CN212461666U

CN212461666U - Semiconductor radiator

Info

Publication number: CN212461666U
Application number: CN202020743869.6U
Authority: CN
Inventors: 闫广; 耿晓红; 蒋琼; 张海新; 张硕; 王云
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2021-02-02
Anticipated expiration: 2030-05-08

Abstract

The utility model discloses a semiconductor radiator, including N type semiconductor and P type semiconductor, its characterized in that: the middle parts of the N-type semiconductor and the P-type semiconductor are provided with low-temperature heat absorption tubes, the upper parts of the N-type semiconductor and the P-type semiconductor are provided with insulating heat insulation strips, the top of each insulating heat insulation strip is provided with a component, the lower ends of the N-type semiconductor and the P-type semiconductor are provided with high-temperature heat dissipation electrode heat tubes, the bottom of each high-temperature heat dissipation electrode heat tube is provided with a plurality of groups of fin radiators, and the bottom of each high-. Compared with the prior radiator, the utility model has no high-frequency noise of fan and non-centering noise, and is suitable for office environment; fan heat dissipation has the drawback of entering the dust, enters into the water tank with drain pipe exhaust rivers, can recycle, the water tank provides the water source for the water pump, and the pressurization back cooling water through the water pump accomplishes the heat dissipation to the fin radiator through inlet tube and drain pipe, further promotes the heat radiation characteristic of structure.

Description

Semiconductor radiator

Technical Field

The utility model relates to a semiconductor radiator field, in particular to semiconductor radiator.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. The importance of semiconductors is enormous, both from a technological and economic point of view. Based on the semiconductor refrigeration (heating) principle: when two different conductors form an electrical circuit, heat absorption and heat release, known as the peltier effect, occur at the junctions of the conductors. The semiconductor is adopted to form a loop, so that the generated cold and heat benefits can be improved. In the prior art, heat-dissipating insulating ceramic is adopted as a heat-absorbing surface and a heat-dissipating surface, electrodes made of copper are tightly attached to the heat-absorbing surface and the heat-dissipating surface, a refrigerating element and a heating element are made of an N-type P-type semiconductor, direct current is conducted to two ends of an NP semiconductor, so that the copper electrodes between the NP semiconductors can absorb heat, and the copper electrodes at the two ends release heat.

However, most of the existing semiconductor radiators adopt an air cooling structure, and the air cooling structure can generate vibration and noise; to solve the above problems, a semiconductor heat sink is proposed.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a semiconductor radiator, adopt the metal heat pipe as the exothermic original paper of heat absorption and semiconductor copper electrode, two semiconductor refrigerator's heat transfer flow has been simplified, under the same cold and hot end difference, can reduce the difference in temperature at semiconductor components and parts both ends, reinforcing heat transfer effect, improve refrigeration heating efficiency, form the lower environment of a temperature on the mesa, reach for the radiating purpose of refrigeration bench equipment (notebook computer etc.), the fin radiator of end is released in the high temperature to the cooperation installation, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor heat spreader comprising: the high-temperature heat dissipation electrode heat pipe comprises an N-type semiconductor and a P-type semiconductor, wherein a low-temperature heat absorption pipe is arranged in the middle of the N-type semiconductor and the P-type semiconductor and is made of insulating materials, heat is conducted downwards through the low-temperature heat absorption pipe, insulating heat insulation strips are arranged on the upper portions of the N-type semiconductor and the P-type semiconductor, components are arranged on the tops of the insulating heat insulation strips and are power components of electronic equipment of the components, high-temperature heat dissipation electrode heat pipes are arranged at the lower ends of the N-type semiconductor and the P-type semiconductor, a plurality of groups of fin radiators are arranged at the bottoms of the high-temperature heat dissipation electrode heat pipes, and a heat conduction.

Preferably, be provided with inlet tube and drain pipe in the fin radiator, inlet tube and drain pipe run through and have the fin radiator, form the endless route through inlet tube and drain pipe, fin radiator left side is provided with the water pump, the water pump has the water tank through water piping connection, the drain pipe upper end is put through with the water tank, with in the drain pipe exhaust rivers enter into the water tank, can recycle, the water tank provides the water source for the water pump, and the pressurization back cooling water through the water pump accomplishes the heat dissipation to the fin radiator through inlet tube and drain pipe, further promotes the heat radiation characteristic of structure.

Preferably, be provided with heat conduction insulating paint layer between insulating heat insulating strip and the components and parts, isolate insulating heat insulating strip and components and parts through heat conduction insulating paint layer, avoid causing the equipment circuit.

Preferably, the fin radiator is of a spaced structure, a gap is formed in the middle of the fin radiator, the heat dissipation capacity of the fin radiator can be improved, so that the N-type semiconductor and the P-type semiconductor can be better dissipated, the N-type semiconductor, the P-type semiconductor, the low-temperature heat absorption tube and the high-temperature heat dissipation electrode heat tube form an integral heat dissipation platform, a connecting wire is connected in the high-temperature heat dissipation electrode heat tube, and the other end of the connecting wire is connected with a power supply.

Preferably, the inside first cooling tube that is provided with of fin radiator, the inside second cooling tube that is provided with of fin radiator can promote the area of contact of fin radiator exterior structure through first cooling tube and second cooling tube to promotion structure heat radiation characteristic that can be better.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. compared with the existing radiator, the radiator has no fan high-frequency noise and non-centering noise, is quiet and is suitable for office environment; the fan heat dissipation has the defect of dust inlet, and the scheme can avoid the further influence on the structure heat dissipation caused by the covering after the dust enters the electrical appliance element.

2. Can directly adopt the air cooling, do not increase other intensive heat dissipation measures, also can put and use in the basin, enter into the water tank with drain pipe exhaust rivers, can recycle, the water tank provides the water source for the water pump, and the pressurization back cooling water through the water pump accomplishes the heat dissipation to the fin radiator through inlet tube and drain pipe, further promotes the heat radiation characteristic of structure.

Drawings

Fig. 1 is an overall structural view of a semiconductor heat sink in embodiment 1;

fig. 2 is an overall structural view of a semiconductor heat sink in embodiment 2;

FIG. 3 is a structural diagram of a heat sink in the semiconductor heat sink of this embodiment 3;

fig. 4 is a side view of the first heat pipe of the semiconductor heat sink of this embodiment 4;

fig. 5 is a side view of the second heat pipe of the semiconductor heat sink of embodiment 4.

In the figure: 1. an N-type semiconductor; 2. a P-type semiconductor; 3. a low temperature heat absorption tube; 4. a high-temperature heat-dissipation electrode heat pipe; 5. insulating heat insulating strips; 6. a heat conductive insulating paint layer; 7. a finned heat sink; 8. a component; 9. a connecting wire; 10. a power source; 11. a water inlet pipe; 12. a water pump; 13. a drain pipe; 14. a water tank; 15. a first radiating pipe; 16. a second heat dissipation pipe.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

Example 1

Referring to fig. 1, a semiconductor heat spreader includes: the low-temperature heat-absorbing tube 3 is arranged in the middle of the N-type semiconductor 1 and the P-type semiconductor 2, heat is conducted downwards through the low-temperature heat-absorbing tube 3 and is made of an insulating material, the insulating heat-insulating strip 5 is arranged on the upper portion of the N-type semiconductor 1 and the P-type semiconductor 2, the top of the insulating heat-insulating strip 5 is provided with a component 8, the power component of electronic equipment with the component 8 is a heat-conducting insulating paint layer 6, the insulating heat-insulating strip 5 and the component 8 are isolated through the heat-conducting insulating paint layer 6, an equipment circuit is avoided being caused, the high-temperature heat-radiating electrode heat tube 4 is arranged at the lower end of the N-type semiconductor 1 and the P-type semiconductor 2, a plurality of groups of fin radiators 7 are arranged at the bottom of the high-temperature heat-radiating electrode heat tube 4, and the heat-conducting insulating, the high-temperature heat dissipation electrode heat pipe 4 and the fin radiator 7 are prevented from causing short circuit, the fin radiator 7 is of a spaced structure, a gap is formed in the middle of the fin radiator 7, the heat dissipation capacity of the fin radiator 7 can be improved, and therefore the N-type semiconductor 1 and the P-type semiconductor 2 can be better dissipated, the N-type semiconductor 1, the P-type semiconductor 2, the low-temperature heat absorption pipe 3 and the high-temperature heat dissipation electrode heat pipe 4 form an integral heat dissipation table, the high-temperature heat dissipation electrode heat pipe 4 is internally connected with a connecting wire 9, the other end of the connecting wire 9 is connected with a power supply 10, and compared with the existing radiator, the high-temperature heat dissipation electrode heat pipe is free of; the fan has the defect of dust inlet in the heat dissipation process, and the scheme can avoid the further influence on the structure heat dissipation caused by the covering after the dust enters the electrical appliance element;

the insulating heat insulating strip is a low-temperature heat absorbing pipe 3, a high-temperature heat radiating electrode heat pipe 4 and an insulating heat insulating strip 5 which are copper metal heat pipes, saturated vapor-liquid two-phase heat conducting liquid is filled in the insulating heat insulating strip after the insulating heat insulating strip is vacuumized, the heat pipe externally connected with a direct-current power supply is an electrode heat pipe, the heat pipe on the other side is used for connecting NP two semiconductors, and forms a power-on loop with the NP two semiconductors. Whether to heat or cool depends on the direction of the current.

Example 2

Referring to fig. 2, a semiconductor heat spreader includes: the low-temperature heat-absorbing tube 3 is arranged in the middle of the N-type semiconductor 1 and the P-type semiconductor 2, heat is conducted downwards through the low-temperature heat-absorbing tube 3 and is made of an insulating material, the insulating heat-insulating strip 5 is arranged on the upper portion of the N-type semiconductor 1 and the P-type semiconductor 2, the top of the insulating heat-insulating strip 5 is provided with a component 8, the power component of electronic equipment with the component 8 is a heat-conducting insulating paint layer 6, the insulating heat-insulating strip 5 and the component 8 are isolated through the heat-conducting insulating paint layer 6, an equipment circuit is avoided being caused, the high-temperature heat-radiating electrode heat tube 4 is arranged at the lower end of the N-type semiconductor 1 and the P-type semiconductor 2, a plurality of groups of fin radiators 7 are arranged at the bottom of the high-temperature heat-radiating electrode heat tube 4, and the heat-conducting insulating, the high-temperature heat dissipation electrode heat pipe 4 and the fin radiator 7 are prevented from causing short circuit, the fin radiator 7 is of a spaced structure, a gap is formed in the middle of the fin radiator 7, the heat dissipation capacity of the fin radiator 7 can be improved, and therefore the N-type semiconductor 1 and the P-type semiconductor 2 can be better dissipated, the N-type semiconductor 1, the P-type semiconductor 2, the low-temperature heat absorption pipe 3 and the high-temperature heat dissipation electrode heat pipe 4 form an integral heat dissipation table, the high-temperature heat dissipation electrode heat pipe 4 is connected with a connecting wire 9, and the other end of the connecting wire 9 is connected with a power supply;

be provided with inlet tube 11 and drain pipe 13 in the fin radiator 7, inlet tube 11 and drain pipe 13 run through have fin radiator 7, form the endless route through inlet tube 11 and drain pipe 13, fin radiator 7 left side is provided with water pump 12, water pump 12 has water tank 14 through water piping connection, drain pipe 13 upper end and the switch-on of water tank 14, with in the water tank 14 of the discharge rivers of drain pipe 13 entering, can recycle, water tank 14 provides the water source for water pump 12, and the pressurization back cooling water through water pump 12 accomplishes the heat dissipation to fin radiator 7 through inlet tube 11 and drain pipe 13, further promotes the heat radiation characteristic of structure.

Example 3

Compared with the embodiment 2, the heat dissipation device has the following differences that as shown in fig. 3, the N-type semiconductor 1, the P-type semiconductor 2, the low-temperature heat absorption pipe 3 and the high-temperature heat dissipation electrode heat pipe 4 form an integral heat dissipation table, and the heat dissipation table with larger temperature difference can be manufactured by adopting two layers of refrigerators, so that the heat dissipation characteristic of the structure is further improved.

Example 4

Compared with embodiment 2, the difference is that as shown in fig. 4, the first radiating pipe 15 is arranged inside the finned radiator 7, as shown in fig. 5, the second radiating pipe 16 is arranged inside the finned radiator 7, the contact area of the external structure of the finned radiator 7 can be increased through the first radiating pipe 15 and the second radiating pipe 16, and therefore the structural radiating characteristic can be better improved.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, and it should be understood by those skilled in the art that the present invention is not limited by the above embodiments, which are only illustrative, but also various changes and modifications may be made without departing from the spirit and scope of the present invention, which fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heat sink comprising an N-type semiconductor (1) and a P-type semiconductor (2), characterized in that: the high-temperature heat dissipation device is characterized in that low-temperature heat absorption tubes (3) are arranged in the middle of the N-type semiconductor (1) and the P-type semiconductor (2), insulating heat insulation strips (5) are arranged on the upper portions of the N-type semiconductor (1) and the P-type semiconductor (2), components (8) are arranged at the tops of the insulating heat insulation strips (5), high-temperature heat dissipation electrode heat tubes (4) are arranged at the lower ends of the N-type semiconductor (1) and the P-type semiconductor (2), the N-type semiconductor (1), the P-type semiconductor (2), the low-temperature heat absorption tubes (3) and the high-temperature heat dissipation electrode heat tubes (4) form an integral heat dissipation platform, a plurality of groups of fin radiators (7) are arranged at the bottom of the high-temperature heat dissipation electrode heat tubes.

2. A semiconductor heat sink as claimed in claim 1, wherein: be provided with inlet tube (11) and drain pipe (13) in fin radiator (7), inlet tube (11) and drain pipe (13) run through have fin radiator (7), fin radiator (7) left side is provided with water pump (12), water pump (12) have water tank (14) through water piping connection, drain pipe (13) upper end and water tank (14) switch-on.

3. A semiconductor heat sink as claimed in claim 1, wherein: and a heat-conducting insulating paint layer (6) is arranged between the insulating heat-insulating strip (5) and the component (8).

4. A semiconductor heat sink as claimed in claim 2, wherein: the fin radiator (7) is of an interval structure, a gap is formed in the middle of the fin radiator, a connecting wire (9) is connected in the high-temperature heat-dissipation electrode heat pipe (4), and the other end of the connecting wire (9) is connected with a power supply (10).

5. The semiconductor heat sink of claim 4, wherein: the radiating fin is characterized in that a first radiating pipe (15) is arranged inside the radiating fin (7), and a second radiating pipe (16) is arranged inside the radiating fin (7).