CN220755363U - Module power supply heat dissipation assembly - Google Patents
Module power supply heat dissipation assembly Download PDFInfo
- Publication number
- CN220755363U CN220755363U CN202322461507.4U CN202322461507U CN220755363U CN 220755363 U CN220755363 U CN 220755363U CN 202322461507 U CN202322461507 U CN 202322461507U CN 220755363 U CN220755363 U CN 220755363U
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- water tank
- heat
- heat dissipation
- radiating
- module
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 94
- 238000005057 refrigeration Methods 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 abstract description 14
- 239000000110 cooling liquid Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000498 cooling water Substances 0.000 description 22
- 238000004891 communication Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a module power supply heat dissipation assembly, and relates to the field of module power supplies. The module power supply radiating assembly comprises a circuit board, a power supply module is fixedly connected to the surface of the circuit board, a radiating water tank is arranged above the power supply module, a heat conducting plate is fixedly connected to the bottom of the radiating water tank, a plurality of radiating mechanisms are fixedly connected to the surface of the radiating water tank, each radiating mechanism comprises a fixing plate, the fixing plates are fixedly connected with the radiating water tank, radiating fins are fixedly connected to the inside of the fixing plates at equal intervals, and a refrigerating water tank for refrigerating is arranged outside the circuit board. This module power radiating component, through the heat-conducting plate, the heat that produces power module is inside leading-in heat dissipation water tank fast, through the fixed plate, fixes the fin, through the fin, goes out the absorptive heat conduction of water-cooling liquid, improves the radiating effect, through the refrigeration water tank, carries out rapid cooling to the inside liquid of heat dissipation water tank, improves device radiating efficiency.
Description
Technical Field
The utility model relates to a module power supply assembly, in particular to a module power supply heat dissipation assembly, and belongs to the technical field of module power supplies.
Background
The module power supply is a power supply which can be directly mounted on a printed circuit board and can provide power for an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Generally, such modules are referred to as load (POL) power supply systems or point-of-use power supply systems (PUPS). Because the advantages of the modular structure are obvious, the modular power supply is widely applied to the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, automobile electronics, aerospace and the like
The utility model of patent number CN217825632U relates to the technical field of power supply modules, and discloses a novel high-efficient heat dissipation type power supply module, which comprises a power supply module main body, first connecting port has been seted up to the front end surface of power supply module main body, the second connector has been seted up to the upper end surface of power supply module main body, be provided with adjusting part in the power supply module main body, adjusting part includes connecting piece, thermovent and regulation structure, a novel high-efficient heat dissipation type power supply module, and the radiating effect is good, and the angle of the breather pipe on this power supply module can be adjusted wantonly, and the hot air just can not take place the backward flow and reentry power supply module in the emission process like this to improve power supply module's radiating effect.
When the power supply works in an over-frequency mode, a large amount of heat can be instantaneously generated, and although the heat can be discharged by the device in the patent, the conveying capacity of the ventilation pipe is limited, the air heat dissipation efficiency is low, the heat is difficult to be rapidly discharged, and the power supply is easy to fail; to this end, we provide a modular power heat sink assembly that solves the above problems.
Disclosure of Invention
The present utility model is directed to a module power supply heat dissipation assembly for solving the above problems, so as to solve the problem that the power supply in the comparison document is difficult to dissipate heat rapidly.
Technical proposal
The utility model is realized by the following technical scheme: a module power supply heat dissipation assembly.
The circuit board is included, the fixed surface of circuit board is connected with power module, power module's top is provided with the heat dissipation water tank, the bottom fixedly connected with heat conduction board of heat dissipation water tank, the fixed surface of heat dissipation water tank is connected with a plurality of cooling mechanism, cooling mechanism includes the fixed plate, and fixed plate and heat dissipation water tank fixed connection, the inside fixedly connected with equidistance of fixed plate arranges the fin, the outside of circuit board is provided with refrigerated refrigeration water tank
Preferably, a graphite sheet is arranged between the power module and the radiating water tank, the surface of the graphite sheet is tightly contacted with the power module and the heat conducting plate, and gaps between the power module and the radiating water tank can be filled by the graphite sheet, so that the heat conduction efficiency is improved.
Preferably, the fixed surface of heat conduction board is connected with the heat conduction piece of equidistance range, the internally mounted of heat dissipation water tank has temperature detector, through the heat conduction piece, can be with the heat of heat conduction board conduction in the inside water-cooling liquid of heat dissipation water tank fast.
Preferably, the surface fixed intercommunication of heat dissipation water tank has inlet tube and outlet pipe, and inlet tube and refrigeration water tank fixed intercommunication, the surface mounting of refrigeration water tank has the water pump, and the outlet pipe is fixed to be linked together with the output of water pump, through inlet tube, outlet pipe and water pump, makes the inside water-cooling liquid flow of heat dissipation water tank and refrigeration water tank get up.
Preferably, the surface of the refrigeration water tank is provided with a semiconductor refrigeration sheet, the surface of the refrigeration water tank is fixedly connected with two fixing rings, and the liquid in the refrigeration water tank is cooled through the negative thermal resistance of the semiconductor refrigeration sheet.
Preferably, the fixing mechanism for fixing the radiating water tank is arranged above the circuit board and comprises a positioning plate and a supporting plate, the positioning plate is fixedly connected with the radiating water tank, the supporting plate is fixedly connected with the circuit board, and the radiating water tank is arranged on the surface of the circuit board through the positioning plate and the supporting plate.
Preferably, the bottom of the locating plate is rotatably connected with a bolt, the bolt is in threaded connection with the supporting plate, and the locating plate and the supporting plate are fixed together through the bolt.
The utility model provides a module power supply heat dissipation assembly, which has the following beneficial effects:
this module power radiator module, the inside water-cooling liquid that has filled up of heat dissipation water tank, through the heat dissipation water tank, in the inside water-cooling liquid of heat dissipation water tank is dispersed to the heat that will power module produce, through the heat-conducting plate, inside the heat dissipation water tank is led in fast to the heat that will power module produce, through the fixed plate, fix and seal the fin, avoid the inside liquid leakage of heat dissipation water tank, through the fin, go out the inside liquid absorbing heat conduction of heat dissipation water tank, the radiating effect is improved, through the refrigeration water tank, carry out rapid cooling to the inside liquid of heat dissipation water tank, the radiating efficiency of improvement module power.
This module power radiating component, through the graphite flake, can fill the space between power module and the cooling water tank, improve heat conduction efficiency, through the conducting strip, can be with the quick leading-in cooling water inside the cooling water tank of heat conduction board heat in, through temperature detector, real-time supervision cooling water temperature, through the inlet tube, outlet pipe and water pump, make the inside cooling water liquid flow of cooling water tank and cooling water tank, improve heat dissipation efficiency, negative thermal resistance through the semiconductor cooling strip, cool down the inside liquid of cooling water tank, through two solid fixed rings, with cooling water tank fixed mounting in the machine inside, through the bolt, fix locating plate and backup pad together, through locating plate and backup pad, install cooling water tank at circuit board surface, the cooling water tank is avoided cooling water tank to break away from power module, improve device heat dissipation efficiency.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
fig. 2 is a sectional view showing an internal structure of the radiator tank of the present utility model;
FIG. 3 is a cross-sectional view of the structure of the refrigeration water tank of the present utility model;
fig. 4 is an enlarged view of the structure of the portion a of fig. 2 according to the present utility model.
[ Main reference numerals Specification ]
1. A circuit board; 2. a power module; 3. a graphite sheet; 4. a heat radiation water tank; 5. a heat conductive plate; 6. a heat conductive sheet;
7. a heat dissipation mechanism; 701. a fixing plate; 702. a heat sink;
8. a temperature detector;
9. a fixing mechanism; 901. a support plate; 902. a positioning plate; 903. a bolt;
10. a refrigeration water tank; 11. a semiconductor refrigeration sheet; 12. a water inlet pipe; 13. a water outlet pipe; 14. a water pump; 15. and a fixing ring.
Detailed Description
The embodiment of the utility model provides a module power supply heat dissipation assembly.
Please refer to fig. 1, which includes a circuit board 1, wherein a power module 2 is fixedly connected to a surface of the circuit board 1, a heat dissipating water tank 4 is disposed above the power module 2, water cooling liquid is filled in the heat dissipating water tank 4, and heat generated by the power module 2 is dispersed into the water cooling liquid in the heat dissipating water tank 4 through the heat dissipating water tank 4.
Be provided with graphite flake 3 between power module 2 and the heat dissipation water tank 4, and the surface and power module 2 and the 5 in close contact of graphite flake 3, through graphite flake 3, can be with the space packing between power module 2 and the heat dissipation water tank 4, improve heat conduction efficiency.
Referring to fig. 4, a plurality of fixing mechanisms 9 for fixing the heat dissipating water tank 4 are disposed above the circuit board 1, the fixing mechanisms 9 include a positioning plate 902 and a supporting plate 901, the positioning plate 902 is fixedly connected with the heat dissipating water tank 4, the supporting plate 901 is fixedly connected with the circuit board 1, a bolt 903 is rotatably connected to the bottom of the positioning plate 902, and the bolt 903 is in threaded connection with the supporting plate 901.
The positioning plate 902 and the supporting plate 901 are fixed together through the bolts 903, and the radiating water tank 4 is installed on the surface of the circuit board 1 through the positioning plate 902 and the supporting plate 901, so that the radiating water tank 4 is prevented from being separated from the power module 2, and the radiating efficiency of the device is improved.
Referring to fig. 2, a heat conducting plate 5 is fixedly connected to the bottom of the heat dissipating water tank 4, heat conducting fins 6 are fixedly connected to the surface of the heat conducting plate 5 and are equidistantly arranged, a temperature detector 8 is installed in the heat dissipating water tank 4, heat conducted by the heat conducting plate 5 can be quickly led into water cooling liquid in the heat dissipating water tank 4 through the heat conducting fins 6, and the temperature of the water cooling liquid is monitored in real time through the temperature detector 8.
The fixed surface of radiator 4 is connected with a plurality of cooling mechanism 7, cooling mechanism 7 includes fixed plate 701, and fixed plate 701 and radiator 4 fixed connection, the inside fixedly connected with equidistance of fixed plate 701 arranges fin 702, inside leading-in radiator 4 is inside with the heat that power module 2 produced fast, through fixed plate 701, fix and seal fin 702, avoid radiator 4 inside liquid leakage, through fin 702, go out radiator 4 inside liquid absorbing heat conduction, improve the radiating effect.
Referring to fig. 1 again, a refrigerating water tank 10 for refrigerating is disposed outside the circuit board 1, and the liquid in the radiating water tank 4 is rapidly cooled by the refrigerating water tank 10.
The surface fixed intercommunication of heat dissipation water tank 4 has inlet tube 12 and outlet pipe 13, and inlet tube 12 and refrigeration water tank 10 fixed intercommunication, and the surface mounting of refrigeration water tank 10 has water pump 14, and outlet pipe 13 and the output fixed intercommunication of water pump 14, through inlet tube 12, outlet pipe 13 and water pump 14, makes the inside water-cooling liquid of heat dissipation water tank 4 and refrigeration water tank 10 flow, improves radiating efficiency.
The water pump 14 is a prior art, and detailed parameters thereof will not be described in detail herein.
Referring to fig. 3, a semiconductor cooling plate 11 is mounted on the surface of a cooling water tank 10, two fixing rings 15 are fixedly connected to the surface of the cooling water tank 10, the cold end of the semiconductor cooling plate 11 is located inside the cooling water tank 10, the cooling treatment is performed on the liquid inside the cooling water tank 10 through the negative thermal resistance of the semiconductor cooling plate 11, and the cooling water tank 10 is fixedly mounted inside a machine through the two fixing rings 15.
The utility model is used when in use: through bolt 903, locating plate 902 and backup pad 901, install the cooling water tank 4 on circuit board 1 surface, through heat-conducting plate 5 and conducting strip 6, can be with the heat that power module 2 produced, in the inside water-cooling liquid of cooling water tank 4 is fast imported, through fin 702, the heat of the inside liquid absorption of cooling water tank 4 is conducted away, simultaneously, through semiconductor refrigeration piece 11, refrigerate the inside liquid of refrigeration water tank 10, at the power high frequency operation, when temperature detector 8 detects the water-cooling liquid temperature higher, start water pump 14, through inlet tube 12 and outlet pipe 13, make the inside water-cooling liquid of cooling water tank 4 and refrigeration water tank 10 flow, reduce the inside liquid temperature of cooling water tank 4, the radiating efficiency of power module 2 has been improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. A module power supply heat dissipation assembly comprising a circuit board (1), characterized in that: the surface fixing of circuit board (1) is connected with power module (2), the top of power module (2) is provided with heat dissipation water tank (4), the bottom fixedly connected with heat conduction board (5) of heat dissipation water tank (4), the surface fixing of heat dissipation water tank (4) is connected with a plurality of cooling mechanism (7), cooling mechanism (7) are including fixed plate (701), and fixed plate (701) and heat dissipation water tank (4) fixed connection, the inside fixedly connected with equidistance of fixed plate (701) is arranged fin (702), the outside of circuit board (1) is provided with refrigerated refrigeration water tank (10).
2. A modular power heat sink assembly as in claim 1 wherein: a graphite sheet (3) is arranged between the power module (2) and the radiating water tank (4), and the surface of the graphite sheet (3) is in close contact with the power module (2) and the heat conducting plate (5).
3. A modular power heat sink assembly as in claim 1 wherein: the surface of the heat conducting plate (5) is fixedly connected with heat conducting fins (6) which are arranged at equal intervals, and a temperature detector (8) is arranged in the heat radiating water tank (4).
4. A modular power heat sink assembly as in claim 1 wherein: the surface fixed intercommunication of heat dissipation water tank (4) has inlet tube (12) and outlet pipe (13), and inlet tube (12) and refrigeration water tank (10) fixed intercommunication, the surface mounting of refrigeration water tank (10) has water pump (14), and outlet pipe (13) and the output fixed intercommunication of water pump (14).
5. A modular power heat sink assembly as in claim 1 wherein: the surface of the refrigeration water tank (10) is provided with a semiconductor refrigeration sheet (11), and the surface of the refrigeration water tank (10) is fixedly connected with two fixing rings (15).
6. A modular power heat sink assembly as in claim 1 wherein: the circuit board (1) is provided with a plurality of fixed mechanism (9) of fixing the heat dissipation water tank (4) above, fixed mechanism (9) are including locating plate (902) and backup pad (901), locating plate (902) and heat dissipation water tank (4) fixed connection, and backup pad (901) and circuit board (1) fixed connection.
7. A modular power heat sink assembly as in claim 6 wherein: the bottom of the locating plate (902) is rotatably connected with a bolt (903), and the bolt (903) is in threaded connection with the supporting plate (901).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322461507.4U CN220755363U (en) | 2023-09-11 | 2023-09-11 | Module power supply heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322461507.4U CN220755363U (en) | 2023-09-11 | 2023-09-11 | Module power supply heat dissipation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220755363U true CN220755363U (en) | 2024-04-09 |
Family
ID=90568206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322461507.4U Active CN220755363U (en) | 2023-09-11 | 2023-09-11 | Module power supply heat dissipation assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220755363U (en) |
-
2023
- 2023-09-11 CN CN202322461507.4U patent/CN220755363U/en active Active
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