CN109579353B - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN109579353B CN109579353B CN201910008218.4A CN201910008218A CN109579353B CN 109579353 B CN109579353 B CN 109579353B CN 201910008218 A CN201910008218 A CN 201910008218A CN 109579353 B CN109579353 B CN 109579353B
- Authority
- CN
- China
- Prior art keywords
- cold end
- circuit board
- cold
- type semiconductor
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 136
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims abstract description 6
- 238000009413 insulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 230000001788 irregular Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 55
- 235000012431 wafers Nutrition 0.000 description 11
- 238000005057 refrigeration Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000004321 preservation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 108010025899 gelatin film Proteins 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a semiconductor refrigerator, which solves the problems that the refrigerating effect is affected by too close distance between a cold end and a hot end in the prior art, and the semiconductor refrigerator is made of hard materials, is not beneficial to cooling objects with irregular surface shapes or changeable surface shapes, and has the effects of separating the cold end and the hot end, reducing the loss of cold energy, being convenient to arrange and use and being capable of adopting flexible materials at the cold end; the technical proposal is as follows: the cold end module and the hot end module are connected through a flat cable to realize cold and hot end separation; the cold end module comprises an integrated semiconductor film for improving cold end heat exchange heat flow density, and two sides of the integrated semiconductor film are respectively attached to a cold end circuit board and a cold end substrate; the integrated semiconductor film comprises a plurality of N-type semiconductor films and P-type semiconductor films which are crossed and distributed at intervals.
Description
Technical Field
The invention relates to the field of temperature control, in particular to a semiconductor refrigerator.
Background
The semiconductor refrigerator, also called thermoelectric refrigerator, is a refrigerating device utilizing the Peltier effect to achieve the purpose of refrigeration and has the advantages of small size, light weight, simple and reliable structure, no mechanical transmission, no noise, no pollution, anti-bump movement and the like. In recent years, with the continuous development of semiconductor material technology, the refrigerating efficiency of a semiconductor refrigerator is continuously improved, and the semiconductor refrigerator is widely applied to the fields of aviation, aerospace, infrared detection, medical equipment, electronic equipment and the like at present, is expanding to the common civil direction, and is gradually applied to refrigerating equipment such as household refrigerators, air conditioners, wine cabinets and the like.
However, semiconductor refrigerators still have low refrigeration efficiency compared to compression refrigeration devices. Among the many factors that restrict the refrigeration efficiency of semiconductor refrigerator, it is very important that because the thickness of current semiconductor refrigeration piece is very little, the cold and hot end is too near to the distance, if the heat that its hot end produced can not derive in time, will very easily conduct to the cold junction through the inner structure of refrigeration piece to seriously influence refrigeration effect. The existing semiconductor refrigerators are made of hard materials, so that the existing semiconductor refrigerators are not beneficial to cooling objects with irregular surface shapes or changeable surface shapes.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a semiconductor refrigerator which has the effects of cold and hot end separation, less cold energy loss, convenient arrangement and use and flexible material for the cold end.
The invention adopts the following technical scheme:
the semiconductor refrigerator comprises a cold end module and a hot end module, wherein the cold end module and the hot end module are connected through a flat cable to realize cold and hot end separation;
The cold end module comprises an integrated semiconductor film for improving cold end heat exchange heat flow density, and two sides of the integrated semiconductor film are respectively attached to a cold end circuit board and a cold end substrate; the integrated semiconductor film comprises a plurality of N-type semiconductor films and P-type semiconductor films which are crossed and distributed at intervals.
Further, the integrated semiconductor film further comprises a base film, and the base film is provided with 2N holes which are uniformly arranged and used for arranging the N-type semiconductor film and the P-type semiconductor film.
Further, n is an integer of 1 or more.
Further, a circuit is arranged on one side of the cold end substrate, and the cold end substrate connects the adjacent N-type semiconductor films forming the PN junction of the semiconductor films with the P-type semiconductor films through the circuit.
Furthermore, the integrated semiconductor film, the cold end substrate and the cold end circuit board are all made of flexible materials, so that the whole cold end module is flexible, and the integrated semiconductor film, the cold end substrate and the cold end circuit board can be used for cooling objects with non-planar shapes or objects with shapes changed.
Further, the cold end module is provided with a cold end heat preservation layer.
Further, the cold junction circuit board is an integrated circuit board, one end of the cold junction circuit board is provided with a cold junction bus interface, the cold junction circuit board is provided with 2n attaching positions, and each attaching position is respectively provided with an independent circuit connected to the cold junction bus interface.
Further, the hot end module comprises a hot end substrate, a hot end circuit board, N N-type semiconductor chips and N P-type semiconductor chips, wherein the N N-type semiconductor chips and the N P-type semiconductor chips are arranged between the hot end substrate and the hot end circuit board.
Further, the hot end circuit board is provided with 2N bonding positions, and N N-type semiconductor chips and N P-type semiconductor chips are arranged on the bonding positions of the hot end circuit board at intervals in a crossing way.
Furthermore, the hot-end circuit board is an integrated circuit board, one end of the integrated circuit board is provided with a hot-end bus interface, and each bonding position of the hot-end circuit board is respectively provided with an independent circuit connected to the hot-end bus interface.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention can realize cold and hot end separation, respectively perform refrigeration and heat dissipation at different positions, effectively reduce heat exchange of the cold and hot ends, reduce the loss of refrigerating capacity and enable the arrangement mode of the semiconductor refrigerator to be more flexible;
(2) The cold end module can be made into hard or flexible materials, can adapt to more heat exchange surface shapes, and is also suitable for occasions where the surface shapes change;
(3) The cold end module adopts the integrated semiconductor film, so that the cold end arrangement is more compact, and the heat flow density of cold end heat exchange is improved; the hot end module can be properly amplified in proportion according to the heat dissipation requirement, so that the heat dissipation area is increased, and the heat flux density of the heat dissipation of the hot end is reduced;
(4) The invention can realize batch mechanical production of all the components and can effectively reduce the production cost.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an integrated semiconductor thin film arrangement according to the present invention;
FIG. 3 is a schematic diagram of a cold end substrate and a circuit structure thereof according to the present invention;
FIG. 4 is a schematic diagram of a circuit structure of a cold end circuit board according to the present invention;
FIG. 5 is a schematic view showing an arrangement of semiconductor chips in a hot side module according to the present invention;
FIG. 6 is a schematic diagram of a hot side substrate and a circuit structure thereof according to the present invention;
FIG. 7 is a schematic diagram of a hot side circuit board according to the present invention;
in the figure, 1, an integrated semiconductor film, 2, a cold end substrate, 3, a cold end circuit board, 4, a cold end heat insulation layer, 5, a cold end wire arrangement interface, 6, a wire arrangement, 7, a hot end circuit board, 8, a hot end substrate, 9, a P-type semiconductor chip, 10, an N-type semiconductor chip, 11, a hot end wire arrangement interface, 12, a power wire interface, 13, a P-type semiconductor film, 14, an N-type semiconductor film, 15, a base film, 16 and a circuit.
Detailed Description
It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
As described in the background art, the prior art has the defects that the cooling effect is affected by too close distance between the cold end and the hot end, and the semiconductor refrigerator is made of hard materials, which is not beneficial to cooling objects with irregular surface shape or changeable surface shape.
In an exemplary embodiment of the present application, as shown in fig. 1 to 7, a semiconductor refrigerator is provided, which includes a cold end module, a hot end module, and a flat cable 6, wherein the cold end module and the hot end module are connected through the flat cable 6 to realize cold and hot end separation.
The cold end module comprises an integrated semiconductor film 1, a cold end substrate 2 and a cold end circuit board 3, wherein the cold end substrate 2 is attached to one side of the semiconductor film 1, and the cold end circuit board 3 is attached to the other side of the semiconductor film 1.
The integrated semiconductor film 1 comprises a base film 15, wherein 2N holes which are uniformly arranged are formed in the base film 15, and N N-type semiconductor films 14 and N P-type semiconductor films 13 are crossed and distributed on the holes at intervals.
Wherein n is an integer of 1 or more.
As shown in fig. 2, each of the P-type semiconductor films 13 has N-type semiconductor films 14 adjacent to four sides, and similarly, each of the N-type semiconductor films 14 has P-type semiconductor films 13 adjacent to four sides; each P-type semiconductor film 13 (N-type semiconductor film 14) is spaced from its adjacent film and does not contact each other.
The 1 st N-type semiconductor film 14 and the 1 st P-type semiconductor film 13 form a1 st semiconductor film PN junction, are sequentially arranged backwards, and form an N semiconductor film PN junction in a conformal mode.
The integrated semiconductor film 1 is made of flexible materials.
When one or more of the cold-end substrate 2 and the cold-end circuit board 3 are made of a hard material, for example, a printed circuit board PCB or the like, the cold-end module is entirely made of a hard material, and is used for cooling a planar object.
When the cold-end substrate 2 and the cold-end circuit board 3 are made of flexible materials, for example, flexible circuit board FPC is used, and the integrated semiconductor film 1 is flexible, the cold-end module is made of flexible materials, and is used for cooling non-planar objects or objects with changed shapes.
The cold end substrate 2 is a flat plate with a circuit 16 machined on one side, as shown in fig. 3.
The cold end substrate 2 connects the m-th N-type semiconductor film 14 and the m-th P-type semiconductor film 13 through a circuit 16, wherein m is an integer of more than or equal to 1 and less than or equal to N; i.e., the N-type semiconductor film 14 of each pair of semiconductor film PN junctions is connected to the P-type semiconductor film 13.
The outside of the cold end substrate 2 (the side far away from the integrated semiconductor film 1) provides cold and heat to the outside, and the cold and heat are transferred to an object to be cooled or heated through direct or indirect action.
The cold end substrate 2 is made of a thinner material with a larger heat conductivity coefficient, for example: a silica gel film and a carbon fiber film.
The cold junction circuit board 3 is an integrated circuit board, as shown in fig. 4, one end of the cold junction circuit board 3 is provided with a cold junction flat cable interface 5, and the cold junction flat cable interface 5 is connected with one end of a flat cable 6.
The circuit 16 on the cold end circuit board 3 is provided with 2n bonding positions which are bonded with 2n semiconductor films in a one-to-one correspondence manner, and each bonding position is provided with an independent circuit 16 which is connected to the cold end flat cable interface 5 and is connected with the hot end module through independent wires in the flat cable 6.
The cold end module still includes cold end heat preservation 4, and cold end heat preservation 4 sets up around the cold end module and is close to the outside of cold end circuit board 3 for reduce the cold energy loss.
When the whole cold end module is made of hard materials, the cold end heat preservation layer 4 can be made of hard or flexible heat preservation materials; when the whole cold end module is made of flexible materials, the cold end heat preservation layer 4 is made of flexible heat preservation materials.
The hot end module comprises a hot end circuit board 7, a hot end substrate 8 and 2N semiconductor chips with equal height, wherein the semiconductor chips comprise N N-type semiconductor chips 10 and N P-type semiconductor chips 9.
The hot-end circuit board 7 is an integrated circuit board, as shown in fig. 7, and the hot-end circuit board 7 has 2n bonding sites.
The N N-type semiconductor wafers 10 and the N P-type semiconductor wafers 9 are alternately arranged on 2N bonding positions of the hot end circuit board 7 at intervals; the bonding position connected with the N-type semiconductor film 14 on the cold end circuit board 3 through the flat cable 6 and the circuit is provided with the N-type semiconductor chip 10, and the bonding position connected with the P-type semiconductor film 13 on the cold end circuit board 3 is provided with the P-type semiconductor chip 9.
Therefore, the 2n semiconductor chips of the hot-end module and the 2n semiconductor films of the cold-end module are connected in one-to-one correspondence with the flat cables 6 through circuits.
The 1 st N-type semiconductor wafer 10 and the 1 st P-type semiconductor wafer 9 correspondingly connected with the 1 st semiconductor film PN junction form a1 st pair of semiconductor wafer PN junctions, are sequentially arranged backwards, and form N pairs of semiconductor wafer PN junctions in a conformal mode.
The hot-end substrate 8 is a flat plate with a circuit processed on the inner side (the side close to the hot-end circuit board 7), as shown in fig. 6; the hot end substrate 8 connects the P-type semiconductor chip 13 in the PN junction of the a-th pair of semiconductor chips and the N-type semiconductor chip 10 in the PN junction of the a+1-th pair of semiconductor chips together through a circuit 16, wherein a is an integer of more than or equal to 1 and less than or equal to N-1.
The hot end substrate 8 is also provided with a power line interface 12, and the circuit 16 of the hot end substrate 8 is also used for respectively connecting the 1 st N-type semiconductor chip 10 and the N-type semiconductor chip 9 with the power line interface 12 and supplying power to the semiconductor refrigerator after being powered on.
The outer side of the hot end substrate 8 dissipates heat to the outside, and the area of the hot end substrate 8 is properly increased under the condition of allowing the installation space, so that the heat dissipation heat flow density can be reduced.
The outer side of the hot end substrate 8 can be provided with a plurality of heat dissipation devices such as heat dissipation fins, fans, heat pipe radiators, water-cooling radiators or phase change heat exchangers and the like for enhancing the heat dissipation effect.
When the semiconductor refrigerator is connected with an external direct-current power supply to work, the semiconductor refrigerator has two working modes, namely a refrigerating mode and a heating mode.
When the semiconductor refrigerator works in a refrigeration mode, the cold end module provides cold energy outwards, the hot end module radiates heat outwards, and the flowing sequence of current is as follows: positive electrode of power supply, 1 st N-type semiconductor wafer, 1 st N-type semiconductor film, 1 st P-type semiconductor wafer, 2 nd N-type semiconductor wafer … …, N-type semiconductor wafer, N-type semiconductor film, N-type P-type semiconductor wafer, and negative electrode of power supply.
When the semiconductor refrigerator works in the heating working mode, the anode and the cathode of the external direct current power supply are reversely connected, at the moment, the cold end module provides heat outwards, the hot end module absorbs heat from the outside, and the current flowing sequence is opposite to that in the refrigerating working mode.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (8)
1. The semiconductor refrigerator is characterized by comprising a cold end module and a hot end module, wherein the cold end module and the hot end module are connected through a flat cable to realize cold and hot end separation;
The cold end module comprises an integrated semiconductor film for improving cold end heat exchange heat flow density, and two sides of the integrated semiconductor film are respectively attached to a cold end circuit board and a cold end substrate; the integrated semiconductor film comprises a plurality of N-type semiconductor films and P-type semiconductor films which are crossed and distributed at intervals;
A circuit is arranged on one side of the cold end substrate, and the cold end substrate connects the adjacent N-type semiconductor films forming the PN junction of the semiconductor films with the P-type semiconductor films through the circuit;
the integrated semiconductor film, the cold end substrate and the cold end circuit board are all made of flexible materials, so that the whole cold end module is flexible, and the integrated semiconductor film, the cold end substrate and the cold end circuit board can be used for cooling objects with non-planar shapes or objects with shapes changed.
2. The semiconductor refrigerator of claim 1, wherein the integrated semiconductor film further comprises a base film, and the base film is provided with 2N holes which are uniformly arranged for arranging the N-type semiconductor film and the P-type semiconductor film.
3. A semiconductor refrigerator according to claim 2, wherein n is an integer of 1 or more.
4. A semiconductor refrigerator according to claim 1, wherein the cold end module has a cold end insulation.
5. The semiconductor cooler of claim 1, wherein the cold end circuit board is an integrated circuit board, one end of the cold end circuit board is provided with a cold end bus interface, the cold end circuit board is provided with 2n bonding positions, and each bonding position is respectively connected to the cold end bus interface by an independent circuit.
6. The semiconductor refrigerator of claim 1, wherein the hot side module comprises a hot side substrate, a hot side circuit board, and N-type semiconductor chips and N P-type semiconductor chips disposed therebetween.
7. The semiconductor refrigerator of claim 6, wherein the hot side circuit board has 2N bonding sites, and N-type semiconductor chips and N P-type semiconductor chips are alternately arranged on the bonding sites of the hot side circuit board.
8. The semiconductor cooler of claim 7, wherein said hot side circuit board is an integrated circuit board having a hot side bus interface at one end thereof, and each of said bonding sites of said hot side circuit board has an independent circuit connected to said hot side bus interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008218.4A CN109579353B (en) | 2019-01-04 | 2019-01-04 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008218.4A CN109579353B (en) | 2019-01-04 | 2019-01-04 | Semiconductor refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109579353A CN109579353A (en) | 2019-04-05 |
| CN109579353B true CN109579353B (en) | 2024-05-28 |
Family
ID=65915533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910008218.4A Active CN109579353B (en) | 2019-01-04 | 2019-01-04 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109579353B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110535373A (en) * | 2019-09-25 | 2019-12-03 | 山东省科学院能源研究所 | A kind of thermoelectric generator |
| CN114413928A (en) * | 2021-11-12 | 2022-04-29 | 株洲菲斯罗克光电科技股份有限公司 | Zero-offset tester for sensitive ring |
| CN116007224B (en) * | 2023-02-01 | 2024-06-11 | 山东大学 | Portable cooling and heating integrated machine and method based on thermoelectric refrigeration |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1352467A (en) * | 2001-10-24 | 2002-06-05 | 王彬 | Split thermocouple refrigeration and power generation technology |
| CN2504569Y (en) * | 2001-11-07 | 2002-08-07 | 王彬 | Splitting thermoelectric cooling module |
| KR20110080963A (en) * | 2010-01-07 | 2011-07-13 | 충북대학교 산학협력단 | Thermoelectric cooler for printed circuit board with flip chip bonding |
| CN103811652A (en) * | 2014-01-22 | 2014-05-21 | 杜效中 | Novel thermoelectric semiconductor device manufacturing method capable of separating cold end and hot end |
| CN105070820A (en) * | 2015-08-02 | 2015-11-18 | 杜效中 | Fabrication method for novel thin film thermoelectric semiconductor device with separated cold end and hot end |
| CN209326136U (en) * | 2019-01-04 | 2019-08-30 | 山东省科学院能源研究所 | A kind of semiconductor cooler |
-
2019
- 2019-01-04 CN CN201910008218.4A patent/CN109579353B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1352467A (en) * | 2001-10-24 | 2002-06-05 | 王彬 | Split thermocouple refrigeration and power generation technology |
| CN2504569Y (en) * | 2001-11-07 | 2002-08-07 | 王彬 | Splitting thermoelectric cooling module |
| KR20110080963A (en) * | 2010-01-07 | 2011-07-13 | 충북대학교 산학협력단 | Thermoelectric cooler for printed circuit board with flip chip bonding |
| CN103811652A (en) * | 2014-01-22 | 2014-05-21 | 杜效中 | Novel thermoelectric semiconductor device manufacturing method capable of separating cold end and hot end |
| CN105070820A (en) * | 2015-08-02 | 2015-11-18 | 杜效中 | Fabrication method for novel thin film thermoelectric semiconductor device with separated cold end and hot end |
| CN209326136U (en) * | 2019-01-04 | 2019-08-30 | 山东省科学院能源研究所 | A kind of semiconductor cooler |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109579353A (en) | 2019-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103591730B (en) | Semiconductor refrigerating integrated system | |
| CN105140194B (en) | Hot superconducting radiator and its manufacture method | |
| CN109579353B (en) | Semiconductor refrigerator | |
| CN107359146B (en) | Heat superconducting plate fin type radiator with fins on surface | |
| CN112672605B (en) | Air cooling plate based on TEC refrigeration | |
| CN105281198A (en) | Thermal management device of semiconductor laser | |
| US20100218512A1 (en) | Heat exchanger for thermoelectric applications | |
| CN103423915B (en) | Semiconductor flexible refrigeration band | |
| CN113793837A (en) | Self-sensing temperature control system of chip | |
| CN112242480A (en) | Thermoelectric refrigeration method for chip-level electronic equipment | |
| WO2018161498A1 (en) | Thermal superconductive finned heat radiator and electrical equipment chassis | |
| CN105555102A (en) | Sealed cabinet with thermal superconductive semiconductor refrigeration system | |
| CN209326136U (en) | A kind of semiconductor cooler | |
| CN102446877A (en) | Semiconductor cooling device | |
| CN203704437U (en) | Semiconductor refrigeration integrated system | |
| CN201488389U (en) | High-efficiency refrigerating device structure for semiconductor | |
| Zhao et al. | Optimal design of heat dissipation structure of IGBT Modules based on graphene | |
| CN207318800U (en) | A kind of high heat load All-in-One optical module semiconductor temperature module | |
| CN202888236U (en) | High-efficiency radiating high-power light-emitting diode (LED) | |
| CN112594964A (en) | Flat-plate sleeve type nitrogen cooling device | |
| CN105050371A (en) | High-heat-flux electronic equipment hot spot removing device | |
| CN201134443Y (en) | Semiconductor refrigerator of high power | |
| CN112130644A (en) | Optical module heat dissipation equipment and server | |
| CN206670116U (en) | A kind of efficient energy-saving semi-conductor refrigerator | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |