CN209386416U - A kind of temperature-controlled package and its temperature-adjusting device - Google Patents
A kind of temperature-controlled package and its temperature-adjusting device Download PDFInfo
- Publication number
- CN209386416U CN209386416U CN201821672431.2U CN201821672431U CN209386416U CN 209386416 U CN209386416 U CN 209386416U CN 201821672431 U CN201821672431 U CN 201821672431U CN 209386416 U CN209386416 U CN 209386416U
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- air
- temperature
- conversion chamber
- heat
- air inlet
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Abstract
The utility model relates to air temperature modification technical fields, refer in particular to a kind of temperature-controlled package, its described air conversion chamber is equipped with the first air inlet duct, the first exhaust passage, refrigeration mechanism and wind guiding mechanism, the refrigeration mechanism includes the semiconductor chilling plate for being set to air conversion chamber, and the semiconductor chilling plate includes first end and second end and first end and second end is located at the inside and outside of air conversion chamber；The wind guiding mechanism is used to that outside air to be freezed or be heated via refrigeration mechanism from the inner cavity of the first air inlet duct sucking air conversion chamber and is discharged again from the first exhaust passage.The utility model also provides a kind of temperature-adjusting device, have the characteristics that adjust the temperature of air that high-efficient, effect is obvious, manufacturing cost is low and energy conservation and environmental protection, which uses Physical temperature-lowering, does not use refrigerant, it is nontoxic, it is not easy the drying that the air after making to adjust becomes.
Description
Technical field
The utility model relates to air temperature modification technical field, a kind of temperature-controlled package and its temperature tune are referred in particular to
Regulating device.
Background technique
Air-conditioning, that is, air regulator (Air Conditioner), be it is a kind of using manual operation to surrounding air in space
The parameters such as temperature, humidity, cleanliness, the speed equipment that is adjusted and controls.With global warming, hot weather is held
The continuous time increasingly increases.In order to cope with temperature change, people increase the application demand of air-conditioning rapidly.
Traditional air-conditioning transmits heat using the phase transformation of refrigerant generally using refrigerant as working media.In other words, it makes
Cryogen absorbs heat when vaporizing in evaporator, heat release when condensing within the condenser, forms compression condensation-expansion-evaporation refrigeration and follows
Ring.The air-conditioning volume of this working principle is larger and needs to consume a large amount of electric power energy and carrys out compressed air, while also will cause
The seriously polluted problem of air conditioner noises and refrigerant.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of temperature-controlled package and its temperature-adjusting devices, pass through
Using semiconductor chilling plate as main refrigeration part, solve traditional air conditioner take up space it is larger, consume energy higher, noise and
The seriously polluted problem of refrigerant.
In order to solve the above-mentioned technical problem, the utility model adopts the following technical solution:
A kind of temperature-controlled package, the air conversion chamber including being equipped with inner cavity, the air conversion chamber are equipped with the first air inlet
Road, the first exhaust passage, refrigeration mechanism and wind guiding mechanism, the refrigeration mechanism include the semiconductor refrigerating for being set to air conversion chamber
Piece, the semiconductor chilling plate include first end and second end, and first end and second end is located at the inside of air conversion chamber
The outside and；The wind guiding mechanism is used for outside air from the inner cavity of the first air inlet duct sucking air conversion chamber via refrigeration mechanism
Refrigeration or heating are discharged from the first exhaust passage again.
Further, the refrigeration mechanism further includes the first end being arranged in air conversion chamber and with semiconductor chilling plate
The heat-conducting part of contact, the hollow setting of the heat-conducting part and wind guiding mechanism is located in heat-conducting part.
Further, the heat-conducting part is externally provided with sealant, and the sealant is externally provided with thermal insulation layer, the sealant with every
There are gaps between thermosphere to form distinguished and admirable road, and the heat-conducting part is equipped with the first air inlet and the first air outlet, and the air turns
Change room and be provided with the second air inlet and the second air outlet, first air inlet, distinguished and admirable road, the second air inlet are sequentially communicated with shape
At the first air inlet duct, first air outlet and the second air outlet are connected to form the first exhaust passage.
Further, the wind guiding mechanism include centrifugal fan and for drive centrifugal fan rotate actuator, it is described
Centrifugal fan rotation is carried in air conversion chamber, and the actuator is arranged outside air conversion chamber, the output of the actuator
Axis passes through air conversion chamber and connect with centrifugal fan.
Further, the temperature-controlled package further includes being set to outside the air conversion chamber and for semiconductor refrigerating
The cooling mechanism that the second end of piece radiates, the cooling mechanism include the heat dissipation for contacting at the second end of semiconductor chilling plate
Block and the radiator fan being arranged on radiating block.
Further, the radiating block is set on the outer wall of air conversion chamber, the second end of the semiconductor chilling plate
Sealing heat-conducting layer is provided between radiating block.
Further, the actuator is fixed on radiating block.
A kind of temperature-adjusting device, including interior machine and outer machine, the outer machine is equipped with above-mentioned temperature-controlled package, described interior
Machine is equipped with the second air inlet duct being connected to the first air inlet duct and the second exhaust passage being connected with the first exhaust passage.
Further, the outer machine offers heat release hole.
Further, the interior machine is equipped with the electric cabinet for controlling temperature-controlled package.
The utility model has the beneficial effects that a kind of temperature-controlled package provided by the utility model and its temperature adjust dress
It sets, has the characteristics that the temperature adjusting to air is high-efficient, effect is obvious, manufacturing cost is low and energy conservation and environmental protection, this is practical new
Type uses Physical temperature-lowering, does not use refrigerant, nontoxic, is not easy the drying that the air after making to adjust becomes.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the schematic perspective view of the utility model temperature-controlled package；
Fig. 2 is the cross-sectional view of the utility model temperature-controlled package；
Fig. 3 is the decomposition texture schematic diagram of the utility model temperature-controlled package；
Fig. 4 is the thermostatic schematic perspective view of the utility model；
Fig. 5 is the thermostatic decomposition diagram of the utility model.
Description of symbols: 10, air conversion chamber；11, thermal insulation layer；12, limited block is sealed；13, collet；14, it seals
Layer；21, the first air inlet；22, distinguished and admirable road；23, the second air inlet；31, the first air outlet；32, the second air outlet；41, it partly leads
Body cooling piece；42, heat-conducting part；51, centrifugal fan；52, actuator；60, cooling mechanism；61, radiating block；62, radiator fan；
70, interior machine；71, the second air inlet duct；72, the second exhaust passage；73, electric cabinet；80, outer machine；81, heat release hole.
Specific embodiment
For the ease of the understanding of those skilled in the art, the utility model is made below with reference to embodiment and attached drawing further
Explanation, the content that embodiment refers to not is restriction to the utility model.
As shown in Figure 1, Figure 2 and Figure 3, a kind of temperature-controlled package provided by the utility model comprising equipped with inner cavity
Air conversion chamber 10, the air conversion chamber 10 are equipped with the first air inlet duct, the first exhaust passage, refrigeration mechanism and wind guiding mechanism, institute
Stating refrigeration mechanism includes the semiconductor chilling plate 41 for being set to air conversion chamber 10, and the semiconductor chilling plate 41 includes first end
And second end, and first end and second end is located at the inside and outside of air conversion chamber 10；The wind guiding mechanism is used for will
Outside air freezes via refrigeration mechanism from the inner cavity of the first air inlet duct sucking air conversion chamber 10 or heats to go out from first again
Air duct discharge.When specific works, temperature-controlled package is installed in a space, wind guiding mechanism sucks the air in space
Air conversion chamber 10, semiconductor chilling plate 41 can carry out heat exchange to the air in air conversion chamber 10, by changing half
The positive and negative anodes of conductor cooling piece 41 can make the first end of semiconductor chilling plate 41 become refrigeration end or heating end, and then right
Air in air conversion chamber 10 is cooled down or is heated up.
Preferably, the refrigeration mechanism further includes first be arranged in air conversion chamber 10 and with semiconductor chilling plate 41
The heat-conducting part 42 of end in contact, the hollow setting of the heat-conducting part 42 and wind guiding mechanism is located in heat-conducting part 42 and are partly led at heat-conducting part 42
It is bonded between the first end of body cooling piece 41 using heat-conducting silicone grease, to improve the heat exchange of semiconductor chilling plate 41 and heat-conducting part 42
Efficiency.Here heat-conducting part 42 is made for the preferable aluminum material of heating conduction, on the one hand the hollow setting of heat-conducting part 42 can be
Installation wind guiding mechanism flows out certain space, the contact area between air and heat-conducting part 42 on the other hand can be improved, in turn
Improve heat exchange efficiency.
The heat-conducting part 42 as described in Fig. 2 and Fig. 3 is externally provided with sealant 14, and the sealant 14 is externally provided with thermal insulation layer 11, described
There are gaps between sealant 14 and thermal insulation layer 11 to form distinguished and admirable road 22, and the heat-conducting part 42 is equipped with the first air inlet 21 and the
One air outlet 31, the air conversion chamber 10 are provided with the second air inlet 23 and the second air outlet 32, first air inlet 21,
Distinguished and admirable road 22, the second air inlet 23 are sequentially communicated to form the first air inlet duct, first air outlet 31 and the second air outlet 32
It is connected to form the first exhaust passage.Here the accurate fitting heat-conducting part 42 of sealant 14, sealant 14 are made using EVA material,
EVA material has excellent heat-proof quality and sealing performance, guarantees that the efficiency in air conversion chamber 10 is not lost.Heat-conducting part 42,
Heat exchange can be rapidly completed in the combination of sealant 14 and thermal insulation layer 11 after air can be made to enter air conversion chamber 10,
Refrigeration or heating effect are obvious.
Preferably, the wind guiding mechanism include centrifugal fan 51 and for drive centrifugal fan 51 rotate actuator 52,
The rotation of centrifugal fan 51 is carried in air conversion chamber 10, and the actuator 52 is arranged outside air conversion chamber 10, described
The output shaft of actuator 52 passes through air conversion chamber 10 and connect with centrifugal fan 51.Here actuator 52 can be servo electricity
Machine, actuator 52 are arranged outside air conversion chamber 10, can influence air conversion chamber to avoid generation heat when the work of actuator 52
10 heat exchange efficiency, while the flow velocity for using centrifugal fan 51 to cooperate servo motor that can efficiently control air.
Preferably, it in order to improve the heat exchange efficiency of temperature-controlled package, is additionally provided with outside air conversion chamber 10 for half-and-half leading
The cooling mechanism 60 that the second end of body cooling piece 41 radiates, the radiating block 61 and setting that the cooling mechanism 60 includes exist
Radiator fan 62 on radiating block 61, the radiating block 61 contradict the second end of semiconductor chilling plate 41.Here radiating block 61 is adopted
It is screwed in air conversion chamber 10, it is more firm that radiating block 61 can be made in this way, while in order to reduce air conversion chamber 10
Heat between screw exchanges, and collet 13 is equipped between screw and air conversion chamber 10.
Air conversion chamber 10 is equipped with the sealing limited block 12 for installing semiconductor chilling plate 41, seals and opens on limited block 12
Equipped with the mounting hole for being embedded semiconductor chilling plate 41, set between the second end and radiating block 61 of the semiconductor chilling plate 41
It is equipped with sealing heat-conducting layer (not showing in figure), sealing heat-conducting layer here is heat-conducting silicone grease, and heat-conducting silicone grease is applied to mounting hole
It is interior, be on the one hand conducive to the second end of semiconductor chilling plate 41 and radiating block 61 carries out hot transmitting, improves heat exchange efficiency, another party
Face can be sealed between semiconductor chilling plate 41 and mounting hole, avoid air in air conversion chamber 10 from mounting hole with
Gap location between semiconductor chilling plate 41 is lost, and further increases the heat exchange efficiency of air conversion chamber 10.
Preferably, the actuator 52 is fixed on radiating block 61, and such cooling mechanism 60 can also carry out for actuator 52
Heat dissipation, makes actuator 52 keep excellent performance at work.
As shown in Figure 4 and Figure 5, the present embodiment also provides a kind of temperature-adjusting device, including interior machine 70 and is connected to interior machine
70 outer machine 80, the outer machine 80 are equipped with above-mentioned temperature-controlled package, and the temperature-controlled package is located at interior machine 70 and outer machine
Between 80, the interior machine 70 be equipped with the second air inlet duct 71 being connected to the first air inlet duct and be connected with the first exhaust passage the
Two exhaust passages 72.Temperature-controlled package is set to outer machine 80, it is possible to reduce indoor noise.Indoor air passes through the first air inlet duct
Enter after temperature-controlled package progress heat exchange with the second air inlet duct 71 and enters from the first exhaust passage and the second exhaust passage 72
It is indoor.Traditional air conditioner is used for a long time, is easy to have a adverse impact to people, such as induces headache, dizzy or arthralgia.With tradition
Air-conditioning is compared, and the device is fast to the adjustment speed of air themperature, and the drying that the air after adjusting will not be made to become, the sky after adjusting
The infinite approach natural wind of gas, long-time service will not cause ill symptoms.The device manufacturing is at low cost, low energy consumption, can be extensive
Apply to on-board air conditioner field.
Preferably, the outer machine 80 offers heat release hole 81, is conducive to the heat that cooling mechanism 60 is discharged, is conducive to heat dissipation.
The interior machine 70 is equipped with the electric cabinet 73 for controlling temperature-controlled package, by electric cabinet 73, the sky that device can be discharged
Gas carries out temperature and wind speed is adjusted, easy to operate.
In conclusion a kind of temperature-controlled package provided by the utility model and its temperature-adjusting device, have to air
Temperature adjust it is high-efficient, effect is obvious, manufacturing cost is low and energy conservation and environmental protection the characteristics of, the utility model using physics drop
Temperature does not use refrigerant, nontoxic, is not easy the drying that the air after making to adjust becomes.
Above-described embodiment is the preferable implementation of the utility model, and in addition to this, the utility model can be with other sides
Formula realizes that any obvious replacement is in the protection model of the utility model under the premise of not departing from the technical program design
Within enclosing.
Claims (10)
1. a kind of temperature-controlled package, it is characterised in that: the air conversion chamber including being equipped with inner cavity, the air conversion chamber are equipped with
First air inlet duct, the first exhaust passage, refrigeration mechanism and wind guiding mechanism, the refrigeration mechanism include be set to air conversion chamber half
Conductor cooling piece, the semiconductor chilling plate include first end and second end, and first end and second end is located at air conversion
Room it is inside and outside；The wind guiding mechanism be used for by outside air from the first air inlet duct sucking air conversion chamber inner cavity via
Refrigeration mechanism refrigeration or heating are discharged from the first exhaust passage again.
2. a kind of temperature-controlled package according to claim 1, it is characterised in that: the refrigeration mechanism further includes that setting exists
In air conversion chamber and the heat-conducting part with the first end in contact of semiconductor chilling plate, the hollow setting of the heat-conducting part and wind guiding mechanism
In heat-conducting part.
3. a kind of temperature-controlled package according to claim 2, it is characterised in that: the heat-conducting part is externally provided with sealant,
The sealant is externally provided with thermal insulation layer, and there are gaps between the sealant and thermal insulation layer to form distinguished and admirable road, the heat-conducting part
Equipped with the first air inlet and the first air outlet, the air conversion chamber is provided with the second air inlet and the second air outlet, and described
One air inlet, distinguished and admirable road, the second air inlet are sequentially communicated to form the first air inlet duct, first air outlet and the second air outlet
It is connected to form the first exhaust passage.
4. a kind of temperature-controlled package according to claim 1, it is characterised in that: the wind guiding mechanism includes centrifugal fan
With the actuator for driving centrifugal fan to rotate, the centrifugal fan rotation is carried in air conversion chamber, the actuator
It is arranged outside air conversion chamber, the output shaft of the actuator passes through air conversion chamber and connect with centrifugal fan.
5. a kind of temperature-controlled package according to claim 4, it is characterised in that: the temperature-controlled package further includes setting
In the cooling mechanism outside the air conversion chamber and for radiating to the second end of semiconductor chilling plate, the cooling mechanism
Including the radiator fan for contacting at the radiating block of the second end of semiconductor chilling plate and being arranged on radiating block.
6. a kind of temperature-controlled package according to claim 5, it is characterised in that: the radiating block is set to air conversion
On the outer wall of room, sealing heat-conducting layer is provided between the second end and radiating block of the semiconductor chilling plate.
7. a kind of temperature-controlled package according to claim 5 or 6, it is characterised in that: the actuator is fixed on heat dissipation
Block.
8. a kind of temperature-adjusting device, it is characterised in that: including interior machine and outer machine, the outer machine is equipped with claim 1-6 such as and appoints
Temperature-controlled package described in meaning one, the interior machine are equipped with the second air inlet duct being connected to the first air inlet duct and go out with first
The second exhaust passage that air duct is connected.
9. a kind of temperature-adjusting device according to claim 8, it is characterised in that: the outer machine offers heat release hole.
10. a kind of temperature-adjusting device according to claim 9, it is characterised in that: the interior machine is equipped with for controlling temperature
Degree adjusts the electric cabinet of component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672431.2U CN209386416U (en) | 2018-10-15 | 2018-10-15 | A kind of temperature-controlled package and its temperature-adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672431.2U CN209386416U (en) | 2018-10-15 | 2018-10-15 | A kind of temperature-controlled package and its temperature-adjusting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209386416U true CN209386416U (en) | 2019-09-13 |
Family
ID=67866718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821672431.2U Expired - Fee Related CN209386416U (en) | 2018-10-15 | 2018-10-15 | A kind of temperature-controlled package and its temperature-adjusting device |
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| Country | Link |
|---|---|
| CN (1) | CN209386416U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
-
2018
- 2018-10-15 CN CN201821672431.2U patent/CN209386416U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190913 Termination date: 20201015 |
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| CF01 | Termination of patent right due to non-payment of annual fee |