JP2013008888A - Server rack cooling apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a server rack cooling apparatus with high energy-saving performance which comprises both an air cooling part and a liquid cooling part inside the apparatus.SOLUTION: Exhaust air from a rack is cooled by exchanging heat with coolant A when it passes over the surface of a group of heat exchange pipes 2c in an air cooling part 2 of a rack cooling apparatus 1. Meanwhile, the coolant A having been liquefied by coolant B in a heat exchanger 4 descends with gravity in a going-side header 2a and then branches into each of the heat exchange pipes 2c. While flowing down inside the heat exchange pipes 2c, the coolant A cools high-temperature exhaust air by exchanging heat with it. The coolant A itself vaporizes and becomes coolant steam to be merged into a returning-side header 2b. Then, the coolant A ascends in the returning-side header 2b and returns to the heat exchanger 4 so that it dissipates heat to the coolant B. Further, part of the coolant A flowing from the going-side header 2a into a liquid cooling part 3 via branch piping 3a is guided to a heat absorption part 3b which comes into contact with a high-temperature heat generation part 7a. Then, the coolant A vaporizes when it cools the high-temperature heat generation part 7a to be merged into the returning-side header 2b.

Description

  The present invention relates to a server rack cooling device, and more particularly to a server rack cooling device having both an air cooling part and a liquid cooling part in the apparatus and excellent in energy saving.

Conventionally, in an information communication machine room (data center), an ICT device is generally stored in a server rack. Server racks often take in cool air from the front and exhaust from the top or back, and each rack is arranged in a horizontal row in the same direction. A plurality of such rack rows are arranged in the machine room. Cooling in the ICT apparatus is performed by supplying cool air to the vicinity of the rack by the base air conditioner 8 and introducing the cool air into the apparatus by a cooling fan included in each ICT apparatus.
In recent years, with the advancement of ICT in society, information communication devices (ICT devices) are rapidly increasing in speed, capacity and density, and there is an increase in heat generation and uneven distribution of heat generation. The temperature environment is getting worse. In order to improve this, it is necessary to increase the amount of cool air introduced, but the amount of heat released through the air is limited in its physical properties (such as heat transfer coefficient). Moreover, in order to dissipate a high calorific value, it is necessary to increase the heat transfer area of the heat dissipating fins, and the installation space for the heat dissipating fins is also an issue. Further, since it is necessary to increase the amount of blown air, increasing the power of the blower is also a problem. For this reason, the base air conditioning system that uniformly air-conditions the entire room is not enough, and there are cases where air conditioners (task air conditioners) are installed at high heat generation points in the rack row, but this is also appropriate There are many cases that can not support.

  In order to solve such a problem, a technique using a liquid cooling method in which a heat recovery and cooling device is incorporated in each server rack using a refrigerant has been proposed (for example, see Patent Document 1). FIG. 11 shows a server rack 100 according to this system, in which a cooling device 102 that forms a refrigeration cycle is accommodated in a main body 101, and an evaporator 102a that is a vaporizing section thereof is arranged in the vertical direction of the main body. In the server module 103, the heat generated in the heat generating portion 103a is conveyed to the heat radiating portion 103c via the coolant circulated by the pump 103b, and is brought into close contact with the evaporator 102a and radiated to the refrigerant. According to this method, local waste heat treatment is possible, and it can be said that heat treatment is efficient inside the server rack.

JP 2004-363308 A

However, the liquid cooling method has the following problems.
Among the components in the ICT device, there are some devices that are necessary and appropriate to be cooled by air due to the nature of electrical components. Considering this, it is necessary to provide two types of air conditioning facilities: liquid cooling facilities and air cooling facilities. . Moreover, since it cools directly by contacting the components, the influence at the time of failure or leakage of the encapsulated liquid is enormous. In addition, there is a problem that the high-temperature exhaust of the liquid cooling equipment may adversely affect the adjacent rack. Furthermore, since the heat absorption part is arranged at the position of the component, there is a problem that the facility needs to be updated every time the ICT device is replaced.

The present invention is to solve such a problem,
In cooling the server rack that houses the ICT device, it contributes to energy savings, and it is possible to select an appropriate cooling method for each element / part that constitutes the ICT device, and flexibly supports the replacement (installation or removal) of the ICT device. It is possible to provide a server rack cooling device that is possible and that can reduce the risk when a refrigerant system fails.

The gist of the present invention is as follows. That is, the server rack cooling device according to the present invention is:
(1) A server rack cooling device for cooling a server rack accommodated in a space to be cooled and sucking in cool air supplied into a room and exhausting high-temperature air,
An air cooling unit that is disposed near or inside the outer surface of the server rack and cools intake air or exhaust, and a liquid that is disposed in the server rack and directly cools the high-temperature heating element of the ICT equipment stored in the rack. A cooling unit, and a heat exchanger disposed above the air cooling unit,
The air-cooling section includes a forward side pipe configured to allow the first refrigerant to pass through the pipe, a return side pipe, and one or more heat exchange pipes disposed between the forward side pipe and the return side pipe. With
The liquid cooling section includes a refrigerant circulation section that branches from the outgoing pipe and joins the return pipe, and a heat absorption section that absorbs heat from the high-temperature heating element by heat exchange with the first refrigerant flowing in the refrigerant circulation section, With
The first cooling medium is configured to flow in a natural circulation manner between the air cooling unit, the liquid cooling unit, and the heat exchanger, and the exhaust gas recovered through the first refrigerant in the heat exchanger. The heat is dissipated out of the system through the second refrigerant.

  In the present invention, the “natural circulation system” means a means for conveying heat without power using a specific gravity difference between a refrigerant liquid and steam by installing a condenser at a position higher than the evaporator. As the refrigerant, a low boiling point medium such as chlorofluorocarbon, CO2, hydrocarbon, and water can be used. Further, as a means for radiating heat to the outside through the second refrigerant in the heat exchanger section, it is possible to circulate the cooling water or to evaporate the refrigerant as an evaporator of the heat pump system.

(2) The above invention is characterized in that it further comprises a heat transfer means for connecting the refrigerant circulation part of the liquid cooling part and the heat absorption part, and the heat transfer means is of a refrigerant natural circulation system.

(3) In the above invention, the heat transfer means is a heat pipe.

(4) In each of the above inventions, the air cooling unit and the heat exchanger are integrally provided, and are configured to be detachable at a connection portion between the air cooling unit and the refrigerant circulation unit.

(5) A server rack cooling device for cooling a server rack accommodated in a space to be cooled and sucking in cool air supplied indoors and exhausting high-temperature air,
An air cooling unit that is disposed close to or inside the outer surface of the server rack and cools intake air or exhaust, and a heat exchanger that is disposed above the air cooling unit,
The air-cooling section includes a forward side pipe configured to allow the first refrigerant to pass through the pipe, a return side pipe, and one or more heat exchange pipes disposed between the forward side pipe and the return side pipe. With
Between the air cooling unit and the heat exchanger, a first refrigerant is configured to flow by a natural circulation method, and in the heat exchanger, waste heat recovered via the first refrigerant is It is characterized in that it is configured to radiate heat outside the system through the refrigerant.

According to each of the above-described inventions, the adoption of the natural circulation system (including the heat pipe system) eliminates the need for power for circulating the refrigerant, thereby reducing power consumption. Furthermore, since no high-pressure liquid is allowed to flow through the ICT device, there is an effect that damage can be minimized even in the event of a leak.
In addition, an optimum cooling method can be added and selected for each component / part of the ICT device, and the energy required for cooling can be minimized.

In addition, since an air cooling unit and a liquid cooling unit are provided in one apparatus, there is no need to separately construct two types of cooling systems, and the cost and installation space can be reduced.
In addition, since the elements and parts of the ICT device are directly cooled in the liquid cooling section, the refrigerant temperature can be set high. For this reason, there is an effect that the operating temperature of the refrigerant as the cold heat source can be raised, and the operating efficiency of the refrigerator can be improved.

  Furthermore, since the operating temperature of the refrigerant can be set higher, in a system that uses outside air cooling such as free cooling as a cooling source, it is possible to extend the operating time using outside air and reduce year-round running costs. There is an effect.

Furthermore, since the refrigerant operating temperature of the liquid cooling part can be set higher than that of the air cooling part, the refrigerant flow path can be set after passing the air cooling part (the refrigerant of the air cooling part and the liquid cooling part is allowed to flow in a cascade). Thereby, compared with the case where it flows in parallel, the refrigerant | coolant circulation amount required can be reduced, the motive power required for refrigerant | coolant circulation can be reduced, and it contributes to energy saving.
Further, in the invention in which the connection between the liquid cooling unit and the air cooling unit is detachable by the coupling connection mechanism, it is usually easy to cope with the replacement (installation or removal) of the ICT device that is performed in a short cycle. There is an effect of becoming.

It is a figure which shows the whole structure (front) of the server rack cooling device 1 which concerns on 1st embodiment. It is a figure which shows the structure of the same side cross section. 3 is a diagram illustrating a detailed configuration of a liquid cooling unit 3. FIG. It is a figure which shows 1 A of machine room air conditioning systems using the server rack cooling device. It is a figure which shows the server rack cooling device 30 which concerns on 2nd embodiment. 3 is a diagram illustrating a detailed configuration of a liquid cooling unit 31 of the server rack cooling device 30. FIG. It is a figure showing machine room air-conditioning system 40A concerning a third embodiment. It is a figure showing machine room air-conditioning system 50A concerning a 4th embodiment. It is a figure which shows the whole structure (side cross section) of the server rack cooling device 60 which concerns on 5th embodiment. It is a figure which shows the same plane cross section. It is a figure which shows the conventional server rack cooling device.

  Hereinafter, an embodiment of a server rack cooling device according to the present invention will be described in more detail with reference to FIGS. In order to avoid redundant description, the same components are denoted by the same reference numerals in the respective drawings. Needless to say, the scope of the present invention is described in the claims and is not limited to the following embodiments.

(First embodiment)
Referring to FIGS. 1 and 4, a server rack cooling device (hereinafter sometimes abbreviated as “rack cooling device”) 1 according to this embodiment includes a plurality of pieces housed in an information communication machine room (data center) 5. It is an apparatus that is attached to the back side of the server rack 6 and cools the high-temperature exhaust discharged from the server rack 6 by a refrigerant natural circulation system. The rack cooling device 1 is installed in the machine room air conditioning system 1A together with the base air conditioner 8 as will be described later.

  The server rack cooling device 1 includes an air cooling unit 2 disposed on the exhaust surface of the server rack 6 and a high heat generating unit 7a (for example, a CPU, a transformer, etc.) inside an in-rack ICT device (hereinafter sometimes abbreviated as a server). A liquid cooling unit 3 for direct cooling and a heat exchanger 4 on the upper part of the air cooling unit 2 are provided as main components.

  The refrigerant system of the server rack cooling device 1 includes a low-pressure refrigerant A system (first refrigerant in the claims) that employs a natural refrigerant circulation system, and a refrigerant that recovers exhaust heat by supplying cold heat from a cold heat source 9 outside the system. It consists of two systems of B system (the 2nd refrigerant | coolant in a claim). The refrigerant A system includes a heat exchanger 4 that receives cold air from the air cooling unit 2, the liquid cooling unit 3, and the refrigerant B system. The refrigerant B system includes an outdoor unit 9, a heat exchanger 4 that recovers exhaust heat from the refrigerant A system, and circulation circuits 9a and 9b. In the present embodiment, a direct expansion air cooling method is assumed as the refrigerant B system, but not limited to this, a water cooling method can also be adopted.

  Referring to FIGS. 2 and 3, the air-cooling unit 2 is arranged in the horizontal or vertical direction between the pipes on the forward side pipe (header part) 2a and the return side pipe (header part) 2b arranged vertically at both ends. One or a plurality of heat exchange pipes 2c arranged and liquid cooling part connection ports 2d and 2e provided at predetermined positions of both pipes as necessary and having a coupling for connection at the tip are mainly used. It is provided as a configuration. The refrigerant A flows through the pipes 2a and 2b and the heat exchange pipe 2c. Each heat exchange pipe 2c is constituted by a finned pipe when heat exchange is promoted, and an adjusting means (not shown) (for example, a coil structure) for adjusting the pipe resistance is taken in order to make the refrigerant passage amount uniform. Yes. The heat exchanging pipe 2c may be provided with a gentle inclination for promoting the flow of the refrigerant or may be installed vertically.

  The liquid cooling unit 3 includes a refrigerant circulation unit 3e mainly composed of a branch pipe 3a that branches from the forward side pipe 2a and joins to the return side pipe 2b as necessary, and a high heat generating part 7a in the path of the branch pipe 3a. And an endothermic part 3b that directly cools by contacting. The end portions 3c and 3d of the branch pipe 3a and the liquid cooling portion connection ports 2d and 2e of both headers are provided with connection coupling mechanisms 2f and 2g (for example, flare connection) and are configured to be detachable. Yes. In addition, about the server which does not require liquid cooling (for example, refer the lowest server of FIG. 2), the branch piping 3a is not connected but the liquid cooling part connection port 2h can be closed. The forward side pipe 2a and the return side pipe 2b are connected to the pipes 9a and 9b, respectively, as will be described later.

Next, an air conditioning system of the machine room 5 in which the rack cooling device 1 is accommodated will be described with reference to FIG. The machine room air conditioning system 1A according to the present embodiment includes a base air conditioner 8 as ambient air conditioning and a plurality of server rack cooling devices 1 as local air conditioning as cold air supply sources. The interior of the machine room 5 is partitioned into three spaces, an indoor space 5a, a ceiling space 5b, and a double floor space 5c, by a floor panel 5d and a ceiling panel 5e.
In the indoor space 5a, a plurality of server racks 6 are accommodated in a rack row 6b. The inside of the server rack 6 is divided into a plurality of stages, and a server 7 is stored in each stage. Each server 7 is provided with a cooling fan (not shown). The entire rack is configured to suck in cool air from the front, cool the inside of the apparatus, and exhaust hot air from the back. With this configuration, a cold aisle 5g is formed on the front side of the rack row 6b, and a hot aisle 5h is formed on the back side.

  The air conditioner 8 includes an indoor unit including an evaporator 8a and a blower 8b, and an outdoor unit (all not shown) mainly including a compressor and a condenser connected to the evaporator 8a by refrigerant piping. Yes. The air conditioner 8 cools the room air introduced into the machine by the cold generated in the evaporator 8a, and supplies the air into the machine room 5 by the blower 8b.

With the above configuration, the room and the server 7 in the machine room 5 are cooled as follows. The room air introduced into the air conditioner 8 is cooled in the evaporator 8a and sent to the double floor space 5c, and is further supplied to the cold aisle 5g through the plurality of outlets 5f provided in the floor panel 5d. The cool air is introduced from the front side of each server rack 6, and after cooling the server 7 in the rack, it becomes high-temperature exhaust and is discharged from the back side to the hot aisle 5 h. The rack exhaust is cooled by heat exchange with the refrigerant A when passing through the surface of the heat exchange pipe 2c of the air cooling unit 2 of the rack cooling device 1, and the refrigerant A becomes vapor.
On the other hand, the refrigerant A evaporated by the refrigerant B in the heat exchanger 4 is liquefied and gravity drops in the outgoing pipe 2a and returns to the heat exchange pipe 2c again. While flowing down the heat exchanging pipe 2c, it is cooled by exchanging heat with the high-temperature exhaust gas, and evaporates itself to become refrigerant vapor again, rises through the return side pipe 2b, and heat exchanger 4 Then, the heat is radiated to the refrigerant B here. Further, if necessary, a part of the refrigerant A flowing into the liquid cooling unit 3 from the outgoing side pipe 2a through the branch pipe 3a is led to the heat absorbing unit 3b in contact with the high heat generating unit 7a to cool the high heat generating unit 7a. When evaporating, it evaporates and returns to the return side pipe 2b.

As described above, by installing the rack cooling device 1 in the vicinity of the exhaust surface of the server rack 6, the exhaust temperature can be lowered, which reduces the load on the base air conditioner 8 and allows the base air conditioning equipment to be downsized. Become.
In this embodiment, an example of air conditioning by a combination of (base air conditioner + rack cooling device) is shown. However, a combination of (task air conditioner + rack cooling device) by arranging task air conditioners in the rack row. It can also be set as the aspect air-conditioned by. Further, a combination of (base air conditioner + task air conditioner + rack cooling device) may be employed. Furthermore, it can also be set as the air-conditioning aspect by a rack cooling device single-piece | unit.

  In this embodiment, the rack cooling device is installed on the rear side of the server rack. However, the present invention is not limited to this. For example, for an upper exhaust type server rack, the rack cooling device is installed near the outside of the exhaust surface. It can be set as the aspect which attaches a rack cooling device.

  Moreover, although the example which cools a rack by combining an air cooling part and a liquid cooling part was shown in this embodiment, it can also be set as the aspect which cools a rack only by an air cooling part, without using a liquid cooling part.

(Second embodiment)
Next, another embodiment of the present invention will be described with reference to FIGS.
The server rack cooling device 30 according to the present embodiment is different from the server rack cooling device 1 described above in that natural circulation in which a refrigerant flows as a heat exchange material between the refrigerant circulation unit 3e and the heat absorption unit 3b of the liquid cooling unit 31. That is, the system (heat pipe 32 as an example) is used. The configuration of the air cooling unit 2 is the same as that of the rack cooling device 1. The liquid cooling unit 31 includes a pipe 33 connected to the return side pipe 2a and the return side pipe 2b, and a heat pipe that absorbs heat from the high heat generation part 7a in the evaporation part 32a and dissipates heat to the refrigerant in the connection pipe 33 in the condensation part 32b. 32. The ends 33a and 33b of the connection pipe 33 are detachably connected by the liquid cooling part connection ports 2d and 2e of the both pipes and the coupling mechanisms 2f and 2d. If the connection is determined in advance, a fixed type may be used.
Inside the heat pipe 32, a working fluid having such characteristics that it absorbs heat in the evaporation section 32a to be in a gas phase state and dissipates heat in the condensation section 32b to be in a liquid phase state is enclosed. As the working fluid, a low boiling point medium such as water, chlorofluorocarbon, CO 2, or hydrocarbon can be used.

With such a configuration, the working fluid in a gas phase state inside the condensing unit 32 b is condensed by exchanging heat with the refrigerant guided to the condensing unit 32 b via the connection pipe 33. The condensed working fluid liquid flows down in the pipe and reaches the evaporation part 32a, where it is cooled by exchanging heat with the high heat generating part 7a, and the working fluid itself in the evaporation part 32a evaporates and rises in the pipe. To return to the condensing unit 32b. By repeating the above behavior, the high heat generating portion in the server is cooled. A connecting member is used for the connecting pipe 33 in order to easily and reliably connect the condensing part 32b (not shown).
The other components in the server are cooled by the base air conditioner 8 and the air cooling unit 2 of the rack cooling device 30 as in the above embodiment.

(Third embodiment)
Next, another embodiment of the present invention will be described with reference to FIG.
The configuration of the machine room air conditioning system 40A according to the present embodiment is different from the air conditioning system 1A according to the first embodiment described above in that the base air conditioner 8 is not provided. Therefore, each server rack 6 is cooled only by the server rack cooling device 1. Also, the indoor air circulation is performed by the blower 41. The configuration itself of the rack cooling device 1 is the same as that of the first embodiment.
Further, the cooling mode of the server rack 6 in the air conditioning system 40A is the same as that of the first embodiment including the cooling of the high heat generation portion by the liquid cooling portion 3 that is performed as necessary, and thus the redundant description is omitted. .

(Fourth embodiment)
Next, another embodiment of the present invention will be described with reference to FIG. The configuration of the machine room air conditioning system 50A according to the present embodiment is different from the first embodiment in the arrangement of the server rack cooling device 50. That is, the air cooling unit 51 of the server rack cooling device 50 is disposed on the front surface (intake surface) side, not on the back surface (exhaust surface) side of the server rack 6. Further, the liquid cooling part 52 is branched from the front side and is arranged inside the rack. Other configurations are the same as those of the server rack cooling apparatus 1 including the configuration of the coupling for connection, except for the structural difference for arrangement on the front side of the rack. In addition, since it is the same also about the structure of a refrigerant circulation system, illustration and duplication description are abbreviate | omitted.
With this configuration, the server rack cooling device 1 can further cool the intake air introduced into the rack from the front of the rack, and contributes to reducing the load on the base air conditioner 8.

In the server rack cooling device according to the present embodiment, since it is installed on the front surface, it is possible to easily supply air at a desired temperature into the rack.
In addition, when installing the server in the rack, the server and the cooling device can be connected from the front, and the maintenance space of the rack can be concentrated on the front.

  In this embodiment, an example of an air conditioning system using a combination of (base air conditioner + rack cooling device) is shown. However, as in the first embodiment, task air conditioners are arranged in a rack row, and (task A combination of (air conditioner + rack cooling device) or a combination of (base air conditioner + task air conditioner + rack cooling device) may be employed. Furthermore, it can also be set as the aspect by a rack cooling device single-piece | unit.

(Fifth embodiment)
Furthermore, another embodiment of the present invention will be described with reference to FIGS. The server rack cooling device 60 according to the present embodiment is different from the server rack cooling device 1 and the like in which the air cooling unit is disposed outside the rack in that the entire device excluding the heat exchanger 4 is accommodated inside the rack. Further, the server rack 6 is different in that there is no opening in the front door portion 6c and the rear surface portion 6d, and intake air from the cold aisle 5g is not performed.
The configuration of the server rack cooling device 60 is basically the same as that of the server rack cooling device 1, and includes an air cooling unit 61 and a liquid cooling unit 62 that directly cools the high heat generation unit 7a inside the ICT device in the rack as necessary. Are provided as main components.

The air-cooling section 61 is provided with a forward-side pipe 61a through which the refrigerant A passes, a return-side pipe 61b, one or a plurality of pipes between both pipes, and a finned heat exchange pipe 61c for high performance. . The heat exchange pipe 61c is arranged in a direction perpendicular to the direction of the airflow circulating in the rack.
The liquid cooling unit 62 includes a pipe 62a that extends from both the pipes of the air cooling unit 61, and a heat absorbing part 62b that contacts the high heat generating part 7a in the path of the pipe 62 and directly cools it. . The air cooling unit 61 and the liquid cooling unit 62 are configured to be detachable as necessary by connection coupling mechanisms 61f and 61g similar to those of the server rack cooling device 1.
Since other configurations and the refrigerant circulation system are the same as those of the server rack cooling apparatus 1, illustration and duplication description are omitted.

Next, the cooling mode of the server 7 in the server rack cooling device 60 will be described. The air circulating in the rack is cooled in the air cooling unit 61 by the fan 7 b provided in the server 7 and is sucked into the server 7 as cold air. In this case, since the air cooling unit 61 is arranged in a direction perpendicular to the circulating air, the heat exchange efficiency by the heat exchange pipe 61c can be improved. About the aspect of the direct cooling of the high heat generating part 7a by the liquid cooling part 62, it is the same as that of each above-mentioned embodiment.
In the server rack cooling apparatus according to the present embodiment, since the cooling air is circulated in the rack, the temperature of each rack is not affected by the change in the suction surface air temperature due to the fluctuation of the operation rate of other racks. It has the feature that it is extremely easy to manage.

  The present invention can be widely applied as a cooling device for an ICT device in a server rack regardless of a heat source method, a refrigerant type, an air conditioning method, a building structure, and the like.

1, 20, 30, 40... Server rack cooling device 1A, 20A, 30A, 40A, 50A ... Machine room air conditioning system 2, 20a, 51, 61 ... Air cooling units 2a, 21, 61a ... Outward piping 2b, 22, 61b ... Return piping 2c, 61c ... Heat exchange pipe 2d ... Liquid cooling port 2f, 2g ... Coupling mechanism 3, 20b, 31 ... Liquid cooling part 3a ... branch pipe 3b ... heat absorption part 3e ... refrigerant circulation part 5 ... machine room 6 ... server rack 7 ... ICT device (server)
7a ... High heat generation part 8 ... Base air conditioner 9 ... Refrigerant circulation circuit 32 ... Heat pipe 71 ... Blower

Claims (5)

A server rack cooling device for cooling a server rack accommodated in a space to be cooled and sucking in cool air supplied indoors and exhausting high-temperature air,
An air cooling unit that is disposed close to or inside the outer surface of the server rack and cools intake air or exhaust air,
A liquid cooling unit for directly cooling a high-temperature heating element of an ICT device disposed in a server rack and stored in the rack;
A heat exchanger disposed above the air cooling unit,
The air-cooling section includes a forward side pipe configured to allow the first refrigerant to pass through the pipe, a return side pipe, and one or more heat exchange pipes disposed between the forward side pipe and the return side pipe. With
The liquid cooling section includes a refrigerant circulation section that branches from the outgoing pipe and joins the return pipe, and a heat absorption section that absorbs heat from the high-temperature heating element by heat exchange with the first refrigerant flowing in the refrigerant circulation section, With
The first cooling medium is configured to flow in a natural circulation manner between the air cooling unit, the liquid cooling unit, and the heat exchanger, and
In the heat exchanger, the exhaust heat recovered via the first refrigerant is configured to dissipate outside the system via the second refrigerant.
A server rack cooling device. A heat transfer means for connecting the refrigerant circulation part of the liquid cooling part and the heat absorption part;
The server rack cooling apparatus according to claim 1, wherein the heat transfer means is based on a natural refrigerant circulation system.   The server rack cooling apparatus according to claim 2, wherein the heat transfer means is a heat pipe. The air cooling unit and the heat exchanger are integrally provided, and configured to be detachable at a connection portion between the air cooling unit and the refrigerant circulation unit.
The server rack cooling device according to any one of claims 1 to 3, wherein A server rack cooling device for cooling a server rack accommodated in a space to be cooled and sucking in cool air supplied indoors and exhausting high-temperature air,
An air cooling unit that is disposed close to or inside the outer surface of the server rack and cools intake air or exhaust, and a heat exchanger that is disposed above the air cooling unit,
The air-cooling section includes a forward side pipe configured to allow the first refrigerant to pass through the pipe, a return side pipe, and one or more heat exchange pipes disposed between the forward side pipe and the return side pipe. With
The first refrigerant is configured to flow in a natural circulation manner between the air cooling unit and the heat exchanger, and
In the heat exchanger, the exhaust heat recovered via the first refrigerant is configured to dissipate outside the system via the second refrigerant.
A server rack cooling device.

Images