CN220963313U

CN220963313U - FPGA chip cooling device

Info

Publication number: CN220963313U
Application number: CN202321893434.XU
Authority: CN
Inventors: 陈志彬; 符蓓
Original assignee: Shenzhen Qunze Electronic Technology Co ltd
Current assignee: Shenzhen Qunze Electronic Technology Co ltd
Priority date: 2023-07-19
Filing date: 2023-07-19
Publication date: 2024-05-14
Anticipated expiration: 2033-07-19

Abstract

The utility model discloses FPGA chip heat dissipation equipment which belongs to the technical field of chip heat dissipation, and comprises a circuit board, wherein an FPGA chip body is arranged at the top of the circuit board, an outer shell is arranged on the periphery of the FPGA chip body, a heat conducting plate is arranged at the top end of the inner part of the outer shell, copper pipes of the heat conducting plate are fixedly arranged in the outer shell in an embedded mode, a refrigerating sheet is arranged at the top of the heat conducting plate, a heat absorbing end of the refrigerating sheet is fixedly connected with the top of the heat conducting plate in a gluing mode, a heat dissipation fin is fixedly arranged at the top heat dissipating end of the refrigerating sheet in a gluing mode, heat generated by the operation of the FPGA chip body is transferred to the heat absorbing end of the refrigerating sheet by the heat conducting silicone grease and the heat conducting plate in a heat transfer mode, heat is diffused by the heat dissipating end, and the purpose of accelerating heat dissipation is achieved by heat absorption and heat dissipation of the refrigerating sheet, and the heat dissipation efficiency of the FPGA chip body is improved.

Description

FPGA chip cooling device

Technical Field

The utility model belongs to the technical field of chip heat dissipation, and particularly relates to FPGA chip heat dissipation equipment.

Background

FPGAs are a product of further development based on programmable devices such as PAL (programmable array logic), GAL (generic array logic) and the like. The FPGA chip is not only limited to research and design chips, but also can be optimally designed by means of a specific chip model aiming at products in more fields.

At present, the integration level of the existing FPGA chip is higher and higher along with development, so that the FPGA chip can generate a large amount of heat during operation, an external radiator is required to radiate the heat due to the fact that the self radiating effect is not ideal, otherwise, the chip temperature is possibly higher due to long-time operation, overload operation is performed under a high-temperature environment for a long time, and the service life of the chip is reduced.

Disclosure of utility model

The utility model aims to provide an FPGA chip heat dissipation device so as to solve the problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a FPGA chip cooling device, includes circuit board, refrigeration piece and water cooling head, the top of circuit board is equipped with the FPGA chip body, the periphery cover of FPGA chip body is equipped with the shell body, the inside top of shell body is equipped with the heat-conducting plate, the heat-conducting plate copper pipe is inlayed the mode and is fixed to be set up in the inside of shell body, the top of heat-conducting plate is equipped with the refrigeration piece, the heat absorption end of refrigeration piece is through the top fixed connection of veneer with the heat-conducting plate, the top of refrigeration piece is released the hot end and is passed through the mode fixed mounting of veneer and is had radiating fin.

Preferably, the top of the radiating fin is provided with a water cooling head, the periphery of the bottom of the water cooling head is provided with a supporting column, the bottom of the supporting column is fixedly connected with the periphery of the top of the outer shell, one side of the outer part of the water cooling head is provided with a circulating copper pipe, and the circulating copper pipe is embedded into an internal gap of the radiating fin and is in tight contact with the internal gap.

Preferably, the heat conduction silicone grease is arranged in the outer shell, and the heat conduction silicone grease is filled in the outer shell.

Preferably, the outer bottom of the outer shell is provided with mounting lugs at the periphery, and the inner side of each mounting lug is provided with a threaded hole.

Preferably, a threaded pipe is arranged around the top of the circuit board, a mounting screw is arranged on the inner side of the top of the threaded pipe, and the mounting screw penetrates through a threaded hole in the mounting lug and is in threaded connection with the threaded pipe.

Compared with the prior art, the utility model has the beneficial effects that:

1. The heat generated by the operation of the FPGA chip body is transferred to the heat absorbing end of the refrigerating sheet by the heat conducting silicone grease and the heat conducting plate by utilizing the heat conducting plate, the refrigerating sheet and the heat radiating fins to diffuse the heat, and the purpose of accelerating heat radiation is realized by absorbing and releasing the heat of the refrigerating sheet, so that the heat radiation efficiency of the FPGA chip body is improved.

2. Through set up the water cooling head at the top of shell body to set up the circulation copper pipe in the clearance of radiating fin, utilize the water-cooling mode, absorb radiating fin's most heat, and circulate repeatedly through the water cooling head, improve the radiating efficiency to the FPGA chip body.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic side view of the present utility model;

Fig. 3 is a schematic diagram of a disassembled structure of the present utility model.

In the figure: 1. a circuit board; 2. an FPGA chip body; 3. an outer housing; 4. heat conductive silicone grease; 5. mounting the protruding blocks; 6. installing a screw; 7. a heat conductive plate; 8. a cooling sheet; 9. a heat radiation fin; 10. a water-cooled head; 11. a support column; 12. and circulating the copper pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution for a heat dissipation device of an FPGA chip: including circuit board 1, refrigeration piece 8 and water cooling head 10, the top of circuit board 1 is equipped with FPGA chip body 2, and the periphery cover of FPGA chip body 2 is equipped with shell body 3, and the inside top of shell body 3 is equipped with heat-conducting plate 7, and heat-conducting plate 7 copper pipe mosaic mode is fixed to be set up in the inside of shell body 3, and the top of heat-conducting plate 7 is equipped with refrigeration piece 8, and the heat absorption end of refrigeration piece 8 is through the top fixed connection of veneer with heat-conducting plate 7, and the top of refrigeration piece 8 is released the hot end and is passed through the mode fixed mounting of veneer and is had radiating fin 9.

Specifically, the top of radiating fin 9 is equipped with water-cooling head 10, and through being equipped with support column 11 around the bottom of water-cooling head 10, the bottom of support column 11 and the top of shell body 3 fixed connection all around, and the outside one side of water-cooling head 10 is equipped with circulation copper pipe 12, and circulation copper pipe 12 imbeds radiating fin 9's inside clearance and with its in close contact.

Specifically, the inside of the outer casing 3 is provided with heat conduction silicone grease 4, and the heat conduction silicone grease 4 is filled in the inside of the outer casing 3.

Specifically, the outside bottom of shell body 3 is equipped with installation lug 5 all around, and the screw hole has been seted up to the inboard of installation lug 5.

Specifically, a threaded pipe is arranged around the top of the circuit board 1, a mounting screw 6 is arranged on the inner side of the top of the threaded pipe, and the mounting screw 6 penetrates through a threaded hole in the mounting lug 5 and is in threaded connection with the threaded pipe.

In this embodiment, in the use process, the heat conducting plate 7 is disposed inside the outer housing 3, and the heat conducting silicone grease 4 is fixedly inlaid at the top end inside the outer housing 3, and the bottom of the heat conducting silicone grease is in close contact with the FPGA chip body 2, and then the heat conducting silicone grease 4 fills the gap, the heat generated by the operation of the FPGA chip body 2 is conducted by the heat conducting plate 7, the heat on the heat conducting plate 7 is absorbed by the heat absorbing end of the refrigerating plate 8, the heat is transferred to the heat dissipating fins 9 by the heat dissipating ends of the refrigerating plate 8, and the heat dissipating fins 9 are used for heat dissipation, and the water cooling head 10 and the circulating copper pipe 12 are used for accelerating the heat loss efficiency of the heat dissipating fins 9 in a water cooling manner, so that the purpose of improving the heat dissipating efficiency is achieved, and the stable temperature environment is provided for the FPGA chip body 2.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a FPGA chip cooling device, includes circuit board (1), refrigeration piece (8) and water-cooling head (10), its characterized in that: the top of circuit board (1) is equipped with FPGA chip body (2), the periphery cover of FPGA chip body (2) is equipped with shell body (3), the inside top of shell body (3) is equipped with heat-conducting plate (7), the inside of heat-conducting plate (7) copper pipe mosaic mode fixed set up in shell body (3), the top of heat-conducting plate (7) is equipped with refrigeration piece (8), the heat absorption end of refrigeration piece (8) is through the top fixed connection of mode and heat-conducting plate (7) of veneer, the top of refrigeration piece (8) is released hot end and is passed through mode fixed mounting of veneer and is had radiating fin (9).

2. The FPGA chip heat dissipating apparatus of claim 1, wherein: the top of fin (9) is equipped with water-cooled head (10), the bottom of water-cooled head (10) is equipped with support column (11) all around, the bottom of support column (11) and the top fixed connection all around of shell body (3), the outside one side of water-cooled head (10) is equipped with circulation copper pipe (12), circulation copper pipe (12) imbeds in the inside clearance of fin (9) and with its intensive contact.

3. The FPGA chip heat dissipating apparatus of claim 1, wherein: the inside of shell body (3) is equipped with heat conduction silicone grease (4), heat conduction silicone grease (4) are filled in the inside of shell body (3).

4. The FPGA chip heat dissipating apparatus of claim 1, wherein: the mounting lug (5) is arranged on the periphery of the outer bottom end of the outer shell (3), and a threaded hole is formed in the inner side of the mounting lug (5).

5. The FPGA chip heat dissipation apparatus of claim 4, wherein: the circuit board is characterized in that a threaded pipe is arranged around the top of the circuit board (1), a mounting screw (6) is arranged on the inner side of the top of the threaded pipe, and the mounting screw (6) penetrates through a threaded hole in the mounting lug (5) and is in threaded connection with the threaded pipe.