CN203759633U - High-power passive heat radiator applicable to PGA988 (Pin Grid Array 988) - Google Patents

High-power passive heat radiator applicable to PGA988 (Pin Grid Array 988) Download PDF

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Publication number
CN203759633U
CN203759633U CN201320878270.3U CN201320878270U CN203759633U CN 203759633 U CN203759633 U CN 203759633U CN 201320878270 U CN201320878270 U CN 201320878270U CN 203759633 U CN203759633 U CN 203759633U
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China
Prior art keywords
pga988
applicable
passive heat
arm
power passive
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Expired - Fee Related
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CN201320878270.3U
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Chinese (zh)
Inventor
赵景广
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Million Scape Video Signal Science And Technology Ltds Of Shenzhen
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Million Scape Video Signal Science And Technology Ltds Of Shenzhen
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Priority to CN201320878270.3U priority Critical patent/CN203759633U/en
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Abstract

The utility model provides a high-power passive heat radiator applicable to a PGA988 (Pin Grid Array 988). The high-power passive heat radiator comprises a base and heat radiator tubes, wherein each heat radiator tube comprises an evaporating arm, a condensing arm and a connecting part; the base comprises a top plate for being in contact with a computer mainboard, a bottom plate for being in contact with a shell heat radiator, and a connecting component for connecting the top plate and the bottom plate, wherein the upper surface of the top plate is provided with upper grooves for accommodating the evaporating arms, and the lower surface of the bottom plate is provided with lower grooves for accommodating the condensing arms; the top plate is provided with holes matched with the computer mainboard, wherein the distance between every two adjacent holes is 50mm. According to the high-power passive heat radiator provided by the utility model, an integrated design is adopted, the evaporating arms and the condensing arms of the heat radiator tubes are respectively arranged on the top plate and the bottom plate, so that the utilization rate of the heat radiator tubes is increased, the heat radiation effect is better, the structure is more compact, and the machining and mounting process is simple and convenient; the high-power passive heat radiator is closely matched with an industrial computer in structure, free of noise and applicable to industrial application occasions; meanwhile, the cost of the application system cannot be greatly increased.

Description

A kind of high-power passive heat radiation device that is applicable to PGA988
Technical field
The utility model relates to a kind of heating radiator, relates in particular to the high-power passive heat radiation device of a kind of PGA988 of being applicable to.
Background technology
In industrial computer application, very high to the reliability requirement of computer, all need to ensure normal good work in many specific environments for use.And heat radiation is a very important ring that ensures industrial computer reliability, the pyrotoxin of industrial computer has display backlight, hard disk, internal memory, video card, but maximum pyrotoxin is CPU, and the design of cpu heat becomes the key that ensures industrial computer quality.
Conventional cpu heat has at present, air-cooled radiator, water-cooled or oil cooling radiator, and passive heat radiation device.
Air-cooled radiator, the fan of namely often saying, fan and heat radiator are the important ingredients of this heating radiator, are mainly to rely on to rotate to allow air current flow, thereby take away the heat on heat radiator.Size and the rotating speed of fan have determined heat dissipation.Exactly because this feature, the fan volume of high-power heat-dissipation is very large, cannot install for some undersized industrial computers at all, and the noise of fan can not be eliminated completely simultaneously.For the product that has three anti-requirements, the design of sealing cannot form air channel at all.
The heating radiator of water-cooled and oil cooling, there is no the problem of noise, and radiating efficiency is high, but normal water-cooled or the oil cooling of using need to, at the outside equipment such as water pump that are equipped with of computer, cause the requirement of exceptional space, cannot realize like this in part application.
Passive radiator is comparatively applicable for there being the application of three anti-requirements and volume requirement, and the heat spreader structures of single existing majority, is not to be industrial computer specialized designs, can not meet the radiating requirements that increased power brings completely, so, be necessary for of this sort application, design a heating radiator.
Utility model content
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of high-power passive heat radiation device is provided, and is particularly useful for the high-power passive heat radiation device of PGA988.
The utility model is achieved in that the high-power passive heat radiation device of a kind of PGA988 of being applicable to comprises base and radiating tube; Described radiating tube comprises evaporation arm, condensation arm and the connecting portion that is connected evaporation arm and condensation arm; Described base comprises top board for contacting with computer main board, for the base plate that contacts with shell heating radiator be connected top board and the link of base plate, the upper surface of described top board is provided with the upper groove that holds described evaporation arm, and the lower surface of described base plate is provided with the low groove that holds described condensation arm; Described top board is provided with the hole for matching with the connecting hole on computer main board, and the distance between adjacent two holes is 50mm.
Wherein, described evaporation arm is arranged in upper groove, and described condensation arm is arranged in low groove.
Preferably, described high-power passive heat radiation device also comprises for described top board is fixed on to the fastener on computer main board.
Wherein, described radiating tube is preferably multiple.
Preferably, described radiating tube is n, and n is greater than 1 integer (being preferably 3-8, more preferably 4-6); Described upper groove and low groove are n; Described upper groove is evenly distributed in the region contacting with CPU on the upper surface of top board; Described low groove is evenly distributed on the lower surface of base plate.
Preferably, described radiating tube is U-shaped pipe.
Wherein, in described radiating tube, be filled with heat transmission medium.
Wherein, described link can be web joint or connecting link.
Preferably, described base is made of aluminum.
The high-power passive heat radiation device of what the utility model provided be applicable to PGA988 has adopted integral type design, the evaporation arm of radiating tube is arranged on the top board of base, condensation arm is arranged on base plate, has increased the utilization factor of radiating tube, radiating effect is better, more compact structure, processing simple installation, this high-power passive heat radiation device coordinates with industrial computer structure closely, noiseless, the cost that can not increase considerably application system simultaneously, is suitable for industrial applications.
Brief description of the drawings
The front elevation of the high-power passive heat radiation device that is applicable to PGA988 that Fig. 1 provides for the utility model;
Fig. 2 is that radiating tube is arranged on the side view on base;
Fig. 3 is the front elevation of base;
Fig. 4 is the structural representation of top board;
Fig. 5 is the structural representation of base plate.
Embodiment
With reference to the accompanying drawings, the utility model will be further described in conjunction with specific embodiments, to understand better the utility model.
With reference to Fig. 1-5, the high-power passive heat radiation device of what the present embodiment provided be applicable to PGA988 comprises base 10 and radiating tube 20.
Radiating tube 20 comprises evaporation arm 21, condensation arm 22 and is connected the connecting portion 23 of evaporation arm 21 and condensation arm 22.
Base 10 comprises top board 11 for contacting with computer main board, for the base plate 12 that contacts with shell heating radiator be connected the link 13 of top board 11 and base plate 12, link 13 can be web joint or connecting link.
The upper surface of top board 11 is provided with and holds the upper groove 14 that evaporates arm 21, and the lower surface of base plate 12 is provided with the low groove 15 that holds condensation arm 22.Wherein, evaporation arm 21 is arranged in upper groove 14, and condensation arm 22 is arranged in low groove 15.Realize so integrated and condensation arm and low groove integrated of evaporation arm and base plate, the utilization factor of radiating tube is provided, strengthened heat-sinking capability.
Radiating tube 20 can be one or more, one preferred embodiment in, radiating tube 20 is multiple, for example 3-8, the number of upper groove 14 and low groove 15 is identical with the number of radiating tube 20, and upper groove 14 is evenly distributed in the region contacting with CPU on the upper surface of top board 11; Low groove 15 is evenly distributed on the lower surface of base plate 12.
Top board 11 is provided with the hole 16 for matching with the connecting hole on computer main board, the utility model designs for Intel LGA1155/PGA988CPU, because the distance between the connecting hole of PGA988 mainboard is 50mm, so the distance on top board 11 between adjacent two holes 16 is 50mm, according to motherboard design, the corresponding adjustment of heat spreader structures, as shown in Figure 4.
The high-power passive heat radiation device that the utility model provides also comprises for described top board is fixed on to the fastener on computer main board.
One preferred embodiment in, radiating tube 20 is U-shaped pipe.
Wherein, in radiating tube 20, be filled with heat transmission medium.
Base 10 is made of aluminum, so can absorb more heat because the specific heat capacity of aluminium is higher, disperse effect more obvious, and cost is lower.
When what the present embodiment provided is applicable to the high-power passive heat radiation device use of PGA988, the evaporation arm 21 contacting with CPU is heated, liquid (heat transmission medium) in evaporation arm 21 evaporates rapidly, the steam producing flows to other one end (condensation arm 22) of radiating tube 20 under small pressure differential, and releases heat, regelation becomes liquid, liquid flows back in evaporation arm by the effect of capillary force along porosint again, so circulation is more than, heat reaches condensation arm 22 by the evaporation arm 21 of heat pipe, this circulation is carried out fast, heat can be come by conduction continuously.
Above specific embodiment of the utility model be have been described in detail, but it is as example, the utility model is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that this practicality is carried out and alternative also all among category of the present utility model.Therefore,, not departing from equalization conversion and the amendment done under spirit and scope of the present utility model, all should be encompassed in scope of the present utility model.

Claims (9)

1. a high-power passive heat radiation device that is applicable to PGA988, is characterized in that, comprises base and radiating tube;
Described radiating tube comprises evaporation arm, condensation arm and the connecting portion that is connected evaporation arm and condensation arm;
Described base comprises top board for contacting with computer main board, for the base plate that contacts with shell heating radiator be connected top board and the link of base plate, the upper surface of described top board is provided with the upper groove that holds described evaporation arm, and the lower surface of described base plate is provided with the low groove that holds described condensation arm;
Described top board is provided with the hole for matching with the connecting hole on computer main board, and the distance between adjacent two holes is 50mm.
2. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1, is characterized in that, described evaporation arm is arranged in upper groove, and described condensation arm is arranged in low groove.
3. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1 and 2, is characterized in that, also comprises for described top board is fixed on to the fastener on computer main board.
4. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1 and 2, is characterized in that, described radiating tube is n, and n is greater than 1 integer; Described upper groove and low groove are n; Described upper groove is evenly distributed in the region contacting with CPU on the upper surface of top board; Described low groove is evenly distributed on the lower surface of base plate.
5. the high-power passive heat radiation device that is applicable to PGA988 according to claim 4, is characterized in that, n is 3~8.
6. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1, is characterized in that, described radiating tube is U-shaped pipe.
7. according to the high-power passive heat radiation device that is applicable to PGA988 described in claim 1 or 7, it is characterized in that, in described radiating tube, be filled with heat transmission medium.
8. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1, is characterized in that, described link is web joint or connecting link.
9. the high-power passive heat radiation device that is applicable to PGA988 according to claim 1, is characterized in that, described base is made of aluminum.
CN201320878270.3U 2013-12-27 2013-12-27 High-power passive heat radiator applicable to PGA988 (Pin Grid Array 988) Expired - Fee Related CN203759633U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320878270.3U CN203759633U (en) 2013-12-27 2013-12-27 High-power passive heat radiator applicable to PGA988 (Pin Grid Array 988)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320878270.3U CN203759633U (en) 2013-12-27 2013-12-27 High-power passive heat radiator applicable to PGA988 (Pin Grid Array 988)

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CN203759633U true CN203759633U (en) 2014-08-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108029224A (en) * 2015-09-23 2018-05-11 大陆汽车有限公司 Device with chimney cooler and electronic housings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108029224A (en) * 2015-09-23 2018-05-11 大陆汽车有限公司 Device with chimney cooler and electronic housings

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140806

Termination date: 20141227

EXPY Termination of patent right or utility model