CN211792613U

CN211792613U - Server chip gravity type heat pipe and heat pipe backboard combined server heat dissipation system and device

Info

Publication number: CN211792613U
Application number: CN202020343248.9U
Authority: CN
Inventors: 朱建斌; 王丁会; 严峰; 王建波; 杨英
Original assignee: Sichuan Chengguan Energy Saving Environmental Protection Technology Co ltd
Current assignee: Sichuan Chengguan Energy Saving Environmental Protection Technology Co ltd
Priority date: 2020-03-18
Filing date: 2020-03-18
Publication date: 2020-10-27
Anticipated expiration: 2030-03-18

Abstract

The utility model relates to a server heat dissipation system and device combining a gravity type heat pipe of a server chip and a heat pipe backboard, which realize the heat dissipation of the server chip level by arranging a gravity type heat pipe chip radiator in a data center; the heat pipe backboard heat dissipation unit is used for auxiliary heat dissipation, so that the space utilization efficiency of the data center is effectively improved, more servers can be arranged, the economic benefit is improved, and the purpose of energy conservation is achieved; the system has the characteristics of high heat exchange efficiency, low thermal resistance, low energy consumption, high heat exchange response speed, high reliability, low noise, long service life and the like; through the combination of the chip-level cooling technology and the outdoor cooling unit, the server chip is directly radiated more reasonably and efficiently, and through the combination of the heat pipe backboard cooling technology and the outdoor freezing unit, other heat sources except the server chip are directly radiated more reasonably and efficiently.

Description

Server chip gravity type heat pipe and heat pipe backboard combined server heat dissipation system and device

Technical Field

The utility model relates to a server cooling system and device that data center computer lab environmental control technical field, especially server chip gravity type heat pipe and heat pipe backplate combine.

Background

China's data centers develop rapidly, the total amount is over 40 thousands, annual power consumption is over 1.5% of the power consumption of the whole society, the data center energy consumption is expected to be equivalent to one year of power generation of three gorges power stations every year, the PUE of most of the data centers is still generally more than 2.2, and the difference is larger than the international advanced level. Data center IT equipment needs to be cooled all weather, and a precise air conditioner is adopted in a machine room for refrigeration generally, so that the environmental control requirement of the data center is met. The energy consumption of the air conditioning unit of the data center accounts for 35% -45% of the total energy consumption of the machine room, which is second to the energy consumption of IT equipment of the data center, so that the PUE value of the data center is high, and the energy efficiency utilization rate is low. The existing cooling mode of a data center is generally that environment is firstly cooled and then equipment is cooled, for example, A, B machine rooms in GB50174-2008 electronic information system machine room design specifications require 23 +/-1 ℃ of ambient temperature, natural cold sources are combined with a water chilling unit cooling technology, a heat pipe radiator close to a heat source is adopted to cool a server, a precise air conditioner can be completely replaced, and a server-level heat dissipation solution is utilized through reasonable airflow organization, so that on one hand, PUE can be effectively reduced, the energy efficiency utilization rate is improved, and on the other hand, the problems of local hot spots and the like caused by unreasonable airflow organization of the precise air conditioning unit can be effectively solved; meanwhile, the complete replacement of the air conditioning unit effectively improves the space utilization rate of the machine room, and more cabinets and servers can be arranged, so that the economic benefit and the land-saving effect can be effectively improved. In actual operation, the main heat dissipation component in the server is a Central Processing Unit (CPU), the heat dissipation capacity of the CPU accounts for about 80% of the total heat dissipation capacity of the server, and structurally, a basic condition is provided for the design of targeted heat dissipation. The temperature of the CPU in operation is generally between 60 and 72 ℃, and if a heat pipe direct cooling mode is adopted, the heat dissipation requirement of the CPU can be met only by 35 to 50 ℃. This temperature is higher than the natural temperature throughout the year in most areas. Therefore, heat transfer medium (cooling water) with the temperature of 35 to 50 ℃ can be prepared all the year round through natural heat conduction, the natural heat dissipation of the chip is realized through the heat pipe, and the heat flow density of the heat pipe heat dissipation device for high-efficiency treatment is far higher than the density which can be achieved through air cooling. The heat dissipation of other components in the server is realized through the air conditioning of the heat pipe back plate. Through the processing mode of the CPU chip heat pipe and the heat pipe back plate or the ceiling heat pipe heat dissipation unit, safe and reliable operation of equipment in a machine room can be guaranteed, natural refrigeration can be fully utilized, heat dissipation power consumption of the machine room is greatly reduced, operating cost of the machine room is saved, the failure rate of a unit is low, and maintenance is simple.

SUMMERY OF THE UTILITY MODEL

The utility model aims at making full use of natural cold source and the water chilling unit with higher energy efficiency ratio, providing a server heat dissipation system and device combining a server chip gravity type heat pipe and a heat pipe backboard, realizing heat dissipation and refrigerant circulation by gravity through a chip gravity type heat pipe radiator, and realizing zero power consumption heat dissipation of the server chip level; through the heat pipe backboard heat dissipation unit, auxiliary heat dissipation and refrigerant circulation are performed by using gravity, and low-power dissipation of heat outside the server chip is realized.

The purpose of the utility model is realized through the following technical scheme:

the utility model discloses an aspect provides a server heat dissipation system that server chip gravity type heat pipe and heat pipe backplate combine, including gravity type heat pipe heat dissipation unit, chip heat dissipation cold volume distribution heat exchanger, heat pipe backplate heat dissipation cold volume distribution heat exchanger and cooling unit;

the cooling unit provides circulating cooling water and chilled water for heat exchange to the chip heat dissipation cold quantity distribution heat exchanger and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger;

the gravity type heat pipe heat dissipation unit comprises a plurality of gravity type heat pipe chip radiators and a plurality of gravity type heat pipe back plate evaporators;

the gravity type heat pipe chip radiator comprises a radiating cavity, a liquid pipe and an air pipe, wherein the position of the air pipe of the gravity type heat pipe chip radiator is higher than that of the liquid pipe, and the radiating cavity of the gravity type heat pipe chip radiator is tightly attached to a server chip; liquid refrigerant of the first system enters the heat dissipation cavity to cool the server chip through the liquid pipe of the gravity type heat pipe chip radiator by the chip heat dissipation cold quantity distribution heat exchanger under the action of gravity, is heated and then is changed into gaseous refrigerant of the first system, returns to the chip heat dissipation cold quantity distribution heat exchanger through the air pipe of the gravity type heat pipe chip radiator to perform heat exchange, performs heat exchange with cold water, and is cooled into liquid refrigerant of the first system;

the gravity type heat pipe back plate evaporator comprises a radiator, a liquid pipe and an air pipe, wherein the position of the air pipe of the gravity type heat pipe back plate evaporator is higher than that of the liquid pipe, and the gravity type heat pipe back plate evaporator is arranged in a heat pipe back plate serving as a back door of the server cabinet; the liquid refrigerant of the second system enters the liquid pipe of the gravity type heat pipe back plate evaporator through the heat pipe back plate heat dissipation cold quantity distribution heat exchanger under the action of gravity, enters the gravity type heat pipe back plate evaporator to cool the air outlet of the server, is heated and then is changed into a gas refrigerant of the second system, returns to the heat pipe back plate heat dissipation cold quantity distribution heat exchanger through the air pipe of the gravity type heat pipe back plate evaporator to perform heat exchange, performs heat exchange with chilled water and is cooled into the liquid refrigerant of the second system.

Further, the liquid refrigerant of the first system and the gaseous refrigerant of the first system are sealed in the chip heat dissipation and cooling capacity distribution heat exchanger, the gravity type heat pipe chip radiator and a passage between the chip heat dissipation and cooling capacity distribution heat exchanger and the gravity type heat pipe chip radiator, and the circulation is carried out by depending on gravity in a passive mode, and the chip heat dissipation and cooling capacity distribution heat exchanger provides the liquid refrigerant of the first system for the heat dissipation cavity of each gravity type heat pipe chip radiator under the action of gravity;

the liquid refrigerant of the second system and the gaseous refrigerant of the second system are sealed in the heat pipe back plate heat dissipation cold quantity distribution heat exchanger, the gravity type heat pipe back plate evaporator and a passage between the heat pipe back plate heat dissipation cold quantity distribution heat exchanger and the gravity type heat pipe back plate evaporator, circulation is carried out by means of gravity, and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger provides the liquid refrigerant of the second system for the heat dissipation cavity of each gravity type heat pipe back plate evaporator under the action of gravity.

Furthermore, the server is arranged in the machine room, the cooling unit is arranged outside the machine room, the chip heat dissipation cold quantity distribution heat exchanger and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger, the cooling water and the chilled water are arranged outside the machine room, and the gravity type chip heat pipe heat dissipation unit and the heat pipe back plate heat dissipation unit are arranged in the machine room.

Further, the system also comprises a main liquid pipe of the first system, a main liquid pipe of the second system and a main liquid pipe of the second system; the chip heat dissipation and refrigeration capacity distribution heat exchanger is internally provided with a circulation cavity of a first system, the upper part of the circulation cavity of the first system is connected to a main air pipe of the first system, and the lower part of the circulation cavity of the first system is connected to a main liquid pipe of the first system; gaseous refrigerant of a first system in the radiating cavity of the gravity type heat pipe chip radiator is discharged to a main air pipe of the first system through an air pipe and then enters a circulating cavity of the first system, the gaseous refrigerant is cooled by cold water in the circulating cavity of the first system and then is converted into liquid refrigerant, the liquid refrigerant flows into a main liquid pipe of the first system, the main liquid pipe of the first system is connected with each radiating cavity of the gravity type heat pipe chip radiator, and the liquid refrigerant in the main liquid pipe of the first system enters the radiating cavity of each gravity type heat pipe chip radiator in a self-adaptive mode under the action of gravity;

the heat pipe back plate heat dissipation and cooling capacity distribution heat exchanger is internally provided with a heat exchanger of a second system, the upper part of a circulation cavity of the second system is connected to a main air pipe of the second system, and the lower part of the heat exchanger of the second system is connected to the main air pipe of the second system; gaseous refrigerant of a second system in the heat dissipation cavity of the gravity type heat pipe backboard evaporator is discharged to a main air pipe of the second system through an air pipe and then enters a circulation cavity of a cold quantity distribution unit of the second system, the circulation cavity of the cold quantity distribution unit of the second system is cooled by chilled water and then is converted into liquid refrigerant, the liquid refrigerant flows into a main liquid pipe of the second system, the main liquid pipe of the second system is connected with each gravity type heat pipe backboard evaporation heat exchanger, and the liquid refrigerant in the main liquid pipe of the second system enters each gravity type heat pipe backboard evaporation heat exchanger in a self-adaptive mode under the action of gravity.

Furthermore, the liquid pipe and the air pipe of the gravity type heat pipe chip radiator are connected with a main liquid pipe of the first system and a main air pipe of the first system through quick connectors, a liquid pipe stop valve is arranged between the liquid pipe of the gravity type heat pipe chip radiator and the main liquid pipe of the first system, and an air pipe stop valve is arranged between the air pipe of the gravity type heat pipe chip radiator and the main air pipe of the first system;

the liquid pipe and the air pipe of the gravity type heat pipe back plate evaporator are connected with a main liquid pipe of a second system and a main air pipe of the second system through quick connectors, a liquid pipe stop valve is arranged between the liquid pipe of the gravity type heat pipe back plate evaporator and the main liquid pipe of the second system, and an air pipe stop valve is arranged between the air pipe of the gravity type heat pipe back plate evaporator and the main air pipe of the second system.

Furthermore, the liquid pipe and the air pipe of the gravity type heat pipe chip radiator are arranged on the same side face of the radiating cavity.

Further, the cooling unit comprises a natural cooling unit and a mechanical refrigeration unit;

the natural cooling unit provides circulating cooling water for the chip heat dissipation cold quantity distribution heat exchanger; the mechanical refrigeration unit provides circulating chilled water for the heat pipe back plate heat dissipation cold energy distribution heat exchanger; under the condition of serial connection, the chip heat dissipation cold energy distribution heat exchanger uses the cold energy of the heat pipe back plate to distribute the chilled water after heat exchange of the heat exchanger in series.

Further, the chip heat dissipation cold quantity distribution heat exchanger and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger adopt a plate type heat exchanger or a shell-and-tube type heat exchanger; the mechanical refrigeration unit is a water chilling unit or a mechanical refrigeration condenser, and the natural cooling unit adopts an air cooling heat exchanger or a cooling tower.

The cooling system further comprises a mechanical refrigeration pump unit and a natural cooling pump unit, wherein circulating cooling water provided by the natural cooling unit enters the chip heat dissipation and cooling capacity distribution heat exchanger under the action of the natural cooling pump unit; circulating chilled water of the mechanical refrigeration unit enters the heat pipe back plate heat dissipation cold quantity distribution heat exchanger and/or the chip heat dissipation cold quantity distribution heat exchanger under the action of the mechanical refrigeration pump unit; the natural cooling unit, the mechanical refrigeration pump unit and the natural cooling pump unit control the supply and return temperatures of cooling water and chilled water through a frequency conversion technology.

Furthermore, the liquid refrigerants of the first system and the second system are substances which absorb and release heat through phase change latent heat and are gaseous substances in natural environment, so that the safety risk of liquid leakage in the machine room is prevented.

The invention provides a server heat dissipation device combining a server chip gravity type heat pipe and a heat pipe backboard, which comprises a plurality of gravity type heat pipe chip radiators, a plurality of gravity type heat pipe backboard evaporators, a main liquid pipe of a first system, a main gas pipe of the first system, a main liquid pipe of a second system and a main gas pipe of the second system;

the main air pipe of the first system and the main liquid pipe of the first system are connected to the chip heat dissipation and cooling capacity distribution heat exchanger; the chip heat dissipation cold quantity distribution heat exchanger is provided with a circulation cavity connected to a main air pipe of a first system and a main liquid pipe of the first system, and the connection position of the main air pipe of the first system is higher than that of the main liquid pipe of the first system;

the gravity type heat pipe chip radiator comprises a heat pipe radiating cavity, a liquid pipe and an air pipe, wherein the position of the air pipe of the gravity type heat pipe chip radiator is higher than that of the liquid pipe, and the radiating cavity of the gravity type heat pipe chip radiator is tightly attached to a server chip; liquid refrigerant of the first system enters the liquid pipe of the gravity type heat pipe chip radiator through the chip heat dissipation cold quantity distribution heat exchanger under the action of gravity, enters the heat dissipation cavity to cool the server chip, is heated and then is changed into gaseous refrigerant of the first system, returns to the chip heat dissipation cold quantity distribution heat exchanger through the air pipe of the gravity type heat pipe chip radiator to perform heat exchange, and is cooled into liquid refrigerant of the first system;

a main air pipe of the second system and a main liquid pipe of the second system are connected to the heat pipe backboard heat dissipation and cooling capacity distribution heat exchanger; the heat pipe backboard heat dissipation cold quantity distribution heat exchanger is provided with a circulation cavity connected to a main air pipe of a second system and a main liquid pipe of the second system, and the connection position of the main air pipe of the second system is higher than that of the main liquid pipe of the second system;

the gravity type heat pipe back plate evaporator comprises a radiator, a liquid pipe and an air pipe, wherein the position of the air pipe of the gravity type heat pipe back plate evaporator is higher than that of the liquid pipe, and the gravity type heat pipe back plate evaporator is arranged in a heat pipe back plate serving as a back door of a server cabinet; the liquid refrigerant of the second system enters the liquid pipe of the gravity type heat pipe back plate evaporator through the heat pipe back plate heat dissipation cold quantity distribution heat exchanger under the action of gravity, enters the gravity type heat pipe back plate evaporator to cool the air outlet of the server, is heated and then is changed into a gas refrigerant of the second system, returns to the heat pipe back plate heat dissipation cold quantity distribution heat exchanger through the air pipe of the gravity type heat pipe back plate evaporator to perform heat exchange, performs heat exchange with chilled water, and is cooled into the liquid refrigerant of the second system.

the liquid refrigerant of the second system and the gaseous refrigerant of the second system are sealed in the heat pipe back plate heat dissipation and cooling capacity distribution heat exchanger, the gravity type heat pipe back plate evaporator and a passage between the heat pipe back plate heat dissipation and cooling capacity distribution heat exchanger and the gravity type heat pipe back plate evaporator, and circulation is carried out by means of gravity in a passive mode, and the heat pipe back plate heat dissipation and cooling capacity distribution heat exchanger provides the liquid refrigerant of the second system for the heat dissipation cavity of each gravity type heat pipe back plate evaporator under the action of gravity.

The utility model discloses following beneficial effect has for prior art:

1. by arranging the server heat dissipation system of the server chip gravity type heat pipe in the data center, the gravity type heat pipe radiator can efficiently process heat flow density which is far larger than that which can be achieved by air cooling, can fully utilize a natural cold source, realize chip-level heat dissipation, reduce thermal resistance, improve the energy efficiency ratio of a refrigeration system, improve the heat exchange response speed of a chip, effectively reduce PUE and improve the utilization efficiency of energy;

2. the gravity type heat pipe chip radiator is arranged in the data center, so that server-level heat radiation is realized, the original conditions of an early cooling environment and a later cooling device are changed, the air flow organization is optimized, and the phenomena of local high temperature and local heat island of a server cabinet caused by uneven air flow are avoided;

3. the server heat dissipation of the server chip gravity type heat pipe is arranged in the data center, so that the temperature of the server chip during operation is high, cooling water with the temperature of 35-50 ℃ can be prepared by an outdoor cooling unit all the year round, the heat dissipation is carried out by utilizing a natural cold source, and the energy consumption is reduced to the maximum extent; meanwhile, the outdoor mechanical refrigeration unit of the heat pipe back plate auxiliary heat dissipation system can fully utilize an outdoor natural cold source according to the outdoor environment temperature, so that the energy consumption is reduced to the maximum extent; the refrigeration capacity distribution heat exchanger circulating water of the server chip heat pipe heat dissipation unit can also use the refrigeration capacity distribution heat exchanger of the heat pipe back plate to exchange heat and then refrigerate water with higher temperature, the refrigeration capacity distribution heat exchanger of the server chip heat pipe heat dissipation unit is connected in series behind the heat pipe back plate heat dissipation refrigeration capacity distribution heat exchanger, and a cold source is effectively utilized;

4. the server heat dissipation system of the server chip gravity type heat pipe is arranged in the data center, chip-level heat dissipation is achieved through the gravity type heat pipe radiator, auxiliary heat dissipation is conducted through the heat pipe back plate heat dissipation unit, the space utilization efficiency of the data center is effectively improved, more servers can be arranged, the economic benefit is effectively improved, and the purpose of energy conservation is achieved;

5. by arranging the server heat dissipation system of the server chip gravity type heat pipe in the data center, cooling water in the server chip heat dissipation cold energy distribution heat exchanger and chilled water in the heat pipe back plate heat dissipation cold energy distribution heat exchanger do not enter a machine room, and the danger of water inlet of the machine room and even a server is completely eradicated;

6. the server heat dissipation system of the server chip gravity type heat pipe is arranged in the data center, heat can be transferred by absorbing and releasing latent heat of phase change of a refrigerant without a compressor and a refrigerant pump, the whole system completely depends on gravity to realize self-adaptive regulation and circulation of the refrigerant, the heat conversion efficiency is very high, redundant parts are reduced, safety and reliability are realized, and a large amount of energy is saved;

7. the server chip heat dissipation system utilizes gravity to perform self-adaptive circulation of a refrigerant in an indoor heat dissipation system within a cold quantity distribution heat exchanger, and the circulation is completely passive and has zero power consumption;

8. the liquid pipe and the air pipe of the gravity type heat pipe chip radiator are arranged on the side surface of the heat exchange cavity, so that the gravity type heat pipe chip radiator is favorable for radiating the chips of high-density servers with the heights of 1U and 2U;

9. the liquid pipe and the air pipe of the gravity type heat pipe chip radiator are connected with the refrigerant pipe by adopting the quick connectors, so that the online quick connection can be realized, and the operation and the maintenance are convenient;

10. the refrigerant in the server heat dissipation of the server chip gravity type heat pipe is a substance which absorbs and releases heat through phase change latent heat, and the refrigerant is gaseous substance in the natural environment, so that the safety risk of liquid leakage (water leakage) in a machine room is prevented.

Drawings

Fig. 1 is a schematic diagram of a server heat dissipation system combining a gravity type heat pipe and a heat pipe back plate of a server chip according to the present invention;

fig. 2 is a schematic diagram of a server heat dissipation system combining a gravity type heat pipe and a heat pipe back plate of a server chip according to the present invention, in which a series-connected cooling capacity distribution heat exchanger is added;

FIG. 3 is a structural diagram of the gravity type heat pipe chip radiator of the present invention;

FIG. 4 is a schematic diagram illustrating the heat dissipation principle of a gravity type heat pipe chip heat sink;

FIG. 5 is a schematic diagram of the heat dissipation principle of the gravity type heat pipe back plate evaporator;

in the figure: 1, a natural cooling unit, 1-1, a natural air cooling heat exchanger, 1-2 pressure gauges, 1-3 butterfly valves, 1-4 thermometers and 1-5 flow switches; 2, a mechanical refrigeration unit, 2-1 a water chilling unit and 2-2 flexible connections; 3, a system voltage stabilizing unit; 4 a pressure sensor; 5 a temperature sensor; 6 mechanical refrigeration pump unit, 6-1 mechanical refrigeration centrifugal water pump, 6-2Y type filter, 6-3 check valve; 7 naturally cooling the pump unit, and 7-1 naturally cooling the centrifugal water pump; 8, a heat pipe backboard heat dissipation cold quantity distribution heat exchanger; 9 gravity type indoor heat pipe heat dissipation unit, 9-1 heat pipe backboard air pipe stop valve, 9-2 heat pipe backboard liquid pipe stop valve, 9-3 server chip heat pipe air pipe stop valve, 9-4 server chip heat pipe liquid pipe stop valve, 9-5 gravity type heat pipe backboard evaporator, 9-6 server chip heat pipe liquid pipe, 9-7 server chip heat pipe air pipe, 9-8 gravity type heat pipe chip radiator, 9-9 cavity, 9-10 pressing plate; 10 chips heat dissipation cold quantity distribution heat exchanger; 11, a water inlet valve of the heat pipe back plate heat dissipation cold energy distribution heat exchanger; 12 chip heat dissipation cold quantity distribution heat exchanger outlet valve; 13 cold energy distribution heat exchanger water outlet bypass valve; 14, distributing heat-dissipating cold quantity of the heat pipe back plate to a water outlet valve of the heat exchanger; 15 chip heat dissipation cold energy distribution heat exchanger water inlet valves; 16 cold energy distribution heat exchanger water inlet bypass valve; 17 the heat dissipation cold energy distribution heat exchanger of the chip is connected with a water inlet valve in series; the 18-chip heat dissipation cold energy distribution heat exchanger is connected with a water outlet valve in series.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

Fig. 1 is a schematic diagram of a server heat dissipation system combining a server chip gravity type heat pipe and a heat pipe back plate, and the server heat dissipation system includes a mechanical refrigeration unit 2, a natural cooling unit 1, a system voltage stabilization unit 3, a pressure sensor 4, a temperature sensor 5, a mechanical refrigeration pump unit 6, a natural cooling pump unit 7, a heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8, a server chip gravity type heat pipe heat dissipation unit 9, a chip heat dissipation cold quantity distribution heat exchanger 10, and the like.

The mechanical refrigeration unit and the natural air cooling unit adopt a parallel refrigeration and cooling double system, and the mechanical refrigeration unit 2 and the natural cooling unit 1 in the system are relatively independent.

The natural cooling unit 1 is arranged outdoors and comprises a natural air cooling heat exchanger 1-1, a pressure gauge 1-2, a butterfly valve 1-3, a thermometer 1-4 and a flow switch 1-5. The natural cooling unit 1 carries cooling capacity to the chip cooling capacity distribution heat exchanger 10 through cooling in the natural air cooling heat exchanger 1-1 under the action of the natural cooling pump unit 7, cooling water absorbs heat through heat exchange, and carries the cooling water back to the natural air cooling heat exchanger 1-1 under the action of the natural cooling pump unit 7 to realize cooling of the cooling water, and natural cooling water circulation realizes water path circulation through the opened valve 15 and the valve 12. The pressure gauge 1-2 is used for detecting the pressure of a water inlet pipe of the natural air-cooled heat exchanger 1-1, the butterfly valve 1-3 is used for controlling the flow of cooling water, the thermometer 1-4 is used for detecting the temperature of the cooling water flowing out of the natural air-cooled heat exchanger 1-1, and the flow switch 1-5 is controlled by the upper computer to control the opening degree of the butterfly valve 1-3. Through the pressure of cooling water flowing into the natural air cooling heat exchanger 1-1 and the monitoring of the temperature and the pressure of outflow water, the natural cooling unit 1 can be effectively monitored and protected through the upper computer.

The natural cooling unit 1 is used for realizing cooling of a data center through the cooling unit by controlling and adjusting the butterfly valve 1-3 and the air-cooled heat exchanger 1-1 under the condition that the outdoor environment temperature is low according to the working condition change of the outdoor environment, so that the utilization of a natural cold source is improved, and the temperature of supply and return water can be changed by adopting a variable frequency fan or a variable frequency water pump along with the further reduction of the outdoor environment.

The natural cooling unit 1 adopts an air-cooled heat exchange device, can be an air-cooled heat exchanger and can be a cooling tower, and the power consumption unit of the natural cooling unit only has a variable frequency fan, and can efficiently provide cold energy by directly utilizing lower ambient temperature.

In a mechanical air-cooled condenser in the mechanical refrigeration unit 2, a water chilling unit 2-1 directly expands and exchanges heat through a compressor, heat is discharged from the mechanical refrigeration unit through refrigerant phase change, chilled water is connected with a water inlet pipe and a water outlet pipe in the water chilling unit 2-1 through a flexible connection 2-2, the chilled water is cooled in the water chilling unit 2-1, and cold is taken into a heat pipe backboard heat dissipation cold distribution heat exchanger 8. A pressure gauge is arranged to detect the pressure of a water inlet pipe of the water chilling unit 2-1, a butterfly valve is used for controlling the flow of chilled water, a thermometer detects the temperature of chilled water flowing out of the water chilling unit 2-1, and a flow switch controls the opening of the butterfly valve under the control of an upper computer. The upper computer can be used for effectively monitoring and protecting the mechanical refrigeration unit 2 by monitoring the pressure of chilled water flowing into the water chilling unit 2-1 and the temperature and pressure of outflow water.

The system pressure stabilizing unit 3 is arranged at the water outlet ends of the natural cooling unit 1 and the mechanical refrigeration unit 2, and is used for stabilizing the pressure of the cooling water and the chilled water.

The mechanical refrigeration pump unit 6 comprises a mechanical refrigeration centrifugal water pump 6-1, a Y-shaped filter 6-2 and a check valve 6-3, chilled water flowing out of the mechanical refrigeration unit 2 is filtered by the Y-shaped filter 6-2, enters the centrifugal water pump 6-1 through the check valve 6-3, and is pumped into the heat pipe back plate heat dissipation cold energy distribution heat exchanger 8 through the centrifugal water pump 6-1 to perform heat exchange.

The natural cooling pump unit 7 comprises a natural cooling centrifugal water pump 7-1, and cooling water flowing out of the natural cooling unit 1 is pumped into the chip heat dissipation and cold distribution heat exchanger 10 through the centrifugal water pump 7-1 to perform heat exchange.

The chip heat dissipation cold distribution heat exchanger 10 is used for realizing heat exchange circulation of the refrigerant of the first system, so that the refrigerant of the gaseous first system is converted into a liquid refrigerant under the cooling of cooling water or chilled water, and the refrigerant of the first system circulates between the server gravity type indoor heat pipe heat dissipation unit 9 and the chip heat dissipation cold distribution heat exchanger 10 through gravity.

The heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 is used for realizing heat exchange circulation of the refrigerant of the second system, so that the refrigerant of the gaseous second system is converted into a liquid refrigerant under the cooling of cooling water or chilled water, and the refrigerant of the second system circulates between the gravity type indoor heat pipe heat dissipation unit 9 and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 through gravity.

The heat pipe backboard heat dissipation cold quantity distribution heat exchanger 8 and the chip heat dissipation cold quantity distribution heat exchanger 10 can be plate type heat exchangers or shell and tube type heat exchangers as an intermediate heat exchange unit in a multistage system, adopt redundant structures which are mutually backup, can be switched and used through valve adjustment, and can effectively improve the uniformity and the safety of system refrigeration. The natural cooling unit, the water chilling unit and the pump set unit can ensure the safety and the energy conservation of the system by controlling the temperature of the supplied and returned water.

The gravity type indoor heat pipe heat dissipation unit 9 comprises a heat pipe back plate air pipe stop valve 9-1, a heat pipe back plate liquid pipe stop valve 9-2, a server chip heat pipe air pipe stop valve 9-3, a server chip heat pipe liquid pipe stop valve 9-4, a gravity type heat pipe back plate evaporator 9-5, a server chip heat pipe liquid pipe 9-6, a server chip heat pipe air pipe 9-7 and a gravity type heat pipe chip radiator 9-8.

With reference to fig. 3 and 4, the gravity type heat pipe chip heat radiator 9-8 is arranged inside the server and closely attached to the surface of the chip to directly cool the server chip, so that chip-level environmental management is realized, and the heat dissipation effect of each chip can be ensured by arranging a chip-level environmental management system in the data center. Each gravity type heat pipe chip radiator 9-8 comprises a cavity 9-9, one end face of the cavity is a pressing plate 9-10, the pressing plate 9-10 is of a flat plate structure, and the four corners of the cavity are provided with connecting holes for tightly fixing the pressing plate 9-10 to the surface of a server chip. One side of the cavity is provided with a liquid pipe 9-6 and an air pipe 9-7, the end part of the cavity is provided with a quick connector, the air pipe 9-7 is connected to a main air pipe of a corresponding first system through the quick connector, the liquid pipe 9-6 is connected to a main liquid pipe of the first system through the quick connector, online quick connection is realized, and the operation and maintenance are convenient; the air pipe 9-7 is positioned above the liquid pipe 9-6, and the height difference between the air pipe 9-7 and the liquid pipe can separate gas-liquid refrigerant through gravity to realize the flow of the refrigerant; the server chip heat pipe air pipe stop valve 9-3 and the server chip heat pipe liquid pipe stop valve 9-4 are respectively used for controlling whether an air pipe 9-7 and a liquid pipe 9-6 of each gravity type heat pipe chip radiator 9-8 are communicated with a main air pipe of a first system and a main liquid pipe of the first system or not, and independent control such as dismounting and mounting of each gravity type heat pipe chip radiator 9-8 is achieved. The server chip heat pipe air pipe stop valve 9-3 and the server chip heat pipe liquid pipe stop valve 9-4 can adopt manual valves without power sources.

The refrigerant circulation of the first system is realized completely by gravity, a refrigerant pump is not needed, a liquid storage tank is not needed, and the whole system completely realizes the self-adaptive adjustment, regulation and circulation of the refrigerant. Referring to fig. 4, the chip cooling capacity distribution heat exchanger 10 has a circulation chamber therein, the upper portion of the chip cooling capacity distribution heat exchanger is connected to the main air pipe of the first system, and the gaseous refrigerant discharged from the gravity type heat pipe chip radiator 9-8 to the main air pipe of the first system through the air pipe enters the circulation chamber of the chip cooling capacity distribution heat exchanger 10 through the main air pipe of the first system, is cooled by cooling water or chilled water, is converted into a liquid refrigerant, and flows into the main air pipe of the first system. Self-adaptive liquid supply is carried out between a main liquid pipe of the first system and the cavity 9-9 of each gravity type heat pipe radiator 9-8, when the heat of a certain chip is higher, the liquid refrigerant of the corresponding radiator is consumed to reduce the liquid level of the refrigerant, and according to the principle of a communicating vessel, the liquid level heights of each radiator and the main liquid pipe need to be kept the same, so that the liquid refrigerant in the cavity of the radiator is supplemented. The refrigerant converted into the gaseous state enters the circulating cavity of the chip heat dissipation and cold quantity distribution heat exchanger 10 through the main air pipe, is cooled by cooling water and then is converted into the liquid refrigerant, the refrigerant in the main liquid pipe of the first system is supplemented, and the supplement of the liquid refrigerant consumed by each cavity 9-9 is realized according to the principle of the communicating vessel. The purpose of the chip heat dissipation cold quantity distribution heat exchanger 10 is to cool water or chilled water so as to cool a refrigerant.

Liquid pipes and air pipes of the gravity type heat pipe chip radiators 9-8 are arranged on the side face of the heat exchange cavity, so that the gravity type heat pipe chip radiators are favorable for heat dissipation of chips of high-density servers with the height of 1U and 2U, and are suitable for high-heating and high-power chips with the height of more than or equal to 50W, such as a CPU (central processing unit), a GPU (graphic processing unit), a memory and the like.

Referring to fig. 3 and 5, the gravity type heat pipe backplane evaporator 9-5 has a similar structure to the gravity type heat pipe chip heat sink 9-8, but has a larger size for directly dissipating heat from the server cabinet. In one embodiment, the server is inserted into the server cabinet in a drawer mode, the gravity type heat pipe back plate evaporator 9-5 is fixed on a heat pipe back plate of the server cabinet to dissipate heat of the whole server cabinet, a heat pipe back plate fan is arranged to enable air to flow in the server cabinet, cold air enters the cabinet to directly dissipate heat generated by the server, and heat exchange efficiency is effectively improved. The gravity type heat pipe back plate evaporator is provided with a liquid pipe and an air pipe, the end part of the gravity type heat pipe back plate evaporator is provided with a quick connector, the air pipe is connected to a main air pipe of a corresponding second system through the quick connector, the liquid pipe is connected to a main liquid pipe of the second system through the quick connector, online quick connection is realized, and the operation and maintenance are convenient; the gas pipe is positioned above the liquid pipe, and the height difference between the gas pipe and the liquid pipe can separate gas-liquid refrigerant through gravity to realize the flow of the refrigerant; the heat pipe back plate air pipe stop valve 9-1 and the heat pipe back plate liquid pipe stop valve 9-2 are respectively used for controlling whether an air pipe and a liquid pipe of each gravity type heat pipe back plate evaporator 9-5 are communicated with a main air pipe of a second system or not and realizing independent control of dismounting and mounting of each gravity type heat pipe back plate evaporator 9-5. The heat pipe back plate air pipe stop valve 9-1 and the heat pipe back plate liquid pipe stop valve 9-2 can adopt manual valves without power sources.

The refrigerant circulation of the second system is realized completely by the gravity, a refrigerant pump is not needed, a liquid storage tank is not needed, and the whole system completely realizes the self-adaptive adjustment, regulation and circulation of the refrigerant. Referring to fig. 5, the heat pipe back plate heat dissipation cold distribution heat exchanger 8 has a circulation chamber therein, the upper portion of the heat pipe back plate heat dissipation cold distribution heat exchanger is connected to the main air pipe of the second system, and the gravity type heat pipe back plate evaporator 9-5 discharges the gaseous refrigerant of the main air pipe of the second system through the air pipe into the circulation chamber of the heat pipe back plate heat dissipation cold distribution heat exchanger 8 through the main air pipe of the second system, and the gaseous refrigerant is cooled by the chilled water and then converted into a liquid refrigerant, which flows into the main liquid pipe of the second system. Self-adaptive liquid supply is carried out between the main liquid pipe of the second system and the cavity of each gravity type heat pipe backboard evaporator 9-5, when the heat of a certain cabinet is higher, the liquid refrigerant of the corresponding gravity type heat pipe backboard evaporator is consumed to reduce the liquid level of the refrigerant, according to the principle of a communicating device, the liquid level height of each gravity type heat pipe backboard evaporator and the liquid level height of the main liquid pipe of the second system need to be kept the same, and therefore the liquid refrigerant in the cavity of the gravity type heat pipe backboard evaporator is supplemented. The refrigerant converted into the gaseous state enters the circulation cavity of the heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 through the main air pipe, is cooled by the chilled water and then is converted into the liquid refrigerant, the refrigerant in the main liquid pipe of the second system is supplemented, and the supplement of the liquid refrigerant consumed by each cavity is realized according to the principle of the communicating vessel. The purpose that the chip heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 flows through chilled water is to cool a refrigerant of a second system.

The circulation of a refrigerant of a first system is realized through a chip heat dissipation cold quantity distribution heat exchanger 10 and a gravity type heat pipe chip radiator 9-8, and the chip is cooled; the cooling capacity distribution heat exchanger 8 of the heat pipe backboard and the gravity type heat pipe backboard evaporator 9-5 realize the circulation of the cooling medium of the second system to cool the cabinet. The chip heat dissipation cold quantity distribution heat exchanger 10 and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 are arranged outside the data center, and the part flowing through the cooling water or the chilled water can be arranged indoors or indoors. The indoor pipelines without cooling water and chilled water are ensured, and once leakage of the cooling water and the chilled water occurs, the leakage cannot reach the indoor environment. The refrigerants of the first system and the second system are substances which absorb and release heat through phase change latent heat, and are gaseous substances in natural environment, so that the safety risk of liquid leakage (water leakage) in a machine room is prevented; for the refrigerant, for example, freon or the like can be used.

Further, according to the heat dissipation requirements of the chip in different temperature environments, the total amount of the refrigerant is adjusted, for example, the temperature in summer is higher, the required heat dissipation amount is larger, and the total amount of the refrigerant of the first system and the refrigerant of the second system are increased; in winter, the temperature is low, the required heat dissipation capacity is reduced, and the total amount of the refrigerants of the first system and the second system can be reduced. The total amount of the refrigerants of the first system and the second system is based on the requirement of meeting the cooling requirement.

The gravity type heat pipe back plate evaporator 9-5 and the gravity type heat pipe chip radiator 9-8 are far higher in heat flux density in efficient processing than the heat flux density which can be achieved by air cooling, and the heat exchange efficiency is high. Indoor heat dissipation parts within the chip heat dissipation cold distribution heat exchanger 10 and the heat pipe backboard heat dissipation cold distribution heat exchanger 8 completely depend on gravity circulation, and are passive and zero-power-consumption.

In high-temperature seasons, chilled water provided by a water chilling unit of the mechanical refrigeration unit 2 is used, heat exchange is carried out through the heat pipe backboard heat dissipation and cooling capacity distribution heat exchanger 8, and waterway circulation is realized through the opened valve 11 and the opened valve 14. Meanwhile, cooling water provided by the natural cooling unit 1 exchanges heat through the chip heat dissipation and cooling capacity distribution heat exchanger 10.

In transition seasons and winter, the mechanical refrigeration unit 2 may not be turned on, and the mechanical refrigeration unit 2 may also be turned on, where two cases a and B are specifically described as follows:

A. when the mechanical refrigeration unit 2 is started, by adjusting the bypass valve 13 and the valve 16, one path of chilled water provided by the mechanical refrigeration unit 2 enters the chip heat dissipation and cooling capacity distribution heat exchanger 10 through the valve 16 and the valve 15 for heat exchange, and then returns to the mechanical refrigeration unit 2 through the valve 12 and the valve 13; and the other path of the heat exchange fluid enters the heat pipe back plate heat dissipation cold quantity distribution heat exchanger 8 through the valve 11 for heat exchange and then returns to the mechanical refrigeration unit 2 through the valve 14.

B. When the mechanical refrigeration unit 2 is not started, by adjusting the bypass valve 13 and the valve 16, one path of cooling water provided by the natural cooling unit 1 enters the heat pipe backboard heat dissipation and cooling capacity distribution heat exchanger 8 through the valve 16 and the valve 11 for heat exchange, and then returns to the natural cooling unit 1 through the valve 14 and the valve 13; and the other path of the heat exchange liquid enters the chip heat dissipation and cooling capacity distribution heat exchanger 10 through the valve 15 for heat exchange and then returns to the natural cooling unit 1 through the valve 12. Because the cooling water provided by the natural cooling unit 1 can be fully utilized as a supplementary cold source of the chilled water of the water chilling unit, the heat is taken away by the heat pipe backboard heat dissipation cold distribution heat exchanger 8 and the chip heat dissipation cold distribution heat exchanger 10, the natural environment cold source is fully utilized, the mechanical refrigeration power consumption is greatly reduced, the PUE value of the data center is effectively improved, and the energy utilization efficiency is improved.

As shown in the embodiment of fig. 2, a chip heat dissipation cold distribution heat exchanger series inlet valve 17 and a chip heat dissipation cold distribution heat exchanger series outlet valve 18 are added, and a heat pipe backboard heat dissipation cold distribution heat exchanger 8 and a chip heat dissipation cold distribution heat exchanger 10 are used in series.

When two cold distribution heat exchangers are used in series, the water outlet valve 14 of the heat pipe back plate heat dissipation cold distribution heat exchanger is closed, the chip heat dissipation cold distribution heat exchanger series water inlet valve 17 and the chip heat dissipation cold distribution heat exchanger series water outlet valve 18 are opened, and water path circulation is achieved through the opened valve 11, the opened valve 17 and the opened valve 18. One of the natural cooling unit 1 and the mechanical refrigeration unit 2 works, and the provided cooling water and chilled water exchange heat with a refrigerant of a second system through the heat pipe back plate heat dissipation and cooling capacity distribution heat exchanger 8 and then exchange heat with a refrigerant of a first system through the chip heat dissipation and cooling capacity distribution heat exchanger 10. Because the cooling temperature required by the cabinet is lower than that required by the chip, the circulating water of the cold distribution heat exchanger of the heat pipe heat dissipation unit of the server chip can use the heat pipe backboard for heat dissipation and cold distribution heat exchanger to exchange heat and then discharge water with higher temperature, and the heat pipe backboard and the cold distribution heat exchanger are connected in series for use, so that the cold source is effectively utilized.

The natural cooling unit and the mechanical cooling unit can operate the natural cooling unit, the regulating valve and the heat exchanger by controlling the working load or the number of the working stations of the mechanical cooling unit according to the working condition change of the outdoor environment under the condition of low outdoor environment temperature, the proportion distribution of the cold load between the natural cooling unit and the mechanical cooling unit can be regulated, the data center can be cooled by the natural cooling unit as much as possible, the utilization of a natural cold source is improved, and the reasonable control on the temperature of supply and return water can be realized by adopting a variable frequency fan or a variable frequency water pump along with the further reduction of the outdoor environment.

The mechanical refrigeration unit can adopt a water chilling unit and also can adopt a unit mechanical refrigeration condenser, and can respectively realize centralized supply of a refrigeration load and unit type supply of the refrigeration load.

The natural cooling unit adopts an air-cooled heat exchange device, can be an air-cooled heat exchanger and can be a cooling tower, and the power consumption unit of the natural cooling unit only has a variable frequency fan, so that the natural cooling unit can efficiently provide cold energy by directly utilizing lower ambient temperature.

To sum up, the utility model provides a server heat dissipation system combining a gravity type server chip gravity type heat pipe and a heat pipe backboard, which realizes the server chip-level heat dissipation by arranging a gravity type heat pipe chip radiator in a data center; the heat pipe backboard heat dissipation unit is used for auxiliary heat dissipation, so that the space utilization efficiency of the data center is effectively improved, more servers can be arranged, the economic benefit is effectively improved, and the purpose of saving energy is achieved; the system has the characteristics of high heat exchange efficiency, low thermal resistance, low energy consumption, high heat exchange response speed, high reliability, low noise, long service life and the like; through the combination of the chip-level cooling technology and the outdoor cooling unit, the server chip is directly radiated more reasonably and efficiently, and through the combination of the heat pipe backboard cooling technology and the outdoor freezing unit, other heat sources except the server chip are directly radiated more reasonably and efficiently.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. The utility model provides a server cooling system that server chip gravity type heat pipe and heat pipe backplate combine which characterized in that: the device comprises a gravity type heat pipe heat dissipation unit, a chip heat dissipation cold quantity distribution heat exchanger, a heat pipe back plate heat dissipation cold quantity distribution heat exchanger and a cooling unit;

the gravity type heat pipe back plate evaporator comprises a radiator, a liquid pipe and an air pipe, wherein the position of the air pipe of the gravity type heat pipe back plate evaporator is higher than that of the liquid pipe, and the gravity type heat pipe back plate evaporator is arranged in a heat pipe back plate serving as a back door of the server cabinet; and the liquid refrigerant of the second system enters the liquid pipe of the gravity type heat pipe back plate evaporator from the heat pipe back plate heat dissipation cold quantity distribution heat exchanger under the action of gravity, enters the gravity type heat pipe back plate evaporator to cool the air outlet of the server, is heated and then is changed into a gas refrigerant of the second system, and returns to the heat pipe back plate heat dissipation cold quantity distribution heat exchanger through the air pipe of the gravity type heat pipe back plate evaporator to perform heat exchange and is cooled into the liquid refrigerant of the second system.

2. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system of claim 1, wherein: the liquid refrigerant of the first system and the gaseous refrigerant of the first system are sealed in the chip heat dissipation and cooling capacity distribution heat exchanger, the gravity type heat pipe chip radiator and a passage between the chip heat dissipation and cooling capacity distribution heat exchanger and the gravity type heat pipe chip radiator, and are circulated by means of gravity in a passive mode, and the chip heat dissipation and cooling capacity distribution heat exchanger provides the liquid refrigerant of the first system for the heat dissipation cavity of each gravity type heat pipe chip radiator under the action of gravity;

3. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system according to claim 1 or 2, wherein: the server is arranged in the machine room, the cooling unit is arranged outside the machine room, the chip heat dissipation cold quantity distribution heat exchanger, the heat pipe back plate heat dissipation cold quantity distribution heat exchanger, the cooling water and the chilled water system are arranged outside the machine room, and the gravity type chip heat pipe heat dissipation unit and the heat pipe back plate heat dissipation unit are arranged in the machine room.

4. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system of claim 3, wherein: the system also comprises a main liquid pipe of the first system, a main gas pipe of the first system, a main liquid pipe of the second system and a main gas pipe of the second system; the chip heat dissipation and refrigeration capacity distribution heat exchanger is internally provided with a circulation cavity of a first system, the upper part of the circulation cavity of the first system is connected to a main air pipe of the first system, and the lower part of the circulation cavity of the first system is connected to a main liquid pipe of the first system; gaseous refrigerant of a first system in the radiating cavity of the gravity type heat pipe chip radiator is discharged to a main air pipe of the first system through an air pipe and then enters a circulating cavity in a cold quantity distribution unit of the first system, the gaseous refrigerant is converted into liquid refrigerant after being cooled by cold water in the circulating cavity in the cold quantity distribution unit of the first system and flows into a main liquid pipe of the first system, the main liquid pipe of the first system is connected with each radiating cavity of the gravity type heat pipe chip radiator, and the liquid refrigerant in the main liquid pipe of the first system adaptively enters the radiating cavity of each gravity type heat pipe chip radiator under the action of gravity;

a circulation cavity of a second system is arranged in the heat pipe back plate heat dissipation and cold quantity distribution heat exchanger, the upper part of the circulation cavity of the second system is connected to a main air pipe of the second system, and the lower part of the heat exchanger of the second system is connected to the main air pipe of the second system; gaseous refrigerant of a second system in the heat dissipation cavity of the gravity type heat pipe backboard evaporator is discharged to a main air pipe of the second system through an air pipe and then enters a circulation cavity of a cold quantity distribution unit of the second system, the circulation cavity of the cold quantity distribution unit of the second system is cooled by chilled water and then is converted into liquid refrigerant, the liquid refrigerant flows into a main liquid pipe of the second system, the main liquid pipe of the second system is connected with each gravity type heat pipe backboard evaporation heat exchanger, and the liquid refrigerant in the main liquid pipe of the second system enters each gravity type heat pipe backboard evaporation heat exchanger in a self-adaptive mode under the action of gravity.

5. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system of claim 4, wherein: the liquid pipe and the air pipe of the gravity type heat pipe chip radiator are connected with a main liquid pipe of a first system and a main air pipe of the first system through quick connectors, a liquid pipe stop valve is arranged between the liquid pipe of the gravity type heat pipe chip radiator and the main liquid pipe of the first system, and an air pipe stop valve is arranged between the air pipe of the gravity type heat pipe chip radiator and the main air pipe of the first system;

6. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system according to claim 1 or 2, wherein: the cooling unit comprises a natural cooling unit and a mechanical refrigeration unit;

the natural cooling unit provides circulating cooling water for the chip heat dissipation cold quantity distribution heat exchanger; the mechanical refrigeration unit provides circulating chilled water for the heat pipe back plate heat dissipation cold energy distribution heat exchanger; under the condition of serial connection, the chip heat dissipation cold energy distribution heat exchanger uses the cold energy of the heat pipe back plate in serial connection to distribute chilled water after heat exchange of the heat exchanger;

the chip heat dissipation cold quantity distribution heat exchanger and the heat pipe back plate heat dissipation cold quantity distribution heat exchanger adopt a plate type heat exchanger or a shell-and-tube type heat exchanger; the mechanical refrigeration unit is a water chilling unit or a mechanical refrigeration condenser, and the natural cooling unit adopts an air cooling heat exchanger or a cooling tower.

7. The server chip gravity type heat pipe and heat pipe back plate combined server heat dissipation system of claim 6, wherein: the cooling system also comprises a mechanical refrigeration pump unit and a natural cooling pump unit, wherein circulating cooling water provided by the natural cooling unit enters the chip heat dissipation and cold quantity distribution heat exchanger under the action of the natural cooling pump unit; circulating chilled water of the mechanical refrigeration unit enters the heat pipe back plate heat dissipation cold quantity distribution heat exchanger and/or the chip heat dissipation cold quantity distribution heat exchanger under the action of the mechanical refrigeration pump unit; the natural cooling unit, the mechanical refrigeration pump unit and the natural cooling pump unit control the supply and return temperatures of cooling water and chilled water through a frequency conversion technology.

8. A server heat dissipation device combining a server chip gravity type heat pipe and a heat pipe backboard is characterized by comprising a plurality of gravity type heat pipe chip radiators, a plurality of gravity type heat pipe backboard evaporators, a main liquid pipe of a first system, a main gas pipe of the first system, a main liquid pipe of a second system and a main gas pipe of the second system;

9. The server heat sink combining the gravity type heat pipe and the heat pipe back plate of the server chip as claimed in claim 8, wherein the liquid refrigerant of the first system and the gaseous refrigerant of the first system are enclosed in the chip heat dissipation cold distribution heat exchanger, the gravity type heat pipe chip heat sink and the passage therebetween, and circulate by gravity in a passive manner, and the chip heat dissipation cold distribution heat exchanger provides the liquid refrigerant of the first system to the heat dissipation cavity of each gravity type heat pipe chip heat sink under the action of gravity;

10. The server heat sink device combining the gravity type heat pipe and the heat pipe back plate of the server chip as claimed in claim 8 or 9, wherein the liquid pipe and the air pipe of the gravity type heat pipe chip heat sink are connected to the main liquid pipe of the first system and the main air pipe of the first system by using quick connectors, a liquid pipe stop valve is disposed between the liquid pipe of the gravity type heat pipe chip heat sink and the main liquid pipe of the first system, and an air pipe stop valve is disposed between the air pipe of the gravity type heat pipe chip heat sink and the main air pipe of the first system;