CN220934066U - High-power consumption module cooling plate structure - Google Patents

Abstract

The utility model relates to the technical field of radiators, in particular to a high-power-consumption module radiating cold plate structure which comprises a cold plate frame, wherein an installation groove is formed in the cold plate frame, a vapor chamber is arranged at the bottom end of the cold plate frame, a radiating mechanism is arranged in the installation groove, the radiating mechanism comprises a vapor chamber, and a plurality of radiating fins are arranged at the top end of the vapor chamber. According to the utility model, the cold plate frame is arranged, the soaking plate and the heat dissipation mechanism are fixedly connected in a high-temperature welding mode when the heat dissipation device is used, the soaking plate is designed to be in a shape meeting the requirements according to the size requirement when the heat dissipation device is used, the vacuum design is adopted in the heat dissipation device, a medium is injected, the boiling point of the medium is reduced in a vacuum environment, the medium is vaporized by heat generated by a chip, the whole inner cavity is rapidly filled, the heat of the chip is rapidly diffused to the whole soaking plate, and the effect of rapid heat dissipation is achieved.

Description

High-power consumption module cooling plate structure

Technical Field

The utility model relates to the technical field of radiators, in particular to a high-power-consumption module radiating cold plate structure.

Background

For high-density high-power consumption modules, a large amount of heat is generated by a chip in the operation process, and if the internal heat cannot be rapidly dissipated, the temperature of the chip can be increased, so that abnormal operation is caused. The chip always works in a high-temperature environment, and the service life of the chip is seriously reduced.

In the prior art, the chip has the characteristics of high density and small size, the contact area of the chip and the heat dissipation cold plate is small, so that the heat around the chip is large, the heat generated by the chip cannot be rapidly dispersed onto the whole heat dissipation cold plate by conventional materials, and the internal chip is easy to fail after long-time use.

Disclosure of utility model

The utility model aims to provide a high-power-consumption module heat dissipation cooling plate structure so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The utility model provides a high-power consumption module heat dissipation cold plate structure, includes the cold plate frame, the mounting groove has been seted up to cold plate frame inside, cold plate frame bottom is provided with the vapor chamber, the inside cooling mechanism that is provided with of mounting groove, cooling mechanism includes vapor chamber, vapor chamber top is provided with a plurality of heat radiation fins.

Preferably, a cavity is formed in the soaking plate, and a plurality of copper columns are arranged in the cavity.

Preferably, the heat dissipation fins are aluminum strips with the thickness of 0.3 mm.

Preferably, the temperature equalizing plate and the radiating fins are fixedly connected by high-temperature welding, and the temperature equalizing plate and the cold plate frame are fixedly connected by high-temperature welding.

Preferably, the interior of the soaking plate is used for vacuumizing.

Preferably, a medium is disposed inside the cavity.

Compared with the prior art, the utility model has the beneficial effects that:

1. This high-power consumption module heat dissipation cold plate structure through installing the cold plate frame, through high temperature welded mode fixed connection vapor chamber and heat dissipation mechanism during the use, vapor chamber designs into the appearance that accords with the requirement according to the size demand during the use, inside adopts the vacuum design, and inject the medium, the boiling point reduces under the vacuum environment of medium, the heat that produces through the chip makes the medium vaporization, fill whole inner chamber fast, with chip heat spread to whole vapor chamber on, utilize the cold plate frame with radiator fin and vapor chamber welded formation, carry out welded joint with vapor chamber and fin through the metal material, transfer vapor chamber heat to radiator fin on, the effect of quick heat dissipation has been played.

2. This high-power consumption module heat dissipation cold plate structure installs the copper post in the cavity, and inside the support cavity when using has played and has avoided the inside effect that appears warping under the vacuum environment of vapor chamber, and heat dissipation fin adopts 0.3 millimeter thick slice aluminium strip, and tooth space 1.5 millimeters constitutes, and in the effective area when using, tooth density is accomplished highest, has played increase and air heat transfer area, realizes the effect that chip temperature reduces.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a split structure of the present utility model;

FIG. 3 is a schematic diagram of a heat sink fin according to the present utility model;

Fig. 4 is an internal schematic view of a soaking plate according to the present utility model.

In the figure: 1. a cold plate frame; 2. a mounting groove; 3. a soaking plate; 4. a heat dissipation mechanism; 41. a temperature equalizing plate; 42. a heat radiation fin; 5. a cavity; 6. copper columns; 7. a medium.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a high-power consumption module heat dissipation cold plate structure, includes cold plate frame 1, and mounting groove 2 has been seted up to cold plate frame 1 inside, and the mounting groove is located cold plate frame's top, and cold plate frame 1 bottom is provided with vapor chamber 3, and mounting groove 2 inside is provided with cooling mechanism 4, and cooling mechanism 4 includes vapor chamber 41, and vapor chamber 41 top is provided with a plurality of heat radiation fins 42.

In this embodiment, the cold plate frame 1 is installed, the vapor chamber 3 and the heat dissipation mechanism 4 are fixedly connected in a high-temperature welding manner during use, the vapor chamber 3 is designed into a shape meeting the requirement according to the size requirement during use, the interior is designed in vacuum, a medium 7 is injected, such as deionized water, the boiling point of the medium 7 in the vacuum environment is reduced, the medium 7 is vaporized by the heat generated by the chip, the whole inner cavity is rapidly filled, the heat of the chip is rapidly diffused to the whole vapor chamber 3, the heat dissipation fins 42 and the vapor chamber 3 are welded and formed by the cold plate frame 1, the vapor chamber 41 and the fins are welded and combined by metal materials, and the heat of the vapor chamber 41 is transferred to the heat dissipation fins 42, so that the effect of rapid heat dissipation is achieved.

The inside of the vapor chamber 3 is provided with a cavity 5, the inside of the cavity 5 is provided with a plurality of copper columns 6, the heat dissipation fins 42 are formed by buckling 0.3 mm thick sheet aluminum strips with tooth spaces of 1.5 mm, and the inside of the cavity 5 is provided with a medium 7;

In this embodiment, install copper post 6, support cavity 5 is inside during the use, has played the effect of avoiding the inside deformation that appears of vapor chamber 3 under the vacuum environment, and tooth density is accomplished highest in the effective area when a plurality of heat radiation fins use, has played the increase and air heat transfer area, realizes the effect that chip temperature reduces.

The soaking plate is designed into a rectangular shape, so that the heat dissipation channel and the heat exchange area are improved. The low boiling point of the medium in the vacuum environment utilizes the heat generated by the chip to promote the medium to be vaporized, and the medium can be transferred to a condensing end and cold liquefaction in application to form heat exchange circulation.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (7)

1. A high-power consumption module heat dissipation cold plate structure is characterized in that: including cold plate frame (1), mounting groove (2) have been seted up to cold plate frame (1) inside, cold plate frame (1) bottom is provided with vapor chamber (3), mounting groove (2) inside is provided with cooling mechanism (4), cooling mechanism (4) are including vapor chamber (41), vapor chamber (41) top is provided with a plurality of heat radiation fins (42).

2. The high power module heat sink structure of claim 1, wherein: the soaking plate is characterized in that a cavity (5) is formed in the soaking plate (3), and a plurality of copper columns (6) are arranged in the cavity (5).

3. The high power module heat sink structure of claim 1, wherein: the radiating fins (42) are made of aluminum strips with the thickness of 0.3 mm.

4. The high power module heat sink structure of claim 1, wherein: the temperature equalizing plate (41) and the radiating fins (42) are fixedly connected by welding.

5. The high power module heat sink structure of claim 1, wherein: the soaking plate (3) and the cold plate frame (1) are fixedly connected by welding.

6. The high power module heat sink structure of claim 2, wherein: the interior of the soaking plate (3) is used for vacuumizing.

7. The high power module heat sink structure of claim 6, wherein: a medium (7) is arranged in the cavity (5).