CN1852646B - Evapouration cooling-radiating structure of power device - Google Patents
Evapouration cooling-radiating structure of power device Download PDFInfo
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- CN1852646B CN1852646B CN2006100119035A CN200610011903A CN1852646B CN 1852646 B CN1852646 B CN 1852646B CN 2006100119035 A CN2006100119035 A CN 2006100119035A CN 200610011903 A CN200610011903 A CN 200610011903A CN 1852646 B CN1852646 B CN 1852646B
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Abstract
The heat emission structure includes liquid reserve tank, evaporating pipes, condenser, carrier plates, and return liquid pipe. Evaporating pipes on two sides are soldered to carrier plates. Evaporating pipes are connected to condenser, and air inlet. Through return pipe, return liquid port of the condenser is connected to return liquid port of the tank. Evaporative cooling medium is poured into the tank and evaporating pipes. Height of liquid level of evaporative cooling medium is higher than height of up boundary face of the carrier plates. Parts to be cooled are placed on surface of carrier plates. Carrier plates can be raw plates, or grooves are punched in lateral direction on back. Intensified pipes with certain angle of slope can be soldered between evaporating pipes and embedded tothe said grooves to enhance heat elimination. Features are: dual effects of evaporative cooling heat transfer and natural heat elimination, simple structure, high cooling efficiency, and no noise.
Description
Technical field
The present invention relates to the heat abstractor of various power devices, particularly adopt the device heat abstractor of evaporative cooling self-circulation system.
Background technology
Along with the continuous increase of power device capacity, to the more and more higher requirement of usefulness proposition of radiator.The weak link that heat dissipation technology has become high power device to further develop is so paid attention to more and more widely the cooling of device.Whether semiconductor device can normally work, and except that the quality of device itself, depends on also that to a great extent device cooperates with the reasonable of radiator.Power device rises junction temperature owing to producing thermal losses in the knot in working order down, if method that need not be suitable is dissipated to the outside with this heat waste, junction temperature will be too high, thereby power device is damaged, and therefore, must consider the cooling of power device usually.The type of cooling of device can be divided into natural cooling, forced air cooling, liquid cools, boiling cooling four big classes.
Natural cooling is the radiating mode of heat being taken away by natural convection air and radiation effects.The characteristics of this cooling are that radiating efficiency is low, and the volume of unit power is big, be applicable to usually rated current below 20A device or the high-current device in the simple mechanism.
Forced air cooling is mainly used in the device of current rating at 50A to 500A, air-cooled characteristics are radiating efficiency height, are 2～4 times of natural cooling, but will adopt air cooling, will be equipped with blower fan, thereby noise occur and suck dust, difficult in maintenance, shortcoming such as reliability is low relatively greatly, easily.
The liquid cools mainly coolant of usefulness is water or oil.The cooling effectiveness of water-cooled is high, and its convection transfer rate equals 150～300 times of air nature heat exchange coefficient.Replace air-cooledly with water-filled radiator, can improve the capacity of device greatly.This radiator generally is used for the device of current capacity more than 500A, because the insulation property of water are very poor, and can galvano-cautery and leaky occur under high voltage, voltage is high more, and then galvanic corrosion phenomenon is more serious, needs to take extra corrosion protection measure sometimes.Therefore concerning high-pressure installation, its cooling water must be handled by spent ion exchange resin, adopts complicated circulation simultaneously.
The radiating efficiency of oil cooling water-cooled and air-cooled between, its coolant adopts transformer oil mostly, when oil immersion free convection was cooled off, thermal transmission coefficient only was 1/10 of a water-cooled.Oil viscosity is big, needs bigger circulation power, and burning easily.
The boiling cooling has high cooling effectiveness, and the heat transfer efficiency of boiling cooling is than the high several times of oil cooling, and is higher tens times than air cooling, also surpasses water-cooled.Therefore, the volume ratio of boiling cooling device is but much smaller with self-cooling set with the capacity oil cooling.
The cooling effect of immersion type boiling cooling is fabulous, changes the device difficulty, though the effect difference of non-steeped formula cooling, it is very convenient to change device.
Chinese patent CN200320129492.1 " device for high-power power electronic evaporation-cooled device ", proposing the power power electronic device is the outer panel surface that power model is installed in the evaporative cooling case, the heat that produces during power model work reaches the evaporative cooling case that contacts with module, cooling fluid heat absorption in the case, the boiling cooling.Its heat-transfer effect is better, but its structure exists sealing (easily cause the dielectric leakage of system, it is safe and reliable to influence device) and the big problem of dielectric dissipation amount.F-11 3 will be stopped using after 2010, and new coolant price comparison costliness, the consumption of medium will influence promoting the use of of this patent.
So in order to reduce cost and to improve the reliability of device, the present invention proposes a kind of new cooling structure,
Summary of the invention
In order both to obtain better cooling effect, satisfy device again and change requirement convenient, that reduce cost and improve device reliability, the present invention proposes a kind of vaporation-cooling radiating structure of power device, the present invention has strengthened heat exchange by the special construction of support plate and evaporation tube, has reduced the coolant consumption.Because the discord coolant contact of support plate back has reduced the processing technology requirement of support plate, fixing of heat generating components is also easier simultaneously.Because there is not crucial hermetic unit in the present invention, has reduced the dielectric leakage chance that hermetic unit causes to system, heat relies on the medium latent heat of vaporization to take away heat, the cooling effectiveness height simultaneously.
The mode that the present invention adopts the boiling cooling to combine with natural cooling realizes the cooling of device.The present invention is made up of liquid reserve tank, evaporation tube, support plate, condenser and liquid back pipe.Liquid reserve tank, evaporation tube, support plate connect as one, and material adopts high thermal conductivity such as copper or aluminium and the material of certain degree of hardness is arranged.Device can adopt nut screwing clamping or the method for tightening from the top with the hexagonal pedestal is fixed on the support plate.The heat of device relies on conduction and convection current, pass to the coolant in the evaporation tube pipeline, coolant heat absorption boiling, by heat of vaporization heat is taken out of, and risen, in condenser, finish exchange heat with cooling pipe along evaporation tubes, become liquid, then, get back in the liquid reserve tank, form airtight self-circulation system by liquid back pipe.
Support plate relies on conduction and convection current with the coolant in the heat transferred evaporation tube heat part, and other has part to rely on the special construction at support plate back to rely on convection current and outside air to carry out heat exchange heat.In order to satisfy the different operating modes that require, the present invention has designed four kinds of carrying board structures.The surface finish of support plate constant power device one side is handled, to reduce the contact heat resistance of device and support plate.When the device heating amount is big, adopt and be with horizontal evaporation tube structure, heat on the one hand by support plate left and right and base with the heat transferred coolant, on the other hand with the enhanced tube at heat transferred support plate back.During design, the width of support plate should be set according to the size of power device, should make support plate width minimum as far as possible, and heat generating components should be arranged up and down.
Evaporation tube of the present invention is the passage that entire heat dissipation system heat is transmitted, and can adopt pipe, square tube or rectangular tube, and material can be copper or aluminium.The size of caliber designs according to the caloric value of practical devices.In order to reduce thermal resistance, the present invention is welded as a whole support plate and evaporation tube.Evaporation tube can be to be welded as a whole also can connect by flange butt joint or flexible pipe with being connected of liquid reserve tank according to actual needs.
Liquid reserve tank of the present invention adopts 6 blocks of identical material metals to constitute or directly curves with evaporation tube 20.When liquid reserve tank and the non-welding of evaporation tube employing, material can be selected metals such as stainless steel, copper, aluminium.When the welding one, the material of liquid reserve tank is identical with the material of evaporation tube.In order to increase cooling effect, support plate can be welded simultaneously with above the liquid reserve tank mutually, simultaneously the part heat transferred liquid reserve tank of support plate.
The used condenser of the present invention has two air inlets, liquid return hole, exhaust outlet, pressure sensor interface and a gauge port, intake-outlet.Among the present invention in the condenser pipeline adopt copper pipe, and reserve the gas collection space of 100mm in the upper chamber of condenser.The gas that rises enters condenser by air inlet, runs into the copper pipe that inside is connected with cooling water, carries out exchange heat, and the cooling of medium gas is become liquid, by liquid return hole, flows into liquid reserve tank.Pressure sensor is used to transmit signal and gives control appliance, guarantees the safe operation of system.
The used evaporative cooling medium of the present invention is the evaporative cooling medium that environmental requirement is stablized, satisfied in high insulation, low boiling, physical and chemical performance, as new fluorocarbons Fla, 4310,3000 etc. and the F-113 medium that adopting at present.Normal temperature for liquid, is heated to about 50 ~ 60 ℃ down, and the heat absorption evaporation becomes gas.
The present invention has tangible advantage:
1, cooling effectiveness height.The present invention uses low boiling, high insulate, do not burn, the evaporative cooling medium of nontoxic, stable chemical performance, and by the evaporation tube of both sides, most of heat is taken away the device heat by the latent heat of vaporization of medium.The special processing of support plate back has more improved the cooling effectiveness of device.
2, simple in structure.This structure can be according to the fixed form of device, and processes design, easily device is fixed on the support plate.
3, noise is little, the reliability height.Evaporative cooling of the present invention as air-cooled, has been saved original whole ventilating system with respect to the type of cooling in the past, reduces the harm to system of noise that blower fan brings and fan trouble widely; Medium has high insulation, has eliminated original water and has leaked the shortcomings such as electrical breakdown that cause.The problem that does not have simultaneously sealing leak.Adopt self-cycle structure, do not needed outer loop power.
Description of drawings
Fig. 1 is a specific embodiment of the invention vaporation-cooling radiating structure rearview, among the figure: 10 liquid reserve tanks, 20 evaporation tubes, 30 condensers, 40 support plates, 50 liquid back pipes, 60 coolants.
Fig. 2 is liquid reserve tank 10 structure left views of the present invention, among the figure: 101 casings, 102 liquid return holes, 103 band valve leakage fluid drams, 104 connected entrances.
Fig. 3 is evaporation tube 20 structural representations of the present invention.Fig. 3 a is not for being with horizontal evaporation tube structural representation, Fig. 3 b for being with horizontal evaporation tube structural representation.
Fig. 4 is condenser 30 structural representations of the present invention, among the figure: 301 housings, 302 air inlets, 303 liquid return holes, 304 transducers, 305 pressure gauge connections, 306 copper pipes, 307 electromagnetically operated valves.
Fig. 5 is the various structural representations of support plate of the present invention, and Fig. 5 a is that tabula rasa structural representation, Fig. 5 b are that carrying board structure schematic diagram with ribbing, Fig. 5 c are that net rib carrying board structure schematic diagram, Fig. 5 d are diagonal rib carrying board structure schematic diagram
Embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, the present invention is made up of liquid reserve tank 10, evaporation tube 20, condenser 30, support plate 40 and liquid back pipe 50.Liquid reserve tank 10 and evaporation tube 20 are communicated with, can connect by welding, flange and flexible pipe, support plate 40 welds one with the evaporation tube 20 of both sides, evaporation tube 20 adopts flange or flexible pipe to be connected with the air inlet 302 of condenser 30, the liquid return hole 303 of condenser 30 links to each other by liquid back pipe 50 with the liquid return hole 102 of liquid reserve tank, constitutes a kind of radiator structure efficiently.Pour into evaporative cooling medium 60 in liquid reserve tank 10 and the evaporation tube 20, the liquid level of evaporative cooling medium 60 is higher than the last interfacial level of support plate 40.Device is fixed in support plate 40 surfaces.When the device heating amount is big, heat on the one hand by support plate 40 left and right and base with the heat transferred coolant, on the other hand with the enhanced tube 2021 at heat transferred support plate 40 backs.During design, the width of support plate 40 should be set according to the size of power device, makes support plate 40 width minimums as far as possible, and heat generating components should be arranged up and down.
Fig. 2 is the structural representation of liquid reserve tank 10 of the present invention.As shown in Figure 2, casing 101 adopts the rectangle sheet material welding of metal material or directly curves with evaporation tube 20.Liquid return hole 102 links to each other with liquid back pipe 50.The leakage fluid dram 103 of band valve is used for the liquid of liquid reserve tank 10 is discharged.Connected entrance 104 can be designed as with evaporation tube 20 and is one, also can middle add flange and connect.
Fig. 3 is the structural representation of evaporation tube 20 of the present invention.Shown in Fig. 3 a, be not with horizontal evaporation tube structure, left and right sides evaporation tube 20 is not communicated with at the horizontal space of support plate 40, and coolant 60 is heated in pipeline separately, brings heat into condenser 30 after the vaporization and carries out exchange heat.Flexible for structure, condenser 30 is connected by flange or flexible pipe with evaporation tube 20, can realize the remote placement of condenser.Evaporation tube 20 adopts the metal material of high thermal conductivities such as copper or aluminium.Fig. 3 b is depicted as the structure with horizontal evaporation tube, in order to increase the radiating efficiency of support plate 40, welding has the enhanced tube 2021` at certain angle of inclination between the evaporation tube 20 of the left and right sides, the back that is covered with support plate 40, manufacturing materials is consistent with the material of evaporation tube 20, and the selection of caliber can be arbitrarily, and matches with support plate 40 structures shown in Fig. 5 d, enhanced tube 2021 embeds in the groove at support plate 40 backs, and guarantees that by heat-conducting silicone grease or welding manner contact is good.
Fig. 4 is condenser 30 structural representations of the present invention.As shown in Figure 4, copper pipe 306 is arranged in condenser shell 301 inner horizontal, in order to give full play to the condensation efficiency of condenser 30, and less exhaust number of times, require copper pipe 306 and condenser shell 301 tops distance greater than 100mm, the tube side of condenser can be designed as single tube journey or two-tube-pass according to cooling capacity.Transducer 304 is used to detect the operating pressure of internal cavity, when pressure surpasses anticipation pressure, opens electromagnetically operated valve 307 by control appliance and carries out exhaust.The safe operation of assurance system.
Fig. 5 is support plate 40 structural representations of the present invention.In order to satisfy the requirement of structure under difference heat radiation operating mode, improve radiating efficiency, support plate 40 has designed 4 kinds of structures.Tabula rasa structure shown in Fig. 5 a: the face of support plate 40 installing devices adopts polishing, grinds, and requires to have higher evenness, the less contact heat resistance of trying one's best.Another side can not deal with.Fig. 5 b is a carrying board structure with ribbing, laterally goes out some grooves at support plate 40 backs, and bottom land can be circular-arc or plane.Fig. 5 c is a net rib carrying board structure, goes out some grooves in support plate 40 back vertical, horizontal, and the groove bottom land can be circular-arc or plane.Fig. 5 d is the diagonal rib carrying board structure, goes out the groove that some have constant slope at support plate 40 backs, and the size of groove is identical with enhanced tube 2021 external diameters, and enhanced tube 2021 is embedded in the skewed slot of support plate, guarantees that by heat-conducting silicone grease or welding contact is good.When the needs heat dissipation capacity was big, support plate 40 was with the coolant of enhanced tube 2021 inside at heat transferred back, and medium is taken away heat at the boiling in ducts of constant slope.
As shown in Figure 1, the present invention adopts the method for nut screwing clamping or the method for tightening from the top with the hexagonal pedestal, and device is fixed on the support plate 40, open electromagnetically operated valve 307, charge into evaporative cooling medium, observe the height of liquid level in the liquid back pipe 50, the control liquid level surpasses interface on the support plate 40, stops topping up.When power device is worked, because the internal loss device temperature rises, heat is on the one hand by support plate 40 left sides, the right side and base are with heat transferred evaporative cooling medium 60, on the other hand with the evaporative cooling 60 of the enhanced tube 2021` inside at heat transferred support plate 40 backs, evaporative cooling medium 60 absorbs heat, surpass temperature under the saturation pressure, come to life, by vaporization heat is taken away, coolant 60 gases rise along evaporation tube 20, arrive the condenser 30 at top, carry out heat exchange with the cooling water pipe 306 that is connected with secondary cooling water, the heat transferred secondary cooling water is taken away, its body of medium is condensed into liquid simultaneously, flow into liquid reserve tank 10 along liquid back pipe 50, form airtight self-cycle structure.Condenser 30 tops are provided with pressure sensor 304 and are used for the test chamber pressure inside, and electromagnetically operated valve 307 has automatic vent and pipe liquid dual function.
The present invention has realized that evaporative cooling is conducted heat and the cooling of natural heat dissipation dual-use function, and is simple in structure, easy for installation, cooling effectiveness height and noiseless etc.The present invention is applicable to the heat radiation of various power devices, as diode, triode, IGBT, IGCT, thyristor, can turn-off transistor constant power device, can be applied to the cooling of various device heat generating components simultaneously.
Claims (6)
1. the evaporative cooling for heat radiation device of a power device comprises evaporation tube (20), condenser (30) and liquid back pipe (50), it is characterized in that also comprising liquid reserve tank (10), support plate (40); The evaporation tube (20) that is positioned at described support plate (40) both sides is welded as a whole with support plate (40), evaporation tube (20) adopts flange or flexible pipe to be connected with condenser (30) air inlet (302), and the liquid return hole (303) of condenser (30) links to each other by liquid back pipe (50) with the liquid return hole (102) of liquid reserve tank (10); Pour into evaporative cooling medium (60) in liquid reserve tank (10) and the evaporation tube (20), the liquid level of evaporative cooling medium (60) is higher than the last interfacial level of support plate (40); Described power device is fixed in the surface of support plate (40) one sides through polishing.
2. according to the evaporative cooling for heat radiation device of the described power device of claim 1, it is characterized in that support plate (40) opposite side surface is polished.
3. according to the evaporative cooling for heat radiation device of the described power device of claim 1, it is characterized in that laterally going out groove on the opposite side surface of described support plate (40), the groove bottom land is circular-arc (4021) or plane (4022).
4. according to the evaporative cooling for heat radiation device of the described power device of claim 1, it is characterized in that at the opposite side surface longitudinal of described support plate (40) and laterally go out groove that the groove bottom land is circular-arc (4021) or plane (4022).
5. according to the evaporative cooling for heat radiation device of the described power device of claim 1, it is characterized in that going out groove with constant slope on the opposite side surface of described support plate (40).
6. the evaporative cooling for heat radiation device of power device according to claim 1, it is characterized in that welding the enhanced tube (2021) with certain angle of inclination between the evaporation tube (20) in the left and right sides, enhanced tube (2021) embeds in the inclined groove on support plate (40) opposite side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100119035A CN1852646B (en) | 2006-05-16 | 2006-05-16 | Evapouration cooling-radiating structure of power device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100119035A CN1852646B (en) | 2006-05-16 | 2006-05-16 | Evapouration cooling-radiating structure of power device |
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| CN1852646A CN1852646A (en) | 2006-10-25 |
| CN1852646B true CN1852646B (en) | 2011-01-12 |
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| CN2006100119035A Expired - Fee Related CN1852646B (en) | 2006-05-16 | 2006-05-16 | Evapouration cooling-radiating structure of power device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100445659C (en) * | 2007-02-12 | 2008-12-24 | 格林斯潘控制技术（上海）有限公司 | Heat releasing mechanism of frequency conversion power driving module |
| CN101751096B (en) * | 2009-12-25 | 2011-11-16 | 中国科学院电工研究所 | Evaporation-cooled device attached to surface of super computer |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4027728A (en) * | 1975-03-31 | 1977-06-07 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooling device for semiconductor device |
| US4501123A (en) * | 1982-12-03 | 1985-02-26 | Mitsubishi Denki Kabushiki Kaisha | Cooling apparatus for machinery |
| US5520244A (en) * | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
| CN2651818Y (en) * | 2003-08-08 | 2004-10-27 | 英业达股份有限公司 | Radiator |
| CN2673048Y (en) * | 2003-12-22 | 2005-01-19 | 中国科学院电工研究所 | Evaporation cooler of high power electric and electronic device |
| CN2711901Y (en) * | 2004-07-13 | 2005-07-20 | 纪惠红 | Radiation cooling device |
| CN2773905Y (en) * | 2004-10-27 | 2006-04-19 | 原泽 | Active evaporating radiator of power semiconductor or module |
-
2006
- 2006-05-16 CN CN2006100119035A patent/CN1852646B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4027728A (en) * | 1975-03-31 | 1977-06-07 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooling device for semiconductor device |
| US4501123A (en) * | 1982-12-03 | 1985-02-26 | Mitsubishi Denki Kabushiki Kaisha | Cooling apparatus for machinery |
| US5520244A (en) * | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
| CN2651818Y (en) * | 2003-08-08 | 2004-10-27 | 英业达股份有限公司 | Radiator |
| CN2673048Y (en) * | 2003-12-22 | 2005-01-19 | 中国科学院电工研究所 | Evaporation cooler of high power electric and electronic device |
| CN2711901Y (en) * | 2004-07-13 | 2005-07-20 | 纪惠红 | Radiation cooling device |
| CN2773905Y (en) * | 2004-10-27 | 2006-04-19 | 原泽 | Active evaporating radiator of power semiconductor or module |
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| CN1852646A (en) | 2006-10-25 |
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Owner name: JIANGSU HONGCHANG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ELECTROTECHNICS INST., OF THE CHINESE ACADEMY OF SCIENCES Effective date: 20120321 |
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Effective date of registration: 20120321 Address after: 212322 East Ring Road, Xinqiao Town, Danyang, Jiangsu Patentee after: Jiangsu Hongchang Technology Co., Ltd. Address before: 100080 Beijing Haidian District Zhongguancun north two No. 6 Patentee before: Institute of Electrical Engineering of the Chinese Academy of Sciences |
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