation of CPU chip and server Download PDFInfo
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- CN107182191B CN107182191B CN201710595312.5A CN201710595312A CN107182191B CN 107182191 B CN107182191 B CN 107182191B CN 201710595312 A CN201710595312 A CN 201710595312A CN 107182191 B CN107182191 B CN 107182191B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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Abstract
The invention discloses a system capable of simultaneously realizing heat dissipation of a CPU chip and a server, wherein an outdoor natural cooling unit and an outdoor mechanical refrigeration unit are sequentially connected with a voltage stabilizing unit, a pump set unit and a cold quantity distribution heat exchange unit to respectively form loops, the cold quantity distribution heat exchange unit is connected with a CPU chip micro heat pipe heat dissipation unit and a server backboard heat pipe heat dissipation unit, the CPU chip micro heat pipe heat dissipation unit is in contact with the CPU chip in the server, and the server backboard heat pipe heat dissipation unit is in contact with a heat dissipation port of the server. The system combines a natural cold source with an air-cooled water chiller cooling technology, adopts a heat pipe radiator close to a heat source to cool the server, and can effectively reduce PUE, improve the energy efficiency utilization rate and effectively solve the problems of local hot spots and the like caused by unreasonable airflow organization of a precision air conditioning unit through reasonable airflow organization; meanwhile, the space utilization rate of the machine room is improved, more cabinets and servers can be arranged, and therefore economic benefits and land-saving effects can be improved.
Description
Technical Field
The invention relates to the technical field of environmental control of a data center machine room, in particular to a system capable of simultaneously realizing heat dissipation of a CPU chip and a server.
Background
China's data centers develop rapidly, the total amount is over 40 thousands, annual power consumption is over 1.5% of the power consumption of the whole society, the data center energy consumption is expected to be equivalent to one year of power generation of three gorges power stations every year, the PUE of most of the data centers is still generally more than 2.2, and the difference is larger than the international advanced level. Data center IT equipment needs to be cooled all weather, and a precise air conditioner is adopted in a machine room for refrigeration generally, so that the environmental control requirement of the data center is met. The energy consumption of the air conditioning unit of the data center accounts for 35% -45% of the total energy consumption of the machine room, which is second to the energy consumption of IT equipment of the data center, so that the PUE value of the data center is high, and the energy efficiency utilization rate is low. In actual operation, a main heat dissipation component in a server is a Central Processing Unit (CPU), the heat dissipation capacity of the CPU accounts for about 80% of the total heat dissipation capacity of the server, and the existing cooling method of a data center generally includes cooling an environment first and then cooling equipment, for example, a A, B machine room requires an environment temperature of 23 ± 1 ℃ as described in GB50174-2008 "design specification of electronic information system machine room", and since heating points in the machine room are not uniformly arranged in the machine room but are mainly concentrated in the equipment and chips, the traditional cooling method can only cause the temperature in the machine room to decrease, and the temperatures of the equipment and the chips do not decrease or decrease too slowly, and cannot keep up with the heating rate of the equipment and the chips, which causes energy loss and does not achieve the cooling effect, and causes a high local hot spot temperature, and does not decrease the PUE.
Disclosure of Invention
The invention aims to solve the technical problems that the existing cooling mode consumes a large amount of energy, but does not reduce the temperature of equipment and a chip, and has poor cooling effect, and aims to provide a system capable of simultaneously cooling a CPU chip and a server, wherein the system combines a natural cold source with an air-cooled water chiller cooling technology, adopts a heat pipe radiator close to a heat source to cool the server, and utilizes a heat dissipation solution facing the server and the chip level through reasonable airflow organization, so that on one hand, the PUE can be effectively reduced, the energy efficiency utilization rate is improved, and on the other hand, the problems of local hot spots and the like caused by unreasonable airflow organization of a precision air conditioning unit can be effectively solved; meanwhile, the space utilization rate of the machine room is effectively improved, more cabinets and servers can be arranged, and therefore economic benefits and land-saving effects can be effectively improved.
The invention is realized by the following technical scheme:
a system capable of simultaneously realizing heat dissipation of a CPU chip and a server comprises an outdoor natural cooling unit and an outdoor mechanical refrigeration unit, wherein the outdoor natural cooling unit and the outdoor mechanical refrigeration unit are sequentially connected with a voltage stabilizing unit, a pump set unit and a cold quantity distribution heat exchange unit, the cold quantity distribution heat exchange unit is respectively connected with the corresponding outdoor natural cooling unit and the outdoor mechanical refrigeration unit and respectively forms a loop, the cold quantity distribution heat exchange unit is connected with an indoor heat pipe heat dissipation unit, the indoor heat pipe heat dissipation unit comprises a CPU chip micro heat pipe heat dissipation unit and a server back plate heat pipe heat dissipation unit, the CPU chip micro heat pipe heat dissipation unit is connected with the cold quantity distribution heat exchange unit connected with the outdoor natural cooling unit, the server back plate heat pipe heat dissipation unit is connected with the cold quantity distribution heat exchange unit connected with the outdoor mechanical refrigeration unit, the CPU chip micro heat pipe heat dissipation unit is in contact with the CPU chip in the server and absorbs and transmits heat quantity generated by the CPU chip to the cold quantity distribution heat exchange unit, and the server back plate heat pipe heat dissipation unit is in contact with a heat dissipation port of the server and transmits the heat quantity generated by the server to the cold quantity distribution heat exchange unit. At present there are two kinds to the cooling methods in the computer lab, firstly adopt accurate air conditioner to refrigerate in the computer lab, this kind of mode can carry out certain reduction to the temperature in the computer lab, but the energy of consumption is many, and do not cool down to the point that generates heat, cause the temperature of local heating point to be high all the time, the space in the computer lab has still been occupied simultaneously, the space utilization of computer lab is low, another kind of mode is through water-cooled mode, let in the cooling water continuously to the point department that generates heat and cool off, this kind of mode can realize the cooling of heating point, but because all be the accurate part of live working in the computer lab, water-cooled mode in case the cooling water leakage appears, will cause serious consequence, simultaneously because the difference in temperature of pipeline wall, there is water steam to condense into on the outer wall, make whole cooling water pipeline have the hidden danger to the equipment in the computer lab, this scheme is then to adopt air-cooled and natural cooling mode directly to cool off equipment and chip in the computer lab, cooling efficiency is high and can not cause the injury to equipment or chip, adopt natural cold source and the cooling water cooling unit cooling technology to combine together outward, realize the heat dissipation of equipment and chip level. The precise air conditioner can be completely replaced, and a server-level oriented heat dissipation solution is utilized through reasonable airflow organization, so that the PUE can be effectively reduced, the energy efficiency utilization rate is improved, and the problems of local hot spots and the like caused by unreasonable airflow organization of a precise air conditioner unit can be effectively solved; meanwhile, the complete replacement of the air conditioning unit effectively improves the space utilization rate of the machine room, and more cabinets and servers can be arranged, so that the economic benefit and the land-saving effect can be effectively improved.
The temperature of the CPU during operation is generally between 60 and 80 ℃, and the heat dissipation requirement of the CPU can be met only by adopting the direct cooling mode of the micro heat pipe and the temperature of 35 to 50 ℃. This temperature is higher than the natural temperature throughout the year in most regions. Therefore, heat transfer medium (cooling water) with the temperature of 35 to 50 ℃ can be prepared all the year round through natural heat conduction, the CPU chip can be naturally radiated through the micro heat pipe, and the heat flow density of the micro heat pipe radiating device for high-efficiency treatment is far greater than the density which can be achieved by air cooling. The heat dissipation of other components in the server is realized through the air conditioning of the heat pipe of the server backboard. The safe and reliable operation of the equipment in the machine room can be ensured by the processing mode of the CPU micro heat pipe and the heat pipe of the server back plate or the heat pipe radiating unit of the suspended ceiling, natural refrigeration can be fully utilized, the heat radiating power consumption of the machine room is greatly reduced, the operating cost of the machine room is saved, the failure rate of the unit is low, and the maintenance is simple.
Furthermore, a gravity heat pipe is arranged between the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit, the gravity heat pipe is simultaneously connected with the CPU chip micro heat pipe heat dissipation unit and the corresponding cold quantity distribution heat exchange unit, the CPU chip micro heat pipe heat dissipation unit comprises a CPU micro heat pipe heat dissipation part, a CPU micro heat pipe capillary and a CPU micro heat pipe heat absorption part which are sequentially communicated, the CPU micro heat pipe heat absorption part is in contact with the CPU chip in the server and absorbs heat generated by the CPU chip, and the CPU micro heat pipe heat dissipation part is connected with the gravity heat pipe. The CPU micro heat pipe heat absorption part is connected with a base, and the base is in contact with a CPU chip in the server; the CPU micro heat pipe radiating part comprises a heat radiating end of the capillary heat pipe and a cooling cavity, the heat radiating end of the capillary heat pipe is arranged in the cooling cavity, and a flow channel groove for gravity heat pipe coolant to flow and an inlet and an outlet of the gravity heat pipe coolant are arranged in the cooling cavity.
The heat of the CPU chip of the server is dissipated to the heat dissipation part of the micro heat pipe through the heat absorption part of the micro heat pipe in direct contact and the refrigerant in the capillary heat pipe, the heat is dissipated to the heat dissipation part of the micro heat pipe through the refrigerant in the gravity heat pipe, the heat is dissipated to the heat dissipation cold distribution heat exchanger of the chip, the heat is dissipated to the outside through the cooling water, the heat at the water side of the heat dissipation cold distribution heat exchanger of the chip is taken away by the natural cooling unit, and the heat is a first-stage heat exchange circulation process. The multi-stage heat exchange system is adopted to realize the heat dissipation and cooling from the server to the outside, the outdoor natural cooling unit and the outdoor mechanical refrigeration unit utilizing an outdoor natural cold source can respectively form two mutually independent closed systems with the server CPU chip micro heat pipe heat dissipation unit and the server backboard heat pipe heat dissipation unit, and the heat dissipation and cooling of the data center are realized. Because the chip is arranged in the server, the volume is small, the heating is high, the gravity heat pipe cannot directly enter into contact with the chip, and only the capillary heat pipe with small diameter and thin wall can be adopted to suck heat out for conversion cooling in a contact mode.
The heat of the CPU chip of the server is heated and evaporated through the heat absorption part of the micro heat pipe in direct contact with the refrigerant in the heat absorption part, the refrigerant after phase change enters the heat dissipation part of the micro heat pipe, the heat dissipation part of the micro heat pipe exchanges heat with the heat absorption part of the gravity heat pipe, the heat of the heat dissipation section of the micro heat pipe is absorbed by the heat absorption part of the gravity heat pipe, and the refrigerant in the micro heat pipe returns to the heat absorption part of the micro heat pipe through capillary action again after being condensed at the heat dissipation section; after the heat absorption part of the gravity heat pipe absorbs heat, the refrigerant inside the gravity heat pipe absorbs heat and changes phase, and the gaseous refrigerant enters the chip heat dissipation cold quantity distribution heat exchanger under the action of pressure difference in the pipe and exchanges heat with circulating water in the chip heat dissipation cold quantity distribution heat exchanger, so that the chip heat dissipation cold quantity distribution heat exchanger forms a heat dissipation part (condensation part) of the gravity heat pipe; circulating water in the cold distribution heat exchanger circulates outdoors under the action of the pump set, and the outdoor natural cooling unit cools the circulating water; the temperature of the CPU chip of the server during operation is high, low-temperature cooling water can be prepared by an outdoor natural cooling unit all the year round, heat dissipation is carried out by utilizing a natural cold source, and energy consumption is reduced to the maximum extent; the micro heat pipe is cooled through the gravity heat pipe without a refrigerant pump, the chip is cooled through the micro heat pipe, heat is transferred by absorbing and releasing latent heat of phase change of the capillary heat pipe and the gravity heat pipe refrigerant, a compressor and the refrigerant pump are not needed, heat conversion efficiency is very high, redundant parts are reduced, safety and reliability are achieved, and a large amount of energy is saved.
And the gravity heat pipe is arranged between the server backboard heat pipe radiating unit and the corresponding cold quantity distribution heat exchange unit, the gravity heat pipe is simultaneously connected with the server backboard heat pipe radiating unit and the corresponding cold quantity distribution heat exchange unit, the server backboard heat pipe radiating unit comprises a server backboard heat pipe evaporator, and the server backboard heat pipe evaporator is arranged at a heat radiating port of the server and is connected with the gravity heat pipe. The outdoor mechanical refrigeration unit and the outdoor natural cooling unit together perform auxiliary heat dissipation on the server, and the two-stage heat exchange system is adopted, so that under the action of the pump unit, the outdoor natural cooling unit and the outdoor mechanical refrigeration unit carry heat generated in the server backboard heat pipe cold energy distribution heat exchanger unit to the natural environment, which is a first-stage circulation process; heat generated by other equipment except the CPU chip of the server passes through the heat pipe radiating unit of the server backboard and is transferred to the heat pipe radiating cold quantity distribution heat exchanger of the server backboard under the high-efficiency heat transfer effect of the gravity heat pipe, and the second-stage circulation process is realized.
The server backboard heat pipe is used for taking heat generated by other parts of the server out of the machine room, carrying out auxiliary heat dissipation to the server backboard heat pipe heat dissipation cold quantity distribution heat exchanger, and cooling circulating water by outdoor cooling equipment; the outdoor cooling unit is a natural cooling unit or a water chilling unit, and the switching and the matching use of the outdoor cooling unit and the water chilling unit are realized through an electric valve according to the working condition of the environmental temperature, so that a natural cold source is further applied, and the energy conservation is realized; the temperature of the supplied return water can be controlled by a frequency conversion technology, so that the safety of the system is ensured, and a fan of the heat pipe radiating system of the back plate of the server is stepless and direct current variable, and automatically adjusts the rotating speed and the radiating capacity.
Under the conditions that the heat productivity of the server is small and the environmental humidity is high, the heat pipe radiating unit of the server backboard possibly forms a very small amount of condensed water, so that a condensed water accumulating tray and a condensed water drain pipe are arranged at the bottom of the heat pipe evaporator of the server backboard, and the condensed water drain pipe is communicated with the condensed water accumulating tray to collect and drain the condensed water; in order to prevent accidents, a water leakage sensor is arranged below the server backboard heat pipe evaporator, so that positioning alarm detection is realized.
In order to effectively monitor and protect the system, a pressure sensor, a flow sensor, a temperature sensor and the like are further arranged, the pressure sensor, the flow sensor and the temperature sensor are communicated with a pipeline and are arranged between the pressure stabilizing unit and the pump set unit, between the cold quantity distribution heat exchange unit and the outdoor natural cooling unit, between the cold quantity distribution heat exchange unit and the outdoor mechanical refrigeration unit as required and at corresponding positions as required.
The natural cooling unit and the mechanical refrigeration unit are changed according to the working condition of the outdoor environment, under the condition that the temperature of the outdoor environment is low, on one hand, the working load or the number of the working platforms of the mechanical refrigeration unit can be controlled, the natural cooling unit is operated, the valve and the heat exchanger are adjusted, the proportion distribution of the cold load between the natural cooling unit and the heat exchanger can be adjusted, the data center can be cooled through the natural cooling unit as much as possible, the utilization of a natural cold source is improved, along with the further reduction of the outdoor environment, the reasonable control of the temperature of supply return water can be realized through adopting a variable frequency fan or a variable frequency water pump.
The mechanical refrigeration unit can adopt a water chilling unit and also can adopt a unit mechanical refrigeration condenser, and can respectively realize centralized supply of a refrigeration load and unit type supply of the refrigeration load; the natural cooling unit adopts an air-cooled heat exchange device, can be an air-cooled heat exchanger and can be a cooling tower, and the power consumption unit of the natural cooling unit only has a variable frequency fan, and can efficiently provide cold energy by directly utilizing lower ambient temperature. In a multi-stage system, as an intermediate heat exchange unit, the cold distribution heat exchange unit is preferably a plate heat exchanger or a shell-and-tube heat exchanger, and adopts a redundant structure which is mutually backup, so that the cold distribution heat exchange unit can be adjusted and switched to use through a valve, and the refrigeration uniformity and safety of the system can be effectively improved. These devices are available and can be purchased directly from the market.
In the two mutually independent multistage heat exchange systems, cooling water in the server chip heat dissipation cold energy distribution heat exchanger and chilled water in the server back plate heat pipe heat dissipation cold energy distribution heat exchanger do not enter a machine room, so that the danger of water entering the machine room or even equipment is avoided.
When the system is started, the heat pipe radiating unit of the back plate of the server is started first, and finally the micro heat pipe radiating device of the CPU of the server is started, so that the local part of the micro heat pipe radiating device close to the CPU chip is prevented from generating condensed water; when the system is stopped, the micro heat pipe heat dissipation device of the CPU of the server is stopped firstly, so that the local condensate water of the micro heat pipe heat dissipation device is avoided, and finally, the heat pipe heat dissipation unit of the backboard of the server is stopped.
The redundancy scheme of the heat dissipation system comprises the redundancy of a heat pipe heat dissipation unit of a server backboard to a micro heat pipe heat dissipation unit of a server CPU chip; the heat pipe heat dissipation unit of the server backboard also considers the redundancy of the heat dissipation capacity, and can complete the whole cold quantity supply of the heat pipe heat dissipation unit stage; the cold quantity distribution heat exchanger unit realizes redundancy and can complete the whole cold quantity supply in the cold quantity distribution heat exchange stage.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. by arranging the system in the data center, the excellent heat conduction effect of the capillary heat pipe is utilized, the micro heat pipe is used for realizing the natural heat dissipation of the CPU chip, the heat flow density of the micro heat pipe heat dissipation device for high-efficiency processing is far greater than the heat flow density which can be achieved by air cooling, a natural cold source can be fully utilized, the CPU chip-level heat dissipation is realized, the energy efficiency ratio of a refrigeration system is improved, the PUE is effectively reduced, and the utilization efficiency of energy is improved;
2. by arranging the system in the data center, heat generated by other components except a CPU chip of the server is efficiently taken away through a heat pipe radiating unit of a server backboard, server-level radiating is realized, the original conditions of an initial cooling environment and a subsequent cooling device are changed, the air flow organization is optimized, and the phenomena of local high temperature and local heat island of a server cabinet caused by uneven air flow are avoided;
3. by arranging the system in the data center, the outdoor natural cooling unit and the outdoor mechanical refrigeration unit utilizing an outdoor natural cold source can respectively form two mutually independent closed systems with the server CPU chip micro heat pipe heat dissipation unit and the server backboard heat pipe heat dissipation unit, so that efficient heat dissipation and cooling of the data center are realized;
4. by arranging the system in the data center, the temperature of the CPU of the server is higher during operation, cooling water with the temperature of 35-50 ℃ can be prepared by an outdoor natural cooling unit all the year round, and the natural cold source is utilized for heat dissipation, so that the energy consumption is reduced to the maximum extent; meanwhile, an outdoor mechanical refrigeration unit of the server backboard heat pipe auxiliary heat dissipation system can fully utilize an outdoor natural cold source according to the outdoor environment temperature, so that the energy consumption is reduced to the maximum extent;
5. by arranging the system in the data center, the natural heat dissipation of a CPU is realized through the micro heat pipe, and the auxiliary heat dissipation is performed through the heat pipe heat dissipation unit of the back plate of the server, so that the heat dissipation capacity of a single server can be increased to 2-3KW (the heat dissipation capacity of a single cabinet can be increased to 25-40 KW), the space utilization efficiency of the data center is effectively improved, more servers can be arranged, the economic benefit is effectively improved, and the purpose of saving energy is achieved;
6. by arranging the system in the data center, cooling water in the chip heat dissipation and cooling capacity distribution heat exchanger and chilled water in the server backboard heat pipe heat dissipation and cooling capacity distribution heat exchanger do not enter a machine room, so that the danger of water entering the machine room or even a server is completely eradicated;
7. by arranging the system in the data center, heat can be transferred by absorbing and releasing the latent heat of the phase change of the capillary heat pipe and the gravity heat pipe refrigerant, a compressor and a refrigerant pump are not needed, the heat conversion efficiency is very high, redundant parts are reduced, the system is safe and reliable, and a large amount of energy is saved;
8. by providing the system within a data center, server-level environment management can be achieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic view of the structure of the present invention;
fig. 2 is a top view of the structure of the present invention.
Reference numbers and corresponding part names in the figures:
1-outdoor natural cooling unit, 1-1-natural air cooling heat exchanger, 1-2-pressure gauge, 1-3-butterfly valve, 1-4-thermometer, 1-5-flow switch, 2-outdoor mechanical refrigeration unit, 2-1-outdoor air cooling water chiller, 2-2-connecting hose, 3-pressure stabilizing unit, 4-pressure sensor, 5-temperature sensor, 6-mechanical refrigeration pump set unit, 6-1-mechanical refrigeration centrifugal water pump, 6-2-Y type filter, 6-3-check valve, 7-natural cooling pump set unit, 7-1-natural cooling centrifugal water pump, 8-server heat dissipation cold energy distribution heat exchanger, 9-indoor heat pipe heat dissipation unit, 9-1-server backboard heat pipe evaporator, 9-2-CPU micro heat pipe stop valve, 9-3-CPU micro heat pipe heat dissipation part, 9-4-CPU micro heat pipe capillary tube, 9-5-CPU micro heat pipe heat absorption part, 9-6-server backboard heat pipe stop valve, 9-7-condensed water accumulation plate, 9-8-condensed water drain pipe, 10-chip heat dissipation cold distribution heat exchanger, 11-natural cooling unit water inlet valve, 12-chip heat dissipation cold distribution heat exchanger water outlet valve, 13-cold distribution heat exchanger water outlet bypass valve, 14-server heat dissipation cold distribution heat exchanger water outlet valve, 15-chip heat dissipation cold distribution heat exchanger water inlet valve, 16-cold distribution heat exchanger water inlet bypass valve, 17-a water inlet valve of a heat exchanger for distributing heat dissipation and cooling capacity of a server, 18-a water outlet valve of a natural cooling centrifugal water pump, 19-a water outlet valve of a mechanical refrigeration centrifugal water pump and 20-a water inlet valve of a mechanical refrigeration unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
The embodiment is as follows:
as shown in fig. 1 and 2, a system capable of simultaneously dissipating heat of a CPU chip and a server includes an outdoor natural cooling unit 1 and an outdoor mechanical refrigeration unit 2, the outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 are sequentially connected to a voltage stabilizing unit 3, a pump set unit and a cold distribution heat exchange unit, the cold distribution heat exchange units are respectively connected to the corresponding outdoor natural cooling unit 1 and the corresponding outdoor mechanical refrigeration unit 2 and respectively form a loop, for convenience of description, the pump set unit and the cold distribution heat exchange unit connected to the outdoor natural cooling unit 1 are respectively named as a natural cooling pump set unit 7 and a chip heat dissipation cold distribution heat exchanger 10, and the pump set unit and the cold distribution heat exchange unit connected to the outdoor mechanical refrigeration unit 2 are respectively named as a mechanical refrigeration pump set unit 6 and a server heat dissipation cold distribution heat exchanger 8. The outdoor natural cooling unit 1 comprises a pressure gauge 1-2, a connecting hose 2-2, a natural air cooling heat exchanger 1-1, a thermometer 1-4, a flow switch 1-5 and a butterfly valve 1-3, the natural cooling pump unit 7 comprises a natural cooling centrifugal water pump 7-1, a Y-shaped filter 6-2 and a check valve 6-3, the outdoor mechanical refrigeration unit 2 comprises an outdoor air cooling water chilling unit 2-1, a connecting hose 2-2, a pressure gauge 1-2, a thermometer 1-4, a flow switch 1-5 and a butterfly valve 1-3, the mechanical refrigeration pump unit 6 comprises a mechanical refrigeration centrifugal water pump 6-1, a Y-shaped filter 6-2 and a check valve 6-3, the outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 adopt a parallel refrigeration dual-cooling system, and the outdoor natural cooling unit 1 and the outdoor mechanical refrigeration unit 2 are relatively independent. The outdoor natural cooling unit 1 is also provided with a pressure sensor 4, a temperature sensor 5, a natural cooling centrifugal pump water outlet valve 18, a chip heat dissipation cold quantity distribution heat exchanger water inlet valve 15, a chip heat dissipation cold quantity distribution heat exchanger water outlet valve 12 and a natural cooling unit water inlet valve 11 on the pipeline, the outdoor mechanical cooling unit 2 is also provided with a mechanical refrigeration centrifugal pump water outlet valve 19, a server heat dissipation cold quantity distribution heat exchanger water inlet valve 17, a server heat dissipation cold quantity distribution heat exchanger water outlet valve 14 and a mechanical cooling unit water inlet valve 20 on the pipeline, a cold quantity distribution heat exchanger water outlet bypass valve 13 and a cold quantity distribution heat exchanger water inlet bypass valve 16 are arranged between the two pipelines, and the cold quantity distribution heat exchanger water outlet bypass valve 13 and the cold quantity distribution heat exchanger water inlet bypass valve 16 are communicated with the two pipelines.
The outdoor natural cooling unit 1 carries cooling water to the chip cooling capacity distribution heat exchanger 10 through cooling in the natural air cooling heat exchanger 1-1 under the action of the natural cooling pump unit 7, the cooling water absorbs heat through heat exchange, and carries the cooling water back to the natural air cooling heat exchanger 1-1 under the action of the natural cooling pump unit 7 to realize cooling of the cooling water.
The indoor heat pipe radiating unit 9 comprises a CPU chip micro heat pipe radiating unit and a server backboard heat pipe radiating unit, the CPU chip micro heat pipe radiating unit comprises a CPU micro heat pipe stop valve 9-2, a CPU micro heat pipe radiating part 9-3, a CPU micro heat pipe capillary 9-4 and a CPU micro heat pipe heat absorbing part 9-5, one end of the CPU micro heat pipe heat absorbing part 9-5 is directly contacted with a server CPU chip for heat transfer, the other end of the CPU micro heat pipe heat absorbing part is in heat exchange with a gravity heat pipe circulating system, the heat flow density of the micro heat pipe radiating device is higher than that of air cooling in an efficient processing mode, through efficient micro heat pipe heat exchange, circulating water can be prevented from directly entering the inside of a server, and the possibility that the server is damaged due to leakage of the circulating water system is eliminated.
The CPU micro heat pipe heat absorption part 9-5 directly contacts with the server CPU chip to absorb heat through the base, wherein a capillary heat pipe heat absorption end tightly fixed inside is arranged; the heat dissipation part of the CPU micro heat pipe heat dissipation part 9-3 consists of a heat dissipation end of the capillary heat pipe and a cooling cavity body in which the heat dissipation end of the capillary heat pipe is arranged, and a runner groove for gravity heat pipe coolant to flow, an inlet and an outlet of the gravity heat pipe coolant are arranged in the cooling cavity body.
A refrigerant is filled in the CPU micro heat pipe capillary 9-4, the CPU micro heat pipe capillary is in a gas-liquid two-phase mixed state at normal temperature, a heat absorption part 9-5 of the CPU micro heat pipe at one end is directly contacted with a CPU chip of a server to absorb heat, heat exchange is carried out through a refrigerant circulating system in the capillary heat pipe, and heat is taken to a heat dissipation part 9-3 of a CPU micro heat pipe radiator, namely, a third-stage circulation; the heat of the CPU micro heat pipe radiating part 9-3 is conducted to the chip radiating cold quantity distribution heat exchanger 10 through the refrigerant in the gravity heat pipe, and the second stage circulation is realized; the chip heat dissipation cold energy is distributed to the heat at the water side of the heat exchanger 10, and is brought to the outdoor through cooling water to be dissipated to the outdoor through the natural cooling unit 1, which is a first-stage circulation process.
In the mechanical air-cooled condenser in the outdoor mechanical refrigeration unit 2, heat is directly expanded and exchanged through a compressor, heat is extracted from the mechanical refrigeration unit through the phase change of a refrigerant in the outdoor mechanical refrigeration unit 2, and the cold energy is carried to the server heat dissipation cold energy distribution heat exchanger 8. In high-temperature seasons, chilled water provided by a water chilling unit is used, and heat exchange is carried out through a server heat dissipation and cooling capacity distribution heat exchanger 8; in transition seasons and winter, by adjusting the cold distribution heat exchanger water outlet bypass valve 13 and the cold distribution heat exchanger water inlet bypass valve 16, cooling water provided by a natural cooling unit can be fully utilized as a supplementary cold source of chilled water of a water chilling unit, heat is taken away through the server heat dissipation cold distribution heat exchanger 8, a natural environment cold source is fully utilized, mechanical refrigeration power consumption is greatly reduced, the PUE value of a data center is effectively improved, and energy utilization efficiency is improved, and the method is mechanical refrigeration first-stage circulation.
The server backboard heat pipe evaporator 9-1 transfers the heat outside the server CPU chip component to the server heat dissipation and cold distribution heat exchanger 8 under the action of the gravity heat pipe for high-efficiency heat transfer, which is a second-stage circulation process.
As shown in fig. 2, a schematic plan view of a server heat dissipation system combining a server CPU chip micro heat pipe and a server backplane heat pipe is shown, according to the requirement of a machine room arrangement structure, a server heat dissipation cold distribution heat exchanger 8 and a chip heat dissipation cold distribution heat exchanger 10 are both arranged outside the machine room, an outdoor mechanical refrigeration unit 2 capable of utilizing a natural cold source corresponds to the server heat dissipation cold distribution heat exchanger 8 and a server backplane heat pipe evaporator 9-1, an outdoor natural air cooling unit 1 corresponds to the chip heat dissipation cold distribution heat exchanger 10 and a CPU micro heat pipe radiator 9-3, and the two sets of cold distribution heat exchangers form two sets of systems which are relatively independent from each other, so as to improve the utilization efficiency of cold loads.
The micro heat pipe heat dissipation unit of the server CPU chip directly contacts the server CPU chip, and directly dissipates heat to the high-temperature chip by utilizing the heat transfer effect of the capillary heat pipe; the server backboard heat pipe radiating unit is arranged on the server backboard and efficiently discharges a small part of residual heat after the micro heat pipes are radiated.
The bottom of the server backboard heat pipe evaporator 9-1 is provided with a condensed water accumulation disc 9-7 and a condensed water drain pipe 9-8, the condensed water drain pipe 9-8 is communicated with the condensed water accumulation disc 9-7, and a water leakage sensor is arranged below the server backboard heat pipe evaporator 9-1.
The server backboard heat pipe heat dissipation unit directly dissipates heat generated by components except a server CPU chip by arranging the circulating fan of the server backboard heat pipe radiator, and effectively improves heat exchange efficiency. According to different implementation modes of the system, the system ensures the safety of the system and the stability of the system operation by arranging related instruments and meters and related pressure storage equipment
The micro heat pipe heat exchange part is adopted between the CPU chip of the server and the micro heat pipe heat exchange device for heat dissipation, circulating water can be prevented from directly entering the inside of the server, the possibility of server damage caused by circulating water system leakage is eliminated, and safety performance is improved.
The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A system capable of simultaneously realizing heat dissipation of a CPU chip and a server is characterized by comprising an outdoor natural cooling unit (1) and an outdoor mechanical refrigeration unit (2), wherein the outdoor natural cooling unit (1) and the outdoor mechanical refrigeration unit (2) are sequentially connected with a voltage stabilizing unit (3), a pump set unit and a cold quantity distribution heat exchange unit, the cold quantity distribution heat exchange unit is respectively connected with the corresponding outdoor natural cooling unit (1) and the outdoor mechanical refrigeration unit (2) to form a loop respectively, the cold quantity distribution heat exchange unit is connected with an indoor heat pipe heat dissipation unit (9), the indoor heat pipe heat dissipation unit comprises a CPU chip micro heat pipe heat dissipation unit and a server backboard heat pipe heat dissipation unit, the CPU chip micro heat pipe heat dissipation unit is connected with the cold quantity distribution heat exchange unit connected with the outdoor natural cooling unit (1), the server backboard heat pipe heat dissipation unit is connected with the cold quantity distribution heat exchange unit connected with the outdoor mechanical refrigeration unit (2), and the CPU chip micro heat pipe heat dissipation unit is in contact with the CPU chip in the server and absorbs and transfers the heat quantity generated by the CPU chip to the cold quantity distribution heat exchange unit, and the server backboard heat dissipation unit is in contact with a heat dissipation port of the server;
a gravity heat pipe is arranged between the CPU chip micro heat pipe radiating unit and the corresponding cold quantity distribution heat exchange unit, and the gravity heat pipe is simultaneously connected with the CPU chip micro heat pipe radiating unit and the corresponding cold quantity distribution heat exchange unit;
the CPU chip micro heat pipe radiating unit comprises a CPU micro heat pipe radiating part (9-3), a CPU micro heat pipe capillary tube (9-4) and a CPU micro heat pipe heat absorption part (9-5) which are sequentially communicated, the CPU micro heat pipe heat absorption part (9-5) is in contact with a CPU chip in a server and absorbs heat generated by the CPU chip, and the CPU micro heat pipe radiating part (9-3) is connected with the gravity heat pipe;
a gravity heat pipe is arranged between the server backboard heat pipe radiating unit and the corresponding cold energy distribution heat exchange unit, and the gravity heat pipe is simultaneously connected with the server backboard heat pipe radiating unit and the corresponding cold energy distribution heat exchange unit;
the server backboard heat pipe radiating unit comprises a server backboard heat pipe evaporator (9-1), and the server backboard heat pipe evaporator (9-1) is arranged at a radiating port of the server and connected with the gravity heat pipe.
2. The system for simultaneously realizing heat dissipation of the CPU chip and the server as claimed in claim 1, wherein the CPU micro heat pipe heat absorption part (9-5) is connected with a base, and the base is in contact with the CPU chip in the server; the CPU micro heat pipe heat dissipation part (9-3) comprises a heat dissipation end of the capillary heat pipe and a cooling cavity, the heat dissipation end of the capillary heat pipe is arranged in the cooling cavity, and a flow channel groove for gravity heat pipe coolant to flow and an inlet and an outlet of the gravity heat pipe coolant are arranged in the cooling cavity.
3. The system for simultaneously realizing heat dissipation of the CPU chip and the server as claimed in claim 1, wherein a condensed water collecting tray (9-7) and a condensed water draining pipe (9-8) are provided at the bottom of the server backplane heat pipe evaporator (9-1), the condensed water draining pipe (9-8) is communicated with the condensed water collecting tray (9-7), and a water leakage sensor is disposed below the server backplane heat pipe evaporator (9-1).
4. The system for simultaneously realizing heat dissipation of the CPU chip and the server according to any one of claims 1 to 3, further comprising a pressure sensor (4), a flow sensor and a temperature sensor (5), wherein the pressure sensor (4), the flow sensor and the temperature sensor (5) are communicated with a pipeline.
5. The system for simultaneously realizing heat dissipation of CPU chips and servers as claimed in any one of claims 1 to 3, wherein the outdoor natural cooling unit (1) is an air-cooled heat exchanger or a cooling tower.
6. The system capable of simultaneously realizing heat dissipation of the CPU chip and the server according to any one of claims 1 to 3, wherein the refrigeration capacity distribution heat exchange unit is a plate heat exchanger or a shell-and-tube heat exchanger.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710595312.5A CN107182191B (en) | 2017-07-20 | 2017-07-20 | System capable of simultaneously realizing heat dissipation of CPU chip and server |
| PCT/CN2018/089601 WO2019015407A1 (en) | 2017-07-20 | 2018-06-01 | System for simultaneously realizing heat dissipation of cpu chip and server |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710595312.5A CN107182191B (en) | 2017-07-20 | 2017-07-20 | System capable of simultaneously realizing heat dissipation of CPU chip and server |
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| CN107182191A CN107182191A (en) | 2017-09-19 |
| CN107182191B true CN107182191B (en) | 2023-04-18 |
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| WO (1) | WO2019015407A1 (en) |
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| CN107182190B (en) * | 2017-07-20 | 2019-04-30 | 四川斯普信信息技术有限公司 | A kind of system for being exclusively used in radiating to server |
| CN107182191B (en) * | 2017-07-20 | 2023-04-18 | 四川斯普信信息技术有限公司 | System capable of simultaneously realizing heat dissipation of CPU chip and server |
| CN108184322B (en) * | 2018-01-22 | 2023-08-29 | 南京佳力图机房环境技术股份有限公司 | VRV (virtual router v) machine room integrated heat dissipation system based on heat pipe and control method thereof |
| CN109588016B (en) * | 2018-12-25 | 2020-12-15 | 北京百度网讯科技有限公司 | Data center and cooling system thereof |
| CN111278262B (en) * | 2020-03-18 | 2024-01-30 | 四川澄观节能环保科技有限公司 | Server radiating system with combination of gravity type heat pipe and heat pipe backboard of server chip |
| CN113677159B (en) * | 2021-08-23 | 2023-09-19 | 联想长风科技(北京)有限公司 | Water-cooling and air-cooling compatible heat dissipation device |
| CN114390859B (en) * | 2021-12-26 | 2023-11-03 | 苏州浪潮智能科技有限公司 | Liquid cooling server cabinet system and liquid cooling server cabinet |
| CN114562809A (en) * | 2022-03-18 | 2022-05-31 | 广东迅能环保科技有限公司 | Be applied to backplate energy-saving equipment in big space |
| CN117295314B (en) * | 2023-10-13 | 2024-04-26 | 惠州瑞德新材料科技股份有限公司 | Heat dissipation system of server room |
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| CN107182191A (en) | 2017-09-19 |
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