CN202979546U - Double-face radiator - Google Patents

Double-face radiator Download PDF

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Publication number
CN202979546U
CN202979546U CN 201220592826 CN201220592826U CN202979546U CN 202979546 U CN202979546 U CN 202979546U CN 201220592826 CN201220592826 CN 201220592826 CN 201220592826 U CN201220592826 U CN 201220592826U CN 202979546 U CN202979546 U CN 202979546U
Authority
CN
China
Prior art keywords
joint pin
fin
supporting plate
mounting plate
connecting column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220592826
Other languages
Chinese (zh)
Inventor
李水冰
杨斌
李巧兵
李柏兵
李巧芝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Welcome Science & Technology Co Ltd
Original Assignee
Wuhan Welcome Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Welcome Science & Technology Co Ltd filed Critical Wuhan Welcome Science & Technology Co Ltd
Priority to CN 201220592826 priority Critical patent/CN202979546U/en
Application granted granted Critical
Publication of CN202979546U publication Critical patent/CN202979546U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The present utility model relates to a radiator, especially to a double-face radiator which can be used for realizing heat radiation of front and back sides of a circuit board and is low in costs. The double-face radiator is composed of two sets o heat radiation assemblies which are symmetrically arranged in an upper and down way, the upper set of heat radiation assembly comprises an upper supporting plate, an upper radiating fin is arranged above the upper supporting plate, the upper radiating fin and the upper supporting plate are connected through a first upper connecting column, a second upper connecting column is arranged on the lower part of the upper supporting plate, the second upper connecting column is provided with an installing hole running through the upper supporting plate; the lower set of heat radiation assembly comprises a lower supporting plate, a lower radiating fin is arranged below the upper supporting plate, the lower radiating fin and the lower supporting plate are connected through a first lower connecting column, the upper part of the lower supporting plate is provided with a second lower connecting column, the second lower connecting column is provided with an installing hole running through the lower supporting plate, and positions of the second upper connecting column and the second lower connecting column are corresponding. The radiator is convenient to install and low in costs.

Description

A kind of double surface radiators
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of double surface radiators easy for installation that can dispel the heat to the circuit board tow sides simultaneously.
Background technology
Circuit board is the main carrying person of electronic devices and components and the supplier of electrical connection thereof, in the electronic devices and components course of work, more heat can be produced, if can not in time these heats be dispersed, the operating efficiency of electronic devices and components will be affected, therefore, all to use radiator.Fast development along with electronic technology, circuit board also develops into double-sided PCB by initial single-sided circuit board, radiator in the past can not satisfy the radiating requirements of double-sided PCB, and due to the structure that has radiator now, two cover radiators are installed simultaneously more difficult on a circuit board two sides, dismantle also very inconveniently, and cost compare is high, is unfavorable for the further developing of electronic product, universal.
Summary of the invention
The utility model is mainly for the existing above-mentioned technical problem of prior art, and a kind of double surface radiators easy for installation that can dispel the heat to the circuit board tow sides simultaneously is provided.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of double surface radiators, formed by the upper and lower two symmetrically arranged radiating subassemblies of cover, wherein, a cover radiating subassembly comprises mounting plate, described mounting plate top is provided with fin, described upper fin and mounting plate are connected by joint pin on first, the mounting plate bottom is provided with joint pin on second, and joint pin offers the installing hole that connects mounting plate on described second; Below one the cover radiating subassembly comprise bottom plate, described mounting plate below is provided with lower fin, described lower fin is connected by first time joint pin with bottom plate, bottom plate top is provided with joint pin second time, described second time joint pin offers the installing hole that connects bottom plate, and joint pin is corresponding with the position of second time joint pin on described second.The utility model has been optimized syndeton by two cover radiating subassemblies are reasonably mated, and makes it can be arranged on simultaneously easily the two sides of circuit board, the effect that realization is dispelled the heat simultaneously to the double-sided PCB upper and lower faces, mount and dismount very conveniently, cost is low, is conducive to promote.
As preferably, described upper fin and lower fin are made by aluminium alloy.The good heat conductivity of aluminium, heat dissipation capacity is large, rapid heat dissipation; withstand voltage height, metal thermal intensity is high, due to its easy extrusion modling; can extrude different shape fin; therefore the outward appearance novel and beautiful, ornamental very strong, and after oxidation, the generation aluminium oxide is best diaphragm; can avoid its further oxidation; therefore it is not afraid of oxide etch, and is double and cheap, cost is low, is suitable for popularization.
As preferably, on described first on joint pin, second joint pin, first time joint pin and second time joint pin be the copper post.Copper post good heat conductivity, sturdy and durable.
As preferably, described upper fin offers the upper heat radiation conduit of many opening upwards, and described upper fin offers many lower heat radiation conduits that Open Side Down.This structure has improved the heat dispersion of fin.
As preferably, described mounting plate and bottom plate are iron plate.The iron plate bearing capacity is large, and is sturdy and durable, not yielding.
The utility model reasonably mates two cover radiating subassemblies, has optimized syndeton, makes it can be arranged on simultaneously easily the two sides of circuit board, the effect that realization is dispelled the heat simultaneously to the double-sided PCB upper and lower faces, mount and dismount very conveniently, cost is low, is conducive to promote.
Description of drawings
Accompanying drawing 1 is the structural representation of a kind of double surface radiators of the utility model.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail, obviously, described embodiment is only part embodiment of the present utility model.
Embodiment 1:
Referring to accompanying drawing 1, a kind of double surface radiators of the utility model, formed by the upper and lower two symmetrically arranged radiating subassemblies of cover, wherein, a cover radiating subassembly comprises mounting plate 1, described mounting plate 1 top is provided with fin 2, described upper fin and mounting plate are connected by joint pin 3 on first, and the mounting plate bottom is provided with joint pin 4 on second, and joint pin offers the installing hole 13 that connects mounting plate on described second; Below one the cover radiating subassembly comprise bottom plate 5, described mounting plate 5 belows are provided with lower fin 6, described lower fin is connected by first time joint pin 7 with bottom plate, bottom plate top is provided with joint pin 8 second time, described second time joint pin offers the installing hole that connects bottom plate, and joint pin 4 is corresponding with the position of second time joint pin on described second.Wherein, upper fin 2 and lower fin 6 are made by aluminium alloy, and the thermal conductivity of aluminium is good; heat dissipation capacity is large, rapid heat dissipation, withstand voltage height; metal thermal intensity is high, due to its easy extrusion modling, can extrude different shape fin; therefore the outward appearance novel and beautiful, ornamental very strong, and after oxidation, the generation aluminium oxide is best diaphragm; can avoid its further oxidation; therefore it is not afraid of oxide etch, and is double and cheap, cost is low, is suitable for popularization.On first on joint pin, second joint pin, first time joint pin and second time joint pin be the copper post, good heat conductivity, sturdy and durable.Mounting plate and bottom plate are iron plate.The iron plate bearing capacity is large, and is sturdy and durable, not yielding.
Upper fin 2 offers the upper heat radiation conduit 11 of many opening upwards, and described upper fin 6 offers many lower heat radiation conduits 12 that Open Side Down, has improved the heat dispersion of fin.
During use, circuit board 9 is arranged on baffle plate 10, then mounting plate and bottom plate are placed on respectively the upper and lower faces of circuit board 9, and make joint pin on second and the second time joint pin installing hole on the alignment circuit plate simultaneously, then use connecting bolt by installing hole 13, mounting plate, circuit board and bottom plate to be connected and get final product.
Should be understood that above-described embodiment only to be used for explanation the utility model and be not used in restriction scope of the present utility model.Should be understood that in addition those skilled in the art can make various changes or modifications the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims limited range equally.

Claims (5)

1. double surface radiators, it is characterized in that: formed by the upper and lower two symmetrically arranged radiating subassemblies of cover, wherein, a cover radiating subassembly comprises mounting plate (1), described mounting plate (1) top is provided with fin (2), described upper fin and mounting plate are connected by joint pin (3) on first, the mounting plate bottom is provided with joint pin on second (4), and joint pin offers the installing hole (13) that connects mounting plate on described second; Below one the cover radiating subassembly comprise bottom plate (5), described mounting plate (5) below is provided with lower fin (6), described lower fin is connected by first time joint pin (7) with bottom plate, bottom plate top is provided with second time joint pin (8), described second time joint pin offers the installing hole that connects bottom plate, and joint pin (4) is corresponding with the position of second time joint pin on described second.
2. new radiator according to claim 1, it is characterized in that: described upper fin (2) and lower fin (6) are made by aluminium alloy.
3. new radiator according to claim 1 is characterized in that: on described first on joint pin, second joint pin, first time joint pin and second time joint pin be the copper post.
4. new radiator according to claim 1, it is characterized in that: described upper fin (2) offers the upper heat radiation conduit (11) of many opening upwards, and described upper fin (6) offers many lower heat radiation conduits (12) that Open Side Down.
5. new radiator according to claim 1 is characterized in that: described mounting plate (1) and bottom plate (2) are iron plate.
CN 201220592826 2012-11-12 2012-11-12 Double-face radiator Expired - Fee Related CN202979546U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220592826 CN202979546U (en) 2012-11-12 2012-11-12 Double-face radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220592826 CN202979546U (en) 2012-11-12 2012-11-12 Double-face radiator

Publications (1)

Publication Number Publication Date
CN202979546U true CN202979546U (en) 2013-06-05

Family

ID=48520560

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220592826 Expired - Fee Related CN202979546U (en) 2012-11-12 2012-11-12 Double-face radiator

Country Status (1)

Country Link
CN (1) CN202979546U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103915526A (en) * 2014-03-20 2014-07-09 项疆腾 Avalanche photodiode coupler with heat dissipation device
CN107239120A (en) * 2017-05-18 2017-10-10 北京嘉楠捷思信息技术有限公司 Electronic equipment
CN108633230A (en) * 2018-06-26 2018-10-09 江苏英杰电子器件有限公司 A kind of radiator that heat absorption capacity is fabulous
CN109219320A (en) * 2018-10-31 2019-01-15 北京地平线机器人技术研发有限公司 Electronic equipment and its radiator and vehicle arrangement

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103915526A (en) * 2014-03-20 2014-07-09 项疆腾 Avalanche photodiode coupler with heat dissipation device
CN103915526B (en) * 2014-03-20 2016-08-17 中国计量学院 A kind of avalanche photodiode coupler carrying heat abstractor
CN107239120A (en) * 2017-05-18 2017-10-10 北京嘉楠捷思信息技术有限公司 Electronic equipment
US11425839B2 (en) 2017-05-18 2022-08-23 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine
US11882669B2 (en) 2017-05-18 2024-01-23 Canaan Creative Co., Ltd. Computational heat dissipation structure, computing device comprising same, mine
CN108633230A (en) * 2018-06-26 2018-10-09 江苏英杰电子器件有限公司 A kind of radiator that heat absorption capacity is fabulous
CN108633230B (en) * 2018-06-26 2023-12-12 江苏英杰电子器件有限公司 Radiator with excellent heat absorption performance
CN109219320A (en) * 2018-10-31 2019-01-15 北京地平线机器人技术研发有限公司 Electronic equipment and its radiator and vehicle arrangement

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130605

Termination date: 20151112

EXPY Termination of patent right or utility model