CN211146959U - Air temperature adjusting device and air conditioner - Google Patents
Air temperature adjusting device and air conditioner Download PDFInfo
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- CN211146959U CN211146959U CN201921531031.4U CN201921531031U CN211146959U CN 211146959 U CN211146959 U CN 211146959U CN 201921531031 U CN201921531031 U CN 201921531031U CN 211146959 U CN211146959 U CN 211146959U
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Abstract
The utility model provides an air temperature adjusting device and air conditioner, include: an air supply duct; the semiconductor refrigerating sheet is used for adjusting the temperature of the gas in the air supply duct; and the heat conducting piece is used for conducting the heat of the semiconductor refrigerating sheet. The air temperature adjusting device does not generate noise during working, does not need a refrigerant and has low use cost.
Description
Technical Field
The utility model relates to a temperature regulation technical field especially relates to an air temperature regulating device and air conditioner.
Background
In life, air temperature is usually adjusted by an air conditioner, and the air temperature in one area can be changed under the action of the air conditioner.
An Air Conditioner is generally called an Air Conditioner (Air Conditioner), and is a device for adjusting and controlling an Air temperature.
At present, the air conditioner utilizes a compressor to perform refrigeration or heating, but the compressor has relatively high noise when in operation. Meanwhile, the refrigerant is also an indispensable important part for the existing air conditioner, but the refrigerant is continuously consumed along with the use of the air conditioner, which causes the use cost of the air conditioner to become very high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide an air temperature regulating device and air conditioner for solve the problem that the air conditioner among the prior art has the noise big, use cost is high.
In order to solve the above problem, the utility model provides a: an air temperature adjustment device comprising:
an air supply duct;
the semiconductor refrigerating sheet is used for adjusting the temperature of the gas in the air supply duct;
and the heat conducting piece is used for conducting the heat of the semiconductor refrigerating sheet.
As a further improvement of the above technical solution, the heat conducting member includes an aluminum sheet.
As a further improvement of the above technical solution, the air temperature adjusting device further includes an air supply module, and the air supply module is configured to generate a flowing air flow in the air supply duct.
As a further improvement of the above technical solution, a collection module for collecting condensed water is disposed outside the air supply duct.
As a further improvement of the above technical solution, the air temperature adjusting device further includes a heat dissipation module for dissipating heat of the semiconductor cooling fin.
As a further improvement of the above technical solution, the heat dissipation module includes a heat sink and a heat dissipation fan for dissipating heat from the heat sink.
As a further improvement of the above technical solution, the heat dissipation module further includes a heat dissipation air duct for conveying the air flow generated by the heat dissipation fan.
As a further improvement of the above technical solution, the air supply duct and the heat dissipation duct are disposed inside an inner casing;
the semiconductor refrigerating sheet is installed on the inner shell.
As a further improvement of the above technical scheme, an interlayer is arranged between the air supply duct and the heat dissipation duct;
the interlayer is provided with a vent, the air supply duct and the heat dissipation duct are communicated with the vent, and the vent is opposite to the radiator.
The utility model discloses still provide: an air conditioner comprising a climate control device as claimed in any preceding claim.
The utility model has the advantages that: the utility model provides an air temperature adjusting device, include: an air supply duct; the semiconductor refrigerating sheet is used for adjusting the temperature of the gas in the air supply duct; wherein, be provided with the heat-conducting piece in the air supply duct, the heat-conducting piece is used for the heat of conduction semiconductor refrigeration piece.
The temperature in the air supply air duct can be adjusted by utilizing the semiconductor refrigerating sheet, wherein the semiconductor refrigerating sheet does not have a rotating part, so that noise is not generated during working, and meanwhile, the semiconductor refrigerating sheet does not need to use a refrigerant during refrigerating or heating.
The heat conducting piece is arranged in the air supply air duct, and conducts heat of the semiconductor refrigerating sheet through the heat conducting piece, so that the heat conducting area of the semiconductor refrigerating sheet can be increased, and the refrigerating or heating efficiency of the semiconductor refrigerating sheet is improved.
The air temperature adjusting device does not generate noise during working, does not need a refrigerant and has low use cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 shows a first isometric view of an air temperature adjustment device;
FIG. 2 illustrates a second axial side view of an air temperature adjustment device;
FIG. 3 illustrates a front view of an air temperature adjustment device;
fig. 4 shows a partial cross-sectional view of a thermostat.
Description of the main element symbols:
1-air supply duct; 2-semiconductor refrigerating sheet; 3-a heat conducting member; 4-a radiator; 5-a heat dissipation air duct; 6-inner shell; 7-an interlayer; 8-installing a through hole; 9-connecting arm.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Example one
Referring to fig. 1 and 4, in the present embodiment, an air temperature adjusting device is provided, which includes:
an air supply duct 1;
the semiconductor refrigerating sheet 2 is used for adjusting the temperature of the gas in the air supply duct 1;
wherein, be provided with heat-conducting piece 3 in the air supply duct 1, heat-conducting piece 3 is used for the heat of conduction semiconductor refrigeration piece 2.
The semiconductor refrigerating sheet 2 comprises a first heat exchange surface and a second heat exchange surface, wherein the first heat exchange surface can be arranged in the air supply duct 1.
The semiconductor refrigerating plate 2 has the following advantages:
1. no refrigerant is needed, no pollution source exists, and continuous work can be realized;
2. the rotary part is not arranged, so that vibration and noise cannot be generated during working;
3. the semiconductor refrigerating sheet 2 is a current transduction type sheet, and can realize high-precision temperature control by controlling input current;
4. the semiconductor refrigerating plate 2 has small thermal inertia and fast refrigerating and heating time.
The air temperature adjusting device has two working modes, namely a cooling mode and a heating mode.
When the air temperature adjusting device is in a cooling mode, the first heat exchange surface is a cold end, and at the moment, the air temperature in the air supply duct 1 is lower than the ambient temperature; when the air temperature adjusting device is in a heating mode, the first heat exchange surface is a hot end, and at the moment, the air temperature in the air supply duct 1 is higher than the ambient temperature.
Wherein, through changing the direction of electric current, just can realize the switching of refrigeration mode and heating mode.
But semiconductor refrigeration piece 2 electric connection has power module, can be provided with the interface that charges on the power module, and wherein, the interface that charges can use the USB interface.
In the specific use process, a user can also use 110V or 220V mains supply (determined according to the country and the region) to supply power to the air temperature adjusting device, and under the action of devices such as an adapter and the like, the input voltage is converted into the safe voltage of 12V-36V to be used by the semiconductor refrigerating sheet 2.
The power module can be provided with a protection circuit, and when the input current or voltage exceeds a certain value, the protection circuit can automatically cut off the power supply, so that the electric components in the air temperature adjusting device are prevented from being damaged.
The temperature in the air supply air duct 1 can be adjusted by utilizing the semiconductor refrigerating sheet 2, wherein the semiconductor refrigerating sheet 2 has no rotating part, so that noise is not generated during working, and meanwhile, the semiconductor refrigerating sheet 2 does not need to use a refrigerant during refrigerating or heating.
The air temperature adjusting device can adjust the air temperature to realize refrigeration or heating; the air temperature adjusting device does not generate noise during operation, and meanwhile, because a refrigerant is not needed, the cost of use and maintenance of the air temperature adjusting device is low.
The heat conducting piece 3 is arranged in the air supply duct 1, and the heat of the semiconductor refrigerating sheet 2 is conducted through the heat conducting piece 3, so that the heat conducting area of the semiconductor refrigerating sheet 2 can be increased, and the refrigerating or heating efficiency of the semiconductor refrigerating sheet 2 is improved. After air enters the air supply duct 1, the air can be rapidly cooled or heated under the action of the semiconductor refrigerating sheet 2 and the heat conducting piece 3.
The heat conducting piece 3 is in contact with the semiconductor refrigerating sheet 2. Wherein, for improving heat-conducting efficiency and effect, the heat-conducting piece 3 accessible heat conduction silica gel is pasted on the first heat-transfer face of semiconductor refrigeration piece 2.
In the present embodiment, the heat conducting member 3 may be made of aluminum, and specifically, the heat conducting member 3 may be an aluminum sheet. Wherein, the quantity of aluminum sheet can be set as required.
Further, the heat conducting member 3 may be made of a material having a high thermal conductivity, such as iron or copper.
In this embodiment, the air temperature adjusting device may further include an air supply module, and the air supply module is configured to generate a flowing air flow in the air supply duct 1. The air supply module can comprise an air supply fan.
The air supply duct 1 may include an air inlet and an air outlet, and the air supply fan may be directed toward the air inlet of the air supply duct 1. After the air supply fan is started, air flow can flow from the air inlet to the air outlet under the action of air pressure generated by the air supply fan.
Starting temperature adjusting device, semiconductor refrigeration piece 2 and air supply duct 1 all can get into operating condition, and at this moment, in external air can flow into air supply duct 1 from the air inlet, the air in air supply duct 1 can become cold or become hot under the effect of semiconductor refrigeration piece 2 and heat-conducting piece 3, along with the flow of air current, the air that becomes cold or becomes hot can be followed the gas outlet and discharged, improves the temperature in the external local area from this.
In the cooling mode, condensed water is generated in the air supply duct 1, and therefore, a collection module for collecting the condensed water can be arranged outside the air supply duct 1. Wherein the collection module may comprise a water collection cup.
The semiconductor refrigerating plate 2 can generate certain heat during working, and if the heat cannot be effectively dissipated, the refrigerating or heating efficiency of the semiconductor refrigerating plate 2 can be affected.
For this reason, in the present embodiment, the thermostat may further include a heat dissipation module for dissipating heat of the semiconductor chilling plate 2.
The heat dissipation module may include a heat sink 4 and a heat dissipation fan for dissipating heat from the heat sink 4. Wherein, the radiator 4 can adopt a tower radiator, and a plurality of copper pipes can be arranged on the tower radiator for improving the radiating efficiency.
In order to dissipate the heat of the heat sink 4 in time, the heat dissipating module may further include a heat dissipating air duct 5, and the heat dissipating air duct 5 is used for conveying the air flow generated by the heat dissipating fan. The second heat exchange surface of the semiconductor refrigeration sheet 2 can be arranged in the heat dissipation air duct 5, and the radiator 4 can be adhered to the second heat exchange surface of the semiconductor refrigeration sheet 2 through heat conduction silicon glue.
When the semiconductor refrigerating sheet 2 is started, the heat radiation fan is also synchronously started, and the air flow generated by the heat radiation fan takes away the heat on the radiator 4, so that the purpose of radiating the semiconductor refrigerating sheet 2 is achieved.
The air flow generated by the heat dissipation fan is conveyed into the heat dissipation air duct 5 and flows out of the heat dissipation air duct 5 through the exhaust port of the heat dissipation air duct 5.
In the present embodiment, the air supply duct 1 and the heat dissipation duct 5 may be disposed inside an inner casing 6, wherein the semiconductor cooling fins 2 may be mounted on the inner casing 6.
In the present embodiment, the air supply duct 1 and the heat dissipation duct 5 are both disposed on the inner casing 6, wherein an interlayer 7 is disposed between the air supply duct 1 and the heat dissipation duct 5.
The partition 7 has a heat insulation function, and is used for preventing heat exchange between the air supply duct 1 and the heat dissipation duct 5. Specifically, the interior of the interlayer 7 can be a hollow structure, wherein the hollow structure can be filled with glass fiber, asbestos, rock wool, silicate and the like for heat insulation.
In order to improve the heat insulation effect, the outer surface of the interlayer 7 can be coated with heat insulation paint.
The interlayer 7 is provided with a vent, the air supply duct 1 and the heat dissipation duct 5 are both communicated with the vent, and the vent is opposite to the radiator 4. When the air temperature adjusting device is in a refrigeration mode, the vent can be opened, at the moment, cold air flow in the air supply air channel 1 can enter the heat dissipation air channel 5 through the vent, and the vent is opposite to the radiator 4, so that the radiator 4 can obtain certain heat dissipation and cooling under the action of the cold air flow, the heat dissipation efficiency of the radiator 4 can be improved, and the refrigeration efficiency of the semiconductor refrigeration sheet 2 is higher.
As shown in fig. 2, the semiconductor chilling plate 2 penetrates through the partition layer 7, wherein the partition layer 7 is provided with a mounting through hole 8 for mounting the semiconductor chilling plate 2, and a heat insulation gasket can be arranged in the mounting through hole 8 for improving the sealing property and the heat insulation property.
When installing, need to pay attention to radiator fan's position, avoid radiator fan's production air current to flow to the vent.
The interlayer 7 is arranged on one side of the air supply duct 1 and can be provided with an inclined plane, and condensed water can flow into the water collection cup conveniently through the inclined plane.
In this embodiment, the inner housing 6 may be disposed inside an outer housing, wherein the outer housing is provided with heat dissipation holes. The heat dissipation holes are not aligned with the exhaust ports of the heat dissipation air duct 5, and through the arrangement, hot air in the heat dissipation air duct 5 can be prevented from being directly exhausted to the outside of the outer shell from the exhaust ports, and the hot air can be cooled in the space between the inner shell 6 and the outer shell in advance and then exhausted to the outside of the outer shell from the heat dissipation holes.
In this embodiment, the housing may be provided in a rectangular parallelepiped shape, and the side surfaces of the housing are located on both sides of the front and back surfaces thereof. The exhaust port of the heat dissipation duct 5 may be aligned with the back of the housing, and the heat dissipation holes may be disposed on the side of the housing.
The back of the housing may be provided with an air supply hole, wherein the air outlet of the air supply duct 1 may be communicated with the air supply hole through a conduit, thereby preventing the air flow discharged from the heat dissipation duct 5 from flowing into the air supply hole.
The inner shell 6 is detachably connected with the outer shell. Wherein the front side of the outer shell may comprise an opening through which the inner shell 6 is mounted within the outer shell.
Because the inner shell 6 is detachably connected with the outer shell, the semiconductor refrigerating sheet 2 and other components can be installed on the inner shell 6, and then the inner shell 6 is installed in the outer shell. After the inner shell 6 is placed in the outer shell, an air supply fan and a water collection cup can be arranged in the outer shell, and then a blocking cover is arranged on the outer shell, wherein the blocking cover is used for closing an opening of the outer shell. The blocking cover can be provided with an air inlet hole which is opposite to the air inlet of the air supply duct 1.
As shown in fig. 3, the outer wall of the inner housing 6 may be provided with two connecting arms 9, and the two connecting arms 9 are symmetrically arranged on two sides of the inner housing 6.
Correspondingly, the inner wall of the housing may be provided with a sliding groove corresponding to the connecting arm 9, wherein the connecting arm 9 is inserted into the sliding groove and slidably connected therewith.
To fix the position of the inner housing 6, the inner housing 6 may be fixed in the outer housing by screws, snaps, or the like.
In order to reduce the production cost, the inner shell 6 and the outer shell can be made of plastics. Specifically, the inner shell 6 and the outer shell can be made of other insulating and high-ignition-point materials according to needs, so that electric shock or fire and the like are avoided.
In this embodiment, the air temperature adjusting device may further include a temperature monitoring module and a temperature control module.
The temperature monitoring module can include a temperature sensor, wherein the temperature sensor can be arranged in the air supply duct 1, and the temperature in the air supply duct 1 can be monitored through the temperature monitoring module.
The temperature control module may include a processor, etc., wherein the temperature control module may be used to control the temperature in the air supply duct 1. It should be noted that there is a limit value for the adjustable range of the temperature in the supply air duct 1, which is related to the specification of the semiconductor cooling fins 2.
After the air temperature adjusting device is started, a user can set a required temperature value by using a button, a remote controller, a mobile phone or other terminals. The temperature sensor transmits the monitored temperature signal to the processor, when the monitored temperature value is different from the set temperature value, the control module sends a control signal to the power supply module, and the power supply module can adjust the input power after receiving the control signal, so that the control of the temperature in the air supply air duct 1 is realized.
The semiconductor refrigeration piece 2 is simple in structure and small, and therefore, in the embodiment, the inner shell 6 and the outer shell can be made into a proper size according to needs, so that the air temperature adjusting device is convenient to carry.
The air temperature adjusting device realizes temperature adjustment through the semiconductor refrigerating sheet 2, has good refrigerating and heating effects, and meanwhile, has small volume and compact structure, is convenient to move and can be carried about. The user can place the air temperature adjusting device on the desktop, and the temperature of the body surface is reduced or increased through cold air or hot air sent out from the air supply hole.
In order to facilitate the user to move the air temperature adjusting device, the shell can be provided with a handle.
In this embodiment, an air conditioner is also proposed, which includes the air temperature adjusting device. The air conditioner can be used for adjusting the air temperature in the areas such as rooms, elevators, cars and the like.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention.
In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (6)
1. An air temperature adjustment device characterized by comprising:
an air supply duct;
the semiconductor refrigerating sheet is used for adjusting the temperature of the gas in the air supply duct;
the air supply duct is internally provided with a heat conducting piece, and the heat conducting piece is used for conducting heat of the semiconductor refrigerating sheet;
the air temperature adjusting device also comprises a heat dissipation module used for dissipating heat of the semiconductor refrigerating sheet;
the heat dissipation module comprises a heat radiator and a heat dissipation fan for dissipating heat of the heat radiator;
the heat dissipation module also comprises a heat dissipation air channel which is used for conveying airflow generated by the heat dissipation fan;
the air supply duct and the heat dissipation duct are arranged inside an inner shell;
the semiconductor refrigerating sheet is arranged on the inner shell, and a first heat exchange surface and a second heat exchange surface of the semiconductor refrigerating sheet are respectively arranged in the air supply duct and the heat dissipation duct;
and an interlayer is arranged between the air supply duct and the heat dissipation duct, wherein the outer surface of the interlayer is coated with heat insulation coating.
2. The thermostat of claim 1, wherein the thermally conductive member comprises an aluminum sheet.
3. The air temperature adjusting apparatus according to claim 1, further comprising an air supply module for generating a flowing air flow in the air supply duct.
4. The air temperature adjusting apparatus according to claim 1, wherein a collection module for collecting condensed water is provided outside the air supply duct.
5. The air temperature adjusting device according to claim 1, wherein a vent is provided on the partition, and the air supply duct and the heat dissipation duct are both communicated with the vent, which is opposite to the heat sink.
6. An air conditioner characterized by comprising the air temperature adjusting device according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921531031.4U CN211146959U (en) | 2019-09-12 | 2019-09-12 | Air temperature adjusting device and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921531031.4U CN211146959U (en) | 2019-09-12 | 2019-09-12 | Air temperature adjusting device and air conditioner |
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| Publication Number | Publication Date |
|---|---|
| CN211146959U true CN211146959U (en) | 2020-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921531031.4U Active CN211146959U (en) | 2019-09-12 | 2019-09-12 | Air temperature adjusting device and air conditioner |
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| CN (1) | CN211146959U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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2019
- 2019-09-12 CN CN201921531031.4U patent/CN211146959U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115076813A (en) * | 2022-06-23 | 2022-09-20 | 珠海格力电器股份有限公司 | Heat exchange system, air conditioner and control method |
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