CN2711901Y - Radiation cooling device - Google Patents
Radiation cooling device Download PDFInfo
- Publication number
- CN2711901Y CN2711901Y CN 200420071552 CN200420071552U CN2711901Y CN 2711901 Y CN2711901 Y CN 2711901Y CN 200420071552 CN200420071552 CN 200420071552 CN 200420071552 U CN200420071552 U CN 200420071552U CN 2711901 Y CN2711901 Y CN 2711901Y
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- CN
- China
- Prior art keywords
- evaporating
- zone
- cooling device
- condensing
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a radiation cooling device, comprising an evaporating zone, a condensing zone and a sealed cavity which is composed of communicating pipes provided between the evaporating zone and the condensing zone; the gaseous substance or the liquid substance can circularly flow in the sealed cavity; the evaporating zone contains a heating surface having a micro channel; the condensing zone contains a radiating surface; the space in the sealed cavity is the sealed space which is pumped into the vacuum and is filled with the liquid working medium. The communicating pipe contains at least a condensing pipe and at least an evaporating pipe, and the sectional area of the evaporating pipe can be larger than the sectional area of the condensing pipe. The outlet liquid position of the condensing zone is higher than the inlet liquid position of the evaporating zone. When applying, the external surface of the heating surface of the evaporating zone of the evaporating cooling device is stuck with the external surface of the heating electronic component; the liquid in the evaporating zone is heated to evaporate to enter into the condensing zone via the communicating pipe. Due to the function of the heat radiation device of the condensing zone, the steam becomes the liquid after cooled, and flows back to the evaporating zone via the communicating pipe; such repetition, the function of the electronic component such as the cooling chip, etc. can be achieved.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly is applied to the evaporative heat loss cooling device of electronic devices and components, processor, video card, chipset and hard disk.
Background technology
At present at industrial circle, the cooling of electronic devices and components, processor, video card, chipset and hard disk to heating mainly is to adopt fin to carry out air cooling in conjunction with fan, and principle is to utilize the heat convection principle to be lost to the cabinet as early as possible from the heat that thermal source produces to go.The major defect of this technology is: the effect of heat radiation relies on the power consumption of fan, and power consumption can not significantly improve, and has restricted heat-sinking capability.Because the noise that active fan sent is very big, influence is environment for use on every side in addition.In recent years, microchannel is used more and more widely in the chip cooling field, and its phase transformation evaporation hot-fluid principle also is proved to be a kind of dynamical heat radiation type of cooling.But use the evaporation-cooled device product of microchannel production design, large-scale application has seldom hindered the paces that China's new technology is used virtually.
The utility model content:
The utility model purpose is for utilizing microchannel, and a kind of suitable large-scale production, widely used no power consumption, peace and quiet, evaporation-cooled device that the heat radiation total capacity is big are provided.
The technical solution of the utility model is such:
A kind of heat sinking cooling device constitutes the airtight cavity that a gaseous state or liquid can circulate by evaporating area (1), condensing zone (3) and the communicating pipe between them (2) and (4).Evaporating area (1) comprises that one has the heating surface of micro-channel (5), the micro-channel of heating surface is made by following technology: process the height unanimity on metallic plate (copper coin or the aluminium sheet) plane of moulding, at interval uniform slotted vane, height and width are a millimeter level or a micron order.Two ends encapsulate and reserve input/output port with the metal derby (6) that is higher than micro-channel again and communicating pipe joins, and encapsulate with a metallic plate on it again.Condensing zone (2) can be made body structure, and peripheral hardware fin, condensing zone also have input/output port and communicating pipe to join.By the space in the airtight cavity that constitutes evaporating area, condensing zone, communicating pipe is the confined space that vacuumizes and be perfused with liquid working substance.For guaranteeing that liquid is back to evaporating area from condensing zone under action of gravity, said condensing zone fluid position is higher than evaporating area feed liquor position.
Can comprise at least one condenser pipe and at least one evaporation tube communicating pipe, and the sectional area of evaporation tube can be greater than the sectional area of described condenser pipe.
When this evaporation-cooled device is used, the outer surface of evaporation-cooled device evaporating area heating surface is pasted mutually with the outer surface of heating electronic component, the heated liquid in the evaporating area evaporates, by communicating pipe entering condensing zone.Because the effect of condensing zone heat abstractor becomes liquid again after the steam cooled,, so can reach the effect of electronic devices and components such as cooled wafer repeatedly by communicating pipe being back to evaporating area.
Technique effect of the present utility model is: because micro-channel processing is easy, economical, improved process efficiency, in addition, the space in the airtight cavity be vacuumize and be perfused with liquid working substance because free from admixture disturbs, improved heat transfer property and circulation rate greatly.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the evaporating area schematic diagram of band micro-channel of the present utility model.
Embodiment:
See Fig. 1 and Fig. 2, a kind of heat sinking cooling device, comprise the airtight cavity that gaseous state that evaporating area (1), condensing zone (3) and the communicating pipe between them (2) and (4) constitute or liquid can circulate, the space in this airtight cavity be vacuumize and be perfused with liquid working substance.Described evaporating area (1) comprises that one has the heating surface of micro-channel, and described condensing zone (3) includes radiating surface, and described evaporating area (1) and condensing zone (3) are square box structure, and the heating surface of evaporating area (1) has micro-channel as shown in Figure 2.Connect an evaporation tube (2) to condensing zone (3) by evaporating area, condensing zone (3) connects a condenser pipe (4) to evaporating area (1) lower end.Said condensing zone (3) fluid position is higher than evaporating area (1) feed liquor position.Said condensing zone (3) outer surface has the radiating fin device.
Claims (7)
1. heat sinking cooling device, comprise the airtight cavity that gaseous state that evaporating area, condensing zone and the communicating pipe between them constitute or liquid can circulate, described evaporating area comprises that one has the heating surface of micro-channel, described condensing zone includes radiating surface, it is characterized in that: the space in the described airtight cavity is the confined space that vacuumizes and be perfused with liquid working substance.
2. heat sinking cooling device as claimed in claim 1 is characterized in that: comprise at least one condenser pipe and at least one evaporation tube described communicating pipe.
3. heat sinking cooling device as claimed in claim 1 is characterized in that being divided into communicating pipe two groups up and down, and one group is evaporation tube, and one group is condenser pipe.
4. heat sinking cooling device as claimed in claim 1 or 2 is characterized in that: the outer surface of described evaporating area pastes mutually with the outer surface of heater.
5. heat sinking cooling device as claimed in claim 1 or 2 is characterized in that evaporating area is positioned under the condensing zone.
6. as claim 2 or 3 described heat sinking cooling devices, it is characterized in that: the sectional area of described evaporation tube is greater than the sectional area of described condenser pipe.
7. heat sinking cooling device as claimed in claim 1 or 2 is characterized in that: the radiating surface appearance of described condensing zone is equiped with fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420071552 CN2711901Y (en) | 2004-07-13 | 2004-07-13 | Radiation cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420071552 CN2711901Y (en) | 2004-07-13 | 2004-07-13 | Radiation cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2711901Y true CN2711901Y (en) | 2005-07-20 |
Family
ID=36193002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420071552 Expired - Fee Related CN2711901Y (en) | 2004-07-13 | 2004-07-13 | Radiation cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2711901Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100495692C (en) * | 2005-11-18 | 2009-06-03 | 华南理工大学 | Capillary pump cooler with micro-groove wing structure and its manufacturing method |
| CN1852646B (en) * | 2006-05-16 | 2011-01-12 | 中国科学院电工研究所 | Evapouration cooling-radiating structure of power device |
| CN107835617A (en) * | 2017-11-01 | 2018-03-23 | 深圳兴奇宏科技有限公司 | Loop heat pipe structure |
-
2004
- 2004-07-13 CN CN 200420071552 patent/CN2711901Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100495692C (en) * | 2005-11-18 | 2009-06-03 | 华南理工大学 | Capillary pump cooler with micro-groove wing structure and its manufacturing method |
| CN1852646B (en) * | 2006-05-16 | 2011-01-12 | 中国科学院电工研究所 | Evapouration cooling-radiating structure of power device |
| CN107835617A (en) * | 2017-11-01 | 2018-03-23 | 深圳兴奇宏科技有限公司 | Loop heat pipe structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |