CN204796016U - Heat abstractor and electron terminal - Google Patents
Heat abstractor and electron terminal Download PDFInfo
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- CN204796016U CN204796016U CN201520511787.8U CN201520511787U CN204796016U CN 204796016 U CN204796016 U CN 204796016U CN 201520511787 U CN201520511787 U CN 201520511787U CN 204796016 U CN204796016 U CN 204796016U
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- heat
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- heating panel
- heat abstractor
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Abstract
The utility model discloses a heat abstractor, install on the circuit board, a chip heat dissipation for giving on the circuit board, heat abstractor includes first heating panel, first heating panel has first face, be provided with on the first face one be used for with the chip butt, and be used for transmitting the heat on the chip to the first boss of first heating panel, heat abstractor still includes a heat pipe, first heating panel still have with the second face of main board facial features to setting up, the heat pipe is laminated on the second face, first boss and second face correspond the partly on the extension route of heat pipe at least of position. The utility model discloses a heat abstractor sets up the boss through the one side at first heating panel, and the another side sets up a heat pipe, and evenly spread the heat to the second face by the heat pipe and distribute the heat rapidly behind the leading -in heat pipe of heat that gives out through the chip of first boss on with the circuit board, the utility model discloses a heat abstractor is thinner, does benefit to the more slimming of electron terminal.
Description
Technical field
The utility model relates to heat abstractor technical field, particularly a kind of heat abstractor and electric terminal.
Background technology
Electric terminal, is considered as example with LED electrical, enters super clear, high colour gamut, ultrathin epoch, TV multifunction, the integrated level of TV motherboard is very high, the speed goes of chip process is high, and the caloric value of chip is very large, if not in time by the heat Quick diffusing of chip, easily there is flower screen in TV, picture pauses, and the phenomenon such as repeatedly to restart, reduces the life-span of TV.
The chip surface of mainboard heat radiation normally on mainboard of existing TV is coated with silicone grease, larger gilled radiator is fixed to the surface of chip, is taken away by the heat of chip.Reduce the temperature of high-power chip, the gilled radiator heat radiation just needing thickness larger just can reach the temperature increase requirement of chip; But in the confined space of thin TV, radiator must do very thin, could meet the cooling requirements of thin TV high-power chip, and existing gilled radiator seriously constrains the development of ultra-thin television slimming.
Utility model content
Main purpose of the present utility model is to provide a kind of heat abstractor, is intended to solve existing heat abstractor thickness comparatively large, constrains the problem of electric terminal slimming.
The utility model provides a kind of heat abstractor, be installed on circuit board, for to the chip cooling on circuit board, described heat abstractor comprises the first heating panel, described first heating panel has the first plate face, described first plate face is provided with one for abut with described chip and for by the delivered heat on chip to the first boss of described first heating panel; Described heat abstractor also comprises a heat pipe, described first heating panel also has the second plate face be oppositely arranged with described first plate face, described heat pipe fits on described second plate face, further, described first boss and described second plate face correspondence position at least partially on the extension path of described heat pipe.
Preferably, described first boss has the bearing surface for abutting with described chip, and described bearing surface is in order to cover the one side of described chip towards described first boss completely.
Preferably, described second plate forms an accepting groove facing to described first boss sunken inside, is provided with a heat-conducting block in described accepting groove, and described heat-conducting block connects the bottom of described accepting groove and described heat pipe.
Preferably, described heat pipe is flat hot pipe, and this flat hot pipe is arranged in bending on described second plate face.
Preferably, described first plate face is also provided with the first elastic conducting warmware, described first boss is abutted with described chip by described first elastic conducting warmware.
Preferably, described heat abstractor also comprises the second heating panel, described second heating panel on a plate face of described first heating panel, be provided with one second boss, described first heating panel and the second heating panel are for clamping described circuit board, and described heat abstractor clamps described chip by described first boss and the second boss.
Preferably, described second boss is provided with the second elastic conducting warmware towards the one side of described first boss, and described second boss is abutted with the back side of described chip in the position of described circuit board by described second elastic conducting warmware.
For achieving the above object, the utility model also provides a kind of electric terminal, described electric terminal is provided with the heat abstractor described in above-mentioned any one.
Preferably, described electric terminal is TV.
Heat abstractor of the present utility model is by arranging boss in the one side of the first heating panel, another side arranges after the heat that the chip on circuit board gives out imports heat pipe rapidly by the first boss by a heat pipe, by heat pipe, even heat is diffused to the second plate face of the first heating panel and heat is distributed rapidly, for traditional gilled radiator, heat abstractor of the present utility model is thinner, is beneficial to electric terminal (as: TV) more slimming.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model heat abstractor first embodiment;
Fig. 2 is the structural representation of the utility model heat abstractor second embodiment;
Fig. 3 is the structural representation of the circuit board coordinated with the utility model heat abstractor;
Fig. 4 is the structural representation that the 3rd embodiment of the utility model heat abstractor and circuit board assemble when using;
Fig. 5 is the structural representation of the second heating panel of heat abstractor in Fig. 4;
Fig. 6 is C portion structure for amplifying schematic diagram in Fig. 4.
The realization of the utility model object, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
With reference to Fig. 1, Fig. 2 and Fig. 3, the utility model provides a kind of heat abstractor, be installed on circuit board 30, dispel the heat for giving the chip 300 on circuit board 30, described heat abstractor comprises the first heating panel 10, described first heating panel 10 has the first plate face 11, described first plate face 11 is provided with the first boss 13 for abutting with described chip 300; Described first heating panel 10 also has the second plate face 12 be oppositely arranged with described first plate face 11, described heat pipe 14 to fit on described second plate face 12, and the correspondence position in described first boss 13 and described second plate face 12 is on the extension path of described heat pipe 14.
Aluminium is lighter, cheap, ductility is good, and the feature such as good heat conductivity, and general heat abstractor is aluminium all preferably.Heat abstractor in the present embodiment can be the good material of heat conductivility, and as good metals of heat conductivility such as iron, aluminium or copper, in view of the advantage of above-mentioned aluminium, the preferred aluminium of the heat abstractor in the present embodiment is base material, followingly will be described for aluminium.
The first boss 13 in the present embodiment can be the aluminium block being separately set in described first plate face 11, and this aluminium block can weld with the first plate face 11, and in addition, described first boss 13 can also be formed towards the first plate face 11 is recessed by the second plate face 12.Described first boss 13 abuts with chip 300, for by the heat conduction of chip 300 to the first heating panel 10, when described chip 300 adstante febre, heat is passed through the first boss 13 by chip 300, its heat is conducted to rapidly heat pipe 14 by the first boss 13, heat evenly diffuses to and quickly diffuses in air to the second plate face 12, plate face 12, second by heat on heat pipe 14, completes heat radiation.
Described heat pipe 14 is by metal shell, and the heat recipient fluid be arranged in metal shell forms (heat pipe two ends are closed), and the preferred aluminium shell of metal shell, heat recipient fluid can be water, methyl alcohol, ethanol etc.After heat pipe 14 absorbs the heat sent from the first boss 13, the liquid gasification of heat pipe 14 inside, by delivered heat to whole heat pipe 14, heat is distributed to rapidly the second plate face 12 of the first heating panel 10 by whole heat pipe 14, described chip 300 temperature so just can be reduced too high and cause system failure or chip 300 temperature sharply to raise, the accident of burning chip 300 occurs.
Heat abstractor of the present utility model is by arranging boss 13 in the one side of the first heating panel 10, another side arranges a heat pipe 14, by heat pipe 14, even heat is diffused to the second plate face 12 of the first heating panel 10 after the heat that the chip 300 on circuit board 30 gives out being imported rapidly heat pipe 14 by the first boss 13 and heat is distributed rapidly, for traditional gilled radiator, heat abstractor of the present utility model is thinner, is beneficial to electric terminal (as: TV) more slimming.
Further, with reference to Fig. 1, described first boss 13 has for abutting with described chip 300 and the bearing surface 131 covered completely towards the one side of described first boss 13 by described chip 300.
Concrete, described first boss 13 is defined as A face towards the one side of described chip 300, chip is defined as B face towards the one side of described first boss 13, A face directly contacts with B, overlap with the B face size in face of A face directly affects chip 300 delivered heat speed, the area of the two contact that overlaps is larger, and the effect of chip 300 delivered heat is better, poorer on the contrary.B face covers and can be gone out by the delivered heat that chip 300 gives out to the full extent by A face completely.
Further, see figures.1.and.2, described second plate face 12 forms an accepting groove 130 towards described first boss 13 sunken inside, is provided with a heat-conducting block 15 in described accepting groove 130, and described heat-conducting block 15 connects bottom and the described heat pipe 14 of described accepting groove 130.
Although described first boss 13 can have multiple setting, considers cost, and processing complexity problem, the first boss 13 in the present embodiment is formed by the second plate face 12 is recessed towards the direction in the first plate face 11.In order to strengthen the heat transfer efficiency of the first boss 13 and heat pipe 14, a heat-conducting block 15 is had additional in the accepting groove 130 of described first boss 13, as aluminium block etc., the bottom of this heat-conducting block 15 and accepting groove 130, and heat pipe 14 contact can make heat-conducting effect better, so that heat is absorbed rear rapid diffusion by heat pipe 14.
Further, continue with reference to Fig. 2, described heat pipe 14 is flat hot pipe, and this heat pipe 14 is arranged in bending on described second plate face 12.
Particularly, the heat pipe 14 of flat can make heat pipe 14 increase with the contact area of heat-conducting block 15, is conducive to heat and leads from heat-conducting block 15 transmission rate of heat pipe 14, increase heat.In addition, the heat pipe 14 of flat is arranged (as " S " shape is arranged) in bending, relative to the heat pipe that straight line is arranged, add the effective contact area between heat pipe 14 and whole second plate face 12, like this, just can make heat uniform guiding first heating panel 10 from heat pipe 14, better heat-radiation effect.
Further, with reference to Fig. 4 and Fig. 6, described first plate face 11 is also provided with the first elastic conducting warmware 16, and described first boss 13 is abutted with described chip 300 by described first elastic conducting warmware 16.
Particularly, arranging of the first elastic conducting warmware 16 can make the first boss 13 contact more closely with described chip 300, the better effects if of Heat transmission; In addition, the setting of described first elastic conducting warmware 16 also plays a protective role to chip 300.Herein, described first elastic conducting warmware 16 preferably silica gel piece.
Further, with reference to Fig. 4 and Fig. 5, described heat abstractor also comprises the second heating panel 20, one plate face of described second heating panel 20 is provided with one second boss 21, described circuit board 30 is arranged between described first heating panel 10 and the second heating panel 20, and described heat abstractor clamps described chip 300 by described first boss 13 and the second boss 21.
After the equipment being provided with this heat abstractor uses for a long time, circuit board 30 may because being out of shape thus causing the first boss 13 can not compress described chip 300, chip 300 on circuit board 30 can not fully be contacted with the first boss 13, produce gap, like this, chip 300 temperature can sharply raise, and burns chip.In the present embodiment, described circuit board 30 can be supported by the second boss 21 of described second heating panel 20, circuit board 30 clamps by the first heating panel 10 and the second heating panel 20, chip 300 is between the first boss 13 and the second boss 21, and at the first boss 13 and the second boss 21 by chip 300 held tight, ensure chip 300 and fully contacting between the first boss 13, prevent chip 300 to be burned.
Further, with reference to Fig. 6, described second boss 21 is provided with the second elastic conducting warmware 22 towards the one side of described first boss 13, and described second boss 21 is abutted with the back side of described chip 300 in the position of described circuit board 30 by described second elastic conducting warmware 22.
Described second elastic conducting warmware 21 plays cushioning effect between the second boss 21 and circuit board 30.Particularly, on the one hand, the second elastic conducting warmware 22 can avoid the local deformation of circuit board 30 to cause producing gap between chip 300 and the first boss 13; On the other hand, the second elastic conducting warmware 22 can make circuit board 30 more stable between the first heating panel 10 and the second heating panel 20.
In addition, described heat abstractor is close-connected with circuit board 30 when installation.In the present embodiment, described first heating panel 10 and the second heating panel 20 are fixed by screws on circuit board 30.Concrete, with reference to Fig. 2, described first heating panel 10 from described second plate face 12 towards the recessed formation first in the direction clamp lug 17 in the first plate face 11.With reference to Fig. 3, described second heating panel 20, towards the recessed formation in direction of described first heating panel 10 second clamp lug 23 corresponding with described first clamp lug 17 position, described first clamp lug 17 and the second clamp lug 23 all offers screw.When mounted, passed the screw of the first clamp lug 17 and the second clamp lug 23 by a screw, and the screw 301 on circuit board 30, circuit board 30 is fixed between the first heating panel 10 and the second heating panel 20 by described screw and screw by described heat abstractor.
The utility model also provides a kind of electric terminal, described electric terminal is provided with the heat abstractor described in above-mentioned any one.
Particularly, owing to being provided with the heat abstractor described in above-mentioned any embodiment in this electric terminal, therefore, all beneficial effects that this heat abstractor has, this electric terminal also should one should to have, and does not repeat one by one at this.
In addition, the preferred TV of this electric terminal, as ultra-thin television.
The foregoing is only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (9)
1. a heat abstractor, be installed on circuit board, for to the chip cooling on circuit board, it is characterized in that, described heat abstractor comprises the first heating panel, described first heating panel has the first plate face, described first plate face is provided with one for abut with described chip and for by the delivered heat on chip to the first boss of described first heating panel; Described heat abstractor also comprises a heat pipe, described first heating panel also has the second plate face be oppositely arranged with described first plate face, described heat pipe fits on described second plate face, further, described first boss and described second plate face correspondence position at least partially on the extension path of described heat pipe.
2. heat abstractor as claimed in claim 1, it is characterized in that, described first boss has the bearing surface for abutting with described chip, and described bearing surface is in order to cover the one side of described chip towards described first boss completely.
3. heat abstractor as claimed in claim 1, it is characterized in that, described second plate forms an accepting groove facing to described first boss sunken inside, is provided with a heat-conducting block in described accepting groove, and described heat-conducting block connects the bottom of described accepting groove and described heat pipe.
4. heat abstractor as claimed in claim 1, it is characterized in that, described heat pipe is flat hot pipe, and this flat hot pipe is arranged in bending on described second plate face.
5. heat abstractor as claimed in claim 1, is characterized in that, described first plate face is also provided with the first elastic conducting warmware, and described first boss is abutted with described chip by described first elastic conducting warmware.
6. heat abstractor as claimed in claim 1, it is characterized in that, described heat abstractor also comprises the second heating panel, described second heating panel on a plate face of described first heating panel, be provided with one second boss, described first heating panel and the second heating panel are for clamping described circuit board, and described heat abstractor clamps described chip by described first boss and the second boss.
7. heat abstractor as claimed in claim 6, it is characterized in that, described second boss is provided with the second elastic conducting warmware towards the one side of described first boss, and described second boss is abutted with the back side of described chip in the position of described circuit board by described second elastic conducting warmware.
8. an electric terminal, is characterized in that, described electric terminal is provided with the heat abstractor as described in any one of claim 1 to 7.
9. electric terminal as claimed in claim 8, it is characterized in that, described electric terminal is TV.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520511787.8U CN204796016U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor and electron terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520511787.8U CN204796016U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor and electron terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204796016U true CN204796016U (en) | 2015-11-18 |
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ID=54535971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520511787.8U Active CN204796016U (en) | 2015-07-14 | 2015-07-14 | Heat abstractor and electron terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204796016U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993393A (en) * | 2017-02-28 | 2017-07-28 | 华为机器有限公司 | A kind of heat dissipation equipment and terminal |
| CN108334177A (en) * | 2018-03-14 | 2018-07-27 | 深圳市世纪联合创新科技有限公司 | A kind of water-cooling heat radiating system of waterproof cabinet |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN109392282A (en) * | 2017-08-02 | 2019-02-26 | 启碁科技股份有限公司 | Electronic device |
-
2015
- 2015-07-14 CN CN201520511787.8U patent/CN204796016U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993393A (en) * | 2017-02-28 | 2017-07-28 | 华为机器有限公司 | A kind of heat dissipation equipment and terminal |
| CN106993393B (en) * | 2017-02-28 | 2020-11-17 | 华为机器有限公司 | Heat dissipation equipment and terminal |
| CN109392282A (en) * | 2017-08-02 | 2019-02-26 | 启碁科技股份有限公司 | Electronic device |
| CN109392282B (en) * | 2017-08-02 | 2020-06-02 | 启碁科技股份有限公司 | Electronic device |
| CN108334177A (en) * | 2018-03-14 | 2018-07-27 | 深圳市世纪联合创新科技有限公司 | A kind of water-cooling heat radiating system of waterproof cabinet |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |