CN220856565U - Composite chip liquid cooling radiator - Google Patents
Composite chip liquid cooling radiator Download PDFInfo
- Publication number
- CN220856565U CN220856565U CN202322471954.8U CN202322471954U CN220856565U CN 220856565 U CN220856565 U CN 220856565U CN 202322471954 U CN202322471954 U CN 202322471954U CN 220856565 U CN220856565 U CN 220856565U
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- China
- Prior art keywords
- heat absorption
- absorption module
- module
- heat
- cold
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- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 title claims abstract description 12
- 239000002131 composite material Substances 0.000 title claims description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 122
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 239000000110 cooling liquid Substances 0.000 claims abstract description 27
- 238000005057 refrigeration Methods 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000012809 cooling fluid Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A compound chip liquid cooling radiator relates to the technical field of radiators. It comprises the following steps: cold head, cold row, water pump and water pipe, the cold head includes: the device comprises a bottom block, a first heat absorption module, a second heat absorption module, a third heat absorption module, a semiconductor refrigeration piece and a control module; the second heat absorption module is provided with a water inlet, the third heat absorption module is provided with a water outlet, and the second heat absorption module, the first heat absorption module and the third heat absorption module are sequentially communicated, so that cooling liquid sequentially flows through the second heat absorption module, the first heat absorption module and the third heat absorption module; the first heat absorption module is arranged above the bottom block, the third heat absorption module is arranged above the second heat absorption module, and the semiconductor refrigerating sheet is arranged between the second heat absorption module and the third heat absorption module; the control module is electrically connected with the semiconductor refrigerating sheet, the two ends of the semiconductor refrigerating sheet are respectively a cold end and a hot end, the cold end is contacted with the second heat absorption module, and the hot end is contacted with the third heat absorption module. By adopting the technical scheme, the heat dissipation efficiency is high.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a composite chip liquid cooling radiator.
Background
The chip can generate a large amount of heat during operation, and the working performance of the chip can be influenced by the excessively high temperature, so that the chip needs to be cooled. The current mature heat dissipation means comprises two types of air cooling and liquid cooling. The chip liquid cooling radiator has the advantages of silence, stable cooling, small dependence on environment and the like.
With the performance of chips becoming better, the heat dissipation power of the liquid cooling radiator needs to be improved to meet the higher and higher heat dissipation requirements.
Disclosure of utility model
The utility model aims to overcome the defects and shortcomings of the prior art and provides a composite chip liquid cooling radiator which has the advantage of high radiating power.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a composite chip liquid-cooled heat sink comprising:
Cold head, cold row, water pump and water pipe, the cold head includes: the device comprises a bottom block, a first heat absorption module, a second heat absorption module, a third heat absorption module, a semiconductor refrigeration piece and a control module;
The second heat absorption module is provided with a water inlet, the third heat absorption module is provided with a water outlet, and the second heat absorption module, the first heat absorption module and the third heat absorption module are sequentially communicated, so that cooling liquid sequentially flows through the second heat absorption module, the first heat absorption module and the third heat absorption module; the first heat absorption module is arranged above the bottom block, the third heat absorption module is arranged above the second heat absorption module, and the semiconductor refrigeration sheet is arranged between the second heat absorption module and the third heat absorption module; the control module is electrically connected with the semiconductor refrigerating sheet, the two ends of the semiconductor refrigerating sheet are respectively a cold end and a hot end, the cold end is contacted with the second heat absorption module, and the hot end is contacted with the third heat absorption module.
The utility model is further provided with a first bottom surface at one side of the first heat absorption module contacted with the bottom block, and radiating fins are arranged in the first heat absorption module and on the first bottom surface;
The side, contacted with the cold end, of the second heat absorption module is a second bottom surface, and radiating fins are arranged in the second heat absorption module and on the second bottom surface;
And one side of the third heat absorption module, which is contacted with the hot end, is a third bottom surface, and radiating fins are arranged in the second heat absorption module and on the third bottom surface.
The utility model further provides that the second heat absorbing module is arranged above the first heat absorbing module.
The utility model further provides that the second heat absorption module is communicated with the first heat absorption module through a through hole formed between the first heat absorption module and the second heat absorption module, and the first heat absorption module is communicated with the third heat absorption module through a connecting pipe.
The utility model further provides that the water pump is arranged on the cold head.
The utility model further provides that the water pump is arranged above the third heat absorption module.
The utility model further provides that the bottom block is arranged as a copper bottom.
After the technical scheme is adopted, the utility model has the beneficial effects that:
1. In the utility model, the cold head comprises a first heat absorption module, a second heat absorption module and a third heat absorption module, and the cooling liquid sequentially flows through the second heat absorption module, the first heat absorption module and the third heat absorption module, wherein the first heat absorption module is contacted with the bottom block to directly absorb heat generated by the chip, the second heat absorption module is contacted with the cold end of the semiconductor refrigerating sheet, the third heat absorption module is contacted with the hot end, and when the semiconductor refrigerating sheet works, the cooling liquid flowing in the third heat absorption module takes away the heat of the hot end to enable the cold end to keep a relatively low temperature so as to further cool the cooling liquid of the second heat dissipation module, thereby improving the heat absorption efficiency of the chip of the first heat absorption module and improving the integral heat dissipation power of the radiator.
2. In the utility model, radiating fins are arranged in the first heat absorption module and on the first bottom surface; the side, contacted with the cold end, of the second heat absorption module is a second bottom surface, and radiating fins are arranged in the second heat absorption module and on the second bottom surface; and the heat radiating fins are arranged in the third heat absorbing module and on the third bottom surface, so that the heat transfer efficiency of the first bottom surface, the second bottom surface and the third bottom surface is improved, and the overall heat radiating power of the radiator is further improved.
3. In the utility model, the second heat absorption module is arranged above the first heat absorption module, so that the structure of the cold head is more compact, and the second heat absorption module is communicated with the first heat absorption module through the through hole arranged between the first heat absorption module and the second heat absorption module, thereby effectively avoiding the connection failure and leakage.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the coldhead of the present utility model;
FIG. 3 is a schematic view of another view of the cold head of the present utility model
FIG. 4 is a schematic view of another view of the cold head according to the present utility model
FIG. 5 is a cross-sectional view corresponding to the direction A-A of FIG. 4;
FIG. 6 is a schematic view of the cooling fluid flow inside the coldhead corresponding to FIG. 5.
Reference numerals illustrate: 1. a cold head; 2. cold row; 21. a cold exhaust fan; 3. a water pump; 4. a water pipe; 5. a water inlet; 6. a water outlet; 11. a bottom block; 12. a first heat absorption module; 13. a second heat absorption module; 14. a third heat absorption module; 15. a semiconductor refrigeration sheet; 121. a first bottom surface; 122. a first cover plate; 131. a second bottom surface; 132. a second cover plate; 141. a third bottom surface; 142. a third cover plate; 8. a through hole; 9. and (5) connecting pipes.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and those skilled in the art can make modifications to the present embodiment which do not contribute to the utility model as required after reading the present specification, but are protected by the patent laws within the scope of the appended claims.
The present embodiment relates to a compound chip liquid cooling radiator, as shown in fig. 1-6, comprising: cold head 1, cold row 2, water pump 3 and water pipe 4.
The water pipe 4 connects the water pump 3, the cold head 1 and the cold row 2 in series to form a heat dissipation loop. The cooling liquid is filled in the water pipe 4, and the water pump 3 provides power for the flowing of the cooling liquid in the water pipe 4, so that the cooling liquid circulates in the heat dissipation loop to take away the heat generated by the chip operation, and the influence of the chip temperature on the working performance of the chip is avoided.
As shown in fig. 1, the cold head 1 is disposed at the chip and is responsible for absorbing heat emitted by the chip during operation. The cold head 1 is provided with a water inlet 5 and a water outlet 6, and cooling liquid with lower temperature flows into the cold head 1 through the water inlet 5 to absorb heat generated by the chip so as to reduce the temperature of the chip, and the cooling liquid with increased temperature absorbs the heat of the chip. Flows out of the cold head 1 from the water outlet 6 and into the cold row 2 under the action of the water pump 3. The cold row 2 is responsible for radiating heat in the cooling liquid to the outer side of the case so as to reduce the temperature of the cooling liquid, and then the cooling liquid is led into the cold head 1 so as to radiate heat of the chip. Install cold exhaust fan 21 on cold row 2, cold exhaust fan 21 can accelerate the circulation speed of air in cold row 2 for cold row 2 contacts more air, thereby promotes cold row 2's radiating efficiency, in order to better heat dissipation, the cooling to flowing through cold row 2's coolant liquid.
In the present embodiment, as shown in fig. 2 to 6, the coldhead 1 includes: the bottom block 11, the first heat absorbing module 12, the second heat absorbing module 13, the third heat absorbing module 14, the semiconductor cooling sheet 15, and the control module. The water inlet 5 is arranged on the second heat absorption module 13, the water outlet 6 is arranged on the third heat absorption module, and the second heat absorption module 13, the first heat absorption module 12 and the third heat absorption module 14 are sequentially communicated, so that the cooling liquid flows into the cold head 1 from the water inlet 5 and flows through the second heat absorption module 13, the first heat absorption module 12 and the third heat absorption module 14 in sequence as shown by arrows in fig. 6, and then flows out from the water outlet 6, so that the cooling liquid absorbs heat in the chip.
Wherein, as shown in fig. 2-5, the bottom block 11 is the part of the cold head 1 directly contacted with the chip, so as to transfer the heat emitted by the chip into the cold head 1 for absorption. As a preferred solution, the bottom block 11 is a copper block, which has better heat conductivity and can transfer the heat emitted by the chip into the cold head 1 efficiently.
The first heat absorbing module 12 is disposed above the bottom block 11, and the cooling liquid flowing through the first heat absorbing module 12 can directly absorb the heat conducted by the bottom block 11 to dissipate heat and cool the chip. The third heat absorbing module 14 is disposed above the second heat absorbing module 13, and a semiconductor cooling sheet 15 is disposed between the second heat absorbing module 13 and the third heat absorbing module 14. The control module is electrically connected with the semiconductor refrigeration piece 15 to control the working state of the semiconductor refrigeration piece 15, and the semiconductor refrigeration piece 15 can generate a peltier effect when working, namely, when current flows through the semiconductor refrigeration piece 15, the two ends of the semiconductor refrigeration piece 15 can respectively generate heat absorption and heat release phenomena. Wherein the heat absorbing end of the semiconductor refrigerating sheet 15 is a cold end, and the heat releasing end is a hot end. The cold end of the semiconductor refrigeration sheet 15 is in contact with the second heat absorption module 13, and the hot end is in contact with the third heat absorption module 14. The semiconductor cooling fin 15 is operative to absorb heat from the hot side by the cooling fluid flowing in the third heat absorption module 14 so that the cold side is maintained at a relatively low temperature at all times to further cool the cooling fluid in the second heat absorption module 13. Thereby further reducing the temperature of the cooling liquid flowing into the first heat absorbing module 12, and the temperature difference between the cooling liquid in the first heat absorbing module 12 and the chip is larger, so that the cooling liquid in the first heat absorbing module 12 can absorb the heat in the chip better, and the heat is brought into the cold row 2 to be emitted outside the cabinet. The cooling liquid in the third heat absorption module 14 absorbs the heat from the hot end of the semiconductor refrigerating sheet 15, and then directly flows out of the cold head 1 from the water outlet 6 on the third heat absorption module 14, flows into the cold row 2 for heat dissipation and temperature reduction.
As a preferred solution, as shown in fig. 2-5, a first bottom 121 is disposed on one side of the first heat absorbing module 12 contacting the bottom block 11, a first cover 122 is disposed on the other side, heat dissipation fins are disposed on the first bottom 121 inside the first heat absorbing module 12, and the cooling liquid flowing through the first heat absorbing module 12 is fully contacted with the heat dissipation fins on the first bottom 121, so as to efficiently transfer the heat of the chip to the cooling liquid in the first heat absorbing module 12; a second bottom surface 131 is arranged on one side of the second heat absorption module 13, which is contacted with the cold end of the semiconductor refrigerating sheet 15, and a second cover plate 132 is arranged on the other side, and radiating fins are arranged in the second heat absorption module 13 and on the second bottom surface 131, so that the cooling liquid flowing through the second heat absorption module 13 can be fully contacted with the radiating fins on the second bottom surface 131, and the temperature of the cooling liquid flowing through the second heat absorption module 13 can be reduced more efficiently; the third heat absorption module 14 is provided with a third bottom surface 141 on one side contacting with the hot end of the semiconductor refrigerating sheet 15, and a third cover plate 142 on the other side, and heat dissipation fins are arranged in the third heat absorption module 14 and on the third bottom surface 141, so that the cooling liquid flowing through the third heat absorption module 14 can be fully contacted with the heat dissipation fins on the third bottom surface 141, the third heat absorption module 14 can absorb the heat of the hot end of the semiconductor refrigerating sheet 15 more efficiently, the cold end can keep low temperature, the heat dissipation efficiency is improved, and a better heat dissipation effect is realized.
In the present embodiment, as shown in fig. 2 to 5, the second heat absorbing module 13 is disposed above the first heat absorbing module 12, that is, the first cover plate 122 contacts the second cover plate 132. This arrangement makes the structure of the coldhead 1 more compact and smaller. In other embodiments, the first cover plate 122 and the second cover plate 132 may also be provided as an integral molding. As a preferred solution, the second heat absorbing module 13 is communicated with the first heat absorbing module 12 through the through hole 8 formed between the first heat absorbing module 12 and the second heat absorbing module 13, that is, the through hole 8 is formed on the first cover plate 122 and the second cover plate 132, so that the communicating structure is simpler, and damage, leakage and the like are not easy to occur. The first heat absorbing module 12 is communicated with the third heat absorbing module 14 through the connecting pipe 9, so that smooth circulation of the cooling liquid is ensured.
In this embodiment, as shown in fig. 1 to 5, a water pump 3 is provided on the coldhead 1 to power the flow of the coolant. As a preferred solution, the water pump 3 is arranged above the third heat absorption module 14, so that the structure of the coldhead 1 remains compact. Of course, in other implementations, the water pump 3 may be provided at other locations.
The above description is only for the purpose of illustrating the technical solution of the present utility model and not for the purpose of limiting the same, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (7)
1. A composite chip liquid-cooled heat sink comprising: cold head (1), cold row (2), water pump (3) and water pipe (4), its characterized in that, cold head (1) includes: the device comprises a bottom block (11), a first heat absorption module (12), a second heat absorption module (13), a third heat absorption module (14), a semiconductor refrigeration sheet (15) and a control module;
The second heat absorption module (13) is provided with a water inlet (5), the third heat absorption module is provided with a water outlet (6), and the second heat absorption module (13), the first heat absorption module (12) and the third heat absorption module (14) are sequentially communicated, so that cooling liquid sequentially flows through the second heat absorption module (13), the first heat absorption module (12) and the third heat absorption module (14);
The first heat absorption module (12) is arranged above the bottom block (11), the third heat absorption module (14) is arranged above the second heat absorption module (13), and the semiconductor refrigeration sheet (15) is arranged between the second heat absorption module (13) and the third heat absorption module (14); the control module is electrically connected with the semiconductor refrigerating sheet (15), the two ends of the semiconductor refrigerating sheet (15) are respectively a cold end and a hot end, the cold end is contacted with the second heat absorption module (13), and the hot end is contacted with the third heat absorption module (14).
2. The composite chip liquid cooling radiator according to claim 1, wherein a side of the first heat absorbing module (12) contacting the bottom block (11) is a first bottom surface (121), and heat dissipating fins are disposed in the first heat absorbing module (12) on the first bottom surface (121);
The side, contacted with the cold end, of the second heat absorption module (13) is a second bottom surface (131), and radiating fins are arranged in the second heat absorption module (13) and on the second bottom surface (131);
the side, contacted with the hot end, of the third heat absorption module (14) is a third bottom surface (141), and radiating fins are arranged in the second heat absorption module (13) and on the third bottom surface (141).
3. The composite chip liquid-cooled heat sink of claim 1, wherein the second heat absorption module (13) is disposed above the first heat absorption module (12).
4. A composite chip liquid-cooled radiator according to claim 3, characterized in that the second heat absorbing module (13) is in communication with the first heat absorbing module (12) through a through hole (8) opened between the first heat absorbing module (12) and the second heat absorbing module (13), and the first heat absorbing module (12) is in communication with the third heat absorbing module (14) through a connecting pipe (9).
5. The composite chip liquid cooling radiator according to claim 1, wherein the water pump (3) is provided on the cold head (1).
6. The composite chip liquid-cooled radiator according to claim 5, characterized in that the water pump (3) is arranged above the third heat absorbing module (14).
7. The composite chip liquid-cooled radiator according to claim 1, characterized in that the bottom block (11) is provided as a copper bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322471954.8U CN220856565U (en) | 2023-09-11 | 2023-09-11 | Composite chip liquid cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322471954.8U CN220856565U (en) | 2023-09-11 | 2023-09-11 | Composite chip liquid cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856565U true CN220856565U (en) | 2024-04-26 |
Family
ID=90780970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322471954.8U Active CN220856565U (en) | 2023-09-11 | 2023-09-11 | Composite chip liquid cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118159000A (en) * | 2024-05-10 | 2024-06-07 | 深圳市联明电源股份有限公司 | Water cooling assembly for high-power supply |
-
2023
- 2023-09-11 CN CN202322471954.8U patent/CN220856565U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118159000A (en) * | 2024-05-10 | 2024-06-07 | 深圳市联明电源股份有限公司 | Water cooling assembly for high-power supply |
| CN118159000B (en) * | 2024-05-10 | 2024-07-30 | 深圳市联明电源股份有限公司 | Water cooling assembly for high-power supply |
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