CN201035492Y - Cone type secondary heat superconduction heat radiator for CPU, display card - Google Patents

Abstract

The utility model discloses a cone-shaped secondary heat supper conducting radiator used for a CPU and a graphic card, the radiator consists of a cone-shaped heat pipe (5), U-shaped secondary supper pipe components (6), fixed pressing caps (7), O-shaped spring washers (8), and an immediate positioning device (9); a plurality of groups of U-shaped twice supper pipe components (6) are suited on the periphery of the cone-shaped heat pipe (5) to form a tower-shaped structure, adjacent groups of U-shaped twice supper pipe components (6) are padded by the O-shaped spring washers (8), and are fastened by the fixed pressing caps (7) after the installation working direction is adjusted, a fixed buckling spring (9.1) in the immediate positioning device (9) is suited at the bottom part of the cone-shaped heat pipe (5) and is used for installing and positioning the radiator on the CPU and the graphic card. The cone-shaped heat pipe effectively solves the once thermal resistance in the radiation, and the harmful heat energy is transferred away; the heat energy transferred by the U-shaped secondary supper pipe components can be transfered to a computer reasonable radiation space according to the direction of the 360 degrees; a radiation ventilating fan is not required to be installed.

Description

A kind of hot superconducting radiator of tapered secondary that is used for CPU, video card

Technical field

The utility model belongs to computer CPU, video card heat dissipation technology field, specially refers to the hot superconducting radiator of tapered secondary of a kind of CPU of being used for, video card.

Background technology

In recent years because the high speed development of computer technology, cpu chip computing velocity and video card capacity increase gradually, reached more than the 3G such as the P4 arithmetic speed, the heating power of its CPU has increased to more than 50 watts, the highlyest reached more than 100 watt, heat dissipation problem has become the bottleneck of restriction computer CPU, video card technical development.

The arithmetic speed of computing machine is improving; even CPU and video card heat-pipe radiator in the middle and high shelves desk-top computer also seem unable to do what one wishes; with the common structural drawing 1 of CPU heat-pipe radiator is example: the heat that is produced during cpu chip 1 work is at first passed to encapsulating material 2; the effect of encapsulating material 2 is except that should having good heat transfer effect and the protection to CPU; dispersing in the process of CPU heat energy; also be called as thermal resistance one time; the production technology and the material of CPU manufacturer are depended in the improvement of a resistive properties.Be called as the secondary thermal resistance by CPU encapsulating material 2 to the heat conduction of base plate of radiator 3 and heat pipe 4.Because the restriction of base plate of radiator 3 heat pipes 4 folded contacts area when conducting heat, the heat energy that sends from CPU encapsulating material 2 can not the most effectively pass to base plate of radiator 3 and the extraordinary heat pipe 4 of heat conductivility, causes present heat-pipe radiator radiating efficiency and traditional heating radiator than unsatisfactory.In addition, heat-pipe radiator in use exists the problem of installation direction, the difference that CPU being equipped with on mainboard keeps flat and stand up, principle of work according to heat pipe, flexibility and installation direction when heat pipe uses all will influence the backflow of heating agent liquid in the pipe, thereby influence Heat Transfer of Heat Pipe on Heat Pipe efficient.

Summary of the invention

For addressing the above problem, the utility model has designed a kind of CPU of being used for, the hot superconducting radiator of tapered secondary of video card, this heating radiator is according to existing CPU packing forms, it is big to have designed a kind of thermal interface that is subjected to, high-power, the pyramid type heat pipe of low thermal resistance, this heat pipe can be effectively with the fast speed belt of the heat that CPU or video card produced from the heating core, again by array that is installed on it and the super pipe of the U type secondary heat assembly that can arbitrarily adjust every group of setting angle, with thermal energy transfer to the reasonable heat-dissipating space of setting at random, no matter CPU or the installation of video card on mainboard keep flat or stand up, this heating radiator can arbitrarily be adjusted the installment work direction of the super pipe of U type secondary heat assembly the best, rationally utilize the computer to dissipate heat space, improve the whole structure of CPU or video card heat radiation.

For achieving the above object, the utility model adopts following technical scheme:

Described a kind of hot superconducting radiator of tapered secondary that is used for CPU, video card, this heating radiator are by the super pipe of pyramid type heat pipe, U type secondary heat assembly, fixedly pressure cap, O type spring shim reach and form with joining locating device; The super pipe of array U type secondary heat assembly is socketed in the peripheral tower structure that forms of pyramid type heat pipe, between adjacent set by O type spring shim liner, after setting up the installment work direction by fixedly pressure cap is fastening, and be used for the installing and locating of this heating radiator on CPU and video card with the clip spring of joining in the locating device in the socket of the bottom of pyramid type heat pipe, wherein:

1) the pyramid type heat pipe is the half-conical hollow shape, and seal by having externally threaded level pressure cap the upper end, and level pressure cap center is provided with vacuum pumping hole, and the lower end is flat seals; The pyramid type heat pipe is made by pure copper tube, and base diameter reaches 25～35mm, and its internal layer adheres to copper powder by sintering, and the equipped condensed fluid in bottom, cylindric space stays in institute;

2) the super pipe of U type secondary heat assembly is made up of radiating fin, heat pipe platen, secondary radiating fin, U type heat pipe and an aluminium sheet; A radiating fin is embedded in cylindrical formation a slice integral body of heat pipe platen, and it is provided with U type groove, coats when two integral body and just can be used to install U type heat pipe when the heat-conducting silicone grease symmetry snaps together; Inlay rectangular aluminum secondary radiating fin around " II " type aluminium sheet, at two terminal two secondary radiating fins up and down that are provided with of U type heat pipe, the fixed orifice by last lower aluminum sheet is an integral body by screw retention;

3) form by clip spring, card cap, cutting ferrule, attachment bolt with joining locating device, the bottom that the clip spring is socketed in the pyramid type heat pipe is four jiaos of symmetry shapes, and attachment bolt is used to connect four pilot holes of CPU or video card, cutting ferrule screws on attachment bolt by internal thread, and the card cap that has a flat card end inserts in the flat hole of cutting ferrule upper end half-twist and can lock with joining locating device.

Owing to adopted aforesaid technical scheme, the utlity model has following superiority:

1, the pyramid type heat pipe has effectively solved a thermal resistance in CPU and the video card chip cooling, high-speed will be harmful to heat energy pass from;

2, the heat energy that spreads out of of the super pipe of U type secondary heat assembly at a high speed by 360 ° of directions of setting at random, with thermal energy transfer to the reasonable heat-dissipating space of computing machine;

3, under present most CPU and video card chip operation state, the heat radiation exhaust fan need not be installed, will make that heating radiator is accomplished efficiently, noiselessness, install more convenient, more attractive in appearance;

4, the secondary heat pipe setting angle of the super pipe of U type secondary heat assembly random installation makes every U type heat pipe all be operated in best heat conduction state;

5, lower CPU and video card chip temperature reserved wide technology space for the computing machine development that is provided with more at a high speed;

6, because the existing enough heat dispersions of pyramid type heat pipe, therefore also can be equipped with the super pipe of 2-3 group U type secondary heat assembly according to actual needs, U type heat pipe is all mostly around the pyramid type heat pipe simultaneously, increased and be subjected to thermocontact area and stretch out two ends simultaneously to connect the secondary radiating fin, quite reached the effect of two directly-heated pipes with a U type heat pipe.

Description of drawings

Fig. 1 is a conventional heat pipe heat spreader structures synoptic diagram;

Fig. 2 be used for CPU, video card the hot superconducting radiator structural representation of tapered secondary;

Fig. 3 is that the A of Fig. 2 is to the rotational structure synoptic diagram;

Among the above-mentioned figure: the 1-CPU chip; The 2-CPU encapsulating material; The 3-base plate of radiator; The 4-heat pipe; 5-pyramid type heat pipe; 5.1-level pressure cap; 5.2-vacuum pumping hole; 5.3-condensed fluid; 5.4-copper powder; The super pipe of 6-U type secondary heat assembly; 6.1-radiating fin; 6.2-heat pipe platen; 6.3-secondary radiating fin; 6.4-U type heat pipe; 6.5-aluminium sheet; 7-is pressure cap fixedly; 8-O type spring shim; 9-is with joining locating device; 9.1-clip spring; 9.2-card cap; 9.3-cutting ferrule; 9.4-attachment bolt.

Embodiment

Shown in Fig. 2,3: a kind of hot superconducting radiator of tapered secondary that is used for CPU, video card of the present utility model, this heating radiator are by the super pipe of pyramid type heat pipe (5), U type secondary heat assembly (6), fixedly pressure cap (7), O type spring shim (8) reach and form with joining locating device (9); Array U type secondary heat super pipe assembly (6) is socketed in the peripheral tower structure that forms of pyramid type heat pipe (5), between adjacent set by O type spring shim (8) liner, after setting up the installment work direction by fixedly pressure cap (6) is fastening, and be used for the installing and locating of this heating radiator on CPU and video card with the clip spring (9.1) of joining in the locating device (9) in the bottom socket of pyramid type heat pipe (5), wherein:

1) pyramid type heat pipe (5) is the half-conical hollow shape, and seal by having externally threaded level pressure cap (5.1) upper end, and level pressure cap (5.1) center is provided with vacuum pumping hole (5.2), and the lower end is flat seals; Pyramid type heat pipe (5) is made by pure copper tube, and base diameter reaches 25～35mm, and its internal layer adheres to copper powder (5.4) by sintering, and the equipped condensed fluid (5.3) in bottom, cylindric space stays in institute;

2) U type secondary heat super pipe assembly (6) is made up of a radiating fin (6.1), heat pipe platen (6.2), secondary radiating fin (6.3), U type heat pipe (6.4) and aluminium sheet (6.5); The cylindrical that a radiating fin (6.1) is embedded in heat pipe platen (6.2) forms a slice integral body, and it is provided with U type groove, coats when two integral body and just can be used to install U type heat pipe (6.4) when the heat-conducting silicone grease symmetry snaps together; " II " type aluminium sheet (6.5) is inlayed rectangular aluminum secondary radiating fin (6.3) all around, and at the terminal two secondary radiating fins (6.3) up and down that are provided with of (6.4) two of U type heat pipes, the fixed orifice by last lower aluminum sheet (6.3) is an integral body by screw retention;

3) form by clip spring (9.1), card cap (9.2), cutting ferrule (9.3), attachment bolt (9.4) with joining locating device (9), the bottom that clip spring (9.1) is socketed in pyramid type heat pipe (5) is four jiaos of symmetry shapes, and attachment bolt (9.4) is used to connect four pilot holes of CPU or video card, cutting ferrule (9.3) screws on attachment bolt (9.4) by internal thread, and the card cap (9.2) that has a flat card end inserts in the flat hole of cutting ferrule (9.3) upper end half-twist and can lock with joining locating device (9).

Installation method of the present utility model is as follows:

Earlier cutting ferrule (9.3), attachment bolt (9.4) are fixed on computer CPU and the video card chip fixed orifice all around, heat-conducting silicone grease is coated in pyramid type heat pipe (5) bottom to stand up on CPU and video card chip, four card caps (9.2) buckle respectively in cutting ferrule (9.3), aim at joining the card cap (9.2) in the locating device (9) and pushing clip spring (9.1) with screwdriver, (9.2) 90 ° on revotating card cap can be fixing firm with the hot superconducting radiator of tapered secondary.Pyramid type heat pipe this moment (5) bottom closely contacts with CPU1 and video card chip.Since U type secondary heat super pipe assembly (6) when assembling and the bottom of pyramid type heat pipe (5) all scribble heat-conducting silicone grease, put two～three groups of U type secondary Super-conductive conduit assemblies (6) in proper order by the aperture tapering, after adjusting best heat radiation angle by fixedly pressure cap (7) is fastening.

Principle of work of the present utility model is as follows:

Behind the computer booting, the heat that is distributed by CPU (1) and video card chip reaches pyramid type heat pipe (5) through the direct plane of envelope shape material, because pyramid type heat pipe (5) bottom effective diameter reaches 25～35mm, can moment with heat energy pass from thermal source, vaporized condensed fluid part is through a radiating fin (6.1) partial heat energy that leaves, another part heat energy reaches U type heat pipe (6.4) by the heat pipe platen (6.2) of a radiating fin (6.1) and integrative-structure, by secondary radiating fin (6.3), take residue heat energy to farther space again.Because pyramid type heat pipe (5) large tracts of land flat-bottom structure, fully contact with the computing machine euthermic chip, the hot superconductor cavity of the vacuum of super large makes the condensed fluid of gasification more unimpeded, reflux cycle is shorter, and the heat radiation power of super large is more conducive to the high speed diffusion of CPU and video card chip heat energy; Because the hot superconduction method of attachment of tapering secondary of pyramid type heat pipe (5), make more reasonable, more effective through the residue heat energy after a radiating fin (6.1) heat radiation, be dissipated to the best heat-dissipating space of the computing machine of setting at random more fully.

Because the hot superconducting radiator of special-shaped secondary of the present utility model has enough big heat transfer efficiency, enough big area of dissipation and rational computed heat-dissipating spaces, therefore, does not need to increase radiator fan as a rule.In some special cabinets, use, as the CPU of superelevation and video card speed, too small nonventilated chassis space etc., can increase by an auxiliary blower, the available two kinds of methods of the installation of fan, first method are by four unsettled this tops, heating radiator center that are fixed on of spring with electric fan; Second method is not have standard aerial by four extension springs to be hooked on the computing machine wasted space.The use of this fan can further improve cpu heat, comprises the common radiating effect of video card chip radiator and internal memory, hard disk etc.The vibrations injury that mechanical shock when noise that the installation method of these two kinds of novelties is fixing can reduce fan and rotate the time and fan rotate causes integrated package.

Claims (1)

1. hot superconducting radiator of tapered secondary that is used for CPU, video card is characterized in that: this heating radiator is by pyramid type heat pipe (5), the super pipe of U type secondary heat assembly (6), fixedly pressure cap (7), O type spring shim (8) reach and form with joining locating device (9); Array U type secondary heat super pipe assembly (6) is socketed in the peripheral tower structure that forms of pyramid type heat pipe (5), between adjacent set by O type spring shim (8) liner, after setting up the installment work direction by fixedly pressure cap (6) is fastening, and be used for the installing and locating of this heating radiator on CPU and video card with the clip spring (9.1) of joining in the locating device (9) in the bottom socket of pyramid type heat pipe (5), wherein:

1) pyramid type heat pipe (5) is the half-conical hollow shape, and seal by having externally threaded level pressure cap (5.1) upper end, and level pressure cap (5.1) center is provided with vacuum pumping hole (5.2), and the lower end is flat seals; Pyramid type heat pipe (5) is made by pure copper tube, and base diameter reaches 25～35mm, and its internal layer adheres to copper powder (5.4) by sintering, and the equipped condensed fluid (5.3) in bottom, cylindric space stays in institute;

2) U type secondary heat super pipe assembly (6) is made up of a radiating fin (6.1), heat pipe platen (6.2), secondary radiating fin (6.3), U type heat pipe (6.4) and aluminium sheet (6.5); The cylindrical that a radiating fin (6.1) is embedded in heat pipe platen (6.2) forms a slice integral body, and it is provided with U type groove, coats when two integral body and just can be used to install U type heat pipe (6.4) when the heat-conducting silicone grease symmetry snaps together; " II " type aluminium sheet (6.5) is inlayed rectangular aluminum secondary radiating fin (6.3) all around, and at the terminal two secondary radiating fins (6.3) up and down that are provided with of (6.4) two of U type heat pipes, the fixed orifice by last lower aluminum sheet (6.3) is an integral body by screw retention;

3) form by clip spring (9.1), card cap (9.2), cutting ferrule (9.3), attachment bolt (9.4) with joining locating device (9), the bottom that clip spring (9.1) is socketed in pyramid type heat pipe (5) is four jiaos of symmetry shapes, and attachment bolt (9.4) is used to connect four pilot holes of CPU or video card, cutting ferrule (9.3) screws on attachment bolt (9.4) by internal thread, and the card cap (9.2) that has a flat card end inserts in the flat hole of cutting ferrule (9.3) upper end half-twist and can lock with joining locating device (9).

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