CN202813870U - Heat dissipation device of semiconductor cooler - Google Patents
Heat dissipation device of semiconductor cooler Download PDFInfo
- Publication number
- CN202813870U CN202813870U CN201220500631.6U CN201220500631U CN202813870U CN 202813870 U CN202813870 U CN 202813870U CN 201220500631 U CN201220500631 U CN 201220500631U CN 202813870 U CN202813870 U CN 202813870U
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- CN
- China
- Prior art keywords
- heat dissipation
- dissipation device
- semiconductor cooler
- fan
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation device, in particular to the heat dissipation device of a semiconductor cooler. The heat dissipation device of the semiconductor cooler comprises an inner fan, a cold end cooling fin, a heat dissipation cover, a separating board, a hot end cooling fin and an outer fan, wherein the inner fan is located over the heat dissipation cover, the separating board is located between the cold end cooling fin and the hot end cooling fin, the distance from the upper end of the cold end cooling fin to the inner side of the upper end of the heat dissipation cover is 10mm, and the outer fan is located on the bottommost portion of the heat dissipation device. According to the designed heat dissipation device, air resistance is reduced, air quantity and refrigerating capacity of the whole device are improved, and at the same time, noise produced when the heat dissipation device is in operation is reduced.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of heat abstractor of semiconductor cooler.
Background technology
Semiconductor cooler is to utilize semi-conductive heat-electrical effect to produce the device of cold, claims again heat-electric refrigerator.Its operation principle is: connect two blocks of different metals with conductor, connect direct current, then a contact place temperature reduces, and another contact place temperature raises; If with reverse power connection, the temperature inverse variation at contact place then.
Usually, in order to make semiconductor cooler normal operation, generally all need to be at the equipped radiator structure of its hot side and a small-sized DC fan, so as with dissipation of heat in environment.Radiator structure and fan are larger, and the heat that rejects heat in the environment is more, and the effect of refrigeration is also just better.Also need at the equipped radiator structure of its huyashi-chuuka (cold chinese-style noodles) and a small-sized DC fan, to be used for carrying out heat exchange with cooling-air with air when semiconductor cooler is used to cooling-air.But, requiring in the light as far as possible semiconductor cooling device in the as far as possible little and weight of dimensional requirement, it is very important that the raising of radiating effect just seems.Yet in the existing equipment, because the setting of the internal structure of radiator for semiconductor makes the radiator air drag large, air quantity is little, and noise is large.The utility model patent by the structure of change radiator for semiconductor, thereby increases the radiator heat-dissipation effect keeping in the constant situation of fan model and heat sink size, improves the refrigerating capacity of semiconductor cooler.
The utility model content
The technical problems to be solved in the utility model is: provide a kind of heat abstractor, this transmission equipment of radiator for semiconductor rational in infrastructure simple in structure, rationally distributed, improved radiating effect.
In order to overcome the defective that exists in the background technology, the technical scheme that its technical problem that solves the utility model adopts is: a kind of heat abstractor of semiconductor cooler, comprise internal fan, cold junction fin, heat dissipating housing, dividing plate, hot-side heat dissipation sheet and external fan, described internal fan is positioned at directly over the heat dissipating housing, described dividing plate is between cold junction fin and hot-side heat dissipation sheet, described cold junction fin upper end is 10 millimeters to the inboard distance in heat dissipating housing upper end, and described external fan is positioned at the bottommost of heat abstractor.
The utility model has solved the defective that exists in the background technology, being designed to cold junction fin upper end is 10 millimeters to the inboard distance in heat dissipating housing upper end, such design radiator air drag reduces, air quantity improves, the complete machine refrigerating capacity improves 6～10%, the noise when also having reduced simultaneously heat abstractor work.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the internal structure schematic diagram of the heat abstractor of a kind of semiconductor cooler of the utility model;
Wherein: 1, internal fan; 2, cold junction fin; 3, dividing plate; 4, hot-side heat dissipation sheet; 5, external fan; 6, the heat dissipating housing upper end is inboard; 7, cold junction fin upper end; 8, heat dissipating housing.
The specific embodiment
By reference to the accompanying drawings the utility model is described in further detail now.The schematic diagram of accompanying drawing for simplifying basic structure of the present utility model only is described in a schematic way, so it only shows the formation relevant with the utility model.
See also Fig. 1, a kind of heat abstractor of semiconductor cooler, comprise internal fan 1, cold junction fin 2, heat dissipating housing 8, dividing plate 3, hot-side heat dissipation sheet 4 and external fan 5, described internal fan 1 is positioned at directly over the heat dissipating housing 8, described dividing plate is between cold junction fin 2 and hot-side heat dissipation sheet 3, described cold junction fin upper end 7 is 10 millimeters to the distance of heat dissipating housing upper end inboard 6, and described external fan 8 is positioned at the bottommost of heat abstractor.
It is large that the utility model has solved the radiator air drag that exists in the background technology, air quantity is little, the defective that noise is large, being designed to cold junction fin upper end is 10 millimeters to the inboard distance in heat dissipating housing upper end, such design radiator air drag reduces, air quantity improves, and the complete machine refrigerating capacity improves 6～10%, the noise when also having reduced simultaneously heat abstractor work.
Claims (1)
1. the heat abstractor of a semiconductor cooler, comprise internal fan (1), cold junction fin (2), heat dissipating housing (8), dividing plate (3), hot-side heat dissipation sheet (4) and external fan (5), it is characterized in that: described internal fan (1) is positioned at directly over the heat dissipating housing (8), described dividing plate is positioned between cold junction fin (2) and the hot-side heat dissipation sheet (3), described cold junction fin upper end (7) is 10 millimeters to the distance of heat dissipating housing upper end inboard (6), and described external fan (8) is positioned at the bottommost of heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220500631.6U CN202813870U (en) | 2012-09-28 | 2012-09-28 | Heat dissipation device of semiconductor cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220500631.6U CN202813870U (en) | 2012-09-28 | 2012-09-28 | Heat dissipation device of semiconductor cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202813870U true CN202813870U (en) | 2013-03-20 |
Family
ID=47872733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220500631.6U Expired - Fee Related CN202813870U (en) | 2012-09-28 | 2012-09-28 | Heat dissipation device of semiconductor cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202813870U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152597A (en) * | 2015-03-31 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device and refrigerating method |
| CN108811466A (en) * | 2018-07-16 | 2018-11-13 | 佛山职业技术学院 | A kind of cabinet |
| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
-
2012
- 2012-09-28 CN CN201220500631.6U patent/CN202813870U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152597A (en) * | 2015-03-31 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device and refrigerating method |
| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
| CN108811466A (en) * | 2018-07-16 | 2018-11-13 | 佛山职业技术学院 | A kind of cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Patent of Suzhou Huarui Thermal Control Technology Co.,Ltd. The person in charge Document name: Notice of termination of patent right |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20210928 |