CN201893331U

CN201893331U - Heat dissipation structure

Info

Publication number: CN201893331U
Application number: CN2010206126759U
Authority: CN
Inventors: 王金塗
Original assignee: SUZHOU CITY TENGYI TECHNOLOGY Co Ltd
Current assignee: SUZHOU CITY TENGYI TECHNOLOGY Co Ltd
Priority date: 2010-11-18
Filing date: 2010-11-18
Publication date: 2011-07-06
Anticipated expiration: 2020-11-18

Abstract

The utility model relates to a heat dissipation structure, which is arranged on an electronic component and dissipates the heat from the electronic component, and comprises a heat absorption body connected with the electronic component and a heat dissipation body, wherein the heat absorption body is hollow and forms a first space in which a working liquid is arranged, and a plurality of first guide pipes are arranged between the heat absorption body and the heat dissipation body. When the heat absorption body absorbs heat energy generated by the electronic component through a contact surface, the working liquid in the heat absorption body is vaporized to be converted into vapor, and the vapor flows into a second space in the heat dissipation body through the first guide pipes and exchanges heat with a heat dissipation surface on the heat dissipation body, so that the vapor is converted into the working liquid; and finally, the working liquid is conveyed back to the first space through a second guide pipe with capillary structures inside to form a heat cycle, thus the effects that the structure is simple and the heat is quickly absorbed and dissipated are achieved.

Description

Radiator structure

Technical field

The utility model relates to a kind of radiator structure, particularly relates to a kind of radiator structure with capillary structure.

Background technology

The development in science and technology of making rapid progress, convenient human life, the performance of endless lifting electric equipment products, for example emphasize arithmetic speed and stable high-order electronic product, as server and work station, or even personal PC and notebook computer, driven more and more higher performance and the speed requirement of CPU.Yet in this development trend, one of maximum obstacle comes from caloric value, and the at present maximum electronic component faults or the reason of damage are heat and can distribute, and causes overheated institute to cause.Heat mainly is that time institute produces by active element computings such as transistors among the IC, along with transistor size in the chip is more and more, caloric value is increasing, but the volume of electronic product but dwindles day by day, when chip area is not along with increase, area of dissipation dwindles day by day and impels element heating density more and more higher, make traditional radiating module not apply and use, and problems of excessive heat has caused the bottleneck of present electronic component technology development.

Heat dissipation problem, the significant consideration when always being electronic system design, purpose are to reduce electronic component because of the overheated chance that breaks down or damage, and not only promote the reliability of electronic product system even can prolong useful life of electronic product.Document is pointed out 10～15 degrees centigrade of the every risings of temperature, and the chip life-span will reduce 50%, and the heat of therefore how effectively and fast taking away electronic component and being produced becomes the important topic of research.Central processing unit (CPU) with computer is an example, the normal at present radiating mode that uses is for installing fan or fin additional on central processing unit (CPU), directly it is dispelled the heat, but the fan forced convection mode is dispelled the heat to have and need be expended electric power, problems such as tool noise and life-span are short, therefore there is use micro heat pipe (HEATPIPE) that the heat that central processing unit (CPU) produces is delivered to heat sink (HEAT SINK) or counter body again, the passive radiating mode of this kind has not power consumption, noiselessness, advantages such as the life-span is long, micro heat pipe will be played the part of critical role on the heat dissipation problem of following notebook computer and compact information products.

See also TaiWan, China patent announcement certificate I421644 number, it discloses a kind of heat-pipe radiating apparatus, it comprises a heat pipe, a radiator, this heat pipe has an evaporation section, a condensation segment, reaches the adiabatic section that connects this evaporation section and this condensation segment, this evaporation section and heater element surface fit, its binding face area equates substantially with the heater element surface area, this condensation segment is connected with radiator, be connected with the convergent shape transition between this evaporation section and the adiabatic section, the ratio of the radius of curvature of this junction and adiabatic section section width greater than 0.2 smaller or equal to 1.

The defective of aforementioned techniques is, the volume that its heat-sinking capability is subjected in the heat pipe limits, the hydraulic fluid of dying because of its internal capacity is little is also less, and the design of its single heat pipe is slower on rate of heat dispation, if be used in the ultrahigh speed electronics running speed electronic component that can produce high heat, can't reach its heat radiation requirement.

The utility model content

Main purpose of the present utility model is to solve the not good defective of radiating efficiency of aforementioned techniques.

For achieving the above object, the utility model provides a kind of radiator structure, is used on the electronic component so that it is dispelled the heat, and this radiator structure comprises an absorber and a radiator.This absorber is connected on this electronic component absorbing the heat energy of its generation with a contact-making surface, and it is inner for hollow and form one first space, is provided with the hydraulic fluid that transmits heat energy in this first space.This radiator has a radiating surface and forms one second space in inside, and be provided with a plurality of first conduits between this absorber and this radiator, those first conduits connect this first space and this second space, after heat energy that this electronic component produced is absorbed by this absorber via this contact-making surface, this hydraulic fluid that is positioned at this first space evaporates by heat to vaporize in a disguised form becomes steam, and flow to this second space via described first conduit by this first space, this steam carries out heat exchange and in a disguised form replys with this radiating surface in this second space is hydraulic fluid, and be back in this first space of this absorber via second conduit that an inside has a capillary structure, form a thermal cycle and constantly the heat energy of this electronic component is taken away.

Radiator structure described in the utility model, wherein this capillary structure is to be selected from by sintered powder, metallic fiber, metal mesh, groove, and the group that forms of cotton-wool.

Radiator structure described in the utility model wherein connects a radiating fin on this radiating surface of this radiator.

Radiator structure described in the utility model, wherein this hydraulic fluid is a refrigerant.

Radiator structure described in the utility model, wherein this hydraulic fluid is to be selected from the group that is made up of pure water, methyl alcohol, ethanol, acetone and heptane.

Radiator structure described in the utility model, wherein this second conduit is respectively equipped with a diversion division in two ends, and this diversion division is inclination and flows in this second conduit in order to this hydraulic fluid.

Radiator structure described in the utility model, wherein this absorber and this radiator are respectively equipped with a plurality of first and connect and establish hole and second and connect and establish the hole, and described first connects and establishes hole and second and connect that to establish the hole be to wear connection for described first conduit and this second conduit.

Radiator structure described in the utility model, wherein this radiator inside is provided with an inclined wall, and this inclined wall second is connect and establishes the hole direction toward having a down dip toward this by the edge.

Has second conduit of capillary structure by set this of the utility model, make this radiator structure rapidly this hydraulic fluid is back to this first space and form a thermal cycle, and have this first space and this second space respectively because of this absorber and this radiator, make internal capacity can hold more hydraulic fluid greatly, reach effect simple in structure, rapid heat dissipation.

Description of drawings

Fig. 1 is the schematic appearance of the utility model radiator structure;

Fig. 2 is the decomposing schematic representation of the utility model radiator structure;

Fig. 3-the 1st, the structural profile action schematic diagram () of the utility model radiator structure one preferred embodiment;

Fig. 3-the 2nd, the structural profile action schematic diagram (two) of the utility model radiator structure one preferred embodiment;

Fig. 4 is that the utility model radiator structure is with the structural profile action schematic diagram of sliver as the embodiment of capillary structure;

Fig. 5 is the schematic appearance of the embodiment of the utility model radiator structure installing radiating fin.

The reference numeral explanation

1 ... .... radiator structure

10............. absorber

11............. contact-making surface

12............. first space

13............. first connects and establishes the hole

20............. radiator

21............. radiating surface

22............. second space

23............. second connects and establishes the hole

24............. inclined wall

30............. first conduit

40............. second conduit

41............. capillary structure

42............. diversion division

50............. hydraulic fluid

60............. electronic component

70............. radiating fin

Embodiment

Relevant detailed description of the present utility model and technology contents now are described as follows with regard to conjunction with figs.:

See also Fig. 1 and Fig. 2, be the schematic appearance and the decomposing schematic representation of the utility model radiator structure.The utility model is a kind of radiator structure 1, mainly is used on the electronic component 60 so that it is dispelled the heat.This radiator structure 1 comprises an absorber 10, a radiator 20, reaches first conduit 30 of this absorber 10 of a plurality of connections and this radiator 20, this absorber 10 is to be installed on the surface of this electronic component 60 to absorb the heat that it is distributed, it is a hollow housing, and forms one first space 12 in inside.This radiator 20 also is a hollow housing, have a radiating surface 21 and form one second space 22 to carry out thermal energy exchange in inside, this absorber 10 and this radiator 20 are respectively equipped with a plurality of first and connect and establish hole 13 and second and connect and establish hole 23, establish those first conduits 30 in order to connect, more than constitute main framework of the present utility model.

See also Fig. 3-1 and Fig. 3-2, be structural profile illustrative view of the present utility model.Shown in Fig. 3-1, this absorber 10 is installed on this electronic component 60, with a contact-making surface 11 thermal energy conduction that this electronic component 60 is produced when operating is absorbed, and in this first space 12, be provided with hydraulic fluid 50, this hydraulic fluid 50 is a refrigerant in present embodiment, or as liquid such as pure water, methyl alcohol, ethanol, acetone or heptane, but be not restriction with these a little liquid.When these electronic component 60 runnings and generation heat energy, the thermal energy conduction that this contact-making surface 11 will absorb from this electronic component 60 is positioned at the hydraulic fluid 50 in first space 12 to this, the temperature of this hydraulic fluid 50 begins to rise simultaneously, when temperature during greater than the evaporating point of this hydraulic fluid 50, these hydraulic fluid 50 beginnings in a disguised form are converted to steam, and are entered in this second space 22 of this radiator 20 via this first conduit 30 by this first space 12.Because this radiator 20 itself is to adopt the material of high-termal conductivity made, therefore when this steam enters this second space 22 and touches this radiating surface 21, the heat energy that this steam is carried secretly will be absorbed by this radiating surface 21 rapidly and carry out heat exchange with extraneous air, make the temperature of this steam begin to descend, when steam temperature drops to condensation point, this steam begins covert and replys is this hydraulic fluid 50, and is attached to the internal face of this radiator 20.

Shown in Fig. 3-2; this radiator structure 1 is provided with one second conduit 40; this second conduit 40 has a plurality of capillary structures 41; this capillary structure 41 can be minute groove, metallic fiber, sintered powder, metal mesh or cotton-wool cloth etc.; but do not exceed with those structures, all structures with capillary adsorption capacity are protection range of the present utility model.Be provided with diversion division 42 in these second conduit, 40 two ends, this diversion division 42 is the chamfering shape to allow this hydraulic fluid 50 be able to more successfully flow in this second conduit 40, hydraulic fluid 50 after those condense flows along an inclined wall 24 of being located at this radiator 20, this inclined wall 24 is to be had a down dip toward these second conduit, 40 directions are past by the edge, this hydraulic fluid 50 can promptly be flowed and acceleration cycle speed toward these second conduit, 40 directions, and this hydraulic fluid 50 be subjected to this second conduit 40 this capillary structure 41 suction-operated and be pulled in this first space 12 that is back to this absorber 10, and continuation absorbs the heat energy that this electronic component 60 is distributed, and form a thermal cycle, make this electronic component 60 be able to normality and keep a suitable working temperature.

The utility model also has the embodiment of sliver as this capillary structure 41.See also Fig. 4, for of the present utility model with sliver as the structural profile of capillary structure action schematic diagram.As shown in the figure, be provided with the capillary structure 41 of this strip cotton-wool in these second conduit, 40 inside, when steam condenses into hydraulic fluid 50 in this second space 22, this hydraulic fluid 50 will flow toward this second conduit 40 along this inclined wall 24 of this radiator 20, this capillary structure 41 is drawn this hydraulic fluid 50 and it is sent to this first space 12 via this second conduit 40, and forms a thermal cycle.

In order to promote radiating efficiency of the present utility model, also have an embodiment with radiating fin 70, see also Fig. 5, be the schematic appearance of the embodiment of installing radiating fin of the present utility model.On this radiating surface 21 of this radiator 20, installed a radiating fin 70 in addition, this radiating fin 70 is the materials by high-cooling property matter, made as aluminium, copper, its surface has many grooves, except increasing the area of dissipation, also have the effect that the guiding air therebetween circulates, make the radiating effect of this radiator 20 more superior by installing this radiating fin 70, and strengthened heat sinking function of the present utility model.

In sum, the utility model can send back this hydraulic fluid 50 apace in this first space 12, and proceed thermal cycle by the set capillary structure 41 of this second conduit 40, and reaches effect such as simple in structure, rapid heat dissipation.

Below the utility model is described in detail; the above only is preferred embodiment of the present utility model; can not limit protection range of the present utility model with this, promptly all equalizations of doing according to the utility model change and modify, and all should still belong in the protection range of the present utility model.

Claims

1. a radiator structure (1) is used for an electronic component (60) is dispelled the heat, and it is characterized in that comprising:

One absorber (10), has a contact-making surface (11) to be connected in this electronic component (60), its inside is hollow and tool one first space (12), in this first space (12), be provided with hydraulic fluid (50), this absorber (10) absorbs the heat energy that this electronic component (60) is produced with this contact-making surface (11), and this heat energy is reached this hydraulic fluid (50) makes that its evaporation is covert to be steam;

One radiator (20) has a radiating surface (21), and its inside is for hollow and form one second space (22);

A plurality of first conduits (30) and second conduit (40), be communicated in this first space (12) and this second space (22) respectively, this steam enters this second space (22) via described first conduit (30), and contact with this radiating surface (21) and to carry out being condensed into hydraulic fluid (50) after the heat exchange, be provided with a capillary structure (41) in this second conduit (40), the hydraulic fluid that condenses (50) transmission that will be positioned at this second space (22) by this capillary structure (41) is got back to this first space (12) and is formed a thermal cycle.

2. radiator structure as claimed in claim 1 is characterized in that this capillary structure (41) is to be selected from by sintered powder, metallic fiber, metal mesh, groove, and the group that forms of cotton-wool.

3. radiator structure as claimed in claim 1 is characterized in that this radiating surface (21) of this radiator (20) is gone up connection one radiating fin (70).

4. radiator structure as claimed in claim 1 is characterized in that this hydraulic fluid (50) is a refrigerant.

5. radiator structure as claimed in claim 1 is characterized in that this hydraulic fluid (50) is to be selected from the group that is made up of pure water, methyl alcohol, ethanol, acetone and heptane.

6. radiator structure as claimed in claim 1 is characterized in that this second conduit (40) is respectively equipped with a diversion division (42) in two ends, and this diversion division (42) is inclination and flows in this second conduit (40) in order to this hydraulic fluid (50).

7. radiator structure as claimed in claim 1, it is characterized in that this absorber (10) and this radiator (20) are respectively equipped with a plurality of first and connect and establish hole (13) and second and connect and establish hole (23), described first connects and establishes hole (13) and second and connect that to establish hole (23) be to wear connection for described first conduit (30) and this second conduit (40).

8. radiator structure as claimed in claim 7 is characterized in that this radiator (20) inside is provided with an inclined wall, and this inclined wall second is connect and establishes hole (23) direction toward having a down dip toward this by the edge.