CN108184322B - VRV (virtual router v) machine room integrated heat dissipation system based on heat pipe and control method thereof - Google Patents
VRV (virtual router v) machine room integrated heat dissipation system based on heat pipe and control method thereof Download PDFInfo
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- CN108184322B CN108184322B CN201810057503.0A CN201810057503A CN108184322B CN 108184322 B CN108184322 B CN 108184322B CN 201810057503 A CN201810057503 A CN 201810057503A CN 108184322 B CN108184322 B CN 108184322B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a VRV machine room integrated heat dissipation system based on a heat pipe and a control method thereof, wherein the system comprises a refrigerating unit, a main circulation pipeline, an auxiliary circulation pipeline, a centralized heat treatment header, a heat pipe module type embedded heat dissipation plate, a heat pipe, a host temperature monitor and a controller, wherein the centralized heat treatment header comprises a first treatment area and a second treatment area, and the second treatment area comprises a plurality of cooling cavities; the heat pipe module type embedded heat dissipation plate is arranged at a local heat dissipation area of the host machine unit, the evaporation end of the heat pipe is inserted into the heat pipe module type embedded heat dissipation plate, and the condensation end is inserted into a cooling cavity of a second treatment area of the centralized heat treatment header. The heat pipe heat-conducting and heat-resistant heat-dissipating system utilizes the heat-dissipating advantages of the heat pipe, such as quick heat conduction and small heat resistance, adopts the module type embedded heat-dissipating plate to directly reach the heat-dissipating core area, and intensively solves the problems of heat dissipation of a host machine and indoor temperature adjustment through the centralized heat-processing header, so that the heat-dissipating and heat-resistant heat-dissipating system is suitable for a data control center room with a large number of operators and large-scale hosts, and has indoor environment temperature requirements and a large number of local heat-dissipating loads.
Description
Technical Field
The invention belongs to the technical field of energy conservation and refrigeration, and relates to a VRV (Variable Refrigerant Volume) machine room integrated heat dissipation system based on a heat pipe and a control method thereof.
Background
Because of the rapid development of the microelectronics industry, more electronic devices are accommodated in the same volume, the heat flux of a unit area is greatly improved, the heat productivity of devices such as a CPU (Central processing Unit) on a host is great, the high temperature is often a main factor damaging the electronic devices, according to related data, when the temperature of an electronic element rises by 10 ℃, the reliability of the electronic element is reduced by half, the processing performance of a chip is reduced, the working stability of the chip is reduced, and the error rate is increased.
The integration level is continuously improved, the heat density of electronic devices is gradually increased, and how to solve the problem that heat dissipation of a host in a machine room is focused by students. The existing machine room heat dissipation solution adopts a precise air conditioner mostly, the whole room is cooled, a low-temperature environment is built, then the host is cooled through the room low-temperature environment, the heat dissipation solution consumes energy and has poor effect, and when an operator is needed to be in a data control center machine room, the low-temperature indoor environment brings very uncomfortable feeling to the indoor operator. With the enlargement of data centers and the establishment of cloud base stations, central control systems, namely data control centers, are becoming more and more, and in places with a large number of operators and large-scale hosts, a heat dissipation solution which can meet the heat dissipation requirement of the large-scale hosts, maintain the normal work of the hosts and meet the comfort requirement of indoor operators and solve the problem of local high heat density heat dissipation and give consideration to the indoor large environment is urgently needed.
The heat pipe has small thermal resistance, is a good heat conductor, is widely focused by students, and is also tried to be applied to solving the heat dissipation problem of a machine room by the students, but the existing heat pipe radiator for the machine room is connected into a whole and is integrally attached to the rear part of a host, the quantity and the arrangement of the heat pipe radiator cannot be adjusted along with the running condition of the host, and the heat pipe radiator has no instant controllability, so that the problems of heat dissipation delay and energy consumption are caused.
Disclosure of Invention
The invention aims to: aiming at the defects of the prior art, the invention aims to provide a VRV machine room integrated heat dissipation system based on a heat pipe and a control method thereof, which exert the heat dissipation advantages of the heat pipe, such as quick heat conduction and small heat resistance, directly reach a heat dissipation core area by adopting a modular embedded heat dissipation plate, and intensively solve the heat dissipation of a host and the indoor temperature regulation by adopting a centralized heat treatment header, and aim at solving the problem of local high heat density heat dissipation, giving consideration to the indoor large environment and guaranteeing the comfort of indoor operators.
The technical scheme is as follows: in order to achieve the aim of the invention, the technical scheme adopted by the invention is as follows:
a VRV machine room integrated heat radiation system based on a heat pipe comprises a refrigerating unit, a main circulation pipeline, an auxiliary circulation pipeline, a centralized heat treatment header, a heat pipe module type embedded heat radiation plate, a heat pipe, a host temperature monitor and a controller;
the centralized heat treatment header comprises a first treatment area for indoor environment air conditioning and a second treatment area for host environment temperature conditioning; the refrigerating unit is connected with the second treatment area of the centralized heat treatment header through the main circulation pipeline and is connected with the first treatment area of the centralized heat treatment header through the auxiliary circulation pipeline, and valves for flow regulation are respectively arranged on the main circulation pipeline and the auxiliary circulation pipeline;
the second treatment area comprises a plurality of cooling cavities, and each cooling cavity is provided with a valve for filling liquid; the host temperature monitor is arranged in the host unit, and the controller is respectively connected with the host temperature monitor, the main circulation pipeline valve, the auxiliary circulation pipeline valve and the cooling cavity valve;
the heat pipe module type embedded heat dissipation plate is arranged on a local heat dissipation area of the host machine unit, the heat pipe is inserted into the heat pipe module type embedded heat dissipation plate, the evaporation end of the heat pipe is inserted into the heat pipe module type embedded heat dissipation plate, and the condensation end of the heat pipe is inserted into a cooling cavity of a second treatment area of the centralized heat treatment header.
Preferably, the condensing end of the heat pipe in the heat pipe module embedded radiating plate on one host machine unit is inserted into a cooling cavity.
Preferably, the main circulation pipeline has higher frequency conversion charging priority than the auxiliary circulation pipeline.
Preferably, the first treatment area of the centralized heat treatment header comprises an air treatment tank, and a new air pipe, a return air pipe and an air supply pipe which are connected with the air treatment tank.
Preferably, the cooling cavity valve is a gate valve.
Preferably, the heat pipe used for inserting the heat pipe module type embedded heat dissipation plate adopts a commercially available heat pipe with a composite capillary structure.
Preferably, the heat pipe module type embedded heat dissipation plate is arranged on the rear wall surface of the host machine unit and is clung to the concentration position of the electronic components.
The control method of the VRV machine room integrated heat dissipation system based on the heat pipe comprises the following steps:
according to the temperature shown by the host temperature monitor, the main circulation pipeline valve is subjected to flow regulation, and the variable frequency liquid filling in the pipeline is controlled: when the deviation of the temperature shown by the host temperature monitor higher than the normal working temperature increases, the refrigerant flow increases, otherwise the refrigerant flow decreases;
and controlling the valve of the cooling cavity according to the temperature shown by the temperature monitor of the host machine: when the temperature monitor of the host machine monitors that the running temperature of a certain host machine is too high, a valve of a cooling cavity inserted by the host machine is opened, and the refrigerant in a second treatment area of the centralized heat treatment header is filled into the cooling cavity; when the deviation of the temperature shown by the host temperature monitor higher than the normal working temperature is reduced, gradually closing the valve of the cooling cavity; when the temperature shown by the temperature monitor of the host machine is reduced to the normal working temperature, the cooling cavity is closed;
and adjusting the flow of the valve of the auxiliary circulating pipeline according to the temperature shown by the indoor environment temperature monitor, and controlling the frequency conversion liquid filling in the pipeline: when the deviation of the temperature shown by the indoor environment temperature monitor higher than the comfortable environment temperature of the human body increases, the refrigerant flow increases, and conversely, the refrigerant flow decreases.
Preferably, in the control method, the treatment priority of the variable frequency charging liquid of the main circulation pipeline is higher than that of the auxiliary circulation pipeline.
The beneficial effects are that: compared with the prior art, the invention has the following beneficial effects: the heat pipe heat dissipation device utilizes the heat dissipation advantages of quick heat conduction and small thermal resistance of the heat pipe, adopts the module type embedded heat dissipation plate to directly reach the heat dissipation core area, ensures that the heat dissipation is more targeted, and the module type arrangement scheme also increases the flexibility for the arrangement of the heat pipe, and the running condition of the heat pipe heat dissipation device is controlled by electronic signals, so that the heat pipe heat dissipation device is more energy-saving, instant and efficient. The invention provides a VRV machine room integrated heat dissipation solution based on a heat pipe for a data control center machine room with a large number of operators and large-scale hosts, indoor environment temperature requirements and a large number of local heat dissipation loads.
Drawings
Fig. 1 is a schematic layout diagram of an integrated heat dissipation system of a VRV machine room based on a heat pipe.
Fig. 2 is a schematic view of the structure of the first treatment zone of the centralized heat treatment header.
Fig. 3 is a schematic view of the structure of the second treatment zone of the centralized heat treatment header.
Wherein: 1-a refrigerating unit; 2-a main circulation pipeline; 3-a secondary circulation pipeline; 4-centralized heat treatment header; 41-a centralized heat treatment header first treatment zone; 411-new wind pipe; 412-an air return pipe; 413-an air supply pipe; 414-an air treatment tank; 42-a centralized heat treatment header second treatment zone; 421-cooling chamber; 422-cooling chamber valve; 5-a valve of the auxiliary circulating pipeline; 6-a main circulation pipeline valve; 7-heat pipe module type embedded heat dissipation plate; 8-heat pipe module type embedded heat radiation plate for inserting heat pipe; 9-a host temperature monitor; 10-connecting a cable; 11-controller.
Detailed Description
The invention will be described in further detail with reference to the accompanying drawings and specific preferred embodiments.
As shown in fig. 1, the VRV machine room integrated heat dissipation system based on a heat pipe disclosed in the embodiment of the invention includes a refrigerating unit 1, a main circulation pipeline 2, an auxiliary circulation pipeline 3, a centralized heat treatment header 4, a heat pipe module type embedded heat dissipation plate 7, a heat pipe 8 for inserting the heat pipe module type embedded heat dissipation plate, a host temperature monitor 9, a connection cable 10, a controller 11 and a plurality of valves. The centralized heat treatment header 4 is used for intensively solving heat dissipation of a host machine and indoor temperature regulation, and can be placed near the back wall of the host machine unit, and comprises a first treatment area for indoor environment air regulation and a second treatment area for host machine environment temperature regulation. The refrigerating unit 1 is connected with the second treatment area of the centralized heat treatment header 4 through the main circulation pipeline 2, and is connected with the first treatment area of the centralized heat treatment header 4 through the auxiliary circulation pipeline 3. Valves (a main circulation pipeline valve 6 and a secondary circulation pipeline valve 5) for flow regulation are respectively arranged on the main circulation pipeline and the secondary circulation pipeline;
as shown in fig. 2, the first treatment area 41 of the centralized heat treatment header includes a fresh air duct 411, a return air duct 412, an air supply duct 413, and an air treatment tank 414. The first processing area 41 of the centralized heat-treatment header mainly performs air conditioning of the indoor environment, adopts primary return air, and fresh air and partial return air are processed in the air-treatment tank 414 and are sent into a room through an air supply pipe, so that a comfortable indoor environment is provided for indoor operators. The air treatment box is an air treatment unit (AHU), realizes air regulation, is composed of an air filtering section, a surface cooler section, a water spraying chamber section, an air humidifying section and a fan section, and can be made of commercial products. The first treatment area 41 of the centralized heat treatment header can also be used for realizing the refrigeration of the indoor environment in other ways according to practical situations.
As shown in fig. 3, the centralized heat treatment header second treatment zone 42 includes a plurality of cooling chambers 421 and a plurality of cooling chamber valves 422 that control the cooling chamber fill. The host temperature monitor 9 is arranged in each host unit, monitors the running temperature of the host in real time, and the controller 11 is a computer analysis controller and is respectively connected with the host temperature monitor 9, the main circulation pipeline valve 6, the auxiliary circulation pipeline valve 5 and the plurality of cooling cavity valves 422 in a wireless mode through connecting cables 10 for signal transmission. The main circulation pipeline valve 6 and the auxiliary circulation pipeline valve 5 are flow regulating valves, and the cooling cavity valve 422 is a gate valve. The main circulation pipeline valve 6 and the auxiliary circulation pipeline valve 5 can control the frequency conversion liquid filling in the pipeline through the electronic signals of the computer analysis controller, and the plurality of cooling cavity valves 422 can control the frequency conversion liquid filling in the cavity through the electronic signals of the computer analysis controller.
Each host unit (i.e. a cabinet) is provided with a heat pipe module embedded heat dissipation plate 7. The heat pipe module type embedded heat dissipation plates 7 installed by a plurality of host machine sets in the machine room are independently installed. The heat pipe module type embedded heat dissipation plate is provided with an inserting hole, and a heat pipe 8 is inserted into the inserting hole and can be arranged on the rear wall surface of the unit and cling to the concentrated position of the electronic element.
The evaporation end of the heat pipe 8 used for inserting the heat pipe module type embedded heat-dissipating plate is inserted into the heat pipe module type embedded heat-dissipating plate 7, and the condensation end is inserted into the cooling cavity 421 of the second processing region 42 of the centralized heat-processing header. In general, a cooling cavity is inserted into the condensing end of a heat pipe module type embedded heat dissipation plate of a host unit. For a few small-sized and small-sized main machine sets, the centralized heat treatment box is positioned near the rear wall of the main machine set, one end of the centralized heat treatment box can be inserted into the cooling plate, and the other end of the centralized heat treatment box is directly inserted into the cooling cavity, so that the cooling plate and the centralized heat treatment box are combined and installed. For a plurality of large-sized host units, the condensation ends of the inserted heat pipes of each host unit can be connected, the condensation ends are combined, and then the cooling cavity is inserted.
The heat pipe 8 used for inserting the heat pipe module type embedded heat dissipation plate can be a heat pipe with a composite capillary structure, and is a commercially available product, namely, a heat pipe (groove of AVC and copper powder sintering) which is manufactured by combining the characteristics of high permeability of the groove heat pipe and high stability of the sintering heat pipe, so that the optimal performance is achieved.
The working principle of the heat pipe is that when the evaporation end (namely the embedded base of the heat pipe module type embedded heat-dissipating plate, namely the part directly contacted with electronic elements such as a CPU (Central processing Unit) of a host heat-dissipating element) starts to be heated, liquid around the pipe wall is instantaneously vaporized to generate vapor, at the moment, the pressure of the part is increased, and vapor flows to the condensation end under the traction of the pressure. The vapor stream is condensed into a liquid after reaching the condensing end, and a large amount of heat is released at the condensing end (i.e. the part inserted into the cooling cavity of the second treatment zone of the centralized heat treatment header), and finally returns to the evaporation heat receiving end by capillary force to complete one cycle.
The second treatment area of the centralized heat treatment header mainly solves the problem of local heat dissipation of the host, heat generated by operation of the host is quickly transferred to the centralized heat treatment header through the heat pipe module type embedded heat dissipation plate, and meanwhile, the main circulation pipeline valve carries out flow regulation along with the temperature shown by the host temperature monitor, so that frequency conversion liquid filling in a control pipeline is realized: when the deviation amount of the temperature shown by the host temperature monitor from the normal operation temperature increases, the refrigerant flow increases, whereas the refrigerant flow decreases. When the temperature monitor of the host machine monitors that the running temperature of a certain host machine is too high, the gate valve of the cooling cavity inserted by the host machine is opened, and the refrigerant in the second treatment area of the centralized heat treatment header is filled into the cooling cavity, so that the problem of local high heat density heat dissipation is effectively solved in an energy-saving way, and the normal running of the host machine is ensured.
According to the VRV machine room integrated heat dissipation system based on the heat pipe, the controller controls the main circulation pipeline valve and the gate valve to adjust the refrigerant filling rate according to the deviation between the temperature measured by the host temperature monitor and the given normal working temperature of the host, so that the cooling control of the corresponding host is realized, and the closed-loop negative feedback control is realized. According to the temperature shown by the indoor environment temperature monitor and the set indoor temperature, the controller adjusts the filling rate of the refrigerant by controlling the valve of the auxiliary circulating pipeline, so as to realize indoor temperature adjustment. The specific control method comprises the following steps:
according to the temperature shown by the host temperature monitor, the main circulation pipeline valve is subjected to flow regulation, and the variable frequency liquid filling in the pipeline is controlled: when the deviation of the temperature shown by the host temperature monitor from the normal operation temperature increases, the refrigerant flow increases, whereas the refrigerant flow decreases.
And controlling the valve of the cooling cavity according to the temperature shown by the host temperature monitor, and opening a gate valve of the cooling cavity inserted by the host when the host temperature monitor monitors that the running temperature of a certain host is too high, so that the refrigerant in the second treatment area of the centralized heat treatment header is filled into the cooling cavity. The gate valve gradually closes as the amount of deviation of the temperature shown by the main machine temperature monitor from the normal operating temperature decreases. When the temperature shown by the temperature monitor of the host machine is reduced to the normal working temperature, the gate valve is closed.
And adjusting the flow of the valve of the auxiliary circulating pipeline according to the temperature shown by the indoor environment temperature monitor, and controlling the frequency conversion liquid filling in the pipeline: when the deviation of the temperature shown by the indoor environment temperature monitor higher than the comfortable environment temperature of the human body increases, the refrigerant flow increases, and conversely, the refrigerant flow decreases.
The invention uses the heat radiation advantages of quick heat conduction and small thermal resistance of the heat pipe and adopts the module type embedded heat radiation plate to directly reach the heat radiation core area, the invention provides a centralized heat treatment header for intensively solving the heat radiation and indoor temperature regulation of a host, aims at solving the problem of local high heat density heat radiation and giving consideration to the indoor large environment, and provides a VRV machine room integrated heat radiation solution based on the heat pipe for a data control center machine room with a large number of operators and large-scale hosts, indoor environment temperature requirements and a large number of local heat radiation loads.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details of the above embodiments, and various equivalent changes can be made to the technical solution of the present invention within the scope of the technical concept of the present invention, and all the equivalent changes belong to the protection scope of the present invention.
Claims (7)
1. VRV computer lab integration cooling system based on heat pipe, its characterized in that: the device comprises a refrigerating unit, a main circulation pipeline, an auxiliary circulation pipeline, a centralized heat treatment header, a heat pipe module type embedded radiating plate, a heat pipe, a host temperature monitor and a controller;
the centralized heat treatment header comprises a first treatment area for indoor environment air conditioning and a second treatment area for host environment temperature conditioning; the refrigerating unit is connected with the second treatment area of the centralized heat treatment header through the main circulation pipeline and is connected with the first treatment area of the centralized heat treatment header through the auxiliary circulation pipeline, and valves for flow regulation are respectively arranged on the main circulation pipeline and the auxiliary circulation pipeline;
the second treatment area comprises a plurality of cooling cavities, and each cooling cavity is provided with a valve for filling liquid; the host temperature monitor is arranged in the host unit, and the controller is respectively connected with the host temperature monitor, the main circulation pipeline valve, the auxiliary circulation pipeline valve and the cooling cavity valve; the controller is used for adjusting the flow of the valve of the main circulation pipeline according to the temperature shown by the host temperature monitor and controlling the frequency conversion liquid filling in the pipeline: when the deviation of the temperature shown by the host temperature monitor higher than the normal working temperature increases, the refrigerant flow increases, otherwise the refrigerant flow decreases; and controlling the valve of the cooling cavity according to the temperature shown by the temperature monitor of the host machine: when the temperature monitor of the host machine monitors that the running temperature of a certain host machine is too high, a valve of a cooling cavity inserted by the host machine is opened, and the refrigerant in a second treatment area of the centralized heat treatment header is filled into the cooling cavity; when the deviation of the temperature shown by the host temperature monitor higher than the normal working temperature is reduced, gradually closing the valve of the cooling cavity; when the temperature shown by the temperature monitor of the host machine is reduced to the normal working temperature, the cooling cavity is closed; and adjusting the flow of the valve of the auxiliary circulating pipeline according to the temperature shown by the indoor environment temperature monitor, and controlling the frequency conversion liquid filling in the pipeline: when the deviation of the temperature shown by the indoor environment temperature monitor higher than the comfortable environment temperature of the human body is increased, the flow rate of the refrigerant is increased, and conversely, the flow rate of the refrigerant is reduced;
the heat pipe module type embedded heat dissipation plate is arranged on a local heat dissipation area of the host machine unit, the heat pipe is inserted into the heat pipe module type embedded heat dissipation plate, the evaporation end of the heat pipe is inserted into the heat pipe module type embedded heat dissipation plate, and the condensation end of the heat pipe is inserted into a cooling cavity of a second treatment area of the centralized heat treatment header.
2. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the condensing end of the heat pipe in the heat pipe module embedded radiating plate on the host machine set is inserted into a cooling cavity.
3. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the priority of the variable-frequency liquid filling of the main circulation pipeline is higher than that of the auxiliary circulation pipeline.
4. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the first treatment area of the centralized heat treatment header comprises an air treatment tank, and a new air pipe, a return air pipe and an air supply pipe which are connected with the air treatment tank.
5. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the cooling cavity valve is a gate valve.
6. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the heat pipe used for the interpolation of the heat pipe module type embedded heat dissipation plate adopts a commercially available heat pipe with a composite capillary structure.
7. The VRV machine room integrated heat dissipation system based on heat pipes of claim 1, wherein: the heat pipe module type embedded heat radiation plate is arranged on the rear wall surface of the host machine unit and clings to the concentrated position of the electronic element.
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